AU2001283424A1 - Glass-to-metal hermetically led array in a sealed solid state light - Google Patents

Glass-to-metal hermetically led array in a sealed solid state light

Info

Publication number
AU2001283424A1
AU2001283424A1 AU2001283424A AU8342401A AU2001283424A1 AU 2001283424 A1 AU2001283424 A1 AU 2001283424A1 AU 2001283424 A AU2001283424 A AU 2001283424A AU 8342401 A AU8342401 A AU 8342401A AU 2001283424 A1 AU2001283424 A1 AU 2001283424A1
Authority
AU
Australia
Prior art keywords
glass
solid state
led array
state light
sealed solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001283424A
Inventor
Michael C. Hutchison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
POWER SIGNAL TECHNOLOGIES Inc
Original Assignee
POWER SIGNAL TECHNOLOGIES Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by POWER SIGNAL TECHNOLOGIES Inc filed Critical POWER SIGNAL TECHNOLOGIES Inc
Publication of AU2001283424A1 publication Critical patent/AU2001283424A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F21W2111/02—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for roads, paths or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
AU2001283424A 2000-08-17 2001-08-17 Glass-to-metal hermetically led array in a sealed solid state light Abandoned AU2001283424A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US64041600A 2000-08-17 2000-08-17
US09640416 2000-08-17
PCT/US2001/025750 WO2002015281A2 (en) 2000-08-17 2001-08-17 Glass-to-metal hermetically sealed led array

Publications (1)

Publication Number Publication Date
AU2001283424A1 true AU2001283424A1 (en) 2002-02-25

Family

ID=24568140

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001283424A Abandoned AU2001283424A1 (en) 2000-08-17 2001-08-17 Glass-to-metal hermetically led array in a sealed solid state light

Country Status (2)

Country Link
AU (1) AU2001283424A1 (en)
WO (1) WO2002015281A2 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070001177A1 (en) * 2003-05-08 2007-01-04 Koninklijke Philips Electronics N.V. Integrated light-emitting diode system
WO2004107443A1 (en) * 2003-06-03 2004-12-09 Asetronics Ag Insulated metal substrate with at least one light diode, light diode matrix and production method
EP1735844B1 (en) * 2004-03-18 2019-06-19 Phoseon Technology, Inc. Use of a high-density light emitting diode array comprising micro-reflectors for curing applications
WO2005109529A1 (en) * 2004-05-07 2005-11-17 Koninklijke Philips Electronics N.V. Light-emitting-diode chip package and a collimator
US7329982B2 (en) 2004-10-29 2008-02-12 3M Innovative Properties Company LED package with non-bonded optical element
DE102010009429A1 (en) * 2010-02-24 2011-08-25 Siemens Aktiengesellschaft, 80333 Symbol Gazette
US8876322B2 (en) 2012-06-20 2014-11-04 Journée Lighting, Inc. Linear LED module and socket for same
US9565782B2 (en) 2013-02-15 2017-02-07 Ecosense Lighting Inc. Field replaceable power supply cartridge
US9976710B2 (en) 2013-10-30 2018-05-22 Lilibrand Llc Flexible strip lighting apparatus and methods
US10477636B1 (en) 2014-10-28 2019-11-12 Ecosense Lighting Inc. Lighting systems having multiple light sources
US11306897B2 (en) 2015-02-09 2022-04-19 Ecosense Lighting Inc. Lighting systems generating partially-collimated light emissions
US9869450B2 (en) 2015-02-09 2018-01-16 Ecosense Lighting Inc. Lighting systems having a truncated parabolic- or hyperbolic-conical light reflector, or a total internal reflection lens; and having another light reflector
US9651216B2 (en) 2015-03-03 2017-05-16 Ecosense Lighting Inc. Lighting systems including asymmetric lens modules for selectable light distribution
US9746159B1 (en) 2015-03-03 2017-08-29 Ecosense Lighting Inc. Lighting system having a sealing system
US9568665B2 (en) 2015-03-03 2017-02-14 Ecosense Lighting Inc. Lighting systems including lens modules for selectable light distribution
US9651227B2 (en) 2015-03-03 2017-05-16 Ecosense Lighting Inc. Low-profile lighting system having pivotable lighting enclosure
USD785218S1 (en) 2015-07-06 2017-04-25 Ecosense Lighting Inc. LED luminaire having a mounting system
USD782093S1 (en) 2015-07-20 2017-03-21 Ecosense Lighting Inc. LED luminaire having a mounting system
USD782094S1 (en) 2015-07-20 2017-03-21 Ecosense Lighting Inc. LED luminaire having a mounting system
US9651232B1 (en) 2015-08-03 2017-05-16 Ecosense Lighting Inc. Lighting system having a mounting device
US10132476B2 (en) 2016-03-08 2018-11-20 Lilibrand Llc Lighting system with lens assembly
WO2018140727A1 (en) 2017-01-27 2018-08-02 Lilibrand Llc Lighting systems with high color rendering index and uniform planar illumination
US20180328552A1 (en) 2017-03-09 2018-11-15 Lilibrand Llc Fixtures and lighting accessories for lighting devices
WO2019213299A1 (en) 2018-05-01 2019-11-07 Lilibrand Llc Lighting systems and devices with central silicone module
WO2020131933A1 (en) 2018-12-17 2020-06-25 Lilibrand Llc Strip lighting systems which comply with ac driving power

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA920285A (en) * 1970-11-30 1973-01-30 L. Hartman Robert Extending the operating life of light emitting p-n junction devices
US4225380A (en) * 1978-09-05 1980-09-30 Wickens Justin H Method of producing light emitting semiconductor display
JPS5837714B2 (en) * 1979-11-24 1983-08-18 シャープ株式会社 Method for forming a protective film on a light emitting element
JPS60143982A (en) * 1983-12-29 1985-07-30 Sanyo Electric Co Ltd Led head
JP2953468B2 (en) * 1989-06-21 1999-09-27 三菱化学株式会社 Compound semiconductor device and surface treatment method thereof
JP2900000B2 (en) * 1991-07-12 1999-06-02 タキロン株式会社 Light emitting display and method of manufacturing the same
US5771562A (en) * 1995-05-02 1998-06-30 Motorola, Inc. Passivation of organic devices
JPH11163410A (en) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Led lighting device

Also Published As

Publication number Publication date
WO2002015281A3 (en) 2002-05-23
WO2002015281A2 (en) 2002-02-21

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