KR940022765A - 반도체 장치의 상호 접속구조 및 상호접속 방법 - Google Patents

반도체 장치의 상호 접속구조 및 상호접속 방법 Download PDF

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Publication number
KR940022765A
KR940022765A KR1019940004651A KR19940004651A KR940022765A KR 940022765 A KR940022765 A KR 940022765A KR 1019940004651 A KR1019940004651 A KR 1019940004651A KR 19940004651 A KR19940004651 A KR 19940004651A KR 940022765 A KR940022765 A KR 940022765A
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South Korea
Prior art keywords
electronic component
core member
solder
interconnect structure
pad
Prior art date
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KR1019940004651A
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English (en)
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KR0153212B1 (ko
Inventor
겐지 쯔까모또
Original Assignee
세끼모또 다다히로
니뽄 덴끼 가부시끼가이샤
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Publication of KR940022765A publication Critical patent/KR940022765A/ko
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Publication of KR0153212B1 publication Critical patent/KR0153212B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명에 따른 상호접속 구조는 구조를 단순화하여 제조가 쉽고 솔더 범프에 발생되는 응력을 최소화 한다. 반도체 칩의 패드와 기판의 패드는 솔더 범프에 의해 서로 접속된다. 상기 솔더 범프는 모래시계 형태이다. 금속 코어부재는 솔더 범프내에 각각 제공되고, 상기 코어부재는 원형 바닥부와 원형핀부로 구성되며, 또한 상기 코어는 반도체 칩의 패드에 땜납된다.

Description

반도체 장치의 상호 접속구조 및 상호접속 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 따른 전자부품용 상호접속 구조도.
제2a도 내지 제2c도는 코어부재(4)의 구조 상세도.

Claims (16)

  1. 제1전자 부품을 제2전자부품에 접속시키기 위한 솔더 범프와 상기 솔더 범프에 제공된 코어부재를 각각 포함하는 것을 특징으로 하는 전자부품용 상호접속 구조.
  2. 제1항에 있어서, 상기 각각의 솔더 범프는 모래시계 형태인 것을 특징으로 하는 전자부품용 상호접속 구조.
  3. 제1항에 있어서, 상기 제1전자부품은 LSI 베어칩을 포함하고, 제2전자부품은 기판을 포함하는 것을 특징으로 하는 전자부품용 상호접속 구조.
  4. 제3항에 있어서, 상기 코어부재는 LSI 베어칩상에 제공되는 것을 특징으로 하는 전자부품용 상호접속 구조.
  5. 제3항에 있어서, 상기 코어부재는 기판상에 제공되는 것을 특징으로 하는 전자부품용 상호접속 구조.
  6. 제1항에 있어서, 상기 코어부재는 각각 핀 부분을 갖는 것을 특징으로 하는 전자부품용 상호접속 구조.
  7. 제6항에 있어서, 상기 코어부재의 핀 부분은 각각 정확히 위치 지정되는 것을 특징으로 하는 전자부품용 상호접속 구조.
  8. 제6항에 있어서, 상기 코어 부재의 핀 부분은 각각 타원형의 단면을 갖는 것을 특징으로 하는 전자부품용 상호접속 구조.
  9. 제6항에 있어서, 상기 코어 부재의 핀 부부은 상기 핀 부분의 상단부로부터 연장된 각각의 중심홀을 갖는 것을 특징으로 하는 전자부품용 상호접속 구조.
  10. 제6항에 있어서, 상기 각각의 코어부재는 다수의 핀 부분을 갖는 것을 특징으로 하는 전자부품용 상호접속 구조.
  11. 상기 제1전자부품의 각각의 패드상에 코어 부재를 장착하는 제1단계와, 상기 제2전자 부품의 패드를 예정된 솔더 페이스트 양으로 피복하는 제2단계와, 상기 코어 부재를 제2전자 부품의 패드상에 있는 솔더 페이스트내로 각각 삽입하는 제3단계 및, 상기 솔더 페이스트를 가열 용융시킨 후 솔더 범프를 형성하기 위해 솔더 페이스트를 냉각시키는 제4단계를 포함하는 것을 특징으로 하는 제1 및 제2전자부품의 상호접속 방법.
  12. 제11항에 있어서, 상기 제2전자부품의 각 패드상의 솔더 패이스트 양은 상기 솔더 패이스트가 제4단계에서 용융될 때 그 표면 장력에 의해 모래시계 형태를 제공하도록 선택되는 것을 특징으로 하는 제1 및 제2전자부품의 상호접속 방법.
  13. 상기 코어부재를 제1전자부품의 각 패드상에 장착하는 제1단계와, 환형 솔더를 상기 코어 부재상에 각각 끼우는 제2단계와, 상기 코어 부재가 제2전자부품의 패드와 각각 배열되도록 상기 제1전자부품을 제2전자 부품상에 위치시키는 제3단계 및, 상기 솔더링을 가열 및 용융시킨 다음 솔더 범프를 형성하도록 냉각시키는 제4단계를 포함하는 것을 특징으로 하는 제1 및 제2전자부품의 상호접속 방법.
  14. 제13항에 있어서, 각각의 솔더링을 형성하는 솔더양은 상기 솔더링이 제4단계에서 용융될 때 그 표면장력에 의해 모래시계 형태를 제공하도록 선택되는 것을 특징으로 하는 제1 및 제2전자부품의 상호접속 방법.
  15. LSI 베어칩의 패드상에 장착된 코어부재와 LSI 베어칩을 포함하는 것을 특징으로 하는 반도체 장치.
  16. 제15항에 있어서, 솔더량은 상기 각각의 코어부재에 부착되고, 상기 솔더양은 상기 솔더가 재유동시 모래시계 형태를 제공하도록 선택되는 것을 특징으로 하는 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940004651A 1993-03-10 1994-03-10 반도체 장치의 상호 접속 구조 및 상호 접속 방법 KR0153212B1 (ko)

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JP5049172A JP2716336B2 (ja) 1993-03-10 1993-03-10 集積回路装置
JP93-49172 1993-03-11

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CA2118649C (en) 2000-05-02
DE69428819D1 (de) 2001-12-06
CA2118649A1 (en) 1994-09-11
JP2716336B2 (ja) 1998-02-18
EP0615283A1 (en) 1994-09-14
AU675273B2 (en) 1997-01-30
KR0153212B1 (ko) 1998-12-01
JPH06268015A (ja) 1994-09-22
DE69428819T2 (de) 2002-06-20
US5640052A (en) 1997-06-17
EP0615283B1 (en) 2001-10-31

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