KR950704758A - IC 모듈과 그것을 사용한 데이터 커리어(Ic module using it on data carrier) - Google Patents
IC 모듈과 그것을 사용한 데이터 커리어(Ic module using it on data carrier)Info
- Publication number
- KR950704758A KR950704758A KR1019950702462A KR19950702462A KR950704758A KR 950704758 A KR950704758 A KR 950704758A KR 1019950702462 A KR1019950702462 A KR 1019950702462A KR 19950702462 A KR19950702462 A KR 19950702462A KR 950704758 A KR950704758 A KR 950704758A
- Authority
- KR
- South Korea
- Prior art keywords
- data
- module
- career
- engine
- hole
- Prior art date
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Abstract
IC 칩(30)을 절연체로 봉쇄한 블록형상의 IC 모듈(1)의 표면부에서 측면부에 걸쳐서 늘어넣고, IC 칩(30)과의 데이터의 수수가 가능하게 IC 칩(30)과 전기적으로 접속된 큰택트단자(101∼106, 111∼116)를 설치하는 동시에 걸림수단 (14, 15)을 설치하고, 또 이 IC 모듈(1)이 끼워붙여지는 데이터 커리어(100, 120, 140, 160)에는 IC 모듈(1)이 끼워붙이기 가능하도록 걸림수단(14, 15)에 대한 걸어맞춤수단(42, 43, 71, 72, 92, 93)이 있는 구멍부(41, 91)가 설치되어 있어, 하나의 IC 모듈(1)을 여러 가지의 데이터 커리어에 대해서 자유롭게 사용할 수 있고 IC 모듈(1)의 두께를 가능한 두껍게 하는 것으로 IC 모듈(1)의 강도를 향상할 수가 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예를 표시하는 IC모듈의 사시도, 제2도는 제1도에 있어서, A-A' 단면도, 제3도는 제1도의 IC 모듈에서의 IC 칩과 각 콘택트 단자와의 관계를 표시하는 개략 기능 블록도.
Claims (8)
- 절연부재로 된 데이터 커리어에 끼워불여져, 데이터 수수를 행하는 모듈에 있어서, 중앙처리장치 등의 데이터 처리장치가 있고, 그 데이터 처리장치에 상기 데이터의 수수를 하는 단자부가 있는 IC 칩과 그 IC 칩을 봉쇄하고, 소정의 블록형상을 가진 절연체와, 상기 절연체의 표면부로부터 측면부에 걸쳐서 늘어놓고, 상기 IC 칩의 단자부와 전기적으로 접속된 콘택트단자와 상기 절연체의 측면부에 형성되고, 상기 데이터 커리어에 대해서 착탁가능하게 끼워맞춤하는 걸림수단으로 된 것을 특징으로 하는 IC 모듈.
- 제1항에 있어서, 상기 IC 모듈의 두께에 응한 두께가 있고, IC 모듈의 크기보다 큰 절연부재로 된 기관과, 상기 기관에 설치되어, 상기 IC 모듈이 끼워넣기 가능한 크기가 있는 구멍부와, 상기 구멍부의 내측면에 있어서 상기 IC 모듈의 걸림수단이 걸림 가능하게 배치된 걸어맞춤 수단이 있는 것을 특징으로 하는 데이터 커리어.
- 제2항에 있어서, 상기 기관내에 설치되어 외부 장치와 데이터의 수수가 가능한 데이터 취급수단과, 상기 구멍부의 내측면에 형성되어 상기 데이터 취급수단과 상기 데이터의 전송이 가능하게 전기적으로 접속된 내부 단자가 있는 것을 특징으로 하는 데이터 커리어.
- 제2항에 있어서, 상기 기관내에 설치되고, 외부장치와 데이터의 수수가 가나안 데이터 취급수단과, 상기 기관내에 설치되어, 상기 데이터를 격납하고 상기 데이터 취급수단과 그 데이터의 수수를 가능하게 전기적으로 접속된 메모리 수단과, 상기 구멍부의 내측면에 형성되고, 상기 데이터 취급수단과 상기 데이터의 전송이 가능하게 전기적으로 접속된 내부단자가 있는 것을 특징으로 하는 데이터 커리어.
- 제2항에 있어서, 그 기관의 두께는 상기 IC 모듈의 두께와 대략 동일한 것을 특징으로 하는 데이터 커리어.
- 절연부재로 된 데이터 커리어에 데어터의 수수를 행하는 IC모듈을 설치하는 방법에 있어서, 상기 IC모듈은 중앙처리장치 등의 데이터 처리장치가 있고, 그 데이터 처리장치에 상기 데이터의 수숫를 하는 단자부를 가진 IC칩과 그 IC칩을 봉쇄하고, 소정의 블록형상을 한 절연체와 상기 절연체의 표면부에서 측면부에 걸쳐서 늘어놓고 상기 IC 칩의 단자부와 전기적으로 접속된 콘택트단자와, 상기 절연체의 측면부에 형성되어, 상기 데이터 커리어에 대해서 착탈 가능하게 끼워맞추는 걸림수단이 있고, 상기 데이터 커리어는 상기 IC모듈의 두께에 용한 두께가 있고, 그 IC 모듈의 크기보다 큰 절연부재로 된 기판과, 상기 기판에 설치되어 상기 IC 모듈이 끼워넣기 가능한 크기가 있는 구멍부와, 상기 기관내에 설치되고, 외부장치와 데이터의 수수가 가능한 데이터 취급수단과, 상기 구멍부의 내측면에 형성되고 상기 데이터 취급수단과 상기 데이터의 전송이 가능하게 전기적으로 접속된 내부 단자가 있고 상기 IC모듈을 상기 데이터 커리어의 상기 구멍부에 끼워 붙임 했을 때, 그 IC 모듈과 그 데이터 커리어와의 사이에는 그 IC모듈의 콘택트 단자와 그 데이터 커리어의 내부단자와를 전기적으로 접속하는 도전부재를 개재시킨 것을 특징으로 하는 설치방법.
- 제6항에 있어서, 상기 도전부재는 고리모양으로 형성되고, 탄성이 있는 이방성 도전체인 것을 특징으로 하는 설치방법.
- 제7항에 있어서, 상기 도전부재는 상기 IC모듈의 걸림수단에 대응하는 위치에 구멍이 있는 것을 특징으로 하는 설치방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25878893 | 1993-10-18 | ||
JP93-258788 | 1993-10-18 | ||
PCT/JP1994/001742 WO1995011135A1 (en) | 1993-10-18 | 1994-10-17 | Ic module and data carrier using same |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950704758A true KR950704758A (ko) | 1995-11-20 |
Family
ID=17325087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950702462A KR950704758A (ko) | 1993-10-18 | 1994-10-17 | IC 모듈과 그것을 사용한 데이터 커리어(Ic module using it on data carrier) |
Country Status (3)
Country | Link |
---|---|
US (1) | US5736781A (ko) |
KR (1) | KR950704758A (ko) |
WO (1) | WO1995011135A1 (ko) |
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JP3173438B2 (ja) * | 1997-06-04 | 2001-06-04 | ソニー株式会社 | メモリカード及び装着装置 |
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JPS6382795A (ja) * | 1986-09-26 | 1988-04-13 | 株式会社日立製作所 | 半導体装置 |
JPS63194993A (ja) * | 1987-02-09 | 1988-08-12 | 太陽誘電株式会社 | デ−タ記録カ−ド |
JPS63246292A (ja) * | 1987-04-01 | 1988-10-13 | 株式会社東芝 | Icカ−ド |
US5072418A (en) * | 1989-05-04 | 1991-12-10 | Texas Instruments Incorporated | Series maxium/minimum function computing devices, systems and methods |
US5586275A (en) * | 1989-05-04 | 1996-12-17 | Texas Instruments Incorporated | Devices and systems with parallel logic unit operable on data memory locations, and methods |
JP2560895B2 (ja) * | 1990-07-25 | 1996-12-04 | 三菱電機株式会社 | Icカードの製造方法およびicカード |
US5455385A (en) * | 1993-06-28 | 1995-10-03 | Harris Corporation | Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses |
JPH0789282A (ja) * | 1993-06-30 | 1995-04-04 | Mitsubishi Electric Corp | Icメモリカード、ホスト装置側コネクタ及びそれらを用いた接続システム |
DE69422968T2 (de) * | 1993-12-22 | 2000-06-29 | Murata Manufacturing Co | Montageanordnung für elektronisches Bauteil |
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
-
1994
- 1994-10-17 WO PCT/JP1994/001742 patent/WO1995011135A1/ja active Application Filing
- 1994-10-17 US US08/446,640 patent/US5736781A/en not_active Expired - Lifetime
- 1994-10-17 KR KR1019950702462A patent/KR950704758A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO1995011135A1 (en) | 1995-04-27 |
US5736781A (en) | 1998-04-07 |
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Legal Events
Date | Code | Title | Description |
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WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |