JP6815507B2 - 回路基板およびこれを備える発光装置 - Google Patents
回路基板およびこれを備える発光装置 Download PDFInfo
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- JP6815507B2 JP6815507B2 JP2019526721A JP2019526721A JP6815507B2 JP 6815507 B2 JP6815507 B2 JP 6815507B2 JP 2019526721 A JP2019526721 A JP 2019526721A JP 2019526721 A JP2019526721 A JP 2019526721A JP 6815507 B2 JP6815507 B2 JP 6815507B2
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- 239000000945 filler Substances 0.000 claims description 125
- 229920002050 silicone resin Polymers 0.000 claims description 79
- 239000000758 substrate Substances 0.000 claims description 35
- 239000004020 conductor Substances 0.000 claims description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 24
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 22
- 239000002923 metal particle Substances 0.000 claims description 22
- 235000012239 silicon dioxide Nutrition 0.000 claims description 12
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- 239000004408 titanium dioxide Substances 0.000 claims description 11
- 229910002113 barium titanate Inorganic materials 0.000 claims description 10
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 10
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 description 28
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- 239000010949 copper Substances 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 16
- 239000000843 powder Substances 0.000 description 14
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 13
- 239000010408 film Substances 0.000 description 12
- 238000007747 plating Methods 0.000 description 11
- 239000000919 ceramic Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000002994 raw material Substances 0.000 description 10
- 239000010936 titanium Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 229910052719 titanium Inorganic materials 0.000 description 8
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 6
- 239000011224 oxide ceramic Substances 0.000 description 6
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 6
- 229910001928 zirconium oxide Inorganic materials 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 229910052574 oxide ceramic Inorganic materials 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 238000010191 image analysis Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 238000005422 blasting Methods 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 2
- 239000010956 nickel silver Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- YSWBFLWKAIRHEI-UHFFFAOYSA-N 4,5-dimethyl-1h-imidazole Chemical compound CC=1N=CNC=1C YSWBFLWKAIRHEI-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- 229940100630 metacresol Drugs 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 1
- URLKBWYHVLBVBO-UHFFFAOYSA-N p-dimethylbenzene Natural products CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polysiloxane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
2、2a、2b:導体層
3、3a、3b:反射層
4:シリコーン樹脂層
5:発光素子
6:ボンディングワイヤ
10:回路基板
20:発光装置
Claims (12)
- 基板と、
該基板上に位置する導体層と、
該導体層上に位置する反射層と、
前記基板上に位置するとともに、前記導体層および前記反射層に接して位置するシリコーン樹脂層と、を備え、
前記シリコーン樹脂層は、複数のフィラーを45質量%以上含有しており、前記フィラーの全個数100%のうち、アスペクト比が5より大きい第1フィラーが5%以上占め、
前記シリコーン樹脂層は、円相当径が5μm以下である金属粒子を含有し、該金属粒子の個数は、前記シリコーン樹脂層の内部より表面の方が多い
回路基板。 - 前記第1フィラーは、二酸化珪素またはチタン酸カリウムからなる請求項1に記載の回路基板。
- 前記シリコーン樹脂層は、前記フィラーを80質量%以下含有している請求項1または請求項2に記載の回路基板。
- 前記第1フィラーは、前記フィラーの全個数の40%以下である請求項1乃至請求項3のいずれかに記載の回路基板。
- 前記フィラーの全個数100%のうち、二酸化チタンからなる第2フィラーが40%以上55%以下占める請求項1乃至請求項4のいずれかに記載の回路基板。
- 前記第2フィラーの円相当径の平均値は、0.5μm以上3μm以下である請求項5に記載の回路基板。
- 前記フィラーの全個数100%のうち、チタン酸バリウムからなる第3フィラーが5%以上10%以下占める請求項1乃至請求項6のいずれかに記載の回路基板。
- 前記第3フィラーの円相当径の平均値は、0.3μm以上2μm以下である請求項7に記載の回路基板。
- 前記シリコーン樹脂層の表面の高さは、前記反射層の表面の高さよりも5μm以上低い請求項1乃至請求項8のいずれかに記載の回路基板。
- 前記シリコーン樹脂層の表面における粗さ曲線から求められる算術平均粗さRa1は、前記反射層の表面における粗さ曲線から求められる算術平均粗さRa2よりも大きい請求項1乃至請求項9のいずれかに記載の回路基板。
- 前記表面の1mm2の面積の範囲における前記金属粒子の個数が2個以上5個以下である請求項1乃至請求項10のいずれかに記載の回路基板。
- 請求項1乃至請求項11のいずれかに記載の回路基板と、該回路基板上に位置する発光素子とを備える発光装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017127610 | 2017-06-29 | ||
JP2017127610 | 2017-06-29 | ||
PCT/JP2018/020759 WO2019003775A1 (ja) | 2017-06-29 | 2018-05-30 | 回路基板およびこれを備える発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019003775A1 JPWO2019003775A1 (ja) | 2020-04-02 |
JP6815507B2 true JP6815507B2 (ja) | 2021-01-20 |
Family
ID=64740556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019526721A Active JP6815507B2 (ja) | 2017-06-29 | 2018-05-30 | 回路基板およびこれを備える発光装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11304291B2 (ja) |
JP (1) | JP6815507B2 (ja) |
CN (1) | CN110800118B (ja) |
TW (1) | TWI699021B (ja) |
WO (1) | WO2019003775A1 (ja) |
Family Cites Families (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3889700B2 (ja) * | 2002-03-13 | 2007-03-07 | 三井金属鉱業株式会社 | Cofフィルムキャリアテープの製造方法 |
JP2005294779A (ja) * | 2004-04-06 | 2005-10-20 | Matsushita Electric Ind Co Ltd | Led光源 |
JP4630642B2 (ja) * | 2004-11-16 | 2011-02-09 | 三菱樹脂株式会社 | 脂肪族ポリエステル系樹脂反射フィルム及び反射板 |
JP5016206B2 (ja) * | 2005-06-23 | 2012-09-05 | 出光興産株式会社 | 反射体用樹脂組成物及びそれからなる反射体 |
CN101410994B (zh) * | 2006-03-29 | 2011-06-15 | 京瓷株式会社 | 发光装置 |
KR101468748B1 (ko) | 2006-09-27 | 2014-12-04 | 도판 인사츠 가부시키가이샤 | 광학 소자, 라벨 부착 물품, 광학 키트 및 판별 방법 |
WO2009011077A1 (ja) * | 2007-07-17 | 2009-01-22 | Mitsubishi Electric Corporation | 半導体装置及びその製造方法 |
US9660153B2 (en) * | 2007-11-14 | 2017-05-23 | Cree, Inc. | Gap engineering for flip-chip mounted horizontal LEDs |
JP2009129801A (ja) | 2007-11-27 | 2009-06-11 | Denki Kagaku Kogyo Kk | 金属ベース回路基板 |
JP2010263165A (ja) * | 2009-05-11 | 2010-11-18 | Mitsubishi Plastics Inc | Led用反射基板及び発光装置 |
JP5385685B2 (ja) * | 2009-05-28 | 2014-01-08 | 三菱樹脂株式会社 | カバーレイフィルム、発光素子搭載用基板及び光源装置 |
JP5230532B2 (ja) * | 2009-05-29 | 2013-07-10 | 三菱樹脂株式会社 | 白色フィルム、金属積層体、led搭載用基板及び光源装置 |
EP2460783A4 (en) * | 2009-07-31 | 2013-02-20 | Kyocera Corp | CERAMIC SUBSTRATE FOR FIXING A LIGHT ELEMENT |
JP5488326B2 (ja) * | 2009-09-01 | 2014-05-14 | 信越化学工業株式会社 | 光半導体装置用白色熱硬化性シリコーンエポキシ混成樹脂組成物及びその製造方法並びにプレモールドパッケージ及びled装置 |
US8528200B2 (en) * | 2009-12-18 | 2013-09-10 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing printed wiring board |
JP2011140550A (ja) * | 2010-01-06 | 2011-07-21 | Shin-Etsu Chemical Co Ltd | 光学素子ケース成形用付加硬化型シリコーン樹脂組成物及び光半導体装置 |
JP6157118B2 (ja) * | 2010-03-23 | 2017-07-05 | 株式会社朝日ラバー | 可撓性反射基材、その製造方法及びその反射基材に用いる原材料組成物 |
JP2010251783A (ja) * | 2010-06-14 | 2010-11-04 | Hitachi Chem Co Ltd | 半導体搭載用基板および半導体パッケージ |
CN102844897B (zh) * | 2010-06-15 | 2016-01-13 | 古河电气工业株式会社 | 光半导体装置用引线框架、光半导体装置用引线框架的制造方法以及光半导体装置 |
JP5111686B2 (ja) * | 2010-09-29 | 2013-01-09 | 京セラ株式会社 | 発光素子搭載用セラミックス基体および発光装置 |
EP2633554A1 (en) * | 2010-10-27 | 2013-09-04 | Koninklijke Philips Electronics N.V. | Laminate support film for fabrication of light emitting devices and method its fabrication |
JP5514702B2 (ja) * | 2010-11-29 | 2014-06-04 | 三菱樹脂株式会社 | カバーレイフィルム、発光素子搭載用基板及び光源装置 |
JP2012116003A (ja) * | 2010-11-29 | 2012-06-21 | Mitsubishi Plastics Inc | 金属積層体、led搭載用基板及び光源装置 |
JP2012151191A (ja) * | 2011-01-17 | 2012-08-09 | Ibiden Co Ltd | Led用配線基板、発光モジュール、led用配線基板の製造方法、及び発光モジュールの製造方法 |
JP4762374B1 (ja) * | 2011-02-14 | 2011-08-31 | 積水化学工業株式会社 | 感光性組成物及びプリント配線板 |
WO2012169408A1 (ja) * | 2011-06-08 | 2012-12-13 | 京セラ株式会社 | 回路基板およびこれを備える電子装置 |
CN104025726A (zh) * | 2012-02-10 | 2014-09-03 | 三菱树脂株式会社 | 表面保护膜、发光元件搭载用基板及光源装置 |
JP2013226769A (ja) * | 2012-04-27 | 2013-11-07 | Asahi Rubber Inc | 白色反射膜付基材、それを用いた白色反射膜付カバーレイシート及び白色反射膜付回路基板 |
WO2013191288A1 (ja) * | 2012-06-21 | 2013-12-27 | 京セラ株式会社 | 回路基板およびこれを備える電子装置 |
JP5481577B1 (ja) | 2012-09-11 | 2014-04-23 | Jx日鉱日石金属株式会社 | キャリア付き銅箔 |
US20140191263A1 (en) * | 2013-01-07 | 2014-07-10 | Sabic Innovative Plastics Ip B.V. | Compositions for an led reflector and articles thereof |
JP6034484B2 (ja) * | 2013-03-26 | 2016-11-30 | 京セラ株式会社 | 発光素子実装用基板および発光素子モジュール |
JP2014201627A (ja) * | 2013-04-02 | 2014-10-27 | 三菱化学株式会社 | 熱硬化性シリコーン樹脂組成物、シリコーン樹脂成形体の製造方法、およびシリコーン樹脂成形体 |
EP3092663B1 (en) * | 2014-01-06 | 2021-09-15 | Lumileds LLC | Semiconductor light emitting device with shaped substrate and method for manufacturing the same |
CN105874619B (zh) * | 2014-01-10 | 2019-08-20 | 夏普株式会社 | 发光装置用基板、发光装置及发光装置用基板的制造方法 |
KR102235258B1 (ko) * | 2014-02-04 | 2021-04-05 | 삼성디스플레이 주식회사 | 발광 다이오드 패키지 및 이를 포함하는 백라이트 유닛 |
JP6197696B2 (ja) * | 2014-02-28 | 2017-09-20 | 日亜化学工業株式会社 | 発光装置の製造方法及び発光装置 |
US9799812B2 (en) * | 2014-05-09 | 2017-10-24 | Kyocera Corporation | Light emitting element mounting substrate and light emitting device |
JP2016018068A (ja) * | 2014-07-08 | 2016-02-01 | 旭硝子株式会社 | 防眩膜付き基材および物品 |
CN105244396B (zh) * | 2014-07-10 | 2017-09-26 | 光红建圣股份有限公司 | 光电微型模块及其制造方法 |
JP6307009B2 (ja) * | 2014-10-31 | 2018-04-04 | 株式会社ノリタケカンパニーリミテド | 回路基板と回路基板用の導体ペースト |
WO2016092956A1 (ja) * | 2014-12-08 | 2016-06-16 | シャープ株式会社 | 発光装置用基板及び発光装置用基板の製造方法 |
JP6374339B2 (ja) * | 2015-03-26 | 2018-08-15 | 日亜化学工業株式会社 | 発光装置 |
JP2017002296A (ja) * | 2015-06-09 | 2017-01-05 | 大日本印刷株式会社 | 樹脂組成物、リフレクター、リフレクターの製造方法、リフレクター付き光半導体素子実装用基板及び半導体発光装置 |
JP2017041467A (ja) | 2015-08-17 | 2017-02-23 | ローム株式会社 | 光半導体装置 |
JP6615557B2 (ja) * | 2015-09-30 | 2019-12-04 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
JP6606966B2 (ja) * | 2015-10-17 | 2019-11-20 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
JP2017098376A (ja) * | 2015-11-20 | 2017-06-01 | 住友ベークライト株式会社 | 樹脂組成物、回路基板、発熱体搭載基板および回路基板の製造方法 |
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