KR950015715A - 반도체 장치의 소자 분리막 형성방법 - Google Patents
반도체 장치의 소자 분리막 형성방법 Download PDFInfo
- Publication number
- KR950015715A KR950015715A KR1019930024975A KR930024975A KR950015715A KR 950015715 A KR950015715 A KR 950015715A KR 1019930024975 A KR1019930024975 A KR 1019930024975A KR 930024975 A KR930024975 A KR 930024975A KR 950015715 A KR950015715 A KR 950015715A
- Authority
- KR
- South Korea
- Prior art keywords
- forming
- isolation film
- silicon nitride
- oxide film
- film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76227—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials the dielectric materials being obtained by full chemical transformation of non-dielectric materials, such as polycristalline silicon, metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
- H01L21/76205—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Local Oxidation Of Silicon (AREA)
- Element Separation (AREA)
- Formation Of Insulating Films (AREA)
Abstract
본 발명은 반도체 장치의 소자분리막 형성방법에 관한 것으로, 소자분리막을 형성하기 위한 트렌치(trench)의 측벽에 실리콘 질화막과 다결정 실리콘을 형성한 수 필드 산화 공정을 실시하므로 버즈 비크(birds beak) 및 스트레스(stress)를 줄일 수 있는 반도체 장치의 소자 분리막 형성 방법에 관해 기술된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2a도 내지 제2e도는 본 발명에 따라 반도체 장치의 소자 분리막 형성단계를도시한 단면도.
Claims (1)
- 반도체 장치의 소자 분리막 형성방법에 있어서, 반도체 기판(1)상에 패드 산화막 및 제1실리콘 질화막(2 및 10)을 형성한 다음 포토레지스트(9)를도포하고 패턴화하는 단계와, 상기 단계로부터 상기 제1실리콘 질화막, 패드 산화막 및 반도체 기판(10, 2 및 1)을 식각하여 트렌치(4)를 형성하고 상기 포토레지스트(9)를 제거한 다음 희생 산화막(5)을 형성하는 단계와, 상기 단계로부터 제2실리콘 질화막 및 다결정 실리콘(11 및 12)을 증착한 상태에서 상기 다결정 실리콘(12)을 스페이서 에치하여 다결정 실리콘 스페이서(12A)를 형성하는 단계와, 상기 단계로부터 상기 다결정 실리콘 스페이서(12A)를 마스크로 하여 상기 트렌치(4) 저부의 제2실리콘 질화막(11)을 식각하고 필드 산화공정을 실시하는 단계와, 상기 단계로부터 상기 반도체 기판(1) 상부의 패드 산화막(2), 제1 및 제 실리콘 질화막(10 및 11)을 제거하여 필드 산화막(8)을 완성하는 단계로 이루어진 것을 특징으로 하는 반도체 장치의 소자 분리막 형성방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930024975A KR100187678B1 (ko) | 1993-11-23 | 1993-11-23 | 반도체 장치의 소자 분리막 형성방법 |
JP6288262A JPH07321194A (ja) | 1993-11-23 | 1994-11-22 | 半導体装置の素子分離層の形成方法 |
US08/346,929 US5512509A (en) | 1993-11-23 | 1994-11-23 | Method for forming an isolation layer in a semiconductor device |
DE4441706A DE4441706A1 (de) | 1993-11-23 | 1994-11-23 | Verfahren zur Bildung einer Isolationsschicht für eine Halbleitervorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930024975A KR100187678B1 (ko) | 1993-11-23 | 1993-11-23 | 반도체 장치의 소자 분리막 형성방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950015715A true KR950015715A (ko) | 1995-06-17 |
KR100187678B1 KR100187678B1 (ko) | 1999-06-01 |
Family
ID=19368707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930024975A KR100187678B1 (ko) | 1993-11-23 | 1993-11-23 | 반도체 장치의 소자 분리막 형성방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5512509A (ko) |
JP (1) | JPH07321194A (ko) |
KR (1) | KR100187678B1 (ko) |
DE (1) | DE4441706A1 (ko) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5866467A (en) * | 1995-12-08 | 1999-02-02 | Advanced Micro Devices, Inc. | Method of improving oxide isolation in a semiconductor device |
US5972776A (en) * | 1995-12-22 | 1999-10-26 | Stmicroelectronics, Inc. | Method of forming a planar isolation structure in an integrated circuit |
TW309647B (ko) * | 1995-12-30 | 1997-07-01 | Hyundai Electronics Ind | |
US5658822A (en) * | 1996-03-29 | 1997-08-19 | Vanguard International Semiconductor Corporation | Locos method with double polysilicon/silicon nitride spacer |
US5824594A (en) * | 1996-04-29 | 1998-10-20 | Samsung Electronics Co., Ltd. | Integrated circuit device isolating methods including silicon spacers and oxidation barrier films |
US6121087A (en) * | 1996-06-18 | 2000-09-19 | Conexant Systems, Inc. | Integrated circuit device with embedded flash memory and method for manufacturing same |
US5834360A (en) * | 1996-07-31 | 1998-11-10 | Stmicroelectronics, Inc. | Method of forming an improved planar isolation structure in an integrated circuit |
US5753962A (en) * | 1996-09-16 | 1998-05-19 | Micron Technology, Inc. | Texturized polycrystalline silicon to aid field oxide formation |
US5976950A (en) * | 1997-11-13 | 1999-11-02 | National Semiconductor Corporation | Polysilicon coated swami (sidewall masked isolation) |
KR100475050B1 (ko) * | 1998-09-24 | 2005-07-05 | 삼성전자주식회사 | 스페이서로보호되는박막의질화막라이너를갖는트렌치소자분리방법및구조 |
US6613651B1 (en) * | 2000-09-05 | 2003-09-02 | Lsi Logic Corporation | Integrated circuit isolation system |
US6417093B1 (en) | 2000-10-31 | 2002-07-09 | Lsi Logic Corporation | Process for planarization of metal-filled trenches of integrated circuit structures by forming a layer of planarizable material over the metal layer prior to planarizing |
US6586814B1 (en) | 2000-12-11 | 2003-07-01 | Lsi Logic Corporation | Etch resistant shallow trench isolation in a semiconductor wafer |
US6617251B1 (en) | 2001-06-19 | 2003-09-09 | Lsi Logic Corporation | Method of shallow trench isolation formation and planarization |
US7007900B2 (en) * | 2002-10-01 | 2006-03-07 | Andrew Corporation | Cable hanger |
KR100980055B1 (ko) | 2003-06-30 | 2010-09-03 | 주식회사 하이닉스반도체 | 반도체 소자의 소자 분리막 형성 방법 |
US20070224772A1 (en) * | 2006-03-21 | 2007-09-27 | Freescale Semiconductor, Inc. | Method for forming a stressor structure |
KR100824205B1 (ko) * | 2006-12-26 | 2008-04-21 | 매그나칩 반도체 유한회사 | Dmos 트랜지스터 및 그 제조방법 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5992547A (ja) * | 1982-11-19 | 1984-05-28 | Hitachi Ltd | アイソレ−シヨン方法 |
JPS6214439A (ja) * | 1985-07-12 | 1987-01-23 | Nec Corp | 半導体装置の製造方法 |
JPS6324635A (ja) * | 1986-07-17 | 1988-02-02 | Toshiba Corp | 半導体装置の製造方法 |
JPS63258040A (ja) * | 1987-04-15 | 1988-10-25 | Nec Corp | 素子分離領域の形成方法 |
JP2747563B2 (ja) * | 1987-06-15 | 1998-05-06 | ヒュンダイ エレクトロニクス アメリカ | 半導体のフイールド酸化物形成方法 |
JPH0199234A (ja) * | 1987-10-13 | 1989-04-18 | Matsushita Electric Ind Co Ltd | 分離領域形成方法 |
JPH0461123A (ja) * | 1990-06-22 | 1992-02-27 | Nec Corp | 半導体装置の素子分離方法 |
US5175122A (en) * | 1991-06-28 | 1992-12-29 | Digital Equipment Corporation | Planarization process for trench isolation in integrated circuit manufacture |
-
1993
- 1993-11-23 KR KR1019930024975A patent/KR100187678B1/ko not_active IP Right Cessation
-
1994
- 1994-11-22 JP JP6288262A patent/JPH07321194A/ja active Pending
- 1994-11-23 DE DE4441706A patent/DE4441706A1/de not_active Withdrawn
- 1994-11-23 US US08/346,929 patent/US5512509A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100187678B1 (ko) | 1999-06-01 |
US5512509A (en) | 1996-04-30 |
JPH07321194A (ja) | 1995-12-08 |
DE4441706A1 (de) | 1995-05-24 |
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FPAY | Annual fee payment |
Payment date: 20061211 Year of fee payment: 9 |
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LAPS | Lapse due to unpaid annual fee |