JPWO2022244826A1 - - Google Patents
Info
- Publication number
- JPWO2022244826A1 JPWO2022244826A1 JP2023522710A JP2023522710A JPWO2022244826A1 JP WO2022244826 A1 JPWO2022244826 A1 JP WO2022244826A1 JP 2023522710 A JP2023522710 A JP 2023522710A JP 2023522710 A JP2023522710 A JP 2023522710A JP WO2022244826 A1 JPWO2022244826 A1 JP WO2022244826A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021085489 | 2021-05-20 | ||
| PCT/JP2022/020747 WO2022244826A1 (ja) | 2021-05-20 | 2022-05-18 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022244826A1 true JPWO2022244826A1 (ja) | 2022-11-24 |
Family
ID=84141650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023522710A Pending JPWO2022244826A1 (ja) | 2021-05-20 | 2022-05-18 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2022244826A1 (ja) |
| KR (1) | KR20240009403A (ja) |
| CN (1) | CN117321253A (ja) |
| TW (1) | TWI804323B (ja) |
| WO (1) | WO2022244826A1 (ja) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5242710B2 (ja) * | 2010-01-22 | 2013-07-24 | 古河電気工業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
| JP5204908B1 (ja) * | 2012-03-26 | 2013-06-05 | Ｊｘ日鉱日石金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板 |
| JP5481577B1 (ja) * | 2012-09-11 | 2014-04-23 | Ｊｘ日鉱日石金属株式会社 | キャリア付き銅箔 |
| JP6591893B2 (ja) * | 2013-06-04 | 2019-10-16 | Ｊｘ金属株式会社 | キャリア付銅箔、銅張積層板、プリント配線板、電子機器、樹脂層、キャリア付銅箔の製造方法、及びプリント配線板の製造方法 |
| JP6373166B2 (ja) * | 2014-10-30 | 2018-08-15 | Ｊｘ金属株式会社 | 表面処理銅箔及び積層板 |
| KR102031065B1 (ko) | 2015-01-22 | 2019-10-11 | 미쓰이금속광업주식회사 | 캐리어 부착 극박 동박 및 그 제조 방법, 동장 적층판, 및 프린트 배선판의 제조 방법 |
| CN107532322B (zh) * | 2015-04-28 | 2019-07-16 | 三井金属矿业株式会社 | 粗糙化处理铜箔及印刷电路板 |
| JP6200042B2 (ja) * | 2015-08-06 | 2017-09-20 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP6182584B2 (ja) * | 2015-12-09 | 2017-08-16 | 古河電気工業株式会社 | プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板 |
| JP6430092B1 (ja) * | 2017-05-19 | 2018-11-28 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
| JP7127861B2 (ja) * | 2017-11-10 | 2022-08-30 | ナミックス株式会社 | 複合銅箔 |
| CN112424399B (zh) | 2018-08-10 | 2023-07-25 | 三井金属矿业株式会社 | 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板 |
| US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
-
2022
- 2022-05-18 CN CN202280035616.5A patent/CN117321253A/zh active Pending
- 2022-05-18 KR KR1020237038900A patent/KR20240009403A/ko unknown
- 2022-05-18 WO PCT/JP2022/020747 patent/WO2022244826A1/ja active Application Filing
- 2022-05-18 JP JP2023522710A patent/JPWO2022244826A1/ja active Pending
- 2022-05-20 TW TW111118883A patent/TWI804323B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202302914A (zh) | 2023-01-16 |
| TWI804323B (zh) | 2023-06-01 |
| WO2022244826A1 (ja) | 2022-11-24 |
| KR20240009403A (ko) | 2024-01-22 |
| CN117321253A (zh) | 2023-12-29 |