KR970077545A - 보드 온 칩 볼 그리드 어레이(boc-bga) - Google Patents
보드 온 칩 볼 그리드 어레이(boc-bga) Download PDFInfo
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- KR970077545A KR970077545A KR1019970021301A KR19970021301A KR970077545A KR 970077545 A KR970077545 A KR 970077545A KR 1019970021301 A KR1019970021301 A KR 1019970021301A KR 19970021301 A KR19970021301 A KR 19970021301A KR 970077545 A KR970077545 A KR 970077545A
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- integrated circuit
- package
- board
- circuit board
- bga
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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Abstract
집적 회로용 패키지는 제1표면과 제2표면을 갖는 회로 보드(122), 집적 회로(114)를 전기적으로 접속하기 위한 회로 보드(122)의 제1표면상에 위치에 접속소자, 및 회로 보드(122)의 제2표면상에 위치된 집적 회로(114)를 포함한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 상측이 포팅(potting)된 패키지 다이의 측면도.
Claims (8)
- 집적 회로용 패키지에 있어서, 제1 및 제2 표면을 갖는 상기 집적 회로를 장착하기 위한 회로 보드; 상기 집적 회로를 전기적으로 접속하기 위한 상기 회로 보드의 상기 제1면상에 위치된 접속 소자; 및 상기 제2면상에 위치된 상기 집적 회로를 포함하는 집적 회로용 패키지.
- 제1항에 있어서, 상기 집적 회로는 에폭시에 의해 상기 회로 보드에 부착된 것을 특징으로 하는 집적 회로용 패키지.
- 제1항에 있어서, 상기 직접 회로는 접착 테이프에 의해 상기 회로 보드에 부착되는 것을 특징으로 하는 집적 회로용 패키지.
- 제3항에 있어서, 상기 접착 테이프는 폴리이미드 테이프인 것을 특징으로 하는 집적 회로용 패키지.
- 제1항에 있어서, 상기 회로 보드는 와이어를 상기 집적 회로와 상기 접속 소자를 접속하도록 위치시키기 위한 홀을 갖는 것을 특징으로 하는 집적 회로용 패키지.
- 제1항에 있어서, 상기 접속 소자는 땜납 볼을 포함하는 것을 특징으로 하는 집적 회로용 패키지.
- 제1항에 있어서, 상기 패키지는: 상기 집적 회로를 밀봉하기 위한 밀봉 재료를 더 포함하고, 상기 밀봉 재료는 상기 집적 회로의 표면과 동일면을 형성하는 것을 특징으로 하는 집적 회로용 패키지.
- 제1항에 있어서, 상기 패키지는 상기 집적 회로를 완전히 둘러싸기 위한 밀봉 재료를 더 포함하는 것을 특징으로 하는 집적 회로용 패키지.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US1857996P | 1996-05-29 | 1996-05-29 | |
US60/018,579 | 1996-05-29 |
Publications (1)
Publication Number | Publication Date |
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KR970077545A true KR970077545A (ko) | 1997-12-12 |
Family
ID=21788669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970021301A KR970077545A (ko) | 1996-05-29 | 1997-05-28 | 보드 온 칩 볼 그리드 어레이(boc-bga) |
Country Status (4)
Country | Link |
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US (1) | US6667560B2 (ko) |
EP (1) | EP0810655A3 (ko) |
JP (1) | JPH1092972A (ko) |
KR (1) | KR970077545A (ko) |
Families Citing this family (29)
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US6791194B1 (en) * | 1996-05-30 | 2004-09-14 | Hitachi, Ltd. | Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same |
US6890796B1 (en) | 1997-07-16 | 2005-05-10 | Oki Electric Industry Co., Ltd. | Method of manufacturing a semiconductor package having semiconductor decice mounted thereon and elongate opening through which electodes and patterns are connected |
JPH1140694A (ja) | 1997-07-16 | 1999-02-12 | Oki Electric Ind Co Ltd | 半導体パッケージおよび半導体装置とその製造方法 |
USRE43112E1 (en) * | 1998-05-04 | 2012-01-17 | Round Rock Research, Llc | Stackable ball grid array package |
JP2000156435A (ja) * | 1998-06-22 | 2000-06-06 | Fujitsu Ltd | 半導体装置及びその製造方法 |
SG87769A1 (en) * | 1998-09-29 | 2002-04-16 | Texas Instr Singapore Pte Ltd | Direct attachment of semiconductor chip to organic substrate |
WO2000048444A2 (de) * | 1999-02-16 | 2000-08-24 | Wichmann Workx Ag Information Technology | Häusung für ein halbleiterchip |
US7042070B2 (en) | 1999-09-22 | 2006-05-09 | Texas Instruments Incorporated | Direct attachment of semiconductor chip to organic substrate |
DE19954888C2 (de) * | 1999-11-15 | 2002-01-10 | Infineon Technologies Ag | Verpackung für einen Halbleiterchip |
DE10024376A1 (de) * | 2000-05-17 | 2001-12-06 | Infineon Technologies Ag | Halbleiterbauelement und Verfahren zu dessen Herstellung |
US6577004B1 (en) * | 2000-08-31 | 2003-06-10 | Micron Technology, Inc. | Solder ball landpad design to improve laminate performance |
EP1205973A1 (en) * | 2000-11-10 | 2002-05-15 | United Test Center Inc. | Low-profile semiconductor device and method for manufacturing the same |
JP2002208656A (ja) | 2001-01-11 | 2002-07-26 | Mitsubishi Electric Corp | 半導体装置 |
JP2002270762A (ja) * | 2001-03-09 | 2002-09-20 | Sony Corp | 半導体装置 |
US6657132B2 (en) * | 2001-03-15 | 2003-12-02 | Micron Technology, Inc. | Single sided adhesive tape for compound diversion on BOC substrates |
US20020168799A1 (en) * | 2001-05-10 | 2002-11-14 | Kamran Manteghi | Die mounting on a substrate |
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- 1997-05-27 US US08/863,848 patent/US6667560B2/en not_active Expired - Lifetime
- 1997-05-28 KR KR1019970021301A patent/KR970077545A/ko not_active Application Discontinuation
- 1997-05-28 JP JP9138446A patent/JPH1092972A/ja active Pending
- 1997-05-29 EP EP97303638A patent/EP0810655A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
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US20020000652A1 (en) | 2002-01-03 |
US6667560B2 (en) | 2003-12-23 |
EP0810655A3 (en) | 1999-10-06 |
EP0810655A2 (en) | 1997-12-03 |
JPH1092972A (ja) | 1998-04-10 |
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