AU2001289011A1 - Hermetically sealed component assembly package - Google Patents

Hermetically sealed component assembly package

Info

Publication number
AU2001289011A1
AU2001289011A1 AU2001289011A AU8901101A AU2001289011A1 AU 2001289011 A1 AU2001289011 A1 AU 2001289011A1 AU 2001289011 A AU2001289011 A AU 2001289011A AU 8901101 A AU8901101 A AU 8901101A AU 2001289011 A1 AU2001289011 A1 AU 2001289011A1
Authority
AU
Australia
Prior art keywords
hermetically sealed
component assembly
assembly package
sealed component
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001289011A
Inventor
Paul Siu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DATATRONIC DISTRIBUTION Inc
Original Assignee
DATATRONIC DISTRIB Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DATATRONIC DISTRIB Inc filed Critical DATATRONIC DISTRIB Inc
Publication of AU2001289011A1 publication Critical patent/AU2001289011A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
AU2001289011A 2000-09-21 2001-09-12 Hermetically sealed component assembly package Abandoned AU2001289011A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23426500P 2000-09-21 2000-09-21
US60234265 2000-09-21
PCT/US2001/028399 WO2002026008A1 (en) 2000-09-21 2001-09-12 Hermetically sealed component assembly package

Publications (1)

Publication Number Publication Date
AU2001289011A1 true AU2001289011A1 (en) 2002-04-02

Family

ID=22880637

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001289011A Abandoned AU2001289011A1 (en) 2000-09-21 2001-09-12 Hermetically sealed component assembly package

Country Status (5)

Country Link
US (1) US6572004B2 (en)
EP (1) EP1319326A1 (en)
JP (1) JP2004511087A (en)
AU (1) AU2001289011A1 (en)
WO (1) WO2002026008A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004306506A (en) * 2003-04-09 2004-11-04 Canon Inc Method for joining components, method for joining closure member to container, and ultrasonic welding device
EP1734543A1 (en) * 2005-06-17 2006-12-20 YCL Mechanical Co., Ltd. Method for manufacturing electronic device for signal transmission
US8946548B2 (en) * 2006-02-04 2015-02-03 Dean Sanders Nautilus self pressurizing equipment enclosure system, apparatus and methods
US20070251719A1 (en) * 2006-04-27 2007-11-01 Rick Sturdivant Selective, hermetically sealed microwave package apparatus and methods
US8092044B1 (en) 2008-11-21 2012-01-10 Tomar Electronics, Inc. LED light assembly and related methods
WO2013123230A1 (en) * 2012-02-14 2013-08-22 SteriPax, Inc. Design control water based adhesive
US20140238726A1 (en) * 2013-02-28 2014-08-28 Cooper Technologies Company External moisture barrier package for circuit board electrical component
US11432407B2 (en) * 2016-10-28 2022-08-30 Xfmrs, Inc. Electrical component package with reinforced molded pins
US20220240395A1 (en) * 2019-06-11 2022-07-28 Hitachi Astemo, Ltd. Electronic Device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61269345A (en) * 1985-05-24 1986-11-28 Hitachi Ltd Semiconductor device
US4868712A (en) * 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package
JPH0756887B2 (en) * 1988-04-04 1995-06-14 株式会社日立製作所 Semiconductor package and computer using the same
US5200640A (en) * 1991-08-12 1993-04-06 Electron Power Inc. Hermetic package having covers and a base providing for direct electrical connection
JPH0637202A (en) * 1992-07-20 1994-02-10 Mitsubishi Electric Corp Package for microwave ic
US5539151A (en) * 1992-09-25 1996-07-23 Vlsi Technology, Inc. Reinforced sealing technique for an integrated-circuit package
US5904499A (en) * 1994-12-22 1999-05-18 Pace; Benedict G Package for power semiconductor chips
US5641713A (en) * 1995-03-23 1997-06-24 Texas Instruments Incorporated Process for forming a room temperature seal between a base cavity and a lid using an organic sealant and a metal seal ring
US5656985A (en) * 1995-08-10 1997-08-12 Halo Electronics, Inc. Electronic surface mount package
US6075289A (en) * 1996-10-24 2000-06-13 Tessera, Inc. Thermally enhanced packaged semiconductor assemblies
US6094361A (en) * 1997-12-12 2000-07-25 Nortel Networks Corporation Assemblies of printed circuit boards and flexible containers therefor
US5959842A (en) 1998-05-14 1999-09-28 Lucent Technologies Inc. Surface mount power supply package and method of manufacture thereof
US6307258B1 (en) * 1998-12-22 2001-10-23 Silicon Bandwidth, Inc. Open-cavity semiconductor die package
US6305987B1 (en) * 1999-02-12 2001-10-23 Silicon Bandwidth, Inc. Integrated connector and semiconductor die package

Also Published As

Publication number Publication date
EP1319326A1 (en) 2003-06-18
US20020036224A1 (en) 2002-03-28
JP2004511087A (en) 2004-04-08
WO2002026008A1 (en) 2002-03-28
US6572004B2 (en) 2003-06-03

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