CN102401358B - 冷却体的制造方法、冷却体以及具有该冷却体的照明装置 - Google Patents
冷却体的制造方法、冷却体以及具有该冷却体的照明装置 Download PDFInfo
- Publication number
- CN102401358B CN102401358B CN201010281127.7A CN201010281127A CN102401358B CN 102401358 B CN102401358 B CN 102401358B CN 201010281127 A CN201010281127 A CN 201010281127A CN 102401358 B CN102401358 B CN 102401358B
- Authority
- CN
- China
- Prior art keywords
- radiator
- aluminium nitride
- nitride ceramics
- heat carrier
- cooling body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 229910017083 AlN Inorganic materials 0.000 claims abstract description 62
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000000919 ceramic Substances 0.000 claims abstract description 61
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 30
- 239000004744 fabric Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Thermal Sciences (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
本发明涉及一种制造用于照明装置的冷却体(1)的方法,该方法包括以下步骤:a)提供多个氮化铝陶瓷散热体(2);b)将多个氮化铝陶瓷散热体(2)放入模具中;c)封闭该模具,并向模具中注入熔融的金属,以使该金属包裹各个氮化铝陶瓷散热体(2)的一部分,其中该金属的熔点低于氮化铝陶瓷散热体(2)的熔点;d)打开该模具,获得冷却体(1)。通过这种方法获得的金属?陶瓷复合型冷却体具有良好的热性能并且其制造成本也相对较低。此外,本发明还涉及一种利用上述方法制造的冷却体以及一种具有该种类型的冷却体的照明装置。
Description
技术领域
本发明涉及一种制造用于照明装置的冷却体的方法。此外,本发明还涉及一种利用上述方法制造的冷却体以及具有该种类型的冷却体的照明装置。
背景技术
在当今的高功率LED产品的热管理系统中,无源冷却装置通常是最常使用的冷却手段。在这种类型的热管理系统中,无源冷却装置的冷却体的以下性能会对其产生影响:热散逸性能,包括表面发射系数和对流能力;以及热传导能力(导热系数)。
已知的一种用于冷却装置的冷却体是由铝合金-384通过拉模铸造工艺制成的。出于防止腐蚀和美观的考虑,通常要对这种冷却体要进行表面处理,例如涂覆油漆。这种冷却体的优点在于其表面发射系数较高,例如在涂覆油漆的情况下大约为0.92-0.96。然而这种表面层的厚度较大并且其导热系数也较低,例如在涂覆油漆的情况下厚度大约为0.2-0.8mm,导热系数小于1W/m*k。同时,由于铝合金-384本身的材料特性,其自身的导热系数也不是很高,大约为92W/m*k。
在现有技术中,也通常由铝合金-6063通过挤压成形工艺制造冷却装置的冷却体。在挤压成形工艺之后,要对其表面进行氧化处理,从而形成一层较薄的氧化膜,大约为0.02mm。该氧化膜具有中等的导热系数,大约46W/m*k。但是由于氧化膜本身的材料特征,其表面发射系数较低,大约为0.20。
此外,在现有技术中还公开了一种由氮化铝材料制成的冷却体,对于氮化铝材料制成的冷却体的表面处理仅仅是对表面进行清洁。该冷却体的表面是正常的氮化铝陶瓷表面,没有任何的附加材料。这种清洁的表面也没有任何涂层。因此整个冷却体都具有相同的较高的导热系数,大约为180W/m*k。同时,这种冷却体的表面发射系数也较高,大约为0.93。然而其缺点也是非常明显的,即原材料成本较高,并且制造难度较大。
发明内容
因此,本发明的目的在于提出一种改进了冷却体,这种冷却体的热性能,即表面反射系数、导热系数和对流能力都相对较好,同时其制造成本制造难度都相对较低。
本发明的目的由此实现,即用于照明装置的冷却体的方法包括以下步骤:a)提供多个氮化铝陶瓷散热体;b)将多个氮化铝陶瓷散热体放入模具中;c)封闭模具,并向模具中注入熔融的金属,以使金属包裹各个氮化铝陶瓷散热体的一部分,其中金属的熔点低于氮化铝陶瓷散热体的熔点;d)打开模具,获得冷却体。在根据本发明的方法中,散热体由氮化铝陶瓷制成,氮化铝陶瓷本身具有非常良好的热性能,即大约为0.93的较高的表面反射系数、大约为180W/m*k的较大的导热系数。另一方面,导热体本身由熔点低于氮化铝陶瓷散热体的熔点的金属,例如铜或铝合金制成。这样就在整体上降低了整个冷却体的制造成本,并且同时还具有良好的热性能。
在本发明的一个优选的设计方案中,在步骤a)中提供多个片状的氮化铝陶瓷散热体,以及在步骤b)中将多个片状的氮化铝陶瓷散热体放射状地排布在模具中,并且在步骤c)中将熔融的金属注入到由多个片状的氮化铝陶瓷散热体包围形成的中心区域的一部分或全部中,以形成承载多个氮化铝陶瓷散热体的圆柱体或者圆环;或者将熔融的金属注入到多个片状的氮化铝陶瓷散热体的底端,以形成承载多个氮化铝陶瓷散热体的底板。由此,可以形成一种圆柱形的或者圆环形的导热体,并且在其外圆周表面上具有多个放射状地向外延伸的散热片,或者可以形成底板状的导热板,并且在多个放射状地向外延伸的散热片利用其一个端面竖立在该导热板上。这种结构形式的导热体与周围环境具有尽可能大的接触面积,从而获得良好的对流能力,这更加有助于散热。
在本发明的另一个优选的设计方案中提出,在步骤a)中提供多个柱状的氮化铝陶瓷散热体,以及在步骤b)中将多个片状的或柱状的氮化铝陶瓷散热体平行地排布在模具中,并且在步骤c)中将熔融的金属注入到多个片状的或柱状的氮化铝陶瓷散热体的底端,以形成承载多个氮化铝陶瓷散热体的底板。通过这种方法可以获得传统类型的冷却体,并且这种类型的散热体已经被证实能够良好地进行散热。
在本发明的又一优选的设计方案中提出,在步骤a)中提供多个带有中心孔的片状的氮化铝陶瓷散热体。在步骤b)中将多个带有中心孔的片状的氮化铝陶瓷散热体平行地排布在模具中。在步骤c)中将熔融的金属注入到多个片状的氮化铝陶瓷散热体的各个中心孔中,以形成承载多个片状的氮化铝陶瓷散热体的细长杆。通过这种方法获得了一种结构新颖的冷却体,其具有更加良好的对流能力。
本发明的另一目的通过一种用于照明装置的冷却体实现,该冷却体由导热体和多个散热体构成,其中,多个散热体中的每一个的一部分被包入导热体中,导热体由金属制成,散热体由氮化铝陶瓷制成,其中,导热体的熔点低于氮化铝陶瓷的熔点,其中该金属可以例如是铜或铝合金。由于散热体由氮化铝陶瓷制成,氮化铝陶瓷本身具有非常良好的热性能,即大约为0.93的较高的表面反射系数、大约为180W/m*k的较大的导热系数。另一方面,导热体本身由熔点低于氮化铝陶瓷散热体的熔点的金属,例如铜或铝合金制成。这样就获得了一种金属-陶瓷复合型冷却体,这在整体上降低了整个冷却体的制造成本,并且同时还具有良好的热性能。
在本发明的一个优选的设计方案中,导热体设计成圆柱形或圆环形,以及散热体设计成片状,并且散热体放射状地设置在导热体的圆周上。由此,可以形成一种圆柱形的或者圆环形的导热体,并且在其外圆周表面上具有多个放射状地向外延伸的散热片。
在本发明的另一优选的设计方案中,导热体设计成平坦的底板,以及散热体设计成柱状或片状。散热体竖立在导热体上。
以上两种结构形式的冷却体都具有良好的对流能力和导热性能。
根据本发明的又一设计方案,导热体设计成细长杆,以及散热体设计成带有中心孔的片状散热体,导热体穿过多个散热体的中心孔,从而承载多个散热体。这种结构的冷却体的对流能力相对更好。
本发明的最后的一个目的通过一种具有上述类型冷却体的照明装置实现。通过使用根据本发明的冷却体,能够更好地为照明装置排散热量,同时这种冷却体的制造成本相对较低,这也在整体上降低了照明装置的制造成本。
应该理解,以上的一般性描述和以下的详细描述都是列举和说明性质的,目的是为了对要求保护的本发明提供进一步的说明。
附图说明
附图构成本说明书的一部分,用于帮助进一步理解本发明。这些附图图解了本发明的实施例,并与说明书一起用来说明本发明的原理。在附图中相同的部件用相同的标号表示。图中示出:
图1是根据本发明的方法的流程图;
图2是根据本发明的冷却体的示意图;
图3a-图3c是根据本发明的冷却体的第一实施例的示意图;
图4a-图4c是根据本发明的冷却体的第二实施例的示意图;
图5是根据本发明的冷却体的第三实施例的示意图。
具体实施方式
在图1中示出了根据本发明的用于制造冷却体1的方法。在该方法的步骤a中提供多个氮化铝陶瓷散热体2;在步骤b中将多个氮化铝陶瓷散热体2放入模具中;在步骤c中向模具中注入熔融的金属,以使该金属包裹各个氮化铝陶瓷散热体2的一部分,由于金属的熔点低于氮化铝陶瓷散热体2的熔点,因此熔融的金属不会使氮化铝陶瓷散热体2融化,在本发明的设计方案中,该金属为铝合金,其熔点大约在516-654摄氏度之间,而氮化铝陶瓷散热体2的熔点则为2227摄氏度。
图2示出了根据本发明的冷却体的示意图。在图中可见,冷却体1由多个散热体2和导热体3构成,其中导热体3用于将来自发热设备,例如LED的热量传递给散热体2,并通过该散热体2将热量传递到周围环境中。在该设计方案中,导热体3由可熔融的金属,例如铝合金制成,而散热体2则由氮化铝陶瓷制成。
图3a至图3c示出了根据本发明的冷却体的第一实施例的示意图。在该实施例中,导热体3被设计成圆柱形或圆环形的,而多个散热体2放射状地排布在导热体3的圆周上,其中散热体2可以设计成正方形、长方形或者其他的不规则形状的平面散热片或者设计成曲面的散热片。图3b与图3a的区别仅仅在于,导热体3被设计成圆环形。而图3c与图3a的区别仅仅在于散热片2被设计成曲面的。
图4a至图4c示出了根据本发明的冷却体的第二实施例的示意图,在该实施例中,导热体3被设计成多边形或者圆形的底板,多个散热体2竖立在该导热板3上。在图4a中的导热体3是矩形的底板,并且多个彼此平行的散热体2(散热片)竖立在该导热体3上。而图4b中的导热板3是圆形的底板,多个散热体2(散热片)放射状地排布,并且竖立在该导热板3上。图4c中的导热板3是圆形的底板,而区别仅仅在于多个散热体2被设计成柱状,并且彼此平行地竖立在该导热板3上。
图5示出了根据本发明的冷却体的第三实施例的示意图。在该实施例中,散热体2被设计成具有中心孔的圆形散热片。细长杆状的导热体3穿过各个散热片2的中心孔,并使各个散热片2彼此平行地保持在导热体3上。
以上仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
附图标记
1 冷却体
2 散热体
3 导热体
Claims (16)
1.一种制造用于照明装置的冷却体(1)的方法,其特征在于,所述方法包括以下步骤:
a)提供多个氮化铝陶瓷散热体(2);
b)将多个所述氮化铝陶瓷散热体(2)放入模具中;
c)封闭所述模具,并向所述模具中注入熔融的金属,以使所述金属包裹各个所述氮化铝陶瓷散热体(2)的一部分,其中所述金属的熔点低于所述氮化铝陶瓷散热体(2)的熔点,多个所述氮化铝陶瓷散热体(2)向外延伸地布置在金属制成的导热体的表面上;
d)打开所述模具,获得所述冷却体(1)。
2.根据权利要求1所述的方法,其特征在于,在步骤a)中提供多个片状的氮化铝陶瓷散热体(2)。
3.根据权利要求2所述的方法,其特征在于,在步骤b)中将多个所述片状的氮化铝陶瓷散热体(2)放射状地排布在所述模具中。
4.根据权利要求3所述的方法,其特征在于,在步骤c)中将熔融的金属注入到由多个所述片状的氮化铝陶瓷散热体(2)包围形成的中心区域的一部分或全部中,以形成承载多个所述片状的氮化铝陶瓷散热体(2)的圆柱体或者圆环;或者将熔融的金属注入到多个所述片状的氮化铝陶瓷散热体(2)的底端,以形成承载多个所述氮化铝陶瓷散热体(2)的底板。
5.根据权利要求1所述的方法,其特征在于,在步骤a)中提供多个柱状的氮化铝陶瓷散热体(2)。
6.根据权利要求2或5所述的方法,其特征在于,在步骤b)中将多个片状的或柱状的所述氮化铝陶瓷散热体(2)平行地排布在所述模具中。
7.根据权利要求6所述的方法,其特征在于,在步骤c)中将熔融的金属注入到多个片状的或柱状的所述氮化铝陶瓷散热体(2)的底端,以形成承载多个所述氮化铝陶瓷散热体(2)的底板。
8.根据权利要求1所述的方法,其特征在于,在步骤a)中提供多个带有中心孔的片状的氮化铝陶瓷散热体(2)。
9.根据权利要求8所述的方法,其特征在于,在步骤b)中将多个所述带有中心孔的片状的氮化铝陶瓷散热体(2)平行地排布在所述模具中。
10.根据权利要求9所述的方法,其特征在于,在步骤c)中将熔融的金属注入到多个所述片状的氮化铝陶瓷散热体(2)的各个中心孔中,以形成承载多个所述片状的氮化铝陶瓷散热体(2)的细长杆。
11.一种根据权利要求1所述的方法制成的用于照明装置的冷却体(1),所述冷却体由(1)导热体(3)和多个散热体(2)构成,其特征在于,多个所述散热体(2)的每一个的一部分被包入到所述导热体(3)中,所述导热体(3)由金属制成,所述散热体(2)由氮化铝陶瓷制成,其中,所述导热体的熔点低于所述氮化铝陶瓷的熔点,多个氮化铝陶瓷制成的所述散热体(2)向外延伸地布置在金属制成的所述导热体的表面上。
12.根据权利要求11所述的冷却体,其特征在于,所述导热体(3)设计成圆柱形或圆环形,以及所述散热体(2)设计成片状。
13.根据权利要求12所述的冷却体,其特征在于,所述散热体(2)放射状地设置在所述导热体(3)的圆周上。
14.根据权利要求11所述的冷却体,其特征在于,所述导热体(3)设计成平坦的底板,以及所述散热体(2)设计成柱状或片状,所述散热体(2)竖立在所述导热体(3)上。
15.根据权利要求11所述的冷却体,其特征在于,所述导热体设计成细长杆,以及所述散热体(2)设计成带有中心孔的片状散热体(2),所述导热体穿过多个所述散热体(2)的中心孔。
16.一种照明装置,其特征在于,所述照明装置具有权利要求11至15中任一项所述的冷却体(1)。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010281127.7A CN102401358B (zh) | 2010-09-10 | 2010-09-10 | 冷却体的制造方法、冷却体以及具有该冷却体的照明装置 |
EP11752183.1A EP2516924B1 (en) | 2010-09-10 | 2011-08-30 | Making method for cooling body, cooling body and lighting device comprising the cooling body |
US13/820,536 US9448012B2 (en) | 2010-09-10 | 2011-08-30 | Making method for cooling body, cooling body and lighting device comprising the cooling body |
PCT/EP2011/064903 WO2012031943A1 (en) | 2010-09-10 | 2011-08-30 | Making method for cooling body, cooling body and lighting device comprising the cooling body |
US15/238,755 US20160354880A1 (en) | 2010-09-10 | 2016-08-17 | Making method for cooling body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010281127.7A CN102401358B (zh) | 2010-09-10 | 2010-09-10 | 冷却体的制造方法、冷却体以及具有该冷却体的照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102401358A CN102401358A (zh) | 2012-04-04 |
CN102401358B true CN102401358B (zh) | 2016-08-03 |
Family
ID=44651691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010281127.7A Expired - Fee Related CN102401358B (zh) | 2010-09-10 | 2010-09-10 | 冷却体的制造方法、冷却体以及具有该冷却体的照明装置 |
Country Status (4)
Country | Link |
---|---|
US (2) | US9448012B2 (zh) |
EP (1) | EP2516924B1 (zh) |
CN (1) | CN102401358B (zh) |
WO (1) | WO2012031943A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103470978B (zh) * | 2013-09-10 | 2016-06-15 | 日普工艺制品(东莞)有限公司 | 一种多功能灯 |
DE102014222164A1 (de) * | 2014-10-30 | 2016-05-04 | Smiths Heimann Gmbh | Kühlkörper, insbesondere für die Anode eines Röntgenstrahlungserzeugers |
CN105758058B (zh) * | 2014-12-19 | 2020-09-15 | 中国电子科技集团公司第十八研究所 | 一种高电压密集型温差电致冷器及其制备方法 |
CN104654433B (zh) * | 2014-12-31 | 2018-05-01 | 宁波先锋电器制造有限公司 | 带有曲折散热部的散热片及使用该散热片的电热油汀 |
JP1541388S (zh) * | 2015-05-21 | 2016-01-12 | ||
JP1541387S (zh) * | 2015-05-21 | 2016-01-12 | ||
CN105423257A (zh) * | 2015-12-07 | 2016-03-23 | 谢彦涛 | 一种散热器、散热器的制造方法及其应用的灯具 |
CN105603364B (zh) * | 2016-03-16 | 2018-11-23 | 深圳市华星光电技术有限公司 | 导热装置与蒸镀坩埚 |
EP3510196A4 (en) | 2016-09-12 | 2020-02-19 | Structured I, LLC | SHAPER OF WATER-DEPOSIT BRAID USING A STRUCTURED FABRIC AS THE OUTER WIRE |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1400500A1 (en) * | 2002-09-13 | 2004-03-24 | Dowa Mining Co., Ltd. | Apparatus, mold, and method for manufacturing metal-ceramic composite member |
CN101074166A (zh) * | 2006-03-31 | 2007-11-21 | 同和金属技术有限公司 | 制造金属/陶瓷连接基片的方法 |
CN101144592A (zh) * | 2006-09-13 | 2008-03-19 | 海立尔股份有限公司 | 插件式、具有散热件、热电分离式的发光二极管灯泡结构 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001284865A (ja) * | 2000-03-31 | 2001-10-12 | Fujitsu Ltd | ヒートシンク及びその製造方法、並びに、当該ヒートシンクを有する電子機器 |
US6520248B2 (en) * | 2000-05-18 | 2003-02-18 | Aavid Thermalloy Llc | Heat sink having bonded cooling fins |
US6758263B2 (en) * | 2001-12-13 | 2004-07-06 | Advanced Energy Technology Inc. | Heat dissipating component using high conducting inserts |
US6749009B2 (en) * | 2002-02-20 | 2004-06-15 | Delphi Technologies, Inc. | Folded fin on edge heat sink |
JP4036742B2 (ja) * | 2002-09-18 | 2008-01-23 | 富士通株式会社 | パッケージ構造、それを搭載したプリント基板、並びに、かかるプリント基板を有する電子機器 |
US7497013B2 (en) * | 2005-04-15 | 2009-03-03 | R-Theta Thermal Solutions Inc. | Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates |
US7246922B2 (en) * | 2005-09-28 | 2007-07-24 | Hewlett-Packard Development Company, L.P. | Lamp nose cone |
KR100754405B1 (ko) * | 2006-06-01 | 2007-08-31 | 삼성전자주식회사 | 조명기구 |
US7651247B2 (en) * | 2006-12-18 | 2010-01-26 | Mei-Liang Lo | Heat dissipating design for lamp |
DE102007057533B4 (de) * | 2007-11-29 | 2016-07-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Kühlkörper, Verfahren zur Herstellung eines Kühlkörpers und Leiterplatte mit Kühlkörper |
TW200934362A (en) * | 2008-01-16 | 2009-08-01 | Neng Tyi Prec Ind Co Ltd | Method of manufacturing heat dissipaters having heat sinks and structure thereof |
US20090303685A1 (en) * | 2008-06-10 | 2009-12-10 | Chen H W | Interface module with high heat-dissipation |
TW201019431A (en) * | 2008-11-03 | 2010-05-16 | Wen-Qiang Zhou | Insulating and heat-dissipating structure of an electronic component |
TWI407043B (zh) * | 2008-11-04 | 2013-09-01 | Advanced Optoelectronic Tech | 發光二極體光源模組及其光學引擎 |
CN201741694U (zh) * | 2010-01-07 | 2011-02-09 | 林礼裕 | 陶瓷散热器 |
DE102012205178A1 (de) * | 2011-04-04 | 2012-10-04 | Ceramtec Gmbh | Keramische Leiterplatte mit Al-Kühler |
CN202221659U (zh) * | 2011-08-09 | 2012-05-16 | 莫卓荣 | 分体式陶瓷散热器 |
-
2010
- 2010-09-10 CN CN201010281127.7A patent/CN102401358B/zh not_active Expired - Fee Related
-
2011
- 2011-08-30 WO PCT/EP2011/064903 patent/WO2012031943A1/en active Application Filing
- 2011-08-30 EP EP11752183.1A patent/EP2516924B1/en not_active Not-in-force
- 2011-08-30 US US13/820,536 patent/US9448012B2/en not_active Expired - Fee Related
-
2016
- 2016-08-17 US US15/238,755 patent/US20160354880A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1400500A1 (en) * | 2002-09-13 | 2004-03-24 | Dowa Mining Co., Ltd. | Apparatus, mold, and method for manufacturing metal-ceramic composite member |
CN101074166A (zh) * | 2006-03-31 | 2007-11-21 | 同和金属技术有限公司 | 制造金属/陶瓷连接基片的方法 |
CN101144592A (zh) * | 2006-09-13 | 2008-03-19 | 海立尔股份有限公司 | 插件式、具有散热件、热电分离式的发光二极管灯泡结构 |
Also Published As
Publication number | Publication date |
---|---|
US9448012B2 (en) | 2016-09-20 |
WO2012031943A1 (en) | 2012-03-15 |
EP2516924A1 (en) | 2012-10-31 |
US20160354880A1 (en) | 2016-12-08 |
US20130160980A1 (en) | 2013-06-27 |
EP2516924B1 (en) | 2015-05-13 |
CN102401358A (zh) | 2012-04-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102401358B (zh) | 冷却体的制造方法、冷却体以及具有该冷却体的照明装置 | |
US20110061848A1 (en) | Heat Dissipation Module and the Manufacturing Method Thereof | |
CN104235748B (zh) | 灯壳及其制造方法和包括该灯壳的照明装置 | |
US9322540B2 (en) | Heat radiation device and illuminating device having said heat radiation device | |
WO2018106554A2 (en) | Lost wax cast vapor chamber device | |
US6585925B2 (en) | Process for forming molded heat dissipation devices | |
JP2011508447A (ja) | 熱分解グラファイト埋込みヒートシンクの形成方法 | |
US9347712B2 (en) | Heat dissipating device | |
TWI472388B (zh) | Casting with metal insert and its manufacturing method | |
TWM624077U (zh) | 一種具表面圖案化鍍層的車用散熱裝置 | |
CN102045985A (zh) | 散热模块及其制造方法 | |
CN108413362A (zh) | 散热器及其加工方法和包含该散热器的车用led透镜模组 | |
CN1846920A (zh) | 结合低熔点金属合金材料的装置及制造方法与该材料应用 | |
TWI790835B (zh) | 浸沒式散熱結構及其製造方法 | |
CN203617285U (zh) | 一种快速散热的引线框架 | |
CN207486724U (zh) | 一种新型led灯散热外壳结构 | |
CN203659841U (zh) | 一种肋线式散热器 | |
CN210741200U (zh) | 一种真空均热板及终端 | |
CN203589012U (zh) | 一种加厚的引线框架 | |
CN219698283U (zh) | 带自散热腔体的铝合金型材 | |
CN203850286U (zh) | 一种适用于高温环境的塑封引线框架 | |
CN212305944U (zh) | 一种具有超高导热性能的液冷基板 | |
CN202092079U (zh) | 一种led灯泡的散热灯杯 | |
CN105277020A (zh) | 铝制太阳花散热器 | |
CN203850276U (zh) | 一种塑封引线框架 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: Munich, Germany Applicant after: Osram Co., Ltd. Address before: Munich, Germany Applicant before: Osram GMBH |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: OSRAM GMBH TO: OSRAM AG |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160803 Termination date: 20180910 |