MX2007005018A - Metodo y aparato para formar ranuras. - Google Patents

Metodo y aparato para formar ranuras.

Info

Publication number
MX2007005018A
MX2007005018A MX2007005018A MX2007005018A MX2007005018A MX 2007005018 A MX2007005018 A MX 2007005018A MX 2007005018 A MX2007005018 A MX 2007005018A MX 2007005018 A MX2007005018 A MX 2007005018A MX 2007005018 A MX2007005018 A MX 2007005018A
Authority
MX
Mexico
Prior art keywords
point
substrate
line
cooling
unit
Prior art date
Application number
MX2007005018A
Other languages
English (en)
Spanish (es)
Inventor
Togo Gonoe
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of MX2007005018A publication Critical patent/MX2007005018A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/16—Transversely of continuously fed work
    • Y10T225/18—Progressively to or from one side edge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Quality & Reliability (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
MX2007005018A 2004-10-25 2005-10-25 Metodo y aparato para formar ranuras. MX2007005018A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004309958 2004-10-25
PCT/JP2005/019533 WO2006046525A1 (ja) 2004-10-25 2005-10-25 クラック形成方法およびクラック形成装置

Publications (1)

Publication Number Publication Date
MX2007005018A true MX2007005018A (es) 2008-02-19

Family

ID=36227765

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2007005018A MX2007005018A (es) 2004-10-25 2005-10-25 Metodo y aparato para formar ranuras.

Country Status (9)

Country Link
US (1) US7726532B2 (https=)
EP (1) EP1806202B1 (https=)
JP (1) JP4722054B2 (https=)
KR (1) KR100821937B1 (https=)
CN (1) CN100475419C (https=)
AT (1) ATE520495T1 (https=)
MX (1) MX2007005018A (https=)
TW (1) TW200621661A (https=)
WO (1) WO2006046525A1 (https=)

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007018674A1 (de) * 2007-04-18 2008-10-23 Lzh Laserzentrum Hannover E.V. Verfahren zum Bilden von Durchgangslöchern in Bauteilen aus Glas
DE102008001229A1 (de) * 2007-04-25 2008-10-30 Ceramtec Ag Chip-Resistor-Substrat
WO2008133800A1 (en) * 2007-04-30 2008-11-06 Corning Incorporated Apparatus, system, and method for scoring a moving glass ribbon
JP5011048B2 (ja) 2007-09-27 2012-08-29 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
KR100949152B1 (ko) * 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치
CN101468875A (zh) 2007-12-24 2009-07-01 鸿富锦精密工业（深圳）有限公司 脆性非金属基材及其切割方法
CN101910076B (zh) * 2007-12-27 2013-01-30 三星钻石工业股份有限公司 脆性材料基板的裂痕形成方法
CN101497150B (zh) * 2008-02-01 2012-10-10 鸿富锦精密工业（深圳）有限公司 激光切割装置
KR100848854B1 (ko) * 2008-04-21 2008-07-30 주식회사 탑 엔지니어링 취성기판의 스크라이빙 장치 및 그 방법
IT1394891B1 (it) * 2008-07-25 2012-07-20 Matteo Baistrocchi Impianto di scribing laser per il trattamento superficiale di lamierini magnetici con spot a sezione ellittica
KR101041137B1 (ko) * 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
JP2010232603A (ja) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 基板固定装置
TWI517922B (zh) 2009-05-13 2016-01-21 康寧公司 切割脆性材料之方法
WO2010138451A2 (en) * 2009-05-27 2010-12-02 Corning Incorporated Laser scoring of glass at elevated temperatures
US20110011227A1 (en) * 2009-07-15 2011-01-20 Tingley Iii William Q Method and apparatus for non-rotary holemaking by means of controlled fracturing
US11235395B2 (en) * 2009-07-15 2022-02-01 Tennine Corp. Controlled fracture machining method for producing through-holes
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
WO2011155314A1 (ja) * 2010-06-07 2011-12-15 日本電気硝子株式会社 ガラス板の切断方法
JP5696393B2 (ja) * 2010-08-02 2015-04-08 日本電気硝子株式会社 ガラスフィルムの割断方法
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
KR101358672B1 (ko) * 2012-08-13 2014-02-11 한국과학기술원 극초단 펄스 레이저를 이용한 투명시편 절단방법 및 다이싱 장치
KR101355807B1 (ko) * 2012-09-11 2014-02-03 로체 시스템즈(주) 비금속 재료의 곡선 절단방법
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9092187B2 (en) 2013-01-08 2015-07-28 Apple Inc. Ion implant indicia for cover glass or display component
US9623628B2 (en) * 2013-01-10 2017-04-18 Apple Inc. Sapphire component with residual compressive stress
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
KR101641807B1 (ko) 2013-02-12 2016-07-21 애플 인크. 다단계 이온 주입
WO2014134470A1 (en) * 2013-02-28 2014-09-04 Ipg Photonics Corporation Laser system and method for processing sapphire
US10286487B2 (en) * 2013-02-28 2019-05-14 Ipg Photonics Corporation Laser system and method for processing sapphire
US9416442B2 (en) 2013-03-02 2016-08-16 Apple Inc. Sapphire property modification through ion implantation
EP2781296B1 (de) * 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9508570B2 (en) * 2013-10-21 2016-11-29 Asm Technology Singapore Pte Ltd Singulation apparatus and method
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
EP3110592B1 (en) 2014-02-28 2020-01-15 IPG Photonics Corporation Multple-laser distinct wavelengths and pulse durations processing
US10343237B2 (en) 2014-02-28 2019-07-09 Ipg Photonics Corporation System and method for laser beveling and/or polishing
US9764427B2 (en) 2014-02-28 2017-09-19 Ipg Photonics Corporation Multi-laser system and method for cutting and post-cut processing hard dielectric materials
KR101836025B1 (ko) * 2014-06-11 2018-03-07 가부시키가이샤 아이에이치아이 취성 재료 기판의 절단 방법 및 취성 재료 기판의 절단 장치
EP3165615B1 (en) * 2014-07-03 2022-12-21 Nippon Steel Corporation Use of a laser processing apparatus for refining magnetic domains of a grain-oriented electromagnetic steel sheet
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
WO2016010991A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
EP3169479B1 (en) 2014-07-14 2019-10-02 Corning Incorporated Method of and system for arresting incident crack propagation in a transparent material
CN208586209U (zh) 2014-07-14 2019-03-08 康宁股份有限公司 一种用于在工件中形成限定轮廓的多个缺陷的系统
JP2017530867A (ja) * 2014-07-14 2017-10-19 コーニング インコーポレイテッド 長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法
EP3186030B1 (en) 2014-08-28 2023-02-22 IPG Photonics Corporation Multi-laser system and method for cutting and post-cut processing hard dielectric materials
WO2016033494A1 (en) 2014-08-28 2016-03-03 Ipg Photonics Corporation System and method for laser beveling and/or polishing
JP6303950B2 (ja) * 2014-09-19 2018-04-04 旭硝子株式会社 ガラス板の加工方法
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
KR20170105562A (ko) 2015-01-12 2017-09-19 코닝 인코포레이티드 다중 광자 흡수 방법을 사용한 열적 템퍼링된 기판의 레이저 절단
WO2016125609A1 (ja) * 2015-02-03 2016-08-11 セントラル硝子株式会社 脆性材料の切断方法、脆性材料の切断装置、切断脆性材料の製造方法及び切断脆性材料
JP7292006B2 (ja) 2015-03-24 2023-06-16 コーニング インコーポレイテッド ディスプレイガラス組成物のレーザ切断及び加工
EP3274313A1 (en) 2015-03-27 2018-01-31 Corning Incorporated Gas permeable window and method of fabricating the same
CN107835794A (zh) 2015-07-10 2018-03-23 康宁股份有限公司 在挠性基材板中连续制造孔的方法和与此相关的产品
US10280504B2 (en) 2015-09-25 2019-05-07 Apple Inc. Ion-implanted, anti-reflective layer formed within sapphire material
DE102016000051A1 (de) 2016-01-05 2017-07-06 Siltectra Gmbh Verfahren und Vorrichtung zum planaren Erzeugen von Modifikationen in Festkörpern
EP4166270B1 (de) * 2016-03-22 2024-10-16 Siltectra GmbH Verfahren zum abtrennen durch laserbestrahlung einer festkörperschicht von einem festkörper
EP3452418B1 (en) 2016-05-06 2022-03-02 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
JP2019532908A (ja) 2016-08-30 2019-11-14 コーニング インコーポレイテッド 強度マッピング光学システムによる材料のレーザー切断
JP6923284B2 (ja) 2016-09-30 2021-08-18 コーニング インコーポレイテッド 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
LT3529214T (lt) 2016-10-24 2021-02-25 Corning Incorporated Substrato apdorojimo stotis lakšto formos stiklo substratų lazeriniam mašininiam apdorojimui
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
WO2018108938A1 (de) 2016-12-12 2018-06-21 Siltectra Gmbh Verfahren zum dünnen von mit bauteilen versehenen festkörperschichten
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
CN108002696B (zh) * 2017-12-27 2024-05-17 信义玻璃（营口）有限公司 一种跟踪控制装置和冷却控制系统
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN110293310A (zh) * 2018-03-22 2019-10-01 孟晋科技股份有限公司 避免铝分子渗入镀铝硅高张力钢板焊道的加工方法
TWI706614B (zh) * 2018-11-10 2020-10-01 鴻超環保能源股份有限公司 雷射光源模組
CN109680448B (zh) * 2019-01-21 2024-04-19 苏州大喆智能科技有限公司 一种切线热粘装置
CN112828474B (zh) * 2020-12-31 2022-07-05 武汉华工激光工程有限责任公司 用于透明脆性材料的斜向切割补偿方法及系统
JP7713186B2 (ja) * 2021-08-18 2025-07-25 エンシュウ株式会社 レーザ加工装置
US12387307B2 (en) 2022-10-26 2025-08-12 Saudi Arabian Oil Company Determining severity of stepwise cracking in a pressurized vessel

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1244346B (de) * 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
JP3195050B2 (ja) 1992-06-18 2001-08-06 マツダ株式会社 エンジンの吸入空気量検出装置
CN2178584Y (zh) * 1993-11-09 1994-10-05 北京工业大学 可产生宽带激光束的转镜装置
JPH0929472A (ja) * 1995-07-14 1997-02-04 Hitachi Ltd 割断方法、割断装置及びチップ材料
EP0847317B1 (en) * 1995-08-31 2003-08-27 Corning Incorporated Method and apparatus for breaking brittle materials
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
JP4396953B2 (ja) * 1998-08-26 2010-01-13 三星電子株式会社 レーザ切断装置および切断方法
JP2001130921A (ja) 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
WO2001034529A1 (en) * 1999-11-12 2001-05-17 P.T.G. Precision Technology Center Limited Llc Laser glass cutting with super cooled gas chill
KR100631304B1 (ko) * 1999-12-24 2006-10-04 삼성전자주식회사 레이저 빔을 이용한 유리기판 절단 장치 및 그 방법
DE19963939B4 (de) * 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
US6812430B2 (en) * 2000-12-01 2004-11-02 Lg Electronics Inc. Glass cutting method and apparatus with controlled laser beam energy
WO2003008168A1 (en) * 2001-07-16 2003-01-30 Mitsuboshi Diamond Industrial Co., Ltd. Scribing device for fragile material substrate
TW583046B (en) * 2001-08-10 2004-04-11 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing brittle material substrate
JP2005231035A (ja) * 2001-08-23 2005-09-02 Mitsuboshi Diamond Industrial Co Ltd 脆性材料の加工方法及び加工装置
KR100794284B1 (ko) * 2001-09-29 2008-01-11 삼성전자주식회사 비금속 기판 절단 방법
TWI277612B (en) 2002-08-09 2007-04-01 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing fragile material substrate

Also Published As

Publication number Publication date
KR100821937B1 (ko) 2008-04-15
EP1806202B1 (en) 2011-08-17
EP1806202A4 (en) 2009-05-06
TW200621661A (en) 2006-07-01
EP1806202A1 (en) 2007-07-11
KR20070051945A (ko) 2007-05-18
JP4722054B2 (ja) 2011-07-13
CN100475419C (zh) 2009-04-08
CN101048255A (zh) 2007-10-03
US20070228100A1 (en) 2007-10-04
JPWO2006046525A1 (ja) 2008-05-22
US7726532B2 (en) 2010-06-01
ATE520495T1 (de) 2011-09-15
WO2006046525A1 (ja) 2006-05-04
TWI358395B (https=) 2012-02-21

Similar Documents

Publication Publication Date Title
MX2007005018A (es) Metodo y aparato para formar ranuras.
JP4666391B2 (ja) ガラス基板の分断方法
JP5451238B2 (ja) レーザ加工方法
JP5216017B2 (ja) 脆性材料基板の分断方法
CN101821071B (zh) 脆性材料基板的激光划线方法及激光划线装置
JP6278451B2 (ja) マーキング装置およびパターン生成装置
JPWO2008053915A1 (ja) スキャナ光学システム、レーザ加工装置、及び、スキャナ光学装置
WO2013039162A1 (ja) レーザ加工方法及びレーザ加工装置
JP4615231B2 (ja) スクライブ装置およびこの装置を用いたスクライブ方法
KR100551527B1 (ko) 취성재료기판의 스크라이브 방법 및 스크라이브 장치
KR100960302B1 (ko) 레이저를 이용한 필름 절단 장치 및 방법
JP2005081715A (ja) レーザ加工装置およびレーザ加工方法
JP2003115449A (ja) 露光装置
JP3410989B2 (ja) 精密レーザ照射装置及び制御方法
CN111293053A (zh) 激光晶化装置的监控系统
KR20050054444A (ko) 레이저 결정화 장치 및 레이저 결정화 방법
JP2000323025A (ja) プラズマディスプレイパネルの電極基板製造方法および装置
JP2025018684A (ja) レーザー加工装置およびレーザー加工装置の投影光学系
JP2006315085A (ja) レーザ加工装置
TWI556284B (zh) 非週期性脈衝連續橫向結晶之系統及方法
CN116060799A (zh) 照明光学系统和激光加工装置
JP2009164444A (ja) 結晶性半導体膜形成装置、結晶性半導体膜形成方法および結晶性半導体膜形成基板
JP2005246451A (ja) レーザ加工装置及びレーザ加工方法
JPH06152036A (ja) レーザー処理装置および処理方法
JP2002118077A (ja) レーザーアニール装置

Legal Events

Date Code Title Description
FG Grant or registration