KR960043022A - 유기장치를 패시베이팅하는 방법 - Google Patents

유기장치를 패시베이팅하는 방법 Download PDF

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Publication number
KR960043022A
KR960043022A KR1019960008999A KR19960008999A KR960043022A KR 960043022 A KR960043022 A KR 960043022A KR 1019960008999 A KR1019960008999 A KR 1019960008999A KR 19960008999 A KR19960008999 A KR 19960008999A KR 960043022 A KR960043022 A KR 960043022A
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South Korea
Prior art keywords
organic device
providing
sealing
dielectric material
metal
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KR1019960008999A
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KR100372967B1 (ko
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비. 하베이 3세 토마스
조 프랭키
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빈센트 비. 인그라시아
모토로라 인코포레이티드
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Publication of KR960043022A publication Critical patent/KR960043022A/ko
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Publication of KR100372967B1 publication Critical patent/KR100372967B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Devices (AREA)

Abstract

유기 장치를 유전체 재료의 저온 중착막으로 오버코팅하는 단계와, 상기 유기 장치를 용접 밀봉하기 위해 상기 유전체 재료 위에 무기층을 밀봉 결합시키는 단계를 포함하는 지지 기판상에 위치된 유기 장치를 패시베이팅하는 방법이 제공되었다. 대표적 실시예에서, 유전체중은 SiO2이고, 무기층은 금속 캔이다.

Description

유기장치를 패시베이팅하는 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명에 따른 패시베이션 방법을 설명하는 유기적 광방출 다이오드 에레이의 단순화된 단면도.

Claims (3)

  1. 유기 장치를 패시베이팅하는 방법에 있어서, 지지 기판상에 유기 장치를 제공하는 단계와, 상기 유기 장치를 유전체 재료의 저온 중착막으로 오버코팅하는 단계와, 상기 유기 장치를 용접 밀봉하기 위해 상기 유전체 재료위에 무기 충을 밀봉 결합시키는 단계를 포함하는 것을 특징으로 하는 유기 장치를 패시베이팅하는 방법.
  2. 유기 장치를 패시베이팅하는 방법에 있어서, 지지 기판상에 유기 장치를 제공하는 단계와, 상기 유기 장치를 저온 유전체 재료로 오버코팅하는 단계와, 금속 캔을 제공하는 단계와, 상기 유기 장치를 용접 밀봉하기 위해 상기 유전체 재료위에 금속 캔을 밀봉하는 단계를 포함하는 것을 특징으로 하는 유기 장치를 패시베이팅하는 방법.
  3. 유기 장치를 패시베이팅하는 방법에 있어서, 지지 기판상에 유기 장치를 제공하는 단계와, 금속 캔을 제공하는 단계와, 상기 유기 장치를 용접 밀봉하기 위해 저온 밀봉 재료를 사용하여 유기 장치 위에 금속을 밀봉하는 단계를 포함하는 것을 특징으로 하는 유기 장치를 패시베이팅하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960008999A 1995-05-02 1996-03-29 유기장치를패시베이팅하는방법 KR100372967B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/433,909 US5771562A (en) 1995-05-02 1995-05-02 Passivation of organic devices
US433,909 1995-05-02

Publications (2)

Publication Number Publication Date
KR960043022A true KR960043022A (ko) 1996-12-21
KR100372967B1 KR100372967B1 (ko) 2003-05-12

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KR1019960008999A KR100372967B1 (ko) 1995-05-02 1996-03-29 유기장치를패시베이팅하는방법

Country Status (7)

Country Link
US (1) US5771562A (ko)
EP (1) EP0741419B1 (ko)
JP (1) JPH08306955A (ko)
KR (1) KR100372967B1 (ko)
CN (1) CN1092396C (ko)
DE (1) DE69630162T2 (ko)
TW (1) TW409422B (ko)

Families Citing this family (192)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100512670B1 (ko) * 1996-05-15 2005-09-07 세이코 엡슨 가부시키가이샤 박막 디바이스 제조 방법, 박막 트랜지스터 제조 방법, 및전자 기기 제조 방법
JPH11510647A (ja) * 1996-05-28 1999-09-14 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ 有機エレクトロルミネッセンスデバイス
EP1367431B1 (en) * 1996-09-19 2005-12-28 Seiko Epson Corporation Manufacturing method of a matrix type display device
JP3899566B2 (ja) 1996-11-25 2007-03-28 セイコーエプソン株式会社 有機ｅｌ表示装置の製造方法
US5952778A (en) * 1997-03-18 1999-09-14 International Business Machines Corporation Encapsulated organic light emitting device
JP3290375B2 (ja) * 1997-05-12 2002-06-10 松下電器産業株式会社 有機電界発光素子
US6198220B1 (en) * 1997-07-11 2001-03-06 Emagin Corporation Sealing structure for organic light emitting devices
WO1999002277A1 (en) * 1997-07-11 1999-01-21 Fed Corporation Sealing structure for organic light emitting devices
JPH1140346A (ja) * 1997-07-22 1999-02-12 Pioneer Electron Corp 有機エレクトロルミネセンス表示装置
DE19735760A1 (de) * 1997-08-18 1999-02-25 Zeiss Carl Fa Lötverfahren für optische Materialien an Metallfassungen und gefaßte Baugruppen
US5990498A (en) * 1997-09-16 1999-11-23 Polaroid Corporation Light-emitting diode having uniform irradiance distribution
US6370019B1 (en) * 1998-02-17 2002-04-09 Sarnoff Corporation Sealing of large area display structures
US6080031A (en) * 1998-09-02 2000-06-27 Motorola, Inc. Methods of encapsulating electroluminescent apparatus
US7126161B2 (en) 1998-10-13 2006-10-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having El layer and sealing material
CA2353506A1 (en) 1998-11-02 2000-05-11 3M Innovative Properties Company Transparent conductive oxides for plastic flat panel displays
US6274887B1 (en) 1998-11-02 2001-08-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method therefor
US7141821B1 (en) 1998-11-10 2006-11-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having an impurity gradient in the impurity regions and method of manufacture
US7022556B1 (en) 1998-11-11 2006-04-04 Semiconductor Energy Laboratory Co., Ltd. Exposure device, exposure method and method of manufacturing semiconductor device
US6277679B1 (en) 1998-11-25 2001-08-21 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing thin film transistor
US6268695B1 (en) 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
TW439308B (en) 1998-12-16 2001-06-07 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
CN1150639C (zh) * 1998-12-17 2004-05-19 剑桥显示技术有限公司 有机发光装置
US7697052B1 (en) 1999-02-17 2010-04-13 Semiconductor Energy Laboratory Co., Ltd. Electronic view finder utilizing an organic electroluminescence display
JP2000294369A (ja) * 1999-04-05 2000-10-20 Chisso Corp 有機ｅｌ素子
US6680487B1 (en) 1999-05-14 2004-01-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor comprising a TFT provided on a substrate having an insulating surface and method of fabricating the same
US7091605B2 (en) * 2001-09-21 2006-08-15 Eastman Kodak Company Highly moisture-sensitive electronic device element and method for fabrication
TW527735B (en) 1999-06-04 2003-04-11 Semiconductor Energy Lab Electro-optical device
US7288420B1 (en) 1999-06-04 2007-10-30 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing an electro-optical device
US8853696B1 (en) * 1999-06-04 2014-10-07 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and electronic device
TW516244B (en) * 1999-09-17 2003-01-01 Semiconductor Energy Lab EL display device and method for manufacturing the same
JP3942770B2 (ja) * 1999-09-22 2007-07-11 株式会社半導体エネルギー研究所 Ｅｌ表示装置及び電子装置
TW480722B (en) * 1999-10-12 2002-03-21 Semiconductor Energy Lab Manufacturing method of electro-optical device
US6413645B1 (en) * 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6623861B2 (en) 2001-04-16 2003-09-23 Battelle Memorial Institute Multilayer plastic substrates
US7198832B2 (en) * 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US6548912B1 (en) 1999-10-25 2003-04-15 Battelle Memorial Institute Semicoductor passivation using barrier coatings
US20100330748A1 (en) 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US6573652B1 (en) 1999-10-25 2003-06-03 Battelle Memorial Institute Encapsulated display devices
US6587086B1 (en) 1999-10-26 2003-07-01 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device
JP4776769B2 (ja) * 1999-11-09 2011-09-21 株式会社半導体エネルギー研究所 発光装置の作製方法
US6646287B1 (en) 1999-11-19 2003-11-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with tapered gate and insulating film
US20010053559A1 (en) * 2000-01-25 2001-12-20 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating display device
US6559594B2 (en) * 2000-02-03 2003-05-06 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
US6492026B1 (en) 2000-04-20 2002-12-10 Battelle Memorial Institute Smoothing and barrier layers on high Tg substrates
US6465953B1 (en) * 2000-06-12 2002-10-15 General Electric Company Plastic substrates with improved barrier properties for devices sensitive to water and/or oxygen, such as organic electroluminescent devices
WO2002015281A2 (en) * 2000-08-17 2002-02-21 Power Signal Technologies, Inc. Glass-to-metal hermetically sealed led array
US6605826B2 (en) 2000-08-18 2003-08-12 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and display device
EP1309994A2 (de) * 2000-08-18 2003-05-14 Siemens Aktiengesellschaft Verkapseltes organisch-elektronisches bauteil, verfahren zu seiner herstellung und seine verwendung
MY141175A (en) * 2000-09-08 2010-03-31 Semiconductor Energy Lab Light emitting device, method of manufacturing the same, and thin film forming apparatus
DE10044841B4 (de) 2000-09-11 2006-11-30 Osram Opto Semiconductors Gmbh Plasmaverkapselung für elektronische und mikroelektronische Bauelemente wie OLEDs sowie Verfahren zu dessen Herstellung
US6924594B2 (en) * 2000-10-03 2005-08-02 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US6537688B2 (en) 2000-12-01 2003-03-25 Universal Display Corporation Adhesive sealed organic optoelectronic structures
US6614057B2 (en) 2001-02-07 2003-09-02 Universal Display Corporation Sealed organic optoelectronic structures
US7222981B2 (en) * 2001-02-15 2007-05-29 Semiconductor Energy Laboratory Co., Ltd. EL display device and electronic device
US6576351B2 (en) 2001-02-16 2003-06-10 Universal Display Corporation Barrier region for optoelectronic devices
US6822391B2 (en) * 2001-02-21 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, electronic equipment, and method of manufacturing thereof
US6881447B2 (en) 2002-04-04 2005-04-19 Dielectric Systems, Inc. Chemically and electrically stabilized polymer films
US20050274322A1 (en) * 2001-02-26 2005-12-15 Lee Chung J Reactor for producing reactive intermediates for low dielectric constant polymer thin films
US6624568B2 (en) 2001-03-28 2003-09-23 Universal Display Corporation Multilayer barrier region containing moisture- and oxygen-absorbing material for optoelectronic devices
US6664137B2 (en) 2001-03-29 2003-12-16 Universal Display Corporation Methods and structures for reducing lateral diffusion through cooperative barrier layers
US6706316B2 (en) * 2001-05-08 2004-03-16 Eastman Kodak Company Ultrasonically sealing the cover plate to provide a hermetic enclosure for OLED displays
JP4041660B2 (ja) * 2001-05-31 2008-01-30 ユーディナデバイス株式会社 半導体装置及びその製造方法
US6692326B2 (en) 2001-06-16 2004-02-17 Cld, Inc. Method of making organic electroluminescent display
TW588570B (en) * 2001-06-18 2004-05-21 Semiconductor Energy Lab Light emitting device and method of fabricating the same
TW548860B (en) * 2001-06-20 2003-08-21 Semiconductor Energy Lab Light emitting device and method of manufacturing the same
US7211828B2 (en) * 2001-06-20 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic apparatus
TW546857B (en) * 2001-07-03 2003-08-11 Semiconductor Energy Lab Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment
US6664730B2 (en) 2001-07-09 2003-12-16 Universal Display Corporation Electrode structure of el device
US7469558B2 (en) * 2001-07-10 2008-12-30 Springworks, Llc As-deposited planar optical waveguides with low scattering loss and methods for their manufacture
US8415208B2 (en) 2001-07-16 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and peeling off method and method of manufacturing semiconductor device
US6888307B2 (en) * 2001-08-21 2005-05-03 Universal Display Corporation Patterned oxygen and moisture absorber for organic optoelectronic device structures
TW558743B (en) 2001-08-22 2003-10-21 Semiconductor Energy Lab Peeling method and method of manufacturing semiconductor device
US6470594B1 (en) 2001-09-21 2002-10-29 Eastman Kodak Company Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps
US6590157B2 (en) 2001-09-21 2003-07-08 Eastman Kodak Company Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
US7026758B2 (en) * 2001-09-28 2006-04-11 Osram Opto Semiconductors Gmbh Reinforcement of glass substrates in flexible devices
JP4166455B2 (ja) * 2001-10-01 2008-10-15 株式会社半導体エネルギー研究所 偏光フィルム及び発光装置
JP4019690B2 (ja) * 2001-11-02 2007-12-12 セイコーエプソン株式会社 電気光学装置及びその製造方法並びに電子機器
US7404877B2 (en) * 2001-11-09 2008-07-29 Springworks, Llc Low temperature zirconia based thermal barrier layer by PVD
US7050835B2 (en) 2001-12-12 2006-05-23 Universal Display Corporation Intelligent multi-media display communication system
KR20040066898A (ko) * 2001-12-13 2004-07-27 코닌클리케 필립스 일렉트로닉스 엔.브이. 디스플레이 디바이스용 밀봉 구조
JP2003224245A (ja) * 2002-01-31 2003-08-08 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP2003232897A (ja) * 2002-02-13 2003-08-22 Konica Corp 放射線画像変換パネルの製造方法
US7378356B2 (en) * 2002-03-16 2008-05-27 Springworks, Llc Biased pulse DC reactive sputtering of oxide films
US6884327B2 (en) 2002-03-16 2005-04-26 Tao Pan Mode size converter for a planar waveguide
US20030175142A1 (en) * 2002-03-16 2003-09-18 Vassiliki Milonopoulou Rare-earth pre-alloyed PVD targets for dielectric planar applications
US20050158454A1 (en) * 2002-04-04 2005-07-21 Dielectric Systems, Inc. Method and system for forming an organic light-emitting device display having a plurality of passive polymer layers
US20070216300A1 (en) * 2002-04-04 2007-09-20 International Display Systems, Inc. Organic opto-electronic device with environmentally protective barrier
US20050174045A1 (en) * 2002-04-04 2005-08-11 Dielectric Systems, Inc. Organic light-emitting device display having a plurality of passive polymer layers
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US7164155B2 (en) * 2002-05-15 2007-01-16 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US7230271B2 (en) 2002-06-11 2007-06-12 Semiconductor Energy Laboratory Co., Ltd. Light emitting device comprising film having hygroscopic property and transparency and manufacturing method thereof
DE10236855B4 (de) * 2002-08-07 2006-03-16 Samsung SDI Co., Ltd., Suwon Gehäuseeinheit zur Verkapselung von Bauelementen und Verfahren zu deren Herstellung
US8021778B2 (en) 2002-08-09 2011-09-20 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8404376B2 (en) 2002-08-09 2013-03-26 Infinite Power Solutions, Inc. Metal film encapsulation
US20070264564A1 (en) 2006-03-16 2007-11-15 Infinite Power Solutions, Inc. Thin film battery on an integrated circuit or circuit board and method thereof
US8236443B2 (en) 2002-08-09 2012-08-07 Infinite Power Solutions, Inc. Metal film encapsulation
US7993773B2 (en) 2002-08-09 2011-08-09 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8431264B2 (en) 2002-08-09 2013-04-30 Infinite Power Solutions, Inc. Hybrid thin-film battery
US8394522B2 (en) 2002-08-09 2013-03-12 Infinite Power Solutions, Inc. Robust metal film encapsulation
US8445130B2 (en) 2002-08-09 2013-05-21 Infinite Power Solutions, Inc. Hybrid thin-film battery
US7215473B2 (en) * 2002-08-17 2007-05-08 3M Innovative Properties Company Enhanced heat mirror films
US6818291B2 (en) 2002-08-17 2004-11-16 3M Innovative Properties Company Durable transparent EMI shielding film
US6929864B2 (en) * 2002-08-17 2005-08-16 3M Innovative Properties Company Extensible, visible light-transmissive and infrared-reflective film and methods of making and using the film
US6933051B2 (en) * 2002-08-17 2005-08-23 3M Innovative Properties Company Flexible electrically conductive film
US7826702B2 (en) 2002-08-27 2010-11-02 Springworks, Llc Optically coupling into highly uniform waveguides
US6887733B2 (en) * 2002-09-11 2005-05-03 Osram Opto Semiconductors (Malaysia) Sdn. Bhd Method of fabricating electronic devices
US20040048033A1 (en) * 2002-09-11 2004-03-11 Osram Opto Semiconductors (Malaysia) Sdn. Bhd. Oled devices with improved encapsulation
US7224116B2 (en) * 2002-09-11 2007-05-29 Osram Opto Semiconductors Gmbh Encapsulation of active electronic devices
US7193364B2 (en) * 2002-09-12 2007-03-20 Osram Opto Semiconductors (Malaysia) Sdn. Bhd Encapsulation for organic devices
US7710019B2 (en) 2002-12-11 2010-05-04 Samsung Electronics Co., Ltd. Organic light-emitting diode display comprising auxiliary electrodes
JP2004200041A (ja) * 2002-12-19 2004-07-15 Tohoku Pioneer Corp 有機ｅｌ表示装置
TW586329B (en) * 2003-01-29 2004-05-01 Au Optronics Corp Sealing structure and method of making the same
WO2004077519A2 (en) 2003-02-27 2004-09-10 Mukundan Narasimhan Dielectric barrier layer films
US7365442B2 (en) * 2003-03-31 2008-04-29 Osram Opto Semiconductors Gmbh Encapsulation of thin-film electronic devices
US7510913B2 (en) 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US20040206953A1 (en) * 2003-04-16 2004-10-21 Robert Morena Hermetically sealed glass package and method of fabrication
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US7344901B2 (en) * 2003-04-16 2008-03-18 Corning Incorporated Hermetically sealed package and method of fabricating of a hermetically sealed package
US8728285B2 (en) 2003-05-23 2014-05-20 Demaray, Llc Transparent conductive oxides
US7238628B2 (en) 2003-05-23 2007-07-03 Symmorphix, Inc. Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides
US20040238846A1 (en) * 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device
US8188643B2 (en) * 2003-12-26 2012-05-29 Panasonic Corporation Display apparatus
US7495644B2 (en) * 2003-12-26 2009-02-24 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing display device
KR100553758B1 (ko) * 2004-02-02 2006-02-20 삼성에스디아이 주식회사 유기 전계 발광 소자
JP4540382B2 (ja) * 2004-04-05 2010-09-08 Ｈｏｙａ株式会社 撮影用照明装置
DE102004024676A1 (de) * 2004-05-18 2005-12-15 Süd-Chemie AG Filmförmige sorbenshaltige Zusammensetzungen
US7202504B2 (en) * 2004-05-20 2007-04-10 Semiconductor Energy Laboratory Co., Ltd. Light-emitting element and display device
KR100615228B1 (ko) * 2004-06-29 2006-08-25 삼성에스디아이 주식회사 흡습 능력이 개선된 유기 전계 발광 소자 및 그 제조방법
EP1617494B1 (en) * 2004-07-02 2010-08-11 Konarka Technologies, Inc. Organic photovoltaic component with encapsulation
US8732004B1 (en) 2004-09-22 2014-05-20 Experian Information Solutions, Inc. Automated analysis of data to generate prospect notifications based on trigger events
US7342356B2 (en) 2004-09-23 2008-03-11 3M Innovative Properties Company Organic electroluminescent device having protective structure with boron oxide layer and inorganic barrier layer
US20060063015A1 (en) 2004-09-23 2006-03-23 3M Innovative Properties Company Protected polymeric film
US7792732B2 (en) 2004-10-29 2010-09-07 American Express Travel Related Services Company, Inc. Using commercial share of wallet to rate investments
US20060093795A1 (en) * 2004-11-04 2006-05-04 Eastman Kodak Company Polymeric substrate having a desiccant layer
KR101021536B1 (ko) 2004-12-08 2011-03-16 섬모픽스, 인코포레이티드 ＬｉＣｏＯ２의 증착
US7959769B2 (en) 2004-12-08 2011-06-14 Infinite Power Solutions, Inc. Deposition of LiCoO2
US20060145599A1 (en) * 2005-01-04 2006-07-06 Reza Stegamat OLEDs with phosphors
US7767498B2 (en) * 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US7838133B2 (en) 2005-09-02 2010-11-23 Springworks, Llc Deposition of perovskite and other compound ceramic films for dielectric applications
US7549905B2 (en) * 2005-09-30 2009-06-23 International Display Systems, Inc. Method of encapsulating an organic light emitting device
US20080033852A1 (en) * 2005-10-24 2008-02-07 Megdal Myles G Computer-based modeling of spending behaviors of entities
US7621794B2 (en) * 2005-11-09 2009-11-24 International Display Systems, Inc. Method of encapsulating an organic light-emitting device
US20080124558A1 (en) * 2006-08-18 2008-05-29 Heather Debra Boek Boro-silicate glass frits for hermetic sealing of light emitting device displays
US8088502B2 (en) * 2006-09-20 2012-01-03 Battelle Memorial Institute Nanostructured thin film optical coatings
US8062708B2 (en) 2006-09-29 2011-11-22 Infinite Power Solutions, Inc. Masking of and material constraint for depositing battery layers on flexible substrates
US8036979B1 (en) 2006-10-05 2011-10-11 Experian Information Solutions, Inc. System and method for generating a finance attribute from tradeline data
US8197781B2 (en) 2006-11-07 2012-06-12 Infinite Power Solutions, Inc. Sputtering target of Li3PO4 and method for producing same
CN101573228B (zh) * 2006-12-28 2015-08-05 3M创新有限公司 用于薄膜金属层形成的成核层
US8606666B1 (en) 2007-01-31 2013-12-10 Experian Information Solutions, Inc. System and method for providing an aggregation tool
US8606626B1 (en) 2007-01-31 2013-12-10 Experian Information Solutions, Inc. Systems and methods for providing a direct marketing campaign planning environment
JP5208591B2 (ja) * 2007-06-28 2013-06-12 株式会社半導体エネルギー研究所 発光装置、及び照明装置
US8268488B2 (en) 2007-12-21 2012-09-18 Infinite Power Solutions, Inc. Thin film electrolyte for thin film batteries
TWI441937B (zh) 2007-12-21 2014-06-21 Infinite Power Solutions Inc 形成用於電解質薄膜之濺鍍靶材的方法
KR101606183B1 (ko) 2008-01-11 2016-03-25 사푸라스트 리써치 엘엘씨 박막 배터리 및 기타 소자를 위한 박막 캡슐화
EP2266183B1 (en) 2008-04-02 2018-12-12 Sapurast Research LLC Passive over/under voltage control and protection for energy storage devices associated with energy harvesting
US8350451B2 (en) * 2008-06-05 2013-01-08 3M Innovative Properties Company Ultrathin transparent EMI shielding film comprising a polymer basecoat and crosslinked polymer transparent dielectric layer
EP2319101B1 (en) 2008-08-11 2015-11-04 Sapurast Research LLC Energy device with integral collector surface for electromagnetic energy harvesting and method thereof
KR101613671B1 (ko) 2008-09-12 2016-04-19 사푸라스트 리써치 엘엘씨 전자기 에너지에 의해 데이터 통신을 하는 통합 도전성 표면을 가진 에너지 장치 및 그 통신 방법
US8508193B2 (en) 2008-10-08 2013-08-13 Infinite Power Solutions, Inc. Environmentally-powered wireless sensor module
EP2178133B1 (en) 2008-10-16 2019-09-18 Semiconductor Energy Laboratory Co., Ltd. Flexible Light-Emitting Device, Electronic Device, and Method for Manufacturing Flexible-Light Emitting Device
US20100095705A1 (en) 2008-10-20 2010-04-22 Burkhalter Robert S Method for forming a dry glass-based frit
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US8219408B2 (en) * 2008-12-29 2012-07-10 Motorola Mobility, Inc. Audio signal decoder and method for producing a scaled reconstructed audio signal
US8766269B2 (en) 2009-07-02 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, lighting device, and electronic device
EP2474056B1 (en) 2009-09-01 2016-05-04 Sapurast Research LLC Printed circuit board with integrated thin film battery
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
TWI589042B (zh) * 2010-01-20 2017-06-21 半導體能源研究所股份有限公司 發光裝置，撓性發光裝置，電子裝置，照明設備，以及發光裝置和撓性發光裝置的製造方法
US9000442B2 (en) * 2010-01-20 2015-04-07 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device
US9652802B1 (en) 2010-03-24 2017-05-16 Consumerinfo.Com, Inc. Indirect monitoring and reporting of a user's credit data
WO2011156392A1 (en) 2010-06-07 2011-12-15 Infinite Power Solutions, Inc. Rechargeable, high-density electrochemical device
TWI641287B (zh) 2010-09-14 2018-11-11 半導體能源研究所股份有限公司 固態發光元件，發光裝置和照明裝置
JP5827104B2 (ja) 2010-11-19 2015-12-02 株式会社半導体エネルギー研究所 照明装置
TWI562422B (en) 2010-12-16 2016-12-11 Semiconductor Energy Lab Co Ltd Light-emitting device and lighting device
US8735874B2 (en) 2011-02-14 2014-05-27 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, display device, and method for manufacturing the same
KR101922603B1 (ko) 2011-03-04 2018-11-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치, 조명 장치, 기판, 기판의 제작 방법
KR102079188B1 (ko) 2012-05-09 2020-02-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
KR102309244B1 (ko) 2013-02-20 2021-10-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
CN103560209A (zh) * 2013-10-12 2014-02-05 深圳市华星光电技术有限公司 有机发光二极管装置以及其制造方法
WO2015087192A1 (en) 2013-12-12 2015-06-18 Semiconductor Energy Laboratory Co., Ltd. Peeling method and peeling apparatus
US10262362B1 (en) 2014-02-14 2019-04-16 Experian Information Solutions, Inc. Automatic generation of code for attributes
US10445152B1 (en) 2014-12-19 2019-10-15 Experian Information Solutions, Inc. Systems and methods for dynamic report generation based on automatic modeling of complex data structures
US10431510B2 (en) * 2017-10-09 2019-10-01 Global Circuit Innovations, Inc. Hermetic lid seal printing method
US11588137B2 (en) 2019-06-05 2023-02-21 Semiconductor Energy Laboratory Co., Ltd. Functional panel, display device, input/output device, and data processing device
US11659758B2 (en) 2019-07-05 2023-05-23 Semiconductor Energy Laboratory Co., Ltd. Display unit, display module, and electronic device
CN113994494A (zh) 2019-07-12 2022-01-28 株式会社半导体能源研究所 功能面板、显示装置、输入输出装置、数据处理装置
JP2021043263A (ja) * 2019-09-06 2021-03-18 富士通オプティカルコンポーネンツ株式会社 光変調装置及び光変調装置の製造方法
JPWO2021069999A1 (ko) 2019-10-11 2021-04-15
US11539088B2 (en) 2020-03-09 2022-12-27 International Business Machines Corporation Ultra-thin microbattery packaging and handling

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL260956A (ko) * 1961-02-07
US3807833A (en) * 1971-10-29 1974-04-30 Optel Corp Electro-optic cell having a liquid isolated from its hermetic sealing means
US4097889A (en) * 1976-11-01 1978-06-27 Rca Corporation Combination glass/low temperature deposited Siw Nx Hy O.sub.z
JPS63105493A (ja) * 1986-10-22 1988-05-10 アルプス電気株式会社 薄膜ｅｌパネル
JP2636341B2 (ja) * 1988-06-09 1997-07-30 日本電気株式会社 有機薄膜ｅｌ素子
JPH0212284A (ja) * 1988-06-30 1990-01-17 Canon Inc 現像装置
JP2742057B2 (ja) * 1988-07-14 1998-04-22 シャープ株式会社 薄膜ｅｌパネル
JPH03239536A (ja) * 1990-02-16 1991-10-25 Nitto Denko Corp 透明導電性耐透湿フイルム
JP2776040B2 (ja) * 1990-04-27 1998-07-16 凸版印刷株式会社 有機薄膜ｅｌ素子
US5073446A (en) * 1990-07-26 1991-12-17 Eastman Kodak Company Organic electroluminescent device with stabilizing fused metal particle cathode
US5059861A (en) * 1990-07-26 1991-10-22 Eastman Kodak Company Organic electroluminescent device with stabilizing cathode capping layer
US5047687A (en) * 1990-07-26 1991-09-10 Eastman Kodak Company Organic electroluminescent device with stabilized cathode
JP2772739B2 (ja) * 1991-06-20 1998-07-09 いわき電子株式会社 リードレスパッケージの外部電極構造及びその製造方法
JP2699695B2 (ja) * 1991-06-07 1998-01-19 日本電気株式会社 化学気相成長法
JP2813499B2 (ja) * 1991-09-30 1998-10-22 出光興産株式会社 有機ｅｌ素子

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DE69630162D1 (de) 2003-11-06
JPH08306955A (ja) 1996-11-22
US5771562A (en) 1998-06-30
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EP0741419A3 (en) 1997-09-03
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