JP4722054B2 - クラック形成方法およびクラック形成装置 - Google Patents

クラック形成方法およびクラック形成装置 Download PDF

Info

Publication number
JP4722054B2
JP4722054B2 JP2006543142A JP2006543142A JP4722054B2 JP 4722054 B2 JP4722054 B2 JP 4722054B2 JP 2006543142 A JP2006543142 A JP 2006543142A JP 2006543142 A JP2006543142 A JP 2006543142A JP 4722054 B2 JP4722054 B2 JP 4722054B2
Authority
JP
Japan
Prior art keywords
spot
substrate
crack
cooling
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006543142A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2006046525A1 (ja
Inventor
統悟 五戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2006543142A priority Critical patent/JP4722054B2/ja
Publication of JPWO2006046525A1 publication Critical patent/JPWO2006046525A1/ja
Application granted granted Critical
Publication of JP4722054B2 publication Critical patent/JP4722054B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/16—Transversely of continuously fed work
    • Y10T225/18—Progressively to or from one side edge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Quality & Reliability (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP2006543142A 2004-10-25 2005-10-25 クラック形成方法およびクラック形成装置 Expired - Fee Related JP4722054B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006543142A JP4722054B2 (ja) 2004-10-25 2005-10-25 クラック形成方法およびクラック形成装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004309958 2004-10-25
JP2004309958 2004-10-25
JP2006543142A JP4722054B2 (ja) 2004-10-25 2005-10-25 クラック形成方法およびクラック形成装置
PCT/JP2005/019533 WO2006046525A1 (ja) 2004-10-25 2005-10-25 クラック形成方法およびクラック形成装置

Publications (2)

Publication Number Publication Date
JPWO2006046525A1 JPWO2006046525A1 (ja) 2008-05-22
JP4722054B2 true JP4722054B2 (ja) 2011-07-13

Family

ID=36227765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006543142A Expired - Fee Related JP4722054B2 (ja) 2004-10-25 2005-10-25 クラック形成方法およびクラック形成装置

Country Status (9)

Country Link
US (1) US7726532B2 (https=)
EP (1) EP1806202B1 (https=)
JP (1) JP4722054B2 (https=)
KR (1) KR100821937B1 (https=)
CN (1) CN100475419C (https=)
AT (1) ATE520495T1 (https=)
MX (1) MX2007005018A (https=)
TW (1) TW200621661A (https=)
WO (1) WO2006046525A1 (https=)

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007018674A1 (de) * 2007-04-18 2008-10-23 Lzh Laserzentrum Hannover E.V. Verfahren zum Bilden von Durchgangslöchern in Bauteilen aus Glas
WO2008132055A1 (de) * 2007-04-25 2008-11-06 Ceramtec Ag Chip-resistor-substrat
CN101687686A (zh) * 2007-04-30 2010-03-31 康宁股份有限公司 用于刻划移动玻璃带的装置、系统和方法
JP5011048B2 (ja) 2007-09-27 2012-08-29 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
KR100949152B1 (ko) * 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치
CN101468875A (zh) 2007-12-24 2009-07-01 鸿富锦精密工业（深圳）有限公司 脆性非金属基材及其切割方法
KR101139306B1 (ko) * 2007-12-27 2012-04-26 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 크랙 형성 방법
CN101497150B (zh) * 2008-02-01 2012-10-10 鸿富锦精密工业（深圳）有限公司 激光切割装置
KR100848854B1 (ko) * 2008-04-21 2008-07-30 주식회사 탑 엔지니어링 취성기판의 스크라이빙 장치 및 그 방법
IT1394891B1 (it) 2008-07-25 2012-07-20 Matteo Baistrocchi Impianto di scribing laser per il trattamento superficiale di lamierini magnetici con spot a sezione ellittica
KR101041137B1 (ko) * 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
JP2010232603A (ja) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 基板固定装置
TWI517922B (zh) * 2009-05-13 2016-01-21 康寧公司 切割脆性材料之方法
JP5636423B2 (ja) * 2009-05-27 2014-12-03 コーニング インコーポレイテッド 高温でのガラスのレーザ・スコアリング
US20110011227A1 (en) * 2009-07-15 2011-01-20 Tingley Iii William Q Method and apparatus for non-rotary holemaking by means of controlled fracturing
US11235395B2 (en) * 2009-07-15 2022-02-01 Tennine Corp. Controlled fracture machining method for producing through-holes
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
WO2011155314A1 (ja) * 2010-06-07 2011-12-15 日本電気硝子株式会社 ガラス板の切断方法
JP5696393B2 (ja) * 2010-08-02 2015-04-08 日本電気硝子株式会社 ガラスフィルムの割断方法
TWI513670B (zh) 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
KR101358672B1 (ko) * 2012-08-13 2014-02-11 한국과학기술원 극초단 펄스 레이저를 이용한 투명시편 절단방법 및 다이싱 장치
KR101355807B1 (ko) * 2012-09-11 2014-02-03 로체 시스템즈(주) 비금속 재료의 곡선 절단방법
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9092187B2 (en) 2013-01-08 2015-07-28 Apple Inc. Ion implant indicia for cover glass or display component
US9623628B2 (en) * 2013-01-10 2017-04-18 Apple Inc. Sapphire component with residual compressive stress
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
CN104145320B (zh) 2013-02-12 2018-02-02 苹果公司 多步骤离子注入
US10286487B2 (en) * 2013-02-28 2019-05-14 Ipg Photonics Corporation Laser system and method for processing sapphire
KR102176313B1 (ko) * 2013-02-28 2020-11-09 아이피지 포토닉스 코포레이션 사파이어를 처리하기 위한 레이저 시스템 및 방법
US9416442B2 (en) 2013-03-02 2016-08-16 Apple Inc. Sapphire property modification through ion implantation
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9508570B2 (en) * 2013-10-21 2016-11-29 Asm Technology Singapore Pte Ltd Singulation apparatus and method
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10343237B2 (en) 2014-02-28 2019-07-09 Ipg Photonics Corporation System and method for laser beveling and/or polishing
US9956646B2 (en) 2014-02-28 2018-05-01 Ipg Photonics Corporation Multiple-beam laser processing using multiple laser beams with distinct wavelengths and/or pulse durations
US9764427B2 (en) 2014-02-28 2017-09-19 Ipg Photonics Corporation Multi-laser system and method for cutting and post-cut processing hard dielectric materials
JP6269830B2 (ja) * 2014-06-11 2018-01-31 株式会社Ihi 脆性材料基板の割断方法及び脆性材料基板の割断装置
CN106471140B (zh) * 2014-07-03 2019-02-05 新日铁住金株式会社 激光加工装置
TWI730945B (zh) 2014-07-08 2021-06-21 美商康寧公司 用於雷射處理材料的方法與設備
WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
KR20170028943A (ko) 2014-07-14 2017-03-14 코닝 인코포레이티드 조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템
CN107073641B (zh) 2014-07-14 2020-11-10 康宁股份有限公司 接口块；用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
EP3169479B1 (en) 2014-07-14 2019-10-02 Corning Incorporated Method of and system for arresting incident crack propagation in a transparent material
CN107148324A (zh) 2014-08-28 2017-09-08 Ipg光子公司 用于切割和切割后加工硬质电介质材料的多激光器系统和方法
WO2016033494A1 (en) 2014-08-28 2016-03-03 Ipg Photonics Corporation System and method for laser beveling and/or polishing
JP6303950B2 (ja) * 2014-09-19 2018-04-04 旭硝子株式会社 ガラス板の加工方法
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
CN107406293A (zh) 2015-01-12 2017-11-28 康宁股份有限公司 使用多光子吸收方法来对经热回火的基板进行激光切割
WO2016125609A1 (ja) * 2015-02-03 2016-08-11 セントラル硝子株式会社 脆性材料の切断方法、脆性材料の切断装置、切断脆性材料の製造方法及び切断脆性材料
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
KR20170131638A (ko) 2015-03-27 2017-11-29 코닝 인코포레이티드 가스 투과성 유리창 및 이의 제작방법
WO2017011296A1 (en) 2015-07-10 2017-01-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
US10280504B2 (en) 2015-09-25 2019-05-07 Apple Inc. Ion-implanted, anti-reflective layer formed within sapphire material
DE102016000051A1 (de) 2016-01-05 2017-07-06 Siltectra Gmbh Verfahren und Vorrichtung zum planaren Erzeugen von Modifikationen in Festkörpern
US11130200B2 (en) 2016-03-22 2021-09-28 Siltectra Gmbh Combined laser treatment of a solid body to be split
JP6938543B2 (ja) 2016-05-06 2021-09-22 コーニング インコーポレイテッド 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
KR102423775B1 (ko) 2016-08-30 2022-07-22 코닝 인코포레이티드 투명 재료의 레이저 가공
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
KR102428350B1 (ko) 2016-10-24 2022-08-02 코닝 인코포레이티드 시트형 유리 기판의 레이저 기반 기계 가공을 위한 기판 프로세싱 스테이션
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10978311B2 (en) 2016-12-12 2021-04-13 Siltectra Gmbh Method for thinning solid body layers provided with components
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
CN108002696B (zh) * 2017-12-27 2024-05-17 信义玻璃（营口）有限公司 一种跟踪控制装置和冷却控制系统
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN110293310A (zh) * 2018-03-22 2019-10-01 孟晋科技股份有限公司 避免铝分子渗入镀铝硅高张力钢板焊道的加工方法
TWI706614B (zh) * 2018-11-10 2020-10-01 鴻超環保能源股份有限公司 雷射光源模組
CN109680448B (zh) * 2019-01-21 2024-04-19 苏州大喆智能科技有限公司 一种切线热粘装置
CN112828474B (zh) * 2020-12-31 2022-07-05 武汉华工激光工程有限责任公司 用于透明脆性材料的斜向切割补偿方法及系统
JP7713186B2 (ja) * 2021-08-18 2025-07-25 エンシュウ株式会社 レーザ加工装置
US12387307B2 (en) 2022-10-26 2025-08-12 Saudi Arabian Oil Company Determining severity of stepwise cracking in a pressurized vessel

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1121141A (ja) * 1997-04-14 1999-01-26 Carl Zeiss:Fa 脆い材料、特にガラス製の平坦な加工品を切断する方法及び装置
WO2003013816A1 (fr) * 2001-08-10 2003-02-20 Mitsuboshi Diamond Industrial Co., Ltd. Procede et dispositif de decoupage d'un substrat de materiau cassant
WO2004014625A1 (ja) * 2002-08-09 2004-02-19 Mitsuboshi Diamond Industrial Co.,Ltd. 脆性材料基板のスクライブ方法およびスクライブ装置
JP2005231035A (ja) * 2001-08-23 2005-09-02 Mitsuboshi Diamond Industrial Co Ltd 脆性材料の加工方法及び加工装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1244346B (de) * 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas
RU2024441C1 (ru) 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
JP3195050B2 (ja) 1992-06-18 2001-08-06 マツダ株式会社 エンジンの吸入空気量検出装置
CN2178584Y (zh) * 1993-11-09 1994-10-05 北京工业大学 可产生宽带激光束的转镜装置
JPH0929472A (ja) * 1995-07-14 1997-02-04 Hitachi Ltd 割断方法、割断装置及びチップ材料
DE69629704T2 (de) * 1995-08-31 2004-07-08 Corning Inc. Verfahren und vorrichtung zum zerbrechen von sprödem material
US6407360B1 (en) * 1998-08-26 2002-06-18 Samsung Electronics, Co., Ltd. Laser cutting apparatus and method
JP2001130921A (ja) * 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
WO2001034529A1 (en) * 1999-11-12 2001-05-17 P.T.G. Precision Technology Center Limited Llc Laser glass cutting with super cooled gas chill
KR100631304B1 (ko) * 1999-12-24 2006-10-04 삼성전자주식회사 레이저 빔을 이용한 유리기판 절단 장치 및 그 방법
DE19963939B4 (de) * 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
JP3802442B2 (ja) * 2000-12-01 2006-07-26 エルジー電子株式会社 ガラス切断方法および装置
KR100583889B1 (ko) * 2001-07-16 2006-05-26 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료기판의 스크라이브 장치
KR100794284B1 (ko) * 2001-09-29 2008-01-11 삼성전자주식회사 비금속 기판 절단 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1121141A (ja) * 1997-04-14 1999-01-26 Carl Zeiss:Fa 脆い材料、特にガラス製の平坦な加工品を切断する方法及び装置
WO2003013816A1 (fr) * 2001-08-10 2003-02-20 Mitsuboshi Diamond Industrial Co., Ltd. Procede et dispositif de decoupage d'un substrat de materiau cassant
JP2005231035A (ja) * 2001-08-23 2005-09-02 Mitsuboshi Diamond Industrial Co Ltd 脆性材料の加工方法及び加工装置
WO2004014625A1 (ja) * 2002-08-09 2004-02-19 Mitsuboshi Diamond Industrial Co.,Ltd. 脆性材料基板のスクライブ方法およびスクライブ装置

Also Published As

Publication number Publication date
CN100475419C (zh) 2009-04-08
KR20070051945A (ko) 2007-05-18
EP1806202A4 (en) 2009-05-06
US7726532B2 (en) 2010-06-01
EP1806202A1 (en) 2007-07-11
EP1806202B1 (en) 2011-08-17
MX2007005018A (es) 2008-02-19
CN101048255A (zh) 2007-10-03
TW200621661A (en) 2006-07-01
JPWO2006046525A1 (ja) 2008-05-22
ATE520495T1 (de) 2011-09-15
US20070228100A1 (en) 2007-10-04
WO2006046525A1 (ja) 2006-05-04
KR100821937B1 (ko) 2008-04-15
TWI358395B (https=) 2012-02-21

Similar Documents

Publication Publication Date Title
JP4722054B2 (ja) クラック形成方法およびクラック形成装置
JP4666391B2 (ja) ガラス基板の分断方法
JP5171838B2 (ja) 脆性材料基板のレーザスクライブ方法
JP5216017B2 (ja) 脆性材料基板の分断方法
JP4818120B2 (ja) 脆性材料基板のスクライブ方法ならびにスクライブ装置および脆性材料基板の分断システム。
CN101386467B (zh) 脆性材料基板的分割装置和分割方法
KR100509651B1 (ko) 반도체 웨이퍼의 스크라이브 라인의 형성방법 및스크라이브 라인의 형성장치
CN103030263B (zh) 母基板的分断方法
CN101903128A (zh) 脆性材料基板的倒角加工方法及倒角加工装置
KR20040035861A (ko) 취성재료기판의 스크라이브 방법 및 스크라이브 장치
JP4133812B2 (ja) 脆性材料基板のスクライブ装置およびスクライブ方法
JPWO2007094348A1 (ja) レーザスクライブ方法、レーザスクライブ装置、及びこの方法または装置を用いて割断した割断基板
KR101467157B1 (ko) 취성 재료 기판의 스크라이브 방법
JP2009090598A (ja) 脆性材料基板の曲線状クラック形成方法および脆性材料基板
KR100551527B1 (ko) 취성재료기판의 스크라이브 방법 및 스크라이브 장치
JP2012056229A (ja) レーザ割断装置
CN107650277A (zh) 划线方法以及划线装置
JP2006255725A (ja) 基板の穴あけ装置

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100622

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100819

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100928

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101018

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110308

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110405

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140415

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees