KR100479000B1
(ko)
*
|
1996-05-15 |
2005-08-01 |
세이코 엡슨 가부시키가이샤 |
박막디바이스,액정패널및전자기기및박막디바이스의제조방법
|
DE69707233T2
(de)
*
|
1996-05-28 |
2002-07-11 |
Koninklijke Philips Electronics N.V., Eindhoven |
Organische elektrolumineszente vorrichtung
|
EP0862156B1
(en)
*
|
1996-09-19 |
2005-04-20 |
Seiko Epson Corporation |
Method of production of a matrix type display device
|
JP3899566B2
(ja)
*
|
1996-11-25 |
2007-03-28 |
セイコーエプソン株式会社 |
有機el表示装置の製造方法
|
US5952778A
(en)
*
|
1997-03-18 |
1999-09-14 |
International Business Machines Corporation |
Encapsulated organic light emitting device
|
JP3290375B2
(ja)
*
|
1997-05-12 |
2002-06-10 |
松下電器産業株式会社 |
有機電界発光素子
|
US6198220B1
(en)
*
|
1997-07-11 |
2001-03-06 |
Emagin Corporation |
Sealing structure for organic light emitting devices
|
EP1021255A1
(en)
*
|
1997-07-11 |
2000-07-26 |
Fed Corporation |
Sealing structure for organic light emitting devices
|
JPH1140346A
(ja)
*
|
1997-07-22 |
1999-02-12 |
Pioneer Electron Corp |
有機エレクトロルミネセンス表示装置
|
DE19735760A1
(de)
*
|
1997-08-18 |
1999-02-25 |
Zeiss Carl Fa |
Lötverfahren für optische Materialien an Metallfassungen und gefaßte Baugruppen
|
US5990498A
(en)
*
|
1997-09-16 |
1999-11-23 |
Polaroid Corporation |
Light-emitting diode having uniform irradiance distribution
|
US6370019B1
(en)
*
|
1998-02-17 |
2002-04-09 |
Sarnoff Corporation |
Sealing of large area display structures
|
US6080031A
(en)
*
|
1998-09-02 |
2000-06-27 |
Motorola, Inc. |
Methods of encapsulating electroluminescent apparatus
|
US7126161B2
(en)
|
1998-10-13 |
2006-10-24 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device having El layer and sealing material
|
US6274887B1
(en)
|
1998-11-02 |
2001-08-14 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device and manufacturing method therefor
|
CA2353506A1
(en)
*
|
1998-11-02 |
2000-05-11 |
3M Innovative Properties Company |
Transparent conductive oxides for plastic flat panel displays
|
US7141821B1
(en)
*
|
1998-11-10 |
2006-11-28 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device having an impurity gradient in the impurity regions and method of manufacture
|
US7022556B1
(en)
|
1998-11-11 |
2006-04-04 |
Semiconductor Energy Laboratory Co., Ltd. |
Exposure device, exposure method and method of manufacturing semiconductor device
|
US6277679B1
(en)
|
1998-11-25 |
2001-08-21 |
Semiconductor Energy Laboratory Co., Ltd. |
Method of manufacturing thin film transistor
|
EP1524708A3
(en)
|
1998-12-16 |
2006-07-26 |
Battelle Memorial Institute |
Environmental barrier material and methods of making.
|
US6268695B1
(en)
|
1998-12-16 |
2001-07-31 |
Battelle Memorial Institute |
Environmental barrier material for organic light emitting device and method of making
|
US6960877B1
(en)
|
1998-12-17 |
2005-11-01 |
Cambrdige Display Technology Limited |
Organic light-emitting devices including specific barrier layers
|
US7697052B1
(en)
|
1999-02-17 |
2010-04-13 |
Semiconductor Energy Laboratory Co., Ltd. |
Electronic view finder utilizing an organic electroluminescence display
|
JP2000294369A
(ja)
*
|
1999-04-05 |
2000-10-20 |
Chisso Corp |
有機el素子
|
US6680487B1
(en)
|
1999-05-14 |
2004-01-20 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor comprising a TFT provided on a substrate having an insulating surface and method of fabricating the same
|
US7091605B2
(en)
*
|
2001-09-21 |
2006-08-15 |
Eastman Kodak Company |
Highly moisture-sensitive electronic device element and method for fabrication
|
TW527735B
(en)
*
|
1999-06-04 |
2003-04-11 |
Semiconductor Energy Lab |
Electro-optical device
|
US8853696B1
(en)
|
1999-06-04 |
2014-10-07 |
Semiconductor Energy Laboratory Co., Ltd. |
Electro-optical device and electronic device
|
US7288420B1
(en)
|
1999-06-04 |
2007-10-30 |
Semiconductor Energy Laboratory Co., Ltd. |
Method for manufacturing an electro-optical device
|
TW516244B
(en)
|
1999-09-17 |
2003-01-01 |
Semiconductor Energy Lab |
EL display device and method for manufacturing the same
|
JP3942770B2
(ja)
*
|
1999-09-22 |
2007-07-11 |
株式会社半導体エネルギー研究所 |
El表示装置及び電子装置
|
TW480722B
(en)
|
1999-10-12 |
2002-03-21 |
Semiconductor Energy Lab |
Manufacturing method of electro-optical device
|
US6413645B1
(en)
*
|
2000-04-20 |
2002-07-02 |
Battelle Memorial Institute |
Ultrabarrier substrates
|
US7198832B2
(en)
|
1999-10-25 |
2007-04-03 |
Vitex Systems, Inc. |
Method for edge sealing barrier films
|
US20100330748A1
(en)
|
1999-10-25 |
2010-12-30 |
Xi Chu |
Method of encapsulating an environmentally sensitive device
|
US6548912B1
(en)
|
1999-10-25 |
2003-04-15 |
Battelle Memorial Institute |
Semicoductor passivation using barrier coatings
|
US6866901B2
(en)
*
|
1999-10-25 |
2005-03-15 |
Vitex Systems, Inc. |
Method for edge sealing barrier films
|
US6573652B1
(en)
|
1999-10-25 |
2003-06-03 |
Battelle Memorial Institute |
Encapsulated display devices
|
US6623861B2
(en)
*
|
2001-04-16 |
2003-09-23 |
Battelle Memorial Institute |
Multilayer plastic substrates
|
US6587086B1
(en)
|
1999-10-26 |
2003-07-01 |
Semiconductor Energy Laboratory Co., Ltd. |
Electro-optical device
|
US7112115B1
(en)
|
1999-11-09 |
2006-09-26 |
Semiconductor Energy Laboratory Co., Ltd. |
Light emitting device and method of manufacturing the same
|
US6646287B1
(en)
|
1999-11-19 |
2003-11-11 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device with tapered gate and insulating film
|
US20010053559A1
(en)
*
|
2000-01-25 |
2001-12-20 |
Semiconductor Energy Laboratory Co., Ltd. |
Method of fabricating display device
|
US6559594B2
(en)
*
|
2000-02-03 |
2003-05-06 |
Semiconductor Energy Laboratory Co., Ltd. |
Light-emitting device
|
US6492026B1
(en)
|
2000-04-20 |
2002-12-10 |
Battelle Memorial Institute |
Smoothing and barrier layers on high Tg substrates
|
US6465953B1
(en)
*
|
2000-06-12 |
2002-10-15 |
General Electric Company |
Plastic substrates with improved barrier properties for devices sensitive to water and/or oxygen, such as organic electroluminescent devices
|
AU2001283424A1
(en)
*
|
2000-08-17 |
2002-02-25 |
Power Signal Technologies, Inc. |
Glass-to-metal hermetically led array in a sealed solid state light
|
US7875975B2
(en)
*
|
2000-08-18 |
2011-01-25 |
Polyic Gmbh & Co. Kg |
Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag
|
US6605826B2
(en)
|
2000-08-18 |
2003-08-12 |
Semiconductor Energy Laboratory Co., Ltd. |
Light-emitting device and display device
|
MY141175A
(en)
*
|
2000-09-08 |
2010-03-31 |
Semiconductor Energy Lab |
Light emitting device, method of manufacturing the same, and thin film forming apparatus
|
DE10044841B4
(de)
|
2000-09-11 |
2006-11-30 |
Osram Opto Semiconductors Gmbh |
Plasmaverkapselung für elektronische und mikroelektronische Bauelemente wie OLEDs sowie Verfahren zu dessen Herstellung
|
US6924594B2
(en)
*
|
2000-10-03 |
2005-08-02 |
Semiconductor Energy Laboratory Co., Ltd. |
Light emitting device
|
US6537688B2
(en)
|
2000-12-01 |
2003-03-25 |
Universal Display Corporation |
Adhesive sealed organic optoelectronic structures
|
US6614057B2
(en)
|
2001-02-07 |
2003-09-02 |
Universal Display Corporation |
Sealed organic optoelectronic structures
|
US7222981B2
(en)
*
|
2001-02-15 |
2007-05-29 |
Semiconductor Energy Laboratory Co., Ltd. |
EL display device and electronic device
|
US6576351B2
(en)
|
2001-02-16 |
2003-06-10 |
Universal Display Corporation |
Barrier region for optoelectronic devices
|
US6822391B2
(en)
*
|
2001-02-21 |
2004-11-23 |
Semiconductor Energy Laboratory Co., Ltd. |
Light emitting device, electronic equipment, and method of manufacturing thereof
|
US20050274322A1
(en)
*
|
2001-02-26 |
2005-12-15 |
Lee Chung J |
Reactor for producing reactive intermediates for low dielectric constant polymer thin films
|
US6881447B2
(en)
|
2002-04-04 |
2005-04-19 |
Dielectric Systems, Inc. |
Chemically and electrically stabilized polymer films
|
US6624568B2
(en)
|
2001-03-28 |
2003-09-23 |
Universal Display Corporation |
Multilayer barrier region containing moisture- and oxygen-absorbing material for optoelectronic devices
|
US6664137B2
(en)
*
|
2001-03-29 |
2003-12-16 |
Universal Display Corporation |
Methods and structures for reducing lateral diffusion through cooperative barrier layers
|
US6706316B2
(en)
*
|
2001-05-08 |
2004-03-16 |
Eastman Kodak Company |
Ultrasonically sealing the cover plate to provide a hermetic enclosure for OLED displays
|
JP4041660B2
(ja)
*
|
2001-05-31 |
2008-01-30 |
ユーディナデバイス株式会社 |
半導体装置及びその製造方法
|
US6692326B2
(en)
|
2001-06-16 |
2004-02-17 |
Cld, Inc. |
Method of making organic electroluminescent display
|
TW588570B
(en)
*
|
2001-06-18 |
2004-05-21 |
Semiconductor Energy Lab |
Light emitting device and method of fabricating the same
|
US7211828B2
(en)
|
2001-06-20 |
2007-05-01 |
Semiconductor Energy Laboratory Co., Ltd. |
Light emitting device and electronic apparatus
|
TW548860B
(en)
|
2001-06-20 |
2003-08-21 |
Semiconductor Energy Lab |
Light emitting device and method of manufacturing the same
|
TW546857B
(en)
*
|
2001-07-03 |
2003-08-11 |
Semiconductor Energy Lab |
Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment
|
US6664730B2
(en)
|
2001-07-09 |
2003-12-16 |
Universal Display Corporation |
Electrode structure of el device
|
US7469558B2
(en)
*
|
2001-07-10 |
2008-12-30 |
Springworks, Llc |
As-deposited planar optical waveguides with low scattering loss and methods for their manufacture
|
US8415208B2
(en)
|
2001-07-16 |
2013-04-09 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device and peeling off method and method of manufacturing semiconductor device
|
US6888307B2
(en)
*
|
2001-08-21 |
2005-05-03 |
Universal Display Corporation |
Patterned oxygen and moisture absorber for organic optoelectronic device structures
|
US7351300B2
(en)
*
|
2001-08-22 |
2008-04-01 |
Semiconductor Energy Laboratory Co., Ltd. |
Peeling method and method of manufacturing semiconductor device
|
US6470594B1
(en)
|
2001-09-21 |
2002-10-29 |
Eastman Kodak Company |
Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps
|
US6590157B2
(en)
|
2001-09-21 |
2003-07-08 |
Eastman Kodak Company |
Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
|
US7026758B2
(en)
*
|
2001-09-28 |
2006-04-11 |
Osram Opto Semiconductors Gmbh |
Reinforcement of glass substrates in flexible devices
|
JP4166455B2
(ja)
*
|
2001-10-01 |
2008-10-15 |
株式会社半導体エネルギー研究所 |
偏光フィルム及び発光装置
|
JP4019690B2
(ja)
*
|
2001-11-02 |
2007-12-12 |
セイコーエプソン株式会社 |
電気光学装置及びその製造方法並びに電子機器
|
US7404877B2
(en)
*
|
2001-11-09 |
2008-07-29 |
Springworks, Llc |
Low temperature zirconia based thermal barrier layer by PVD
|
US7050835B2
(en)
|
2001-12-12 |
2006-05-23 |
Universal Display Corporation |
Intelligent multi-media display communication system
|
EP1459394B1
(en)
*
|
2001-12-13 |
2014-10-29 |
Koninklijke Philips N.V. |
Sealing structure for display devices
|
JP2003224245A
(ja)
*
|
2002-01-31 |
2003-08-08 |
Matsushita Electric Ind Co Ltd |
半導体装置の製造方法
|
JP2003232897A
(ja)
*
|
2002-02-13 |
2003-08-22 |
Konica Corp |
放射線画像変換パネルの製造方法
|
US20030175142A1
(en)
*
|
2002-03-16 |
2003-09-18 |
Vassiliki Milonopoulou |
Rare-earth pre-alloyed PVD targets for dielectric planar applications
|
US7378356B2
(en)
|
2002-03-16 |
2008-05-27 |
Springworks, Llc |
Biased pulse DC reactive sputtering of oxide films
|
US6884327B2
(en)
|
2002-03-16 |
2005-04-26 |
Tao Pan |
Mode size converter for a planar waveguide
|
US20050158454A1
(en)
*
|
2002-04-04 |
2005-07-21 |
Dielectric Systems, Inc. |
Method and system for forming an organic light-emitting device display having a plurality of passive polymer layers
|
US20050174045A1
(en)
*
|
2002-04-04 |
2005-08-11 |
Dielectric Systems, Inc. |
Organic light-emitting device display having a plurality of passive polymer layers
|
US20070216300A1
(en)
*
|
2002-04-04 |
2007-09-20 |
International Display Systems, Inc. |
Organic opto-electronic device with environmentally protective barrier
|
US8900366B2
(en)
|
2002-04-15 |
2014-12-02 |
Samsung Display Co., Ltd. |
Apparatus for depositing a multilayer coating on discrete sheets
|
US8808457B2
(en)
|
2002-04-15 |
2014-08-19 |
Samsung Display Co., Ltd. |
Apparatus for depositing a multilayer coating on discrete sheets
|
US7164155B2
(en)
*
|
2002-05-15 |
2007-01-16 |
Semiconductor Energy Laboratory Co., Ltd. |
Light emitting device
|
US7230271B2
(en)
|
2002-06-11 |
2007-06-12 |
Semiconductor Energy Laboratory Co., Ltd. |
Light emitting device comprising film having hygroscopic property and transparency and manufacturing method thereof
|
DE10236855B4
(de)
*
|
2002-08-07 |
2006-03-16 |
Samsung SDI Co., Ltd., Suwon |
Gehäuseeinheit zur Verkapselung von Bauelementen und Verfahren zu deren Herstellung
|
US9793523B2
(en)
|
2002-08-09 |
2017-10-17 |
Sapurast Research Llc |
Electrochemical apparatus with barrier layer protected substrate
|
US8445130B2
(en)
|
2002-08-09 |
2013-05-21 |
Infinite Power Solutions, Inc. |
Hybrid thin-film battery
|
US8236443B2
(en)
|
2002-08-09 |
2012-08-07 |
Infinite Power Solutions, Inc. |
Metal film encapsulation
|
US8394522B2
(en)
|
2002-08-09 |
2013-03-12 |
Infinite Power Solutions, Inc. |
Robust metal film encapsulation
|
US20070264564A1
(en)
|
2006-03-16 |
2007-11-15 |
Infinite Power Solutions, Inc. |
Thin film battery on an integrated circuit or circuit board and method thereof
|
US8431264B2
(en)
|
2002-08-09 |
2013-04-30 |
Infinite Power Solutions, Inc. |
Hybrid thin-film battery
|
US8021778B2
(en)
|
2002-08-09 |
2011-09-20 |
Infinite Power Solutions, Inc. |
Electrochemical apparatus with barrier layer protected substrate
|
US8404376B2
(en)
|
2002-08-09 |
2013-03-26 |
Infinite Power Solutions, Inc. |
Metal film encapsulation
|
US6933051B2
(en)
*
|
2002-08-17 |
2005-08-23 |
3M Innovative Properties Company |
Flexible electrically conductive film
|
US6929864B2
(en)
*
|
2002-08-17 |
2005-08-16 |
3M Innovative Properties Company |
Extensible, visible light-transmissive and infrared-reflective film and methods of making and using the film
|
US6818291B2
(en)
*
|
2002-08-17 |
2004-11-16 |
3M Innovative Properties Company |
Durable transparent EMI shielding film
|
US7215473B2
(en)
*
|
2002-08-17 |
2007-05-08 |
3M Innovative Properties Company |
Enhanced heat mirror films
|
AU2003261463A1
(en)
|
2002-08-27 |
2004-03-19 |
Symmorphix, Inc. |
Optically coupling into highly uniform waveguides
|
US6887733B2
(en)
*
|
2002-09-11 |
2005-05-03 |
Osram Opto Semiconductors (Malaysia) Sdn. Bhd |
Method of fabricating electronic devices
|
US7224116B2
(en)
*
|
2002-09-11 |
2007-05-29 |
Osram Opto Semiconductors Gmbh |
Encapsulation of active electronic devices
|
US20040048033A1
(en)
*
|
2002-09-11 |
2004-03-11 |
Osram Opto Semiconductors (Malaysia) Sdn. Bhd. |
Oled devices with improved encapsulation
|
US7193364B2
(en)
*
|
2002-09-12 |
2007-03-20 |
Osram Opto Semiconductors (Malaysia) Sdn. Bhd |
Encapsulation for organic devices
|
US7710019B2
(en)
|
2002-12-11 |
2010-05-04 |
Samsung Electronics Co., Ltd. |
Organic light-emitting diode display comprising auxiliary electrodes
|
JP2004200041A
(ja)
*
|
2002-12-19 |
2004-07-15 |
Tohoku Pioneer Corp |
有機el表示装置
|
TW586329B
(en)
*
|
2003-01-29 |
2004-05-01 |
Au Optronics Corp |
Sealing structure and method of making the same
|
US7205662B2
(en)
|
2003-02-27 |
2007-04-17 |
Symmorphix, Inc. |
Dielectric barrier layer films
|
US7365442B2
(en)
*
|
2003-03-31 |
2008-04-29 |
Osram Opto Semiconductors Gmbh |
Encapsulation of thin-film electronic devices
|
US7510913B2
(en)
|
2003-04-11 |
2009-03-31 |
Vitex Systems, Inc. |
Method of making an encapsulated plasma sensitive device
|
US7648925B2
(en)
|
2003-04-11 |
2010-01-19 |
Vitex Systems, Inc. |
Multilayer barrier stacks and methods of making multilayer barrier stacks
|
US20040206953A1
(en)
*
|
2003-04-16 |
2004-10-21 |
Robert Morena |
Hermetically sealed glass package and method of fabrication
|
US6998776B2
(en)
*
|
2003-04-16 |
2006-02-14 |
Corning Incorporated |
Glass package that is hermetically sealed with a frit and method of fabrication
|
US7344901B2
(en)
*
|
2003-04-16 |
2008-03-18 |
Corning Incorporated |
Hermetically sealed package and method of fabricating of a hermetically sealed package
|
US7238628B2
(en)
|
2003-05-23 |
2007-07-03 |
Symmorphix, Inc. |
Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides
|
US8728285B2
(en)
|
2003-05-23 |
2014-05-20 |
Demaray, Llc |
Transparent conductive oxides
|
US20040238846A1
(en)
*
|
2003-05-30 |
2004-12-02 |
Georg Wittmann |
Organic electronic device
|
US7495644B2
(en)
*
|
2003-12-26 |
2009-02-24 |
Semiconductor Energy Laboratory Co., Ltd. |
Display device and method for manufacturing display device
|
JP4214152B2
(ja)
*
|
2003-12-26 |
2009-01-28 |
パナソニック株式会社 |
表示装置
|
KR100553758B1
(ko)
*
|
2004-02-02 |
2006-02-20 |
삼성에스디아이 주식회사 |
유기 전계 발광 소자
|
JP4540382B2
(ja)
*
|
2004-04-05 |
2010-09-08 |
Hoya株式会社 |
撮影用照明装置
|
DE102004024676A1
(de)
*
|
2004-05-18 |
2005-12-15 |
Süd-Chemie AG |
Filmförmige sorbenshaltige Zusammensetzungen
|
US7202504B2
(en)
|
2004-05-20 |
2007-04-10 |
Semiconductor Energy Laboratory Co., Ltd. |
Light-emitting element and display device
|
KR100615228B1
(ko)
*
|
2004-06-29 |
2006-08-25 |
삼성에스디아이 주식회사 |
흡습 능력이 개선된 유기 전계 발광 소자 및 그 제조방법
|
ES2350350T3
(es)
*
|
2004-07-02 |
2011-01-21 |
Konarka Technologies, Inc. |
Componente fotovoltaico orgánico con encapsulación.
|
US8732004B1
(en)
|
2004-09-22 |
2014-05-20 |
Experian Information Solutions, Inc. |
Automated analysis of data to generate prospect notifications based on trigger events
|
US7342356B2
(en)
|
2004-09-23 |
2008-03-11 |
3M Innovative Properties Company |
Organic electroluminescent device having protective structure with boron oxide layer and inorganic barrier layer
|
US20060063015A1
(en)
|
2004-09-23 |
2006-03-23 |
3M Innovative Properties Company |
Protected polymeric film
|
US7792732B2
(en)
|
2004-10-29 |
2010-09-07 |
American Express Travel Related Services Company, Inc. |
Using commercial share of wallet to rate investments
|
US20060093795A1
(en)
*
|
2004-11-04 |
2006-05-04 |
Eastman Kodak Company |
Polymeric substrate having a desiccant layer
|
US7959769B2
(en)
|
2004-12-08 |
2011-06-14 |
Infinite Power Solutions, Inc. |
Deposition of LiCoO2
|
ATE447777T1
(de)
|
2004-12-08 |
2009-11-15 |
Symmorphix Inc |
Abscheidung von licoo2
|
US20060145599A1
(en)
*
|
2005-01-04 |
2006-07-06 |
Reza Stegamat |
OLEDs with phosphors
|
US7767498B2
(en)
*
|
2005-08-25 |
2010-08-03 |
Vitex Systems, Inc. |
Encapsulated devices and method of making
|
US7838133B2
(en)
|
2005-09-02 |
2010-11-23 |
Springworks, Llc |
Deposition of perovskite and other compound ceramic films for dielectric applications
|
US7549905B2
(en)
*
|
2005-09-30 |
2009-06-23 |
International Display Systems, Inc. |
Method of encapsulating an organic light emitting device
|
US20080033852A1
(en)
*
|
2005-10-24 |
2008-02-07 |
Megdal Myles G |
Computer-based modeling of spending behaviors of entities
|
US7621794B2
(en)
*
|
2005-11-09 |
2009-11-24 |
International Display Systems, Inc. |
Method of encapsulating an organic light-emitting device
|
US20080124558A1
(en)
*
|
2006-08-18 |
2008-05-29 |
Heather Debra Boek |
Boro-silicate glass frits for hermetic sealing of light emitting device displays
|
US8088502B2
(en)
*
|
2006-09-20 |
2012-01-03 |
Battelle Memorial Institute |
Nanostructured thin film optical coatings
|
CN101523571A
(zh)
|
2006-09-29 |
2009-09-02 |
无穷动力解决方案股份有限公司 |
柔性基板上沉积的电池层的掩模和材料限制
|
US8036979B1
(en)
|
2006-10-05 |
2011-10-11 |
Experian Information Solutions, Inc. |
System and method for generating a finance attribute from tradeline data
|
US8197781B2
(en)
|
2006-11-07 |
2012-06-12 |
Infinite Power Solutions, Inc. |
Sputtering target of Li3PO4 and method for producing same
|
WO2008083308A1
(en)
*
|
2006-12-28 |
2008-07-10 |
3M Innovative Properties Company |
Nucleation layer for thin film metal layer formation
|
US8606626B1
(en)
|
2007-01-31 |
2013-12-10 |
Experian Information Solutions, Inc. |
Systems and methods for providing a direct marketing campaign planning environment
|
US8606666B1
(en)
|
2007-01-31 |
2013-12-10 |
Experian Information Solutions, Inc. |
System and method for providing an aggregation tool
|
JP5208591B2
(ja)
*
|
2007-06-28 |
2013-06-12 |
株式会社半導体エネルギー研究所 |
発光装置、及び照明装置
|
US9334557B2
(en)
|
2007-12-21 |
2016-05-10 |
Sapurast Research Llc |
Method for sputter targets for electrolyte films
|
US8268488B2
(en)
|
2007-12-21 |
2012-09-18 |
Infinite Power Solutions, Inc. |
Thin film electrolyte for thin film batteries
|
WO2009089417A1
(en)
|
2008-01-11 |
2009-07-16 |
Infinite Power Solutions, Inc. |
Thin film encapsulation for thin film batteries and other devices
|
CN101983469B
(zh)
|
2008-04-02 |
2014-06-04 |
无穷动力解决方案股份有限公司 |
与能量采集关联的储能装置的无源过电压/欠电压控制和保护
|
US8350451B2
(en)
*
|
2008-06-05 |
2013-01-08 |
3M Innovative Properties Company |
Ultrathin transparent EMI shielding film comprising a polymer basecoat and crosslinked polymer transparent dielectric layer
|
JP2012500610A
(ja)
|
2008-08-11 |
2012-01-05 |
インフィニット パワー ソリューションズ, インコーポレイテッド |
電磁エネルギー獲得ための統合コレクタ表面を有するエネルギーデバイスおよびその方法
|
WO2010030743A1
(en)
|
2008-09-12 |
2010-03-18 |
Infinite Power Solutions, Inc. |
Energy device with integral conductive surface for data communication via electromagnetic energy and method thereof
|
WO2010042594A1
(en)
|
2008-10-08 |
2010-04-15 |
Infinite Power Solutions, Inc. |
Environmentally-powered wireless sensor module
|
EP2178133B1
(en)
|
2008-10-16 |
2019-09-18 |
Semiconductor Energy Laboratory Co., Ltd. |
Flexible Light-Emitting Device, Electronic Device, and Method for Manufacturing Flexible-Light Emitting Device
|
US20100095705A1
(en)
|
2008-10-20 |
2010-04-22 |
Burkhalter Robert S |
Method for forming a dry glass-based frit
|
US9337446B2
(en)
|
2008-12-22 |
2016-05-10 |
Samsung Display Co., Ltd. |
Encapsulated RGB OLEDs having enhanced optical output
|
US9184410B2
(en)
|
2008-12-22 |
2015-11-10 |
Samsung Display Co., Ltd. |
Encapsulated white OLEDs having enhanced optical output
|
US8219408B2
(en)
*
|
2008-12-29 |
2012-07-10 |
Motorola Mobility, Inc. |
Audio signal decoder and method for producing a scaled reconstructed audio signal
|
US8766269B2
(en)
|
2009-07-02 |
2014-07-01 |
Semiconductor Energy Laboratory Co., Ltd. |
Light-emitting device, lighting device, and electronic device
|
CN102576828B
(zh)
|
2009-09-01 |
2016-04-20 |
萨普拉斯特研究有限责任公司 |
具有集成薄膜电池的印刷电路板
|
US8590338B2
(en)
|
2009-12-31 |
2013-11-26 |
Samsung Mobile Display Co., Ltd. |
Evaporator with internal restriction
|
TWI589042B
(zh)
*
|
2010-01-20 |
2017-06-21 |
半導體能源研究所股份有限公司 |
發光裝置,撓性發光裝置,電子裝置,照明設備,以及發光裝置和撓性發光裝置的製造方法
|
US9000442B2
(en)
*
|
2010-01-20 |
2015-04-07 |
Semiconductor Energy Laboratory Co., Ltd. |
Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device
|
US9652802B1
(en)
|
2010-03-24 |
2017-05-16 |
Consumerinfo.Com, Inc. |
Indirect monitoring and reporting of a user's credit data
|
EP2577777B1
(en)
|
2010-06-07 |
2016-12-28 |
Sapurast Research LLC |
Rechargeable, high-density electrochemical device
|
TWI540939B
(zh)
|
2010-09-14 |
2016-07-01 |
半導體能源研究所股份有限公司 |
固態發光元件,發光裝置和照明裝置
|
JP5827104B2
(ja)
|
2010-11-19 |
2015-12-02 |
株式会社半導体エネルギー研究所 |
照明装置
|
JP6118020B2
(ja)
|
2010-12-16 |
2017-04-19 |
株式会社半導体エネルギー研究所 |
発光装置
|
US8735874B2
(en)
|
2011-02-14 |
2014-05-27 |
Semiconductor Energy Laboratory Co., Ltd. |
Light-emitting device, display device, and method for manufacturing the same
|
KR101922603B1
(ko)
|
2011-03-04 |
2018-11-27 |
가부시키가이샤 한도오따이 에네루기 켄큐쇼 |
발광 장치, 조명 장치, 기판, 기판의 제작 방법
|
KR102079188B1
(ko)
|
2012-05-09 |
2020-02-19 |
가부시키가이샤 한도오따이 에네루기 켄큐쇼 |
발광 장치 및 전자 기기
|
WO2014129519A1
(en)
|
2013-02-20 |
2014-08-28 |
Semiconductor Energy Laboratory Co., Ltd. |
Peeling method, semiconductor device, and peeling apparatus
|
CN103560209A
(zh)
*
|
2013-10-12 |
2014-02-05 |
深圳市华星光电技术有限公司 |
有机发光二极管装置以及其制造方法
|
WO2015087192A1
(en)
|
2013-12-12 |
2015-06-18 |
Semiconductor Energy Laboratory Co., Ltd. |
Peeling method and peeling apparatus
|
US10262362B1
(en)
|
2014-02-14 |
2019-04-16 |
Experian Information Solutions, Inc. |
Automatic generation of code for attributes
|
US10242019B1
(en)
|
2014-12-19 |
2019-03-26 |
Experian Information Solutions, Inc. |
User behavior segmentation using latent topic detection
|
US10431510B2
(en)
*
|
2017-10-09 |
2019-10-01 |
Global Circuit Innovations, Inc. |
Hermetic lid seal printing method
|
US11588137B2
(en)
|
2019-06-05 |
2023-02-21 |
Semiconductor Energy Laboratory Co., Ltd. |
Functional panel, display device, input/output device, and data processing device
|
US11659758B2
(en)
|
2019-07-05 |
2023-05-23 |
Semiconductor Energy Laboratory Co., Ltd. |
Display unit, display module, and electronic device
|
CN113994494A
(zh)
|
2019-07-12 |
2022-01-28 |
株式会社半导体能源研究所 |
功能面板、显示装置、输入输出装置、数据处理装置
|
JP2021043263A
(ja)
*
|
2019-09-06 |
2021-03-18 |
富士通オプティカルコンポーネンツ株式会社 |
光変調装置及び光変調装置の製造方法
|
WO2021069999A1
(ja)
|
2019-10-11 |
2021-04-15 |
株式会社半導体エネルギー研究所 |
機能パネル、表示装置、入出力装置、情報処理装置
|
US11539088B2
(en)
|
2020-03-09 |
2022-12-27 |
International Business Machines Corporation |
Ultra-thin microbattery packaging and handling
|