WO2003008168A1 - Scribing device for fragile material substrate - Google Patents

Scribing device for fragile material substrate Download PDF

Info

Publication number
WO2003008168A1
WO2003008168A1 PCT/JP2002/007233 JP0207233W WO03008168A1 WO 2003008168 A1 WO2003008168 A1 WO 2003008168A1 JP 0207233 W JP0207233 W JP 0207233W WO 03008168 A1 WO03008168 A1 WO 03008168A1
Authority
WO
WIPO (PCT)
Prior art keywords
material substrate
fragile material
scribing device
laser spots
peaks
Prior art date
Application number
PCT/JP2002/007233
Other languages
French (fr)
Japanese (ja)
Inventor
Haruo Wakayama
Original Assignee
Mitsuboshi Diamond Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co., Ltd. filed Critical Mitsuboshi Diamond Industrial Co., Ltd.
Priority to JP2003513754A priority Critical patent/JPWO2003008168A1/en
Publication of WO2003008168A1 publication Critical patent/WO2003008168A1/en
Priority to HK05102267A priority patent/HK1069797A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Abstract

A scribing device for a fragile material substrate, wherein a plurality of laser spots are formed so as to provide a plurality of peaks of strength distribution on the fragile material substrate along a predetermined scribing line, and intervals between the plurality of laser spots and intervals between the peaks of strength distribution of the laser spots are set according to the type of the fragile material substrate on which a scribing line is formed.
PCT/JP2002/007233 2001-07-16 2002-07-16 Scribing device for fragile material substrate WO2003008168A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003513754A JPWO2003008168A1 (en) 2001-07-16 2002-07-16 Scribing device for brittle material substrate
HK05102267A HK1069797A1 (en) 2001-07-16 2005-03-15 Scribing device and method for fragile material substrate and scribing method for fragile material substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001215055 2001-07-16
JP2001-215055 2001-07-16

Publications (1)

Publication Number Publication Date
WO2003008168A1 true WO2003008168A1 (en) 2003-01-30

Family

ID=19049763

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/007233 WO2003008168A1 (en) 2001-07-16 2002-07-16 Scribing device for fragile material substrate

Country Status (6)

Country Link
JP (1) JPWO2003008168A1 (en)
KR (1) KR100583889B1 (en)
CN (2) CN100411825C (en)
HK (1) HK1069797A1 (en)
TW (1) TW542763B (en)
WO (1) WO2003008168A1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005102638A1 (en) * 2004-04-27 2005-11-03 Mitsuboshi Diamond Industrial Co., Ltd. Method for forming vertical crack on brittle board and vertical crack forming apparatus
JP2006167804A (en) * 2004-11-19 2006-06-29 Canon Inc Laser cutting method and laser cutting apparatus
JP2008229716A (en) * 2007-03-23 2008-10-02 Toray Eng Co Ltd Method and device for laser scribing, and cleaved substrate cleaved using the same method or the same device
JP2008264805A (en) * 2007-04-17 2008-11-06 Disco Abrasive Syst Ltd Laser beam machining apparatus and laser beam machining method for adhesive film mounted on reverse side of wafer
JP2009066613A (en) * 2007-09-11 2009-04-02 Mitsuboshi Diamond Industrial Co Ltd Apparatus and method for cutting brittle material substrate
JP2010520083A (en) * 2007-02-28 2010-06-10 セラムテック アクチエンゲゼルシャフト Method for manufacturing a component using asymmetric energy introduction along a separation line or target break line
CN102012552A (en) * 2010-09-27 2011-04-13 江苏大学 Light path automatic adjusting system for multi-window multi-wavelength laser
US8093530B2 (en) 2004-11-19 2012-01-10 Canon Kabushiki Kaisha Laser cutting apparatus and laser cutting method
JP2013004957A (en) * 2011-06-17 2013-01-07 National Cheng Kung Univ Light-emitting element structure and manufacturing method of the same
JP5562254B2 (en) * 2008-12-16 2014-07-30 株式会社レミ Brittle material splitting apparatus and splitting method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101140164B1 (en) * 2005-10-28 2012-04-24 미쓰보시 다이야몬도 고교 가부시키가이샤 Method?of?forming?scribe?line?on?substrate?of?brittle?material?and?scribe?line?forming?apparatus
KR101102159B1 (en) * 2009-08-06 2012-01-02 수미토모 케미칼 컴퍼니 리미티드 Method for manufacturing polarizing plate
US20110139758A1 (en) * 2009-08-06 2011-06-16 Applied Materials, Inc. Latitudinal iso-line scribe, stitching, and simplified laser and scanner controls
CN102248308A (en) * 2011-06-24 2011-11-23 广东工业大学 Method for performing microprocessing by utilizing laser cavitation micro jet flow
JP6721439B2 (en) * 2016-07-11 2020-07-15 株式会社ディスコ Laser processing equipment
CN113618251A (en) * 2021-08-04 2021-11-09 昆山燎原自动化设备有限责任公司 Laser processing equipment for substrate scribing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06234092A (en) * 1993-02-12 1994-08-23 Nikon Corp Laser beam working machine
JPH1034364A (en) * 1996-07-25 1998-02-10 Souei Tsusho Kk Brittle material splitting method by plural point heat sources
JPH11784A (en) * 1997-06-11 1999-01-06 Mitsubishi Electric Corp Laser beam machine
JP2000058489A (en) * 1998-08-07 2000-02-25 Disco Abrasive Syst Ltd Work dividing method and device
JP2001151525A (en) * 1999-11-25 2001-06-05 Mitsuboshi Diamond Industrial Co Ltd Method and device for dividing glass sheet

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01306088A (en) * 1988-06-01 1989-12-11 Nippei Toyama Corp Variable beam laser processing device
JPH0639572A (en) * 1991-01-11 1994-02-15 Souei Tsusho Kk Wafer cutting device
JPH0929472A (en) * 1995-07-14 1997-02-04 Hitachi Ltd Method and device for splitting and chip material
JP3164508B2 (en) * 1996-05-22 2001-05-08 株式会社システクアカザワ Scoring device
JPH10128567A (en) * 1996-10-30 1998-05-19 Nec Kansai Ltd Laser beam splitting method
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
CN1413136A (en) * 1999-11-24 2003-04-23 应用光子学公司 Method and apparatus for separating non-metallic materials

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06234092A (en) * 1993-02-12 1994-08-23 Nikon Corp Laser beam working machine
JPH1034364A (en) * 1996-07-25 1998-02-10 Souei Tsusho Kk Brittle material splitting method by plural point heat sources
JPH11784A (en) * 1997-06-11 1999-01-06 Mitsubishi Electric Corp Laser beam machine
JP2000058489A (en) * 1998-08-07 2000-02-25 Disco Abrasive Syst Ltd Work dividing method and device
JP2001151525A (en) * 1999-11-25 2001-06-05 Mitsuboshi Diamond Industrial Co Ltd Method and device for dividing glass sheet

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005102638A1 (en) * 2004-04-27 2005-11-03 Mitsuboshi Diamond Industrial Co., Ltd. Method for forming vertical crack on brittle board and vertical crack forming apparatus
JP2006167804A (en) * 2004-11-19 2006-06-29 Canon Inc Laser cutting method and laser cutting apparatus
US8093530B2 (en) 2004-11-19 2012-01-10 Canon Kabushiki Kaisha Laser cutting apparatus and laser cutting method
JP2010520083A (en) * 2007-02-28 2010-06-10 セラムテック アクチエンゲゼルシャフト Method for manufacturing a component using asymmetric energy introduction along a separation line or target break line
JP2008229716A (en) * 2007-03-23 2008-10-02 Toray Eng Co Ltd Method and device for laser scribing, and cleaved substrate cleaved using the same method or the same device
JP2008264805A (en) * 2007-04-17 2008-11-06 Disco Abrasive Syst Ltd Laser beam machining apparatus and laser beam machining method for adhesive film mounted on reverse side of wafer
JP2009066613A (en) * 2007-09-11 2009-04-02 Mitsuboshi Diamond Industrial Co Ltd Apparatus and method for cutting brittle material substrate
JP5562254B2 (en) * 2008-12-16 2014-07-30 株式会社レミ Brittle material splitting apparatus and splitting method
CN102012552A (en) * 2010-09-27 2011-04-13 江苏大学 Light path automatic adjusting system for multi-window multi-wavelength laser
JP2013004957A (en) * 2011-06-17 2013-01-07 National Cheng Kung Univ Light-emitting element structure and manufacturing method of the same

Also Published As

Publication number Publication date
KR100583889B1 (en) 2006-05-26
CN100411825C (en) 2008-08-20
KR20040017248A (en) 2004-02-26
CN1529648A (en) 2004-09-15
HK1069797A1 (en) 2005-06-03
CN1255858C (en) 2006-05-10
TW542763B (en) 2003-07-21
JPWO2003008168A1 (en) 2004-11-04
CN1827311A (en) 2006-09-06

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