KR940027141A - 다이지지면을 가지지 않은 반도체 장치와 이의 제조방법 - Google Patents

다이지지면을 가지지 않은 반도체 장치와 이의 제조방법 Download PDF

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Publication number
KR940027141A
KR940027141A KR1019940009693A KR19940009693A KR940027141A KR 940027141 A KR940027141 A KR 940027141A KR 1019940009693 A KR1019940009693 A KR 1019940009693A KR 19940009693 A KR19940009693 A KR 19940009693A KR 940027141 A KR940027141 A KR 940027141A
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South Korea
Prior art keywords
semiconductor die
die
conductors
pcb substrate
semiconductor
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KR1019940009693A
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English (en)
Inventor
덴나스 프랭크
케이. 노미 빅터
알. 패스토어 죤
조 리베스 트월라
Original Assignee
빈센트 비. 인그라시아
모토로라 인코포레이티드
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Publication of KR940027141A publication Critical patent/KR940027141A/ko

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    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material

Abstract

다이 지지면을 가지지 않는 와이어 본드가능한 플라스틱 포장된 반도체 장치(58)가 제조될 수 있다. 한실시예에서, 반도체 다이(22)와 다이의 주위면을 향해 연장되는 다수의 도체(12)가 제공되어 있다. 다이는 와이어 본딩 프로세스를 위해 진공(62)으로 워크홀더(60)상의 제위치에 단단히 유지되어 있다. 와이어 본드(26)는 다이를 도체에 전기적으로 연결한다. 와이어 본드된 다이는 몰드 캐비티(64) 내측에 위치되고 수지포장지는 상승된 온도와 압력하에서 캐리티로 이동하여 다이, 와이어 본드와 도체의 일부분 둘레에 패키지 몸체(70)를 형성한다. 패키지 몸체가 형성되기 전, 다이는 도체에 연결된 다이 지지면이 없으므로 와이어 본드의 강성에 의해서만 지지된다.

Description

다이지지면을 가지지 않은 반도체 장치와 이의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 본 발명의 제1실시예에 따른 다이지지면을 가지지 않은 와이어 결합된 반도체를 제조하기 위한 프로세스 단계마다의 각각의 단면도.

Claims (5)

  1. 활성면과 주위면을 가지는 반도체 다이(22)와, 반도체 다이의 활성면을 PCB 기판의 표면상의 다수의 도전성 트레이스에 연결하는 다수의 와이어 본드(26')와, 적어도 반도체 다이의 활성면과 복수의 와이어 본드를 덮는 수지 포장지(122)와, 납땜 패드에 부착된 다수의 납땜볼(126)을 포함하며, 상기 반도체 다이가 다이 캐비티내에 거의 중심 맞추어지고, 상기 PCB 기판은 PCB 기판의 표면상의 주위면을 향해 연장하는 도전성 다수의 트레이스와 다수의 도전성 트레이스에 전기적으로 연결되는 다수의 납땜 패드를 가지며, 상기 다이 캐비티는 PCB 기판의 표면상의 다수의 도전성 트레이스의 전원 트레이스(110)에 그리고 각 납땜 패드에 전기적으로 연결되는 도금된 측벽(108)을 가지는 것을 특징으로 하는 반도체 장치.
  2. 활성면과 주위면을 가지는 반도체 다이(22)와, 다이 캐비티(162)를 가지는 PCB 기판과, 반도체 다이의 활성면을 PCB 기판의 표면상의 다수의 도전성 트레이스에 연결하는 다수의 와이어 본드(26')와, 적어도 반도체 다이의 활성면과 복수의 와이어 본드를 덮는 수지 포장지(180)와, 납땜 패드에 부착된 다수의 납땜볼(126')을 포함하며, 상기 반도체 다이는 다이 캐비티내에 거의 중심 맞추어지고, 상기 PCB 기판은 PCB 기판의 표면상에 반도체 다이의 주위면을 향해 연장하는 다수의 도전성 트레이스(178)와 다수의 도전성 트레이스에 전기적으로 연결되어 있는 다수의 납땜 패드를 가지며, 상기 다수의 도전성 트레이스(178)와 다수의 납땜 패드는 PCB 기판(176)의 동일 표면에 존재하며, 상기 PCB 기판의 평행한 제2표면내에 다수의 리세스를 가지며, 다수의 리세스는 위치상 다수의 납땜 패드에 대응하는 것을 특징으로 하는 반도체 장치.
  3. 반도체 다이와 지지 워크홀더가 밀접한 접촉이 되도록 지지 워크홀더(60)상에 활성면과 주위면을 가지는 반도체 다이(22)를 놓는 단계와, 반도체 다이를 지지 워크홀더상에 단단히 유지하기 위한 수단(62)을 제공하는 단계와, 반도체 다이의 주위면을 향해 연장하는 제1다수의 도체(12, 104)를 제공하는 단계와, 반도체 다이의 활성면을 제1다수의 도체를 전기적으로 연결하는 단계와, 반도체 다이의 비활성면을 지지핀(80)으로 지지하는 단계와, 적어도 반도체 다이의 활성면과 다수의 도체중 일부분을 덮는 패키지 몸체(84, 122)를 형성하도록 몰드 캐비티(64', 118) 내측에 수지 포장지를 몰딩하는 단계와, 외부 전기 접속부를 제공하도록 반도체 다이에 전기적으로 연결된 제2다수의 도체(12, 126)를 제공하는 단계를 포함하는 것을 특징으로 하는 반도체 장치 제조 방법.
  4. 반도체 다이와 지지 워크홀더가 밀접한 접촉이 되도록 지지 워크홀더(60)상에 활성면과 주위면을 가지는 반도체 다이(22)를 놓는 단계와, 반도체 다이를 지지 워크홀더상에 단단히 유지하기 위한 수단(62)을 제공하는 단계와, 반도체 다이의 주위면을 향해 연장하는 제1다수의 도체(12)를 제공하는 단계와, 반도체 다이의 활성면을 제1다수의 도체를 전기적으로 연결하는 단계와, 반도체 다이의 비활성면을 몰드(92, 134)로 지지하는 단계와, 몰드 캐비티 표면에 대항해서 비활성면을 단단히 유지하도록 진공라인(94)을 활성하는 단계와, 적어도 반도체 다이의 활성면과 다수의 도체중 일부분을 덮는 패키지 몸체(96, 122')를 형성하도록 몰드 캐비티(64') 내측에 수지 포장지를 몰딩하는 단계와, 외부 전기 접속부를 제공하도록 반도체 다이에 전기적으로 연결된 제2다수의 도체(12, 126)를 제공하는 단계를 포함하는 것을 특징으로 하는 반도체 장치 제조 방법.
  5. 반도체 다이와 지지 워크홀더가 밀접한 접촉이 되도록 지지 워크홀더(60)상에 활성면과 주위면을 가지는 반도체 다이(22)를 놓는 단계와, 반도체 다이를 지지 워크홀더상에 단단히 유지하기 위한 수단(62)을 제공하는 단계와, 반도체 다이의 주위면을 향해 연장하는 제1다수의 도체(12, 104)를 제공하는 단계와, 다이 캐비티(102)와 PCB 기판의 표면상에 전원 트레이스(110)에 연결되어 있는 도금된 측벽(108)을 가지는 다이 캐비티를 향해 연장하는 다수의 도전성 트레이스(104)를 가지는 PCB 기판(100)을 제공하는 단계와, 반도체 다이의 활성면을 제1다수의 도체를 전기적으로 연결하는 단계와, 적어도 반도체 다이의 활성면과 다수의 도체의 일부분을 덮는 패키지 몸체를 형성할 때 반도체 다이의 비활성면에 접착하는 제거가능한 테이프(148)를 사용하는 단계와, 테이프 제2부분이 비활성면상에 다수의 납땜 레지스트 환형 링(153)을 형성하여 비활성면상에 남아있도록 패키지 몸체를 형성한 후 반도체 다이의 비활성면으로부터 테이프의 제1부분을 제거하는 단계와, 다수의 납땜 레지스터 환형링 내측에 반도체 다이의 비활성면에 제1다수의 납땜 볼(152)을 부착하는 단계와, 반도체 다이의 비활성면을 지지핀(80)으로 지지하는 단계와, 적어도 반도체 다이의 활성면과 다수의 도체중 일부분을 덮는 패키지 몸체(84, 122)를 형성하도록 몰드 캐비티(64', 118) 내측에 수지 포장지를 몰딩하는 단계와, 외부 전기 접속부를 제공하도록 반도체 다이에 전기적으로 연결된 제2다수의 납땜블(126)를 제공하는 단계를 포함하는 것을 특징으로 하는 반도체 장치 제조 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940009693A 1993-05-04 1994-05-03 다이지지면을 가지지 않은 반도체 장치와 이의 제조방법 KR940027141A (ko)

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JPH07321139A (ja) 1995-12-08
TW264563B (ko) 1995-12-01

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