MY188679A - Copper foil provided with carrier - Google Patents

Copper foil provided with carrier

Info

Publication number
MY188679A
MY188679A MYPI2018701007A MYPI2018701007A MY188679A MY 188679 A MY188679 A MY 188679A MY PI2018701007 A MYPI2018701007 A MY PI2018701007A MY PI2018701007 A MYPI2018701007 A MY PI2018701007A MY 188679 A MY188679 A MY 188679A
Authority
MY
Malaysia
Prior art keywords
carrier
copper foil
ultra
foil provided
layer
Prior art date
Application number
MYPI2018701007A
Other languages
English (en)
Inventor
Michiya Kohiki
Tomota Nagaura
Kazuhiko Sakaguchi
Toru Chiba
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=50278311&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY188679(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY188679A publication Critical patent/MY188679A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
MYPI2018701007A 2012-09-11 2013-09-11 Copper foil provided with carrier MY188679A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012200017 2012-09-11
JP2012200973 2012-09-12
JP2012280024 2012-12-21
JP2013012468A JP5481577B1 (ja) 2012-09-11 2013-01-25 キャリア付き銅箔

Publications (1)

Publication Number Publication Date
MY188679A true MY188679A (en) 2021-12-22

Family

ID=50278311

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI2015000601A MY167704A (en) 2012-09-11 2013-09-11 Copper foil provided with carrier
MYPI2018701007A MY188679A (en) 2012-09-11 2013-09-11 Copper foil provided with carrier

Family Applications Before (1)

Application Number Title Priority Date Filing Date
MYPI2015000601A MY167704A (en) 2012-09-11 2013-09-11 Copper foil provided with carrier

Country Status (7)

Country Link
JP (1) JP5481577B1 (ja)
KR (2) KR102050646B1 (ja)
CN (4) CN104619889B (ja)
MY (2) MY167704A (ja)
PH (1) PH12015500529B1 (ja)
TW (2) TWI504788B (ja)
WO (1) WO2014042201A1 (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI504504B (zh) * 2012-11-20 2015-10-21 Jx Nippon Mining & Metals Corp Attached copper foil
KR20150126008A (ko) * 2013-03-04 2015-11-10 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 캐리어 부착 동박, 그것을 사용한 구리 피복 적층판, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
TWI613940B (zh) * 2014-03-31 2018-02-01 Jx Nippon Mining & Metals Corp 附載體之銅箔、印刷配線板、積層體、電子機器及印刷配線板之製造方法
JP2015205481A (ja) * 2014-04-22 2015-11-19 Jx日鉱日石金属株式会社 キャリア付銅箔、銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法
JP6591766B2 (ja) * 2014-04-24 2019-10-16 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、積層体、電子機器及びプリント配線板の製造方法
JP6297011B2 (ja) * 2014-08-28 2018-03-20 株式会社有沢製作所 ３層フレキシブル金属張積層板及び両面３層フレキシブル金属張積層板
CN105050331B (zh) * 2015-07-07 2016-09-07 安徽铜冠铜箔有限公司 一种用于陶瓷基高频覆铜板的高粗糙度电子铜箔的制造方法
JP6782561B2 (ja) * 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
CN109072472B (zh) * 2016-04-14 2020-10-16 三井金属矿业株式会社 表面处理铜箔、带载体铜箔、以及使用它们的覆铜层叠板及印刷电路板的制造方法
CN110603654B (zh) * 2017-04-27 2023-03-21 京瓷株式会社 电路基板以及具备其的发光装置
JP6815507B2 (ja) 2017-06-29 2021-01-20 京セラ株式会社 回路基板およびこれを備える発光装置
US10711360B2 (en) * 2017-07-14 2020-07-14 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions with copolymers of arginine and bisepoxides and methods of electroplating nickel
US11950376B2 (en) 2018-03-30 2024-04-02 Mitsui Mining & Smelting Co., Ltd. Copper-clad laminate
KR102098475B1 (ko) 2018-07-06 2020-04-07 주식회사 포스코 내식성, 도장성이 우수한 표면처리된 Zn-Ni 합금 전기도금강판의 제조방법
JP6895936B2 (ja) * 2018-09-28 2021-06-30 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及び回路基板
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
TWI697549B (zh) * 2019-12-23 2020-07-01 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
TWI740515B (zh) 2019-12-23 2021-09-21 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
JP7260059B2 (ja) * 2020-03-30 2023-04-18 三菱マテリアル株式会社 接合体、および、絶縁回路基板
CN112226790B (zh) * 2020-10-19 2022-04-22 九江德福科技股份有限公司 一种超薄高强度电子铜箔的生产方法
WO2022153580A1 (ja) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
JPWO2022244826A1 (ja) * 2021-05-20 2022-11-24
JPWO2022255421A1 (ja) * 2021-06-03 2022-12-08
EP4362611A1 (en) * 2021-06-24 2024-05-01 Kyocera Corporation Wiring board
WO2023281759A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
TWI781818B (zh) * 2021-11-05 2022-10-21 長春石油化學股份有限公司 表面處理銅箔及銅箔基板

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2536095B2 (ja) * 1988-10-20 1996-09-18 日立化成工業株式会社 配線板の製造法
US6461745B2 (en) * 2000-04-25 2002-10-08 Nippon Denkai, Ltd. Copper foil for tape carrier and tab carrier tape and tab tape carrier using the copper foil
US7026059B2 (en) 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
JP2002134858A (ja) * 2000-10-25 2002-05-10 Hitachi Cable Ltd プリント基板用銅箔
WO2004005588A1 (ja) 2002-07-04 2004-01-15 Mitsui Mining & Smelting Co.,Ltd. キャリア箔付電解銅箔
JP2005008955A (ja) * 2003-06-19 2005-01-13 Hitachi Cable Ltd 銅箔の表面処理方法
JP4087369B2 (ja) * 2003-11-11 2008-05-21 古河サーキットフォイル株式会社 キャリア付き極薄銅箔、およびプリント配線板
US7341796B2 (en) * 2004-02-17 2008-03-11 Nippon Mining & Metals Co., Ltd Copper foil having blackened surface or layer
JP4567360B2 (ja) * 2004-04-02 2010-10-20 三井金属鉱業株式会社 銅箔の製造方法及びその製造方法で得られる銅箔
JP4429979B2 (ja) 2005-06-29 2010-03-10 古河電気工業株式会社 キャリア付き極薄銅箔及びキャリア付き極薄銅箔の製造方法
JP2007314855A (ja) * 2006-05-29 2007-12-06 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、銅張積層板及びプリント配線基板
JP4157898B2 (ja) * 2006-10-02 2008-10-01 株式会社神戸製鋼所 プレス打ち抜き性に優れた電気電子部品用銅合金板
CN101636527B (zh) * 2007-03-15 2011-11-09 日矿金属株式会社 铜电解液和使用该铜电解液得到的两层挠性基板
JP5129642B2 (ja) * 2007-04-19 2013-01-30 三井金属鉱業株式会社 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板
CN101842518B (zh) * 2007-10-31 2012-07-18 杰富意钢铁株式会社 表面处理钢板及其制造方法、以及树脂被覆钢板
KR101351928B1 (ko) * 2007-12-28 2014-01-21 일진머티리얼즈 주식회사 캐리어박 부착 극박 동박, 그 제조 방법 및 이를 채용한프린트 배선 기판
TWI499690B (zh) * 2009-03-13 2015-09-11 Ajinomoto Kk Paste metal laminates
JP2010236072A (ja) * 2009-03-31 2010-10-21 Nippon Mining & Metals Co Ltd 積層銅箔及びその製造方法
JP5282675B2 (ja) * 2009-06-23 2013-09-04 日立電線株式会社 プリント配線板用銅箔およびその製造方法
JP2010006071A (ja) 2009-08-21 2010-01-14 Furukawa Electric Co Ltd:The 表面処理銅箔、キャリア付き極薄銅箔、フレキシブル銅張積層板及びポリイミド系フレキシブルプリント配線板
JP5356968B2 (ja) * 2009-09-30 2013-12-04 Ｊｘ日鉱日石金属株式会社 Ｓｎめっき被膜、及びそれを有する複合材料
JP2011116074A (ja) * 2009-12-07 2011-06-16 Jx Nippon Mining & Metals Corp 電気抵抗膜を備えた金属箔及び同金属箔を用いたプリント回路用基板
CN103154327A (zh) * 2010-10-06 2013-06-12 古河电气工业株式会社 铜箔及其制备方法、带有载体的铜箔及其制备方法、印刷电路板、多层印刷电路板
CN102452197B (zh) * 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
KR20140009323A (ko) * 2011-01-26 2014-01-22 스미토모 베이클리트 컴퍼니 리미티드 프린트 배선판 및 프린트 배선판의 제조 방법
JP2012167297A (ja) * 2011-02-09 2012-09-06 Jfe Steel Corp 電気亜鉛めっき鋼板

Also Published As

Publication number Publication date
TWI504788B (zh) 2015-10-21
CN108588766B (zh) 2020-02-18
CN104619889A (zh) 2015-05-13
CN108588766A (zh) 2018-09-28
TW201533280A (zh) 2015-09-01
KR20170046822A (ko) 2017-05-02
KR101766554B1 (ko) 2017-08-08
KR102050646B1 (ko) 2019-11-29
WO2014042201A1 (ja) 2014-03-20
JP5481577B1 (ja) 2014-04-23
CN104619889B (zh) 2018-10-09
MY167704A (en) 2018-09-21
TWI575120B (zh) 2017-03-21
CN109379858A (zh) 2019-02-22
KR20150052315A (ko) 2015-05-13
TW201428144A (zh) 2014-07-16
PH12015500529A1 (en) 2015-04-27
PH12015500529B1 (en) 2015-04-27
CN107641820A (zh) 2018-01-30
JP2014139336A (ja) 2014-07-31

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