DE69428819D1 - Verbindungsstruktur für elektronische Bauteile, welche Lötperlen mit Metallseelen enthalten - Google Patents

Verbindungsstruktur für elektronische Bauteile, welche Lötperlen mit Metallseelen enthalten

Info

Publication number
DE69428819D1
DE69428819D1 DE69428819T DE69428819T DE69428819D1 DE 69428819 D1 DE69428819 D1 DE 69428819D1 DE 69428819 T DE69428819 T DE 69428819T DE 69428819 T DE69428819 T DE 69428819T DE 69428819 D1 DE69428819 D1 DE 69428819D1
Authority
DE
Germany
Prior art keywords
electronic components
connection structure
solder balls
metal cores
contain solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69428819T
Other languages
English (en)
Other versions
DE69428819T2 (de
Inventor
Kenji Tsukamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE69428819D1 publication Critical patent/DE69428819D1/de
Application granted granted Critical
Publication of DE69428819T2 publication Critical patent/DE69428819T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
DE69428819T 1993-03-10 1994-03-07 Verbindungsstruktur für elektronische Bauteile, welche Lötperlen mit Metallseelen enthalten Expired - Fee Related DE69428819T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5049172A JP2716336B2 (ja) 1993-03-10 1993-03-10 集積回路装置

Publications (2)

Publication Number Publication Date
DE69428819D1 true DE69428819D1 (de) 2001-12-06
DE69428819T2 DE69428819T2 (de) 2002-06-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE69428819T Expired - Fee Related DE69428819T2 (de) 1993-03-10 1994-03-07 Verbindungsstruktur für elektronische Bauteile, welche Lötperlen mit Metallseelen enthalten

Country Status (7)

Country Link
US (1) US5640052A (de)
EP (1) EP0615283B1 (de)
JP (1) JP2716336B2 (de)
KR (1) KR0153212B1 (de)
AU (1) AU675273B2 (de)
CA (1) CA2118649C (de)
DE (1) DE69428819T2 (de)

Families Citing this family (136)

* Cited by examiner, † Cited by third party
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AU5771394A (en) 1994-09-15
KR940022765A (ko) 1994-10-21
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JP2716336B2 (ja) 1998-02-18
KR0153212B1 (ko) 1998-12-01
CA2118649A1 (en) 1994-09-11
CA2118649C (en) 2000-05-02
US5640052A (en) 1997-06-17
JPH06268015A (ja) 1994-09-22
DE69428819T2 (de) 2002-06-20
EP0615283B1 (de) 2001-10-31

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