BR112013025429A2 - circuito impresso cerâmico com corpo de arrefecimento em aluminio - Google Patents
circuito impresso cerâmico com corpo de arrefecimento em aluminioInfo
- Publication number
- BR112013025429A2 BR112013025429A2 BR112013025429A BR112013025429A BR112013025429A2 BR 112013025429 A2 BR112013025429 A2 BR 112013025429A2 BR 112013025429 A BR112013025429 A BR 112013025429A BR 112013025429 A BR112013025429 A BR 112013025429A BR 112013025429 A2 BR112013025429 A2 BR 112013025429A2
- Authority
- BR
- Brazil
- Prior art keywords
- printed circuit
- cooling body
- ceramic printed
- aluminum cooling
- upper face
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title abstract 4
- 239000000919 ceramic Substances 0.000 title abstract 3
- 229910052782 aluminium Inorganic materials 0.000 title abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title abstract 2
- 238000001465 metallisation Methods 0.000 abstract 2
- 238000009795 derivation Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
resumo patente de invenção: "circuito impresso cerâmico com corpo de arrefecimento em aluminio". a presente invenção refere-se a um circuito impresso (2) de ce-râmica com uma face superior (2a) e uma face inferior (2b), sendo que na face superior (2a) estão dispostas áreas de metalização sinteradas e a face inferior é conformada como corpo de arrefecimento (3). para que seja aper-feiçoada a derivação de calor dos componentes na face superior do circuito impresso, é proposto que também na face inferior (2b) estejam dispostas áreas de metalização sinteradas, sobre as quais está soldado um corpo de arrefecimento (3) metálico.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011006726 | 2011-04-04 | ||
PCT/EP2012/055746 WO2012136579A1 (de) | 2011-04-04 | 2012-03-30 | Keramische leiterplatte mit al-kühlkörper |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112013025429A2 true BR112013025429A2 (pt) | 2016-12-27 |
Family
ID=45954642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112013025429A BR112013025429A2 (pt) | 2011-04-04 | 2012-03-30 | circuito impresso cerâmico com corpo de arrefecimento em aluminio |
Country Status (10)
Country | Link |
---|---|
US (1) | US9730309B2 (pt) |
EP (1) | EP2695189A1 (pt) |
JP (1) | JP2014517497A (pt) |
KR (1) | KR20140034781A (pt) |
CN (1) | CN103563074B (pt) |
BR (1) | BR112013025429A2 (pt) |
DE (1) | DE102012205178A1 (pt) |
RU (1) | RU2013148615A (pt) |
TW (1) | TW201302046A (pt) |
WO (1) | WO2012136579A1 (pt) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102401358B (zh) * | 2010-09-10 | 2016-08-03 | 欧司朗股份有限公司 | 冷却体的制造方法、冷却体以及具有该冷却体的照明装置 |
CN104486900A (zh) * | 2014-11-07 | 2015-04-01 | 广东风华高新科技股份有限公司 | 用于电路板的支撑件及其制备方法 |
CN105305206B (zh) * | 2015-11-03 | 2021-04-20 | 华中科技大学 | 一种适用于碟片激光器射流冲击冷却系统的热沉 |
JP2018046237A (ja) * | 2016-09-16 | 2018-03-22 | 株式会社東芝 | 半導体装置およびその製造方法 |
US10415895B2 (en) * | 2016-11-21 | 2019-09-17 | Abl Ip Holding Llc | Heatsink |
Family Cites Families (31)
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US3561110A (en) * | 1967-08-31 | 1971-02-09 | Ibm | Method of making connections and conductive paths |
US4695489A (en) * | 1986-07-28 | 1987-09-22 | General Electric Company | Electroless nickel plating composition and method |
JP2688446B2 (ja) * | 1990-03-26 | 1997-12-10 | 株式会社日立製作所 | 多層配線基板およびその製造方法 |
US6003586A (en) | 1990-11-05 | 1999-12-21 | Beane; Glenn L. | Heat-sinking structures and electrical sockets for use therewith |
US5299090A (en) * | 1993-06-29 | 1994-03-29 | At&T Bell Laboratories | Pin-fin heat sink |
JP3792268B2 (ja) * | 1995-05-23 | 2006-07-05 | ローム株式会社 | チップタイプ発光装置の製造方法 |
JPH11307705A (ja) * | 1998-04-24 | 1999-11-05 | Sumitomo Metal Ind Ltd | 強制空冷用ヒートシンクおよびその冷却方法 |
JP2001110956A (ja) * | 1999-10-04 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 電子部品用の冷却機器 |
JP2002222905A (ja) * | 2001-01-25 | 2002-08-09 | Hitachi Ltd | パワーモジュールとその複合基板及び接合用ロー材 |
EP2241803B1 (en) * | 2001-05-26 | 2018-11-07 | GE Lighting Solutions, LLC | High power LED-lamp for spot illumination |
US7775685B2 (en) * | 2003-05-27 | 2010-08-17 | Cree, Inc. | Power surface mount light emitting die package |
US7244965B2 (en) * | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
JP3971296B2 (ja) * | 2002-12-27 | 2007-09-05 | Dowaホールディングス株式会社 | 金属−セラミックス接合基板およびその製造方法 |
CN102290409B (zh) * | 2003-04-01 | 2014-01-15 | 夏普株式会社 | 发光装置 |
US6860652B2 (en) * | 2003-05-23 | 2005-03-01 | Intel Corporation | Package for housing an optoelectronic assembly |
CN2689457Y (zh) * | 2004-02-25 | 2005-03-30 | 周珑 | 适用于信号灯的led发光器件 |
US7269017B2 (en) * | 2004-11-19 | 2007-09-11 | Delphi Technologies, Inc. | Thermal management of surface-mount circuit devices on laminate ceramic substrate |
US7521789B1 (en) * | 2004-12-18 | 2009-04-21 | Rinehart Motion Systems, Llc | Electrical assembly having heat sink protrusions |
KR101305884B1 (ko) * | 2006-01-06 | 2013-09-06 | 엘지이노텍 주식회사 | 발광 다이오드 패키지, 이의 제조 방법 및 이를 구비하는백라이트 유닛 |
TWI449137B (zh) | 2006-03-23 | 2014-08-11 | Ceramtec Ag | 構件或電路用的攜帶體 |
DE102006015117A1 (de) * | 2006-03-31 | 2007-10-04 | Osram Opto Semiconductors Gmbh | Optoelektronischer Scheinwerfer, Verfahren zum Herstellen eines optoelektronischen Scheinwerfers und Lumineszenzdiodenchip |
JP2007294824A (ja) * | 2006-04-20 | 2007-11-08 | Showa Boeki Kk | Ledモジュール |
US20080080187A1 (en) * | 2006-09-28 | 2008-04-03 | Purinton Richard S | Sealed LED light bulb |
US8564380B2 (en) * | 2007-01-30 | 2013-10-22 | Hitachi Metals, Ltd. | Non-reciprocal circuit device and its central conductor assembly |
TW200847469A (en) * | 2007-05-23 | 2008-12-01 | Tysun Inc | Substrates of curved surface for light emitting diodes |
JP5160201B2 (ja) * | 2007-11-20 | 2013-03-13 | 株式会社豊田中央研究所 | はんだ材料及びその製造方法、接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法 |
TW201036508A (en) * | 2009-03-17 | 2010-10-01 | High Conduction Scient Co Ltd | Double-faced conductive composite board and manufacturing method thereof |
JP5383346B2 (ja) * | 2009-06-25 | 2014-01-08 | 京セラ株式会社 | 発光素子搭載用パッケージおよび発光装置 |
TW201100711A (en) | 2009-06-30 | 2011-01-01 | Power Light Tech Co Ltd | Light emitting diode light source assembly with heat dissipation base |
US8882284B2 (en) * | 2010-03-03 | 2014-11-11 | Cree, Inc. | LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties |
US20110279981A1 (en) * | 2010-05-17 | 2011-11-17 | Alex Horng | Heat Dissipating Assembly |
-
2012
- 2012-03-30 CN CN201280017161.0A patent/CN103563074B/zh not_active Expired - Fee Related
- 2012-03-30 RU RU2013148615/07A patent/RU2013148615A/ru not_active Application Discontinuation
- 2012-03-30 EP EP12714276.8A patent/EP2695189A1/de not_active Withdrawn
- 2012-03-30 WO PCT/EP2012/055746 patent/WO2012136579A1/de active Application Filing
- 2012-03-30 KR KR1020137029079A patent/KR20140034781A/ko not_active Application Discontinuation
- 2012-03-30 DE DE102012205178A patent/DE102012205178A1/de not_active Withdrawn
- 2012-03-30 BR BR112013025429A patent/BR112013025429A2/pt not_active IP Right Cessation
- 2012-03-30 US US14/008,867 patent/US9730309B2/en not_active Expired - Fee Related
- 2012-03-30 JP JP2014503085A patent/JP2014517497A/ja active Pending
- 2012-04-02 TW TW101111615A patent/TW201302046A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2012136579A1 (de) | 2012-10-11 |
JP2014517497A (ja) | 2014-07-17 |
CN103563074B (zh) | 2018-09-14 |
DE102012205178A1 (de) | 2012-10-04 |
RU2013148615A (ru) | 2015-05-10 |
US20140016330A1 (en) | 2014-01-16 |
TW201302046A (zh) | 2013-01-01 |
CN103563074A (zh) | 2014-02-05 |
KR20140034781A (ko) | 2014-03-20 |
US9730309B2 (en) | 2017-08-08 |
EP2695189A1 (de) | 2014-02-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] | ||
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |