KR940007757Y1
(ko)
*
|
1991-11-14 |
1994-10-24 |
금성일렉트론 주식회사 |
반도체 패키지
|
JP3057130B2
(ja)
*
|
1993-02-18 |
2000-06-26 |
三菱電機株式会社 |
樹脂封止型半導体パッケージおよびその製造方法
|
US5991156A
(en)
*
|
1993-12-20 |
1999-11-23 |
Stmicroelectronics, Inc. |
Ball grid array integrated circuit package with high thermal conductivity
|
US5604376A
(en)
*
|
1994-06-30 |
1997-02-18 |
Digital Equipment Corporation |
Paddleless molded plastic semiconductor chip package
|
JPH08121442A
(ja)
*
|
1994-10-26 |
1996-05-14 |
Mitsubishi Electric Corp |
接着接合体及びその接合方法並びにリベット
|
JP3487524B2
(ja)
*
|
1994-12-20 |
2004-01-19 |
株式会社ルネサステクノロジ |
半導体装置及びその製造方法
|
US5798909A
(en)
*
|
1995-02-15 |
1998-08-25 |
International Business Machines Corporation |
Single-tiered organic chip carriers for wire bond-type chips
|
JP3475557B2
(ja)
*
|
1995-03-08 |
2003-12-08 |
ソニー株式会社 |
半導体装置の製造方法
|
US5665653A
(en)
*
|
1995-03-29 |
1997-09-09 |
Unifet, Incorporated |
Method for encapsulating an electrochemical sensor
|
US5620928A
(en)
*
|
1995-05-11 |
1997-04-15 |
National Semiconductor Corporation |
Ultra thin ball grid array using a flex tape or printed wiring board substrate and method
|
FR2734984B1
(fr)
*
|
1995-05-29 |
1997-08-22 |
Sgs Thomson Microelectronics |
Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
|
FR2734983B1
(fr)
*
|
1995-05-29 |
1997-07-04 |
Sgs Thomson Microelectronics |
Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
|
US5697148A
(en)
*
|
1995-08-22 |
1997-12-16 |
Motorola, Inc. |
Flip underfill injection technique
|
TW299564B
(zh)
*
|
1995-10-04 |
1997-03-01 |
Ibm |
|
EP0787569B1
(en)
*
|
1996-01-31 |
2002-10-02 |
Sumitomo Bakelite Company Limited |
Method of producing epoxy resin-encapsulated semiconductor device
|
DE19624478A1
(de)
*
|
1996-02-08 |
1998-01-02 |
Bayerische Motoren Werke Ag |
Verfahren zum Herstellen eines elektronischen Steuergeräts
|
JP3170199B2
(ja)
*
|
1996-03-15 |
2001-05-28 |
株式会社東芝 |
半導体装置及びその製造方法及び基板フレーム
|
US6821821B2
(en)
*
|
1996-04-18 |
2004-11-23 |
Tessera, Inc. |
Methods for manufacturing resistors using a sacrificial layer
|
US6001671A
(en)
*
|
1996-04-18 |
1999-12-14 |
Tessera, Inc. |
Methods for manufacturing a semiconductor package having a sacrificial layer
|
US5874319A
(en)
*
|
1996-05-21 |
1999-02-23 |
Honeywell Inc. |
Vacuum die bond for known good die assembly
|
DE19625228C2
(de)
*
|
1996-06-24 |
1998-05-14 |
Siemens Ag |
Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse
|
DE19639025C2
(de)
*
|
1996-09-23 |
1999-10-28 |
Siemens Ag |
Chipmodul und Verfahren zur Herstellung eines Chipmoduls
|
US5825628A
(en)
*
|
1996-10-03 |
1998-10-20 |
International Business Machines Corporation |
Electronic package with enhanced pad design
|
US6127724A
(en)
*
|
1996-10-31 |
2000-10-03 |
Tessera, Inc. |
Packaged microelectronic elements with enhanced thermal conduction
|
US20020110354A1
(en)
*
|
1997-01-09 |
2002-08-15 |
Osamu Ikeda |
Image recording and editing apparatus, and method for capturing and editing an image
|
JP3793628B2
(ja)
*
|
1997-01-20 |
2006-07-05 |
沖電気工業株式会社 |
樹脂封止型半導体装置
|
KR100214555B1
(ko)
*
|
1997-02-14 |
1999-08-02 |
구본준 |
반도체 패키지의 제조방법
|
US6583444B2
(en)
*
|
1997-02-18 |
2003-06-24 |
Tessera, Inc. |
Semiconductor packages having light-sensitive chips
|
US5923081A
(en)
|
1997-05-15 |
1999-07-13 |
Micron Technology, Inc. |
Compression layer on the leadframe to reduce stress defects
|
US6472252B2
(en)
|
1997-07-23 |
2002-10-29 |
Micron Technology, Inc. |
Methods for ball grid array (BGA) encapsulation mold
|
US5923959A
(en)
*
|
1997-07-23 |
1999-07-13 |
Micron Technology, Inc. |
Ball grid array (BGA) encapsulation mold
|
US6081997A
(en)
*
|
1997-08-14 |
2000-07-04 |
Lsi Logic Corporation |
System and method for packaging an integrated circuit using encapsulant injection
|
US6173490B1
(en)
*
|
1997-08-20 |
2001-01-16 |
National Semiconductor Corporation |
Method for forming a panel of packaged integrated circuits
|
US5930604A
(en)
*
|
1998-02-02 |
1999-07-27 |
Delco Electronics Corporation |
Encapsulation method for fine-pitch chip-on-board
|
US6172419B1
(en)
|
1998-02-24 |
2001-01-09 |
Micron Technology, Inc. |
Low profile ball grid array package
|
US6080932A
(en)
*
|
1998-04-14 |
2000-06-27 |
Tessera, Inc. |
Semiconductor package assemblies with moisture vents
|
US7270867B1
(en)
|
1998-06-10 |
2007-09-18 |
Asat Ltd. |
Leadless plastic chip carrier
|
US6229200B1
(en)
|
1998-06-10 |
2001-05-08 |
Asat Limited |
Saw-singulated leadless plastic chip carrier
|
US8330270B1
(en)
|
1998-06-10 |
2012-12-11 |
Utac Hong Kong Limited |
Integrated circuit package having a plurality of spaced apart pad portions
|
US7030474B1
(en)
|
1998-06-24 |
2006-04-18 |
Amkor Technology, Inc. |
Plastic integrated circuit package and method and leadframe for making the package
|
US7005326B1
(en)
|
1998-06-24 |
2006-02-28 |
Amkor Technology, Inc. |
Method of making an integrated circuit package
|
US7112474B1
(en)
|
1998-06-24 |
2006-09-26 |
Amkor Technology, Inc. |
Method of making an integrated circuit package
|
US7332375B1
(en)
|
1998-06-24 |
2008-02-19 |
Amkor Technology, Inc. |
Method of making an integrated circuit package
|
US7071541B1
(en)
|
1998-06-24 |
2006-07-04 |
Amkor Technology, Inc. |
Plastic integrated circuit package and method and leadframe for making the package
|
US6143981A
(en)
*
|
1998-06-24 |
2000-11-07 |
Amkor Technology, Inc. |
Plastic integrated circuit package and method and leadframe for making the package
|
US6893900B1
(en)
|
1998-06-24 |
2005-05-17 |
Amkor Technology, Inc. |
Method of making an integrated circuit package
|
US6137173A
(en)
*
|
1998-06-30 |
2000-10-24 |
Intel Corporation |
Preventing backside analysis of an integrated circuit
|
US6194250B1
(en)
*
|
1998-09-14 |
2001-02-27 |
Motorola, Inc. |
Low-profile microelectronic package
|
US6281568B1
(en)
|
1998-10-21 |
2001-08-28 |
Amkor Technology, Inc. |
Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
|
JP2000138262A
(ja)
|
1998-10-31 |
2000-05-16 |
Anam Semiconductor Inc |
チップスケ―ル半導体パッケ―ジ及びその製造方法
|
WO2000028589A1
(en)
*
|
1998-11-06 |
2000-05-18 |
Festec Co., Ltd. |
A plastic package having an air cavity and manufacturing method thereof
|
US6448633B1
(en)
|
1998-11-20 |
2002-09-10 |
Amkor Technology, Inc. |
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
|
US6537853B1
(en)
*
|
1999-02-22 |
2003-03-25 |
Micron Technology, Inc. |
Overmolding encapsulation process
|
JP3575001B2
(ja)
*
|
1999-05-07 |
2004-10-06 |
アムコー テクノロジー コリア インコーポレーティド |
半導体パッケージ及びその製造方法
|
JP3398721B2
(ja)
|
1999-05-20 |
2003-04-21 |
アムコー テクノロジー コリア インコーポレーティド |
半導体パッケージ及びその製造方法
|
JP3416737B2
(ja)
*
|
1999-05-20 |
2003-06-16 |
アムコー テクノロジー コリア インコーポレーティド |
半導体パッケージの製造方法
|
USRE40112E1
(en)
|
1999-05-20 |
2008-02-26 |
Amkor Technology, Inc. |
Semiconductor package and method for fabricating the same
|
JP3314304B2
(ja)
|
1999-06-07 |
2002-08-12 |
アムコー テクノロジー コリア インコーポレーティド |
半導体パッケージ用の回路基板
|
JP3427352B2
(ja)
|
1999-08-24 |
2003-07-14 |
アムコー テクノロジー コリア インコーポレーティド |
半導体パッケージ用回路基板
|
JP2001077301A
(ja)
*
|
1999-08-24 |
2001-03-23 |
Amkor Technology Korea Inc |
半導体パッケージ及びその製造方法
|
US6247229B1
(en)
|
1999-08-25 |
2001-06-19 |
Ankor Technology, Inc. |
Method of forming an integrated circuit device package using a plastic tape as a base
|
US20020100165A1
(en)
|
2000-02-14 |
2002-08-01 |
Amkor Technology, Inc. |
Method of forming an integrated circuit device package using a temporary substrate
|
KR20010037247A
(ko)
|
1999-10-15 |
2001-05-07 |
마이클 디. 오브라이언 |
반도체패키지
|
KR100379089B1
(ko)
|
1999-10-15 |
2003-04-08 |
앰코 테크놀로지 코리아 주식회사 |
리드프레임 및 이를 이용한 반도체패키지
|
KR100526844B1
(ko)
*
|
1999-10-15 |
2005-11-08 |
앰코 테크놀로지 코리아 주식회사 |
반도체패키지 및 그 제조방법
|
KR100403142B1
(ko)
*
|
1999-10-15 |
2003-10-30 |
앰코 테크놀로지 코리아 주식회사 |
반도체패키지
|
US6580159B1
(en)
|
1999-11-05 |
2003-06-17 |
Amkor Technology, Inc. |
Integrated circuit device packages and substrates for making the packages
|
US6847103B1
(en)
|
1999-11-09 |
2005-01-25 |
Amkor Technology, Inc. |
Semiconductor package with exposed die pad and body-locking leadframe
|
US6476478B1
(en)
|
1999-11-12 |
2002-11-05 |
Amkor Technology, Inc. |
Cavity semiconductor package with exposed leads and die pad
|
US6639308B1
(en)
*
|
1999-12-16 |
2003-10-28 |
Amkor Technology, Inc. |
Near chip size semiconductor package
|
KR100421774B1
(ko)
|
1999-12-16 |
2004-03-10 |
앰코 테크놀로지 코리아 주식회사 |
반도체패키지 및 그 제조 방법
|
DE10012880A1
(de)
*
|
2000-03-16 |
2001-09-27 |
Infineon Technologies Ag |
Verfahren und Vorrichtung zur Herstellung einer Halbleiterchip-Umhüllung
|
KR100583494B1
(ko)
*
|
2000-03-25 |
2006-05-24 |
앰코 테크놀로지 코리아 주식회사 |
반도체패키지
|
US6383843B1
(en)
*
|
2000-04-17 |
2002-05-07 |
Advanced Micro Devices, Inc. |
Using removable spacers to ensure adequate bondline thickness
|
US7042068B2
(en)
|
2000-04-27 |
2006-05-09 |
Amkor Technology, Inc. |
Leadframe and semiconductor package made using the leadframe
|
US6589820B1
(en)
|
2000-06-16 |
2003-07-08 |
Micron Technology, Inc. |
Method and apparatus for packaging a microelectronic die
|
JP4230679B2
(ja)
*
|
2000-06-26 |
2009-02-25 |
株式会社東芝 |
半導体樹脂モールド装置および半導体樹脂モールド方法
|
US6452278B1
(en)
*
|
2000-06-30 |
2002-09-17 |
Amkor Technology, Inc. |
Low profile package for plural semiconductor dies
|
US6483044B1
(en)
|
2000-08-23 |
2002-11-19 |
Micron Technology, Inc. |
Interconnecting substrates for electrical coupling of microelectronic components
|
US6979595B1
(en)
*
|
2000-08-24 |
2005-12-27 |
Micron Technology, Inc. |
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
|
US6838760B1
(en)
|
2000-08-28 |
2005-01-04 |
Micron Technology, Inc. |
Packaged microelectronic devices with interconnecting units
|
US6624005B1
(en)
|
2000-09-06 |
2003-09-23 |
Amkor Technology, Inc. |
Semiconductor memory cards and method of making same
|
US6564454B1
(en)
|
2000-12-28 |
2003-05-20 |
Amkor Technology, Inc. |
Method of making and stacking a semiconductor package
|
KR20020058209A
(ko)
*
|
2000-12-29 |
2002-07-12 |
마이클 디. 오브라이언 |
반도체패키지
|
KR100394030B1
(ko)
*
|
2001-01-15 |
2003-08-06 |
앰코 테크놀로지 코리아 주식회사 |
적층형 반도체 패키지
|
KR100731007B1
(ko)
*
|
2001-01-15 |
2007-06-22 |
앰코 테크놀로지 코리아 주식회사 |
적층형 반도체 패키지
|
US6486537B1
(en)
|
2001-03-19 |
2002-11-26 |
Amkor Technology, Inc. |
Semiconductor package with warpage resistant substrate
|
US6605865B2
(en)
|
2001-03-19 |
2003-08-12 |
Amkor Technology, Inc. |
Semiconductor package with optimized leadframe bonding strength
|
US6967395B1
(en)
|
2001-03-20 |
2005-11-22 |
Amkor Technology, Inc. |
Mounting for a package containing a chip
|
US6545345B1
(en)
|
2001-03-20 |
2003-04-08 |
Amkor Technology, Inc. |
Mounting for a package containing a chip
|
KR100369393B1
(ko)
|
2001-03-27 |
2003-02-05 |
앰코 테크놀로지 코리아 주식회사 |
리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
|
KR100393448B1
(ko)
|
2001-03-27 |
2003-08-02 |
앰코 테크놀로지 코리아 주식회사 |
반도체 패키지 및 그 제조 방법
|
KR100411811B1
(ko)
*
|
2001-04-02 |
2003-12-24 |
앰코 테크놀로지 코리아 주식회사 |
반도체패키지
|
US7045883B1
(en)
|
2001-04-04 |
2006-05-16 |
Amkor Technology, Inc. |
Thermally enhanced chip scale lead on chip semiconductor package and method of making same
|
US7064009B1
(en)
|
2001-04-04 |
2006-06-20 |
Amkor Technology, Inc. |
Thermally enhanced chip scale lead on chip semiconductor package and method of making same
|
US7334326B1
(en)
|
2001-06-19 |
2008-02-26 |
Amkor Technology, Inc. |
Method for making an integrated circuit substrate having embedded passive components
|
US6967124B1
(en)
|
2001-06-19 |
2005-11-22 |
Amkor Technology, Inc. |
Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate
|
US6930256B1
(en)
|
2002-05-01 |
2005-08-16 |
Amkor Technology, Inc. |
Integrated circuit substrate having laser-embedded conductive patterns and method therefor
|
US6534338B1
(en)
|
2001-06-29 |
2003-03-18 |
Amkor Technology, Inc. |
Method for molding semiconductor package having a ceramic substrate
|
US7485952B1
(en)
|
2001-09-19 |
2009-02-03 |
Amkor Technology, Inc. |
Drop resistant bumpers for fully molded memory cards
|
US6900527B1
(en)
|
2001-09-19 |
2005-05-31 |
Amkor Technology, Inc. |
Lead-frame method and assembly for interconnecting circuits within a circuit module
|
US6555917B1
(en)
|
2001-10-09 |
2003-04-29 |
Amkor Technology, Inc. |
Semiconductor package having stacked semiconductor chips and method of making the same
|
US6611047B2
(en)
|
2001-10-12 |
2003-08-26 |
Amkor Technology, Inc. |
Semiconductor package with singulation crease
|
JP3704304B2
(ja)
*
|
2001-10-26 |
2005-10-12 |
新光電気工業株式会社 |
リードフレーム及びその製造方法並びに該リードフレームを用いた半導体装置の製造方法
|
US6630726B1
(en)
|
2001-11-07 |
2003-10-07 |
Amkor Technology, Inc. |
Power semiconductor package with strap
|
US6798046B1
(en)
|
2002-01-22 |
2004-09-28 |
Amkor Technology, Inc. |
Semiconductor package including ring structure connected to leads with vertically downset inner ends
|
US6784534B1
(en)
|
2002-02-06 |
2004-08-31 |
Amkor Technology, Inc. |
Thin integrated circuit package having an optically transparent window
|
US6982485B1
(en)
|
2002-02-13 |
2006-01-03 |
Amkor Technology, Inc. |
Stacking structure for semiconductor chips and a semiconductor package using it
|
US6576998B1
(en)
|
2002-02-28 |
2003-06-10 |
Amkor Technology, Inc. |
Thin semiconductor package with semiconductor chip and electronic discrete device
|
US6885086B1
(en)
|
2002-03-05 |
2005-04-26 |
Amkor Technology, Inc. |
Reduced copper lead frame for saw-singulated chip package
|
US6683795B1
(en)
|
2002-04-10 |
2004-01-27 |
Amkor Technology, Inc. |
Shield cap and semiconductor package including shield cap
|
US6608366B1
(en)
|
2002-04-15 |
2003-08-19 |
Harry J. Fogelson |
Lead frame with plated end leads
|
US7399661B2
(en)
|
2002-05-01 |
2008-07-15 |
Amkor Technology, Inc. |
Method for making an integrated circuit substrate having embedded back-side access conductors and vias
|
US7548430B1
(en)
|
2002-05-01 |
2009-06-16 |
Amkor Technology, Inc. |
Buildup dielectric and metallization process and semiconductor package
|
US6930257B1
(en)
|
2002-05-01 |
2005-08-16 |
Amkor Technology, Inc. |
Integrated circuit substrate having laminated laser-embedded circuit layers
|
US9691635B1
(en)
|
2002-05-01 |
2017-06-27 |
Amkor Technology, Inc. |
Buildup dielectric layer having metallization pattern semiconductor package fabrication method
|
US7633765B1
(en)
|
2004-03-23 |
2009-12-15 |
Amkor Technology, Inc. |
Semiconductor package including a top-surface metal layer for implementing circuit features
|
US7670962B2
(en)
|
2002-05-01 |
2010-03-02 |
Amkor Technology, Inc. |
Substrate having stiffener fabrication method
|
US6627977B1
(en)
|
2002-05-09 |
2003-09-30 |
Amkor Technology, Inc. |
Semiconductor package including isolated ring structure
|
US6841414B1
(en)
|
2002-06-19 |
2005-01-11 |
Amkor Technology, Inc. |
Saw and etch singulation method for a chip package
|
US6791168B1
(en)
*
|
2002-07-10 |
2004-09-14 |
Micron Technology, Inc. |
Semiconductor package with circuit side polymer layer and wafer level fabrication method
|
US6867071B1
(en)
|
2002-07-12 |
2005-03-15 |
Amkor Technology, Inc. |
Leadframe including corner leads and semiconductor package using same
|
US7042072B1
(en)
|
2002-08-02 |
2006-05-09 |
Amkor Technology, Inc. |
Semiconductor package and method of manufacturing the same which reduces warpage
|
US6747352B1
(en)
|
2002-08-19 |
2004-06-08 |
Amkor Technology, Inc. |
Integrated circuit having multiple power/ground connections to a single external terminal
|
US7732914B1
(en)
|
2002-09-03 |
2010-06-08 |
Mclellan Neil |
Cavity-type integrated circuit package
|
US6818973B1
(en)
*
|
2002-09-09 |
2004-11-16 |
Amkor Technology, Inc. |
Exposed lead QFP package fabricated through the use of a partial saw process
|
US6919620B1
(en)
|
2002-09-17 |
2005-07-19 |
Amkor Technology, Inc. |
Compact flash memory card with clamshell leadframe
|
US7361533B1
(en)
|
2002-11-08 |
2008-04-22 |
Amkor Technology, Inc. |
Stacked embedded leadframe
|
US6905914B1
(en)
|
2002-11-08 |
2005-06-14 |
Amkor Technology, Inc. |
Wafer level package and fabrication method
|
US7723210B2
(en)
|
2002-11-08 |
2010-05-25 |
Amkor Technology, Inc. |
Direct-write wafer level chip scale package
|
US7190062B1
(en)
|
2004-06-15 |
2007-03-13 |
Amkor Technology, Inc. |
Embedded leadframe semiconductor package
|
US6798047B1
(en)
|
2002-12-26 |
2004-09-28 |
Amkor Technology, Inc. |
Pre-molded leadframe
|
US7270735B2
(en)
*
|
2003-01-21 |
2007-09-18 |
Seagate Technology Llc |
System and method for holding and releasing a workpiece for electrochemical machining
|
US6847099B1
(en)
|
2003-02-05 |
2005-01-25 |
Amkor Technology Inc. |
Offset etched corner leads for semiconductor package
|
US6750545B1
(en)
|
2003-02-28 |
2004-06-15 |
Amkor Technology, Inc. |
Semiconductor package capable of die stacking
|
US6927483B1
(en)
|
2003-03-07 |
2005-08-09 |
Amkor Technology, Inc. |
Semiconductor package exhibiting efficient lead placement
|
US7001799B1
(en)
|
2003-03-13 |
2006-02-21 |
Amkor Technology, Inc. |
Method of making a leadframe for semiconductor devices
|
US6794740B1
(en)
|
2003-03-13 |
2004-09-21 |
Amkor Technology, Inc. |
Leadframe package for semiconductor devices
|
US7126210B2
(en)
|
2003-04-02 |
2006-10-24 |
Stmicroelectronics, Inc. |
System and method for venting pressure from an integrated circuit package sealed with a lid
|
US7095103B1
(en)
|
2003-05-01 |
2006-08-22 |
Amkor Technology, Inc. |
Leadframe based memory card
|
US6879034B1
(en)
|
2003-05-01 |
2005-04-12 |
Amkor Technology, Inc. |
Semiconductor package including low temperature co-fired ceramic substrate
|
US7008825B1
(en)
|
2003-05-27 |
2006-03-07 |
Amkor Technology, Inc. |
Leadframe strip having enhanced testability
|
US6897550B1
(en)
|
2003-06-11 |
2005-05-24 |
Amkor Technology, Inc. |
Fully-molded leadframe stand-off feature
|
US20050023682A1
(en)
*
|
2003-07-31 |
2005-02-03 |
Morio Nakao |
High reliability chip scale package
|
US7033517B1
(en)
|
2003-09-15 |
2006-04-25 |
Asat Ltd. |
Method of fabricating a leadless plastic chip carrier
|
US7245007B1
(en)
|
2003-09-18 |
2007-07-17 |
Amkor Technology, Inc. |
Exposed lead interposer leadframe package
|
US6921967B2
(en)
*
|
2003-09-24 |
2005-07-26 |
Amkor Technology, Inc. |
Reinforced die pad support structure
|
US6936922B1
(en)
|
2003-09-26 |
2005-08-30 |
Amkor Technology, Inc. |
Semiconductor package structure reducing warpage and manufacturing method thereof
|
US7138707B1
(en)
|
2003-10-21 |
2006-11-21 |
Amkor Technology, Inc. |
Semiconductor package including leads and conductive posts for providing increased functionality
|
US7144517B1
(en)
|
2003-11-07 |
2006-12-05 |
Amkor Technology, Inc. |
Manufacturing method for leadframe and for semiconductor package using the leadframe
|
US7211879B1
(en)
|
2003-11-12 |
2007-05-01 |
Amkor Technology, Inc. |
Semiconductor package with chamfered corners and method of manufacturing the same
|
US20070145548A1
(en)
*
|
2003-12-22 |
2007-06-28 |
Amkor Technology, Inc. |
Stack-type semiconductor package and manufacturing method thereof
|
US7057268B1
(en)
|
2004-01-27 |
2006-06-06 |
Amkor Technology, Inc. |
Cavity case with clip/plug for use on multi-media card
|
US7091594B1
(en)
|
2004-01-28 |
2006-08-15 |
Amkor Technology, Inc. |
Leadframe type semiconductor package having reduced inductance and its manufacturing method
|
US7015075B2
(en)
*
|
2004-02-09 |
2006-03-21 |
Freescale Semiconuctor, Inc. |
Die encapsulation using a porous carrier
|
US11081370B2
(en)
|
2004-03-23 |
2021-08-03 |
Amkor Technology Singapore Holding Pte. Ltd. |
Methods of manufacturing an encapsulated semiconductor device
|
US10811277B2
(en)
|
2004-03-23 |
2020-10-20 |
Amkor Technology, Inc. |
Encapsulated semiconductor package
|
US20080003722A1
(en)
*
|
2004-04-15 |
2008-01-03 |
Chun David D |
Transfer mold solution for molded multi-media card
|
US7145238B1
(en)
|
2004-05-05 |
2006-12-05 |
Amkor Technology, Inc. |
Semiconductor package and substrate having multi-level vias
|
US20050249945A1
(en)
*
|
2004-05-10 |
2005-11-10 |
Wen Kun Yang |
Manufacturing tool for wafer level package and method of placing dies
|
JPWO2005114730A1
(ja)
*
|
2004-05-20 |
2008-03-27 |
スパンション エルエルシー |
半導体装置の製造方法および半導体装置
|
US7091581B1
(en)
|
2004-06-14 |
2006-08-15 |
Asat Limited |
Integrated circuit package and process for fabricating the same
|
US7411289B1
(en)
|
2004-06-14 |
2008-08-12 |
Asat Ltd. |
Integrated circuit package with partially exposed contact pads and process for fabricating the same
|
US7202554B1
(en)
|
2004-08-19 |
2007-04-10 |
Amkor Technology, Inc. |
Semiconductor package and its manufacturing method
|
US7595225B1
(en)
|
2004-10-05 |
2009-09-29 |
Chun Ho Fan |
Leadless plastic chip carrier with contact standoff
|
US7217991B1
(en)
|
2004-10-22 |
2007-05-15 |
Amkor Technology, Inc. |
Fan-in leadframe semiconductor package
|
JP4386008B2
(ja)
*
|
2004-11-11 |
2009-12-16 |
セイコーエプソン株式会社 |
実装基板及び電子機器
|
US7442581B2
(en)
*
|
2004-12-10 |
2008-10-28 |
Freescale Semiconductor, Inc. |
Flexible carrier and release method for high volume electronic package fabrication
|
US7358119B2
(en)
*
|
2005-01-12 |
2008-04-15 |
Asat Ltd. |
Thin array plastic package without die attach pad and process for fabricating the same
|
TWI271807B
(en)
*
|
2005-03-29 |
2007-01-21 |
Phoenix Prec Technology Corp |
Chip embedded package structure and fabrication method thereof
|
US8826531B1
(en)
|
2005-04-05 |
2014-09-09 |
Amkor Technology, Inc. |
Method for making an integrated circuit substrate having laminated laser-embedded circuit layers
|
US7348663B1
(en)
|
2005-07-15 |
2008-03-25 |
Asat Ltd. |
Integrated circuit package and method for fabricating same
|
US7410830B1
(en)
|
2005-09-26 |
2008-08-12 |
Asat Ltd |
Leadless plastic chip carrier and method of fabricating same
|
US7910406B2
(en)
|
2005-11-02 |
2011-03-22 |
Panasonic Corporation |
Electronic circuit device and method for manufacturing same
|
US7507603B1
(en)
|
2005-12-02 |
2009-03-24 |
Amkor Technology, Inc. |
Etch singulated semiconductor package
|
US7572681B1
(en)
|
2005-12-08 |
2009-08-11 |
Amkor Technology, Inc. |
Embedded electronic component package
|
WO2007088835A1
(ja)
*
|
2006-02-03 |
2007-08-09 |
Mitsui Chemicals, Inc. |
樹脂製中空パッケージ及びその製造方法
|
US7902660B1
(en)
|
2006-05-24 |
2011-03-08 |
Amkor Technology, Inc. |
Substrate for semiconductor device and manufacturing method thereof
|
US7968998B1
(en)
|
2006-06-21 |
2011-06-28 |
Amkor Technology, Inc. |
Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
|
US7589398B1
(en)
|
2006-10-04 |
2009-09-15 |
Amkor Technology, Inc. |
Embedded metal features structure
|
US7550857B1
(en)
|
2006-11-16 |
2009-06-23 |
Amkor Technology, Inc. |
Stacked redistribution layer (RDL) die assembly package
|
US7750250B1
(en)
|
2006-12-22 |
2010-07-06 |
Amkor Technology, Inc. |
Blind via capture pad structure
|
US7687893B2
(en)
|
2006-12-27 |
2010-03-30 |
Amkor Technology, Inc. |
Semiconductor package having leadframe with exposed anchor pads
|
US7752752B1
(en)
|
2007-01-09 |
2010-07-13 |
Amkor Technology, Inc. |
Method of fabricating an embedded circuit pattern
|
US7829990B1
(en)
|
2007-01-18 |
2010-11-09 |
Amkor Technology, Inc. |
Stackable semiconductor package including laminate interposer
|
US9466545B1
(en)
|
2007-02-21 |
2016-10-11 |
Amkor Technology, Inc. |
Semiconductor package in package
|
US7833456B2
(en)
|
2007-02-23 |
2010-11-16 |
Micron Technology, Inc. |
Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
|
US7982297B1
(en)
|
2007-03-06 |
2011-07-19 |
Amkor Technology, Inc. |
Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same
|
US8115305B2
(en)
*
|
2007-05-17 |
2012-02-14 |
Stats Chippac Ltd. |
Integrated circuit package system with thin profile
|
US7977774B2
(en)
|
2007-07-10 |
2011-07-12 |
Amkor Technology, Inc. |
Fusion quad flat semiconductor package
|
US7687899B1
(en)
|
2007-08-07 |
2010-03-30 |
Amkor Technology, Inc. |
Dual laminate package structure with embedded elements
|
US8323771B1
(en)
|
2007-08-15 |
2012-12-04 |
Amkor Technology, Inc. |
Straight conductor blind via capture pad structure and fabrication method
|
US7777351B1
(en)
|
2007-10-01 |
2010-08-17 |
Amkor Technology, Inc. |
Thin stacked interposer package
|
US8089159B1
(en)
|
2007-10-03 |
2012-01-03 |
Amkor Technology, Inc. |
Semiconductor package with increased I/O density and method of making the same
|
KR101194713B1
(ko)
*
|
2007-10-03 |
2012-10-25 |
가부시키가이샤후지쿠라 |
모듈, 배선판 및 모듈의 제조 방법
|
US7847386B1
(en)
|
2007-11-05 |
2010-12-07 |
Amkor Technology, Inc. |
Reduced size stacked semiconductor package and method of making the same
|
US7956453B1
(en)
|
2008-01-16 |
2011-06-07 |
Amkor Technology, Inc. |
Semiconductor package with patterning layer and method of making same
|
US7723852B1
(en)
|
2008-01-21 |
2010-05-25 |
Amkor Technology, Inc. |
Stacked semiconductor package and method of making same
|
US8067821B1
(en)
|
2008-04-10 |
2011-11-29 |
Amkor Technology, Inc. |
Flat semiconductor package with half package molding
|
US7768135B1
(en)
|
2008-04-17 |
2010-08-03 |
Amkor Technology, Inc. |
Semiconductor package with fast power-up cycle and method of making same
|
US7808084B1
(en)
|
2008-05-06 |
2010-10-05 |
Amkor Technology, Inc. |
Semiconductor package with half-etched locking features
|
KR100992778B1
(ko)
|
2008-05-23 |
2010-11-05 |
엘지이노텍 주식회사 |
발광소자 패키지 및 그 제조방법
|
US8125064B1
(en)
|
2008-07-28 |
2012-02-28 |
Amkor Technology, Inc. |
Increased I/O semiconductor package and method of making same
|
US8184453B1
(en)
|
2008-07-31 |
2012-05-22 |
Amkor Technology, Inc. |
Increased capacity semiconductor package
|
US7847392B1
(en)
|
2008-09-30 |
2010-12-07 |
Amkor Technology, Inc. |
Semiconductor device including leadframe with increased I/O
|
US7989933B1
(en)
|
2008-10-06 |
2011-08-02 |
Amkor Technology, Inc. |
Increased I/O leadframe and semiconductor device including same
|
US8008758B1
(en)
|
2008-10-27 |
2011-08-30 |
Amkor Technology, Inc. |
Semiconductor device with increased I/O leadframe
|
US8089145B1
(en)
|
2008-11-17 |
2012-01-03 |
Amkor Technology, Inc. |
Semiconductor device including increased capacity leadframe
|
US8072050B1
(en)
|
2008-11-18 |
2011-12-06 |
Amkor Technology, Inc. |
Semiconductor device with increased I/O leadframe including passive device
|
US7875963B1
(en)
|
2008-11-21 |
2011-01-25 |
Amkor Technology, Inc. |
Semiconductor device including leadframe having power bars and increased I/O
|
US7982298B1
(en)
|
2008-12-03 |
2011-07-19 |
Amkor Technology, Inc. |
Package in package semiconductor device
|
US8487420B1
(en)
|
2008-12-08 |
2013-07-16 |
Amkor Technology, Inc. |
Package in package semiconductor device with film over wire
|
US8680656B1
(en)
|
2009-01-05 |
2014-03-25 |
Amkor Technology, Inc. |
Leadframe structure for concentrated photovoltaic receiver package
|
US20170117214A1
(en)
|
2009-01-05 |
2017-04-27 |
Amkor Technology, Inc. |
Semiconductor device with through-mold via
|
US8872329B1
(en)
|
2009-01-09 |
2014-10-28 |
Amkor Technology, Inc. |
Extended landing pad substrate package structure and method
|
US8058715B1
(en)
|
2009-01-09 |
2011-11-15 |
Amkor Technology, Inc. |
Package in package device for RF transceiver module
|
US8026589B1
(en)
|
2009-02-23 |
2011-09-27 |
Amkor Technology, Inc. |
Reduced profile stackable semiconductor package
|
US7960818B1
(en)
|
2009-03-04 |
2011-06-14 |
Amkor Technology, Inc. |
Conformal shield on punch QFN semiconductor package
|
US8575742B1
(en)
|
2009-04-06 |
2013-11-05 |
Amkor Technology, Inc. |
Semiconductor device with increased I/O leadframe including power bars
|
US7960827B1
(en)
|
2009-04-09 |
2011-06-14 |
Amkor Technology, Inc. |
Thermal via heat spreader package and method
|
US8623753B1
(en)
|
2009-05-28 |
2014-01-07 |
Amkor Technology, Inc. |
Stackable protruding via package and method
|
US8222538B1
(en)
|
2009-06-12 |
2012-07-17 |
Amkor Technology, Inc. |
Stackable via package and method
|
US8427269B1
(en)
*
|
2009-06-29 |
2013-04-23 |
VI Chip, Inc. |
Encapsulation method and apparatus for electronic modules
|
US8471154B1
(en)
|
2009-08-06 |
2013-06-25 |
Amkor Technology, Inc. |
Stackable variable height via package and method
|
US8796561B1
(en)
|
2009-10-05 |
2014-08-05 |
Amkor Technology, Inc. |
Fan out build up substrate stackable package and method
|
US8937381B1
(en)
|
2009-12-03 |
2015-01-20 |
Amkor Technology, Inc. |
Thin stackable package and method
|
US9691734B1
(en)
|
2009-12-07 |
2017-06-27 |
Amkor Technology, Inc. |
Method of forming a plurality of electronic component packages
|
US8536462B1
(en)
|
2010-01-22 |
2013-09-17 |
Amkor Technology, Inc. |
Flex circuit package and method
|
US8324511B1
(en)
|
2010-04-06 |
2012-12-04 |
Amkor Technology, Inc. |
Through via nub reveal method and structure
|
US8300423B1
(en)
|
2010-05-25 |
2012-10-30 |
Amkor Technology, Inc. |
Stackable treated via package and method
|
US8294276B1
(en)
|
2010-05-27 |
2012-10-23 |
Amkor Technology, Inc. |
Semiconductor device and fabricating method thereof
|
US8338229B1
(en)
|
2010-07-30 |
2012-12-25 |
Amkor Technology, Inc. |
Stackable plasma cleaned via package and method
|
US8717775B1
(en)
|
2010-08-02 |
2014-05-06 |
Amkor Technology, Inc. |
Fingerprint sensor package and method
|
US8440554B1
(en)
|
2010-08-02 |
2013-05-14 |
Amkor Technology, Inc. |
Through via connected backside embedded circuit features structure and method
|
US8487445B1
(en)
|
2010-10-05 |
2013-07-16 |
Amkor Technology, Inc. |
Semiconductor device having through electrodes protruding from dielectric layer
|
US8337657B1
(en)
|
2010-10-27 |
2012-12-25 |
Amkor Technology, Inc. |
Mechanical tape separation package and method
|
US8482134B1
(en)
|
2010-11-01 |
2013-07-09 |
Amkor Technology, Inc. |
Stackable package and method
|
US9748154B1
(en)
|
2010-11-04 |
2017-08-29 |
Amkor Technology, Inc. |
Wafer level fan out semiconductor device and manufacturing method thereof
|
US8525318B1
(en)
|
2010-11-10 |
2013-09-03 |
Amkor Technology, Inc. |
Semiconductor device and fabricating method thereof
|
US8791501B1
(en)
|
2010-12-03 |
2014-07-29 |
Amkor Technology, Inc. |
Integrated passive device structure and method
|
US8557629B1
(en)
|
2010-12-03 |
2013-10-15 |
Amkor Technology, Inc. |
Semiconductor device having overlapped via apertures
|
US8674485B1
(en)
|
2010-12-08 |
2014-03-18 |
Amkor Technology, Inc. |
Semiconductor device including leadframe with downsets
|
US8535961B1
(en)
|
2010-12-09 |
2013-09-17 |
Amkor Technology, Inc. |
Light emitting diode (LED) package and method
|
US8390130B1
(en)
|
2011-01-06 |
2013-03-05 |
Amkor Technology, Inc. |
Through via recessed reveal structure and method
|
US8648450B1
(en)
|
2011-01-27 |
2014-02-11 |
Amkor Technology, Inc. |
Semiconductor device including leadframe with a combination of leads and lands
|
TWI557183B
(zh)
|
2015-12-16 |
2016-11-11 |
財團法人工業技術研究院 |
矽氧烷組成物、以及包含其之光電裝置
|
US9721872B1
(en)
|
2011-02-18 |
2017-08-01 |
Amkor Technology, Inc. |
Methods and structures for increasing the allowable die size in TMV packages
|
US9013011B1
(en)
|
2011-03-11 |
2015-04-21 |
Amkor Technology, Inc. |
Stacked and staggered die MEMS package and method
|
KR101140113B1
(ko)
|
2011-04-26 |
2012-04-30 |
앰코 테크놀로지 코리아 주식회사 |
반도체 디바이스
|
US8653674B1
(en)
|
2011-09-15 |
2014-02-18 |
Amkor Technology, Inc. |
Electronic component package fabrication method and structure
|
US8633598B1
(en)
|
2011-09-20 |
2014-01-21 |
Amkor Technology, Inc. |
Underfill contacting stacking balls package fabrication method and structure
|
US9029962B1
(en)
|
2011-10-12 |
2015-05-12 |
Amkor Technology, Inc. |
Molded cavity substrate MEMS package fabrication method and structure
|
US8552548B1
(en)
|
2011-11-29 |
2013-10-08 |
Amkor Technology, Inc. |
Conductive pad on protruding through electrode semiconductor device
|
US9704725B1
(en)
|
2012-03-06 |
2017-07-11 |
Amkor Technology, Inc. |
Semiconductor device with leadframe configured to facilitate reduced burr formation
|
US9048298B1
(en)
|
2012-03-29 |
2015-06-02 |
Amkor Technology, Inc. |
Backside warpage control structure and fabrication method
|
US9129943B1
(en)
|
2012-03-29 |
2015-09-08 |
Amkor Technology, Inc. |
Embedded component package and fabrication method
|
US9246467B2
(en)
|
2012-05-31 |
2016-01-26 |
Texas Instruments Incorporated |
Integrated resonator with a mass bias
|
US8704370B2
(en)
|
2012-06-29 |
2014-04-22 |
Freescale Semiconductor, Inc. |
Semiconductor package structure having an air gap and method for forming
|
US8969730B2
(en)
*
|
2012-08-16 |
2015-03-03 |
Apple Inc. |
Printed circuit solder connections
|
US9799592B2
(en)
|
2013-11-19 |
2017-10-24 |
Amkor Technology, Inc. |
Semicondutor device with through-silicon via-less deep wells
|
KR101366461B1
(ko)
|
2012-11-20 |
2014-02-26 |
앰코 테크놀로지 코리아 주식회사 |
반도체 디바이스 및 그 제조 방법
|
KR101488590B1
(ko)
|
2013-03-29 |
2015-01-30 |
앰코 테크놀로지 코리아 주식회사 |
반도체 디바이스 및 그 제조 방법
|
KR101486790B1
(ko)
|
2013-05-02 |
2015-01-28 |
앰코 테크놀로지 코리아 주식회사 |
강성보강부를 갖는 마이크로 리드프레임
|
KR101563911B1
(ko)
|
2013-10-24 |
2015-10-28 |
앰코 테크놀로지 코리아 주식회사 |
반도체 패키지
|
KR101607981B1
(ko)
|
2013-11-04 |
2016-03-31 |
앰코 테크놀로지 코리아 주식회사 |
반도체 패키지용 인터포저 및 이의 제조 방법, 제조된 인터포저를 이용한 반도체 패키지
|
US9673122B2
(en)
|
2014-05-02 |
2017-06-06 |
Amkor Technology, Inc. |
Micro lead frame structure having reinforcing portions and method
|
US9559077B2
(en)
|
2014-10-22 |
2017-01-31 |
Nxp Usa, Inc. |
Die attachment for packaged semiconductor device
|
TWI586236B
(zh)
*
|
2015-01-13 |
2017-06-01 |
旭德科技股份有限公司 |
封裝載板及其製作方法
|
US9960328B2
(en)
|
2016-09-06 |
2018-05-01 |
Amkor Technology, Inc. |
Semiconductor device and manufacturing method thereof
|