DE69422968T2 - Montageanordnung für elektronisches Bauteil - Google Patents

Montageanordnung für elektronisches Bauteil

Info

Publication number
DE69422968T2
DE69422968T2 DE69422968T DE69422968T DE69422968T2 DE 69422968 T2 DE69422968 T2 DE 69422968T2 DE 69422968 T DE69422968 T DE 69422968T DE 69422968 T DE69422968 T DE 69422968T DE 69422968 T2 DE69422968 T2 DE 69422968T2
Authority
DE
Germany
Prior art keywords
electronic component
mounting arrangement
mounting
arrangement
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69422968T
Other languages
English (en)
Other versions
DE69422968D1 (de
Inventor
Ken Tonegawa
Harufumi Mandai
Teruhisa Tsuru
Mitsuhide Katou
Koji Furutani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP32431193A external-priority patent/JP3161192B2/ja
Priority claimed from JP33640693A external-priority patent/JP3161197B2/ja
Priority claimed from JP33640493A external-priority patent/JP3161196B2/ja
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of DE69422968D1 publication Critical patent/DE69422968D1/de
Publication of DE69422968T2 publication Critical patent/DE69422968T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1006—Non-printed filter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
DE69422968T 1993-12-22 1994-12-21 Montageanordnung für elektronisches Bauteil Expired - Lifetime DE69422968T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP32431193A JP3161192B2 (ja) 1993-12-22 1993-12-22 電子部品の実装構造
JP33640693A JP3161197B2 (ja) 1993-12-28 1993-12-28 電子部品の実装構造
JP33640493A JP3161196B2 (ja) 1993-12-28 1993-12-28 電子部品の実装構造

Publications (2)

Publication Number Publication Date
DE69422968D1 DE69422968D1 (de) 2000-03-16
DE69422968T2 true DE69422968T2 (de) 2000-06-29

Family

ID=27340043

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69422968T Expired - Lifetime DE69422968T2 (de) 1993-12-22 1994-12-21 Montageanordnung für elektronisches Bauteil

Country Status (3)

Country Link
US (1) US5532658A (de)
EP (1) EP0660649B1 (de)
DE (1) DE69422968T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950704758A (ko) * 1993-10-18 1995-11-20 가나미야지 준 IC 모듈과 그것을 사용한 데이터 커리어(Ic module using it on data carrier)
US5528203A (en) * 1994-09-26 1996-06-18 Endgate Corporation Coplanar waveguide-mounted flip chip
US5942957A (en) * 1994-09-26 1999-08-24 Endgate Corporation Flip-mounted impedance
US5907265A (en) * 1996-09-13 1999-05-25 Matsushita Electric Industrial Co., Ltd. High-frequency circuit board trace crossing and electronic component therefor
SE510980C2 (sv) * 1996-11-29 1999-07-19 Ericsson Telefon Ab L M Anordning för montering av en kapsel på ett monteringsunderlag samt förfarande för tillverkning av dylik anordning
US6069403A (en) * 1998-10-06 2000-05-30 Intersil Corporation Power module with lowered inductance and reduced voltage overshoots
DE10013936A1 (de) * 2000-03-21 2001-09-27 Bodenseewerk Geraetetech Filteranordnung
US6362972B1 (en) 2000-04-13 2002-03-26 Molex Incorporated Contactless interconnection system
US6612852B1 (en) 2000-04-13 2003-09-02 Molex Incorporated Contactless interconnection system
EP1324646B1 (de) 2001-12-27 2009-04-01 Alps Electric Co., Ltd. Überbrückungs-Chipbauteil und Montierungsanordnung dafür
US7348666B2 (en) * 2004-06-30 2008-03-25 Endwave Corporation Chip-to-chip trench circuit structure
US7411279B2 (en) * 2004-06-30 2008-08-12 Endwave Corporation Component interconnect with substrate shielding
GB2420020A (en) * 2004-11-04 2006-05-10 Richard Hoptroff Method for mounting electrical component on printed circuit boards
EP2391191A1 (de) * 2010-05-28 2011-11-30 Thales Vorrichtung zum Verbinden von elektronischen Schaltkreisen, insbesondere von elektronischen Hyperfrequenzschaltkreisen
JP5339092B2 (ja) 2010-07-22 2013-11-13 Ｔｄｋ株式会社 バンドパスフィルタモジュール及びモジュール基板
US10201076B2 (en) * 2016-08-12 2019-02-05 Kabushiki Kaisha Toshiba Coupler for proximity wireless communication

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4600907A (en) * 1985-03-07 1986-07-15 Tektronix, Inc. Coplanar microstrap waveguide interconnector and method of interconnection
JPS62120703A (ja) * 1985-11-20 1987-06-02 Fujitsu Ltd 誘電体フイルタの実装構造
US4816789A (en) * 1986-05-19 1989-03-28 United Technologies Corporation Solderless, pushdown connectors for RF and DC
US4716389A (en) * 1986-10-20 1987-12-29 Honeywell Inc. Millimeter wave microstrip surface mounted attenuator
JPH0817300B2 (ja) * 1989-06-14 1996-02-21 株式会社村田製作所 ノイズフィルタの取付け構造
JPH04152708A (ja) * 1990-10-17 1992-05-26 Toshiba Corp 印刷配線板
US5138436A (en) * 1990-11-16 1992-08-11 Ball Corporation Interconnect package having means for waveguide transmission of rf signals
JPH04310009A (ja) * 1991-04-08 1992-11-02 Murata Mfg Co Ltd チップ部品およびその実装構造
JPH06169203A (ja) * 1992-11-30 1994-06-14 Murata Mfg Co Ltd 誘電体共振器装置

Also Published As

Publication number Publication date
EP0660649B1 (de) 2000-02-09
EP0660649A2 (de) 1995-06-28
US5532658A (en) 1996-07-02
EP0660649A3 (de) 1996-10-23
DE69422968D1 (de) 2000-03-16

Similar Documents

Publication Publication Date Title
DE69432968D1 (de) Gehäuse für elektronische Bauelemente
DE59504639D1 (de) Verkapselung für elektronische bauelemente
DE69326318D1 (de) Verpackung für elektronische komponenten
DE69127154D1 (de) Anordnung zur Montierung elektronischer Bauteile
DE69519077D1 (de) Verpackung für elektronische Komponenten
DE69730307D1 (de) Bestückungsverfahren für elektronische bauteile
DE69718416T2 (de) Speisevorrichtung für elektronische Komponenten
DE69422968D1 (de) Montageanordnung für elektronisches Bauteil
DE69400238D1 (de) Befestigungsvorrichtung für Leiterplatten
DE69302994D1 (de) Verzorgungsvorrichtung von Bauelement für integrierte Schaltung
DE69500571T2 (de) Verbesserte Speisevorrichtung für elektronische Komponenten
DE69625837D1 (de) Einrichtung für Leiterplattenzusammenbau
DE69418417D1 (de) Leiterplattenbefestigung
DE69508942D1 (de) Gehäuse für elektronische Bauteile
KR970020349U (ko) 전자부품 실장장치
DE69618148T2 (de) Schwingschaltung für EL Element
DE9313131U1 (de) Trageinrichtung für ein induktives SMD-Bauteil
DE69429367D1 (de) Elektronisches gerät für reflexotherapie
DE9410855U1 (de) Befestigungsgehäuse für Leitungsplatten
KR950012908U (ko) 기판 장착 지그
KR950016123U (ko) 전자부품 장착장치
KR950002548U (ko) 전자부품 실장장치
KR950002544U (ko) 전자부품 실장장치
DE29512979U1 (de) Gehäuse für elektronische Bauteile
DE29602857U1 (de) Befestigungsvorrichtung für ein elektronisches Gerät

Legal Events

Date Code Title Description
8364 No opposition during term of opposition