JPWO2022255421A1 - - Google Patents
Info
- Publication number
- JPWO2022255421A1 JPWO2022255421A1 JP2023525898A JP2023525898A JPWO2022255421A1 JP WO2022255421 A1 JPWO2022255421 A1 JP WO2022255421A1 JP 2023525898 A JP2023525898 A JP 2023525898A JP 2023525898 A JP2023525898 A JP 2023525898A JP WO2022255421 A1 JPWO2022255421 A1 JP WO2022255421A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021093517 | 2021-06-03 | ||
| JP2021121031 | 2021-07-21 | ||
| PCT/JP2022/022387 WO2022255421A1 (ja) | 2021-06-03 | 2022-06-01 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022255421A1 true JPWO2022255421A1 (ja) | 2022-12-08 |
Family
ID=84324125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023525898A Pending JPWO2022255421A1 (ja) | 2021-06-03 | 2022-06-01 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2022255421A1 (ja) |
| KR (1) | KR20240017841A (ja) |
| TW (1) | TWI808775B (ja) |
| WO (1) | WO2022255421A1 (ja) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006210689A (ja) * | 2005-01-28 | 2006-08-10 | Fukuda Metal Foil & Powder Co Ltd | 高周波プリント配線板用銅箔及びその製造方法 |
| JP5481577B1 (ja) * | 2012-09-11 | 2014-04-23 | Ｊｘ日鉱日石金属株式会社 | キャリア付き銅箔 |
| JP6353193B2 (ja) * | 2013-04-02 | 2018-07-04 | Ｊｘ金属株式会社 | キャリア付き銅箔、当該キャリア付き銅箔を用いて銅張積層板を製造する方法、当該キャリア付き銅箔を用いてプリント配線板を製造する方法、及びプリント配線板の製造方法 |
| JP5758035B2 (ja) | 2013-08-20 | 2015-08-05 | Jx日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法 |
| JP2018145519A (ja) * | 2017-03-03 | 2018-09-20 | Ｊｘ金属株式会社 | 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP7356209B2 (ja) | 2017-03-31 | 2023-10-04 | Ｊｘ金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| SG11202009376SA (en) * | 2018-03-30 | 2020-10-29 | Mitsui Mining & Smelting Co | Copper-clad laminate |
-
2022
- 2022-06-01 KR KR1020237043495A patent/KR20240017841A/ko unknown
- 2022-06-01 JP JP2023525898A patent/JPWO2022255421A1/ja active Pending
- 2022-06-01 WO PCT/JP2022/022387 patent/WO2022255421A1/ja unknown
- 2022-06-02 TW TW111120637A patent/TWI808775B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI808775B (zh) | 2023-07-11 |
| KR20240017841A (ko) | 2024-02-08 |
| WO2022255421A1 (ja) | 2022-12-08 |
| TW202248458A (zh) | 2022-12-16 |