MX349946B - Conexión por bola de contacto y bola de contacto y procedimiento para producir una conexión por bola de contacto. - Google Patents

Conexión por bola de contacto y bola de contacto y procedimiento para producir una conexión por bola de contacto.

Info

Publication number
MX349946B
MX349946B MX2015001754A MX2015001754A MX349946B MX 349946 B MX349946 B MX 349946B MX 2015001754 A MX2015001754 A MX 2015001754A MX 2015001754 A MX2015001754 A MX 2015001754A MX 349946 B MX349946 B MX 349946B
Authority
MX
Mexico
Prior art keywords
contact
contact bump
terminal face
displacement
connection
Prior art date
Application number
MX2015001754A
Other languages
English (en)
Other versions
MX2015001754A (es
Inventor
Carsten Nieland
Frank Kriebel
Original Assignee
Smartrac Tech Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smartrac Tech Gmbh filed Critical Smartrac Tech Gmbh
Publication of MX2015001754A publication Critical patent/MX2015001754A/es
Publication of MX349946B publication Critical patent/MX349946B/es

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
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    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76885By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
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    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making
    • Y10T29/49018Antenna or wave energy "plumbing" making with other electrical component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

La invención se refiere a una conexión (24) por bola de contacto y a un procedimiento para producir una conexión por bola de contacto entre un componente electrónico provisto de al menos una cara terminal (11) y un sustrato de contacto (26) que entre en contacto con el componente y que tenga al menos una segunda cara terminal (25), en la cual la primera cara terminal está provista de una bola de contacto (10) que tiene un borde elevado (15) y tiene al menos una clavija de desplazamiento (16) en un compartimento de desplazamiento (18) que está rodeado por el borde elevado y abierto hacia un extremo delantero de la bola de contacto, y en la cual, en una zona de contacto (31) con la primera cara terminal, la segunda cara terminal tiene un cordón de contacto (30) que se forma por desplazamiento de un material de contacto (29) de la segunda cara terminal hacia el compartimento de desplazamiento y que rodea la clavija de desplazamiento, teniendo dicho cordón de contacto una cresta de cordón (33) que está orientada hacia una parte inferior (17) del compartimento de desplazamiento y está elevada con respecto a una superficie de contacto de nivel (32) de la segunda cara terminal que rodea la zona de contacto.
MX2015001754A 2012-08-10 2013-08-09 Conexión por bola de contacto y bola de contacto y procedimiento para producir una conexión por bola de contacto. MX349946B (es)

Applications Claiming Priority (2)

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DE102012015811 2012-08-10
PCT/DE2013/000451 WO2014023287A2 (de) 2012-08-10 2013-08-09 Kontakthöckerverbindung sowie kontakthöcker und verfahren zur herstellung einer kontakthöckerverbindung

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MX349946B true MX349946B (es) 2017-08-22

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KR (1) KR20150053902A (es)
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BR (1) BR112015002759B1 (es)
CA (1) CA2880408A1 (es)
DE (1) DE102013215771B4 (es)
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Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2716336B2 (ja) * 1993-03-10 1998-02-18 日本電気株式会社 集積回路装置
US5483741A (en) * 1993-09-03 1996-01-16 Micron Technology, Inc. Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice
JPH0870019A (ja) * 1994-08-30 1996-03-12 Casio Comput Co Ltd 電子部品の接続構造および接続方法
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
JPH11163036A (ja) * 1997-09-17 1999-06-18 Tamura Seisakusho Co Ltd バンプ形成方法、はんだ接合用前処理方法、はんだ接合方法、バンプ形成装置、はんだ接合用前処理装置およびはんだ接合装置
US6028436A (en) * 1997-12-02 2000-02-22 Micron Technology, Inc. Method for forming coaxial silicon interconnects
US6045026A (en) * 1998-02-23 2000-04-04 Micron Technology, Inc. Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
JP2000114314A (ja) * 1998-09-29 2000-04-21 Hitachi Ltd 半導体素子実装構造体およびその製造方法並びにicカード
DE19905807A1 (de) 1999-02-11 2000-08-31 Ksw Microtec Ges Fuer Angewand Verfahren zur Herstellung elektrisch leitender Verbindungen
JP2001148401A (ja) * 1999-11-18 2001-05-29 Seiko Epson Corp 半導体装置およびその製造方法
DE10157205A1 (de) 2001-11-22 2003-06-12 Fraunhofer Ges Forschung Kontakthöcker mit profilierter Oberflächenstruktur sowie Verfahren zur Herstellung
US7214569B2 (en) 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US7015590B2 (en) 2003-01-10 2006-03-21 Samsung Electronics Co., Ltd. Reinforced solder bump structure and method for forming a reinforced solder bump
JP2005197488A (ja) * 2004-01-08 2005-07-21 Sony Corp 突起電極及びボンディングキャピラリ並びに半導体チップ
DE102004006457A1 (de) * 2004-02-04 2005-08-25 Bielomatik Leuze Gmbh + Co Kg Verfahren und Vorrichtung zum kontinuierlichen Herstellen elektronischer Folienbauteile
DE102005012496B3 (de) * 2005-03-16 2006-10-26 Technische Universität Berlin Vorrichtung mit einem auf einem Montageteil montierten elektronischen Bauteil und Verfahren
JP2006310477A (ja) * 2005-04-27 2006-11-09 Akita Denshi Systems:Kk 半導体装置及びその製造方法
JP5117169B2 (ja) * 2007-04-06 2013-01-09 株式会社日立製作所 半導体装置
US8102021B2 (en) * 2008-05-12 2012-01-24 Sychip Inc. RF devices
US8766450B2 (en) * 2009-09-22 2014-07-01 Samsung Electro-Mechanics Co., Ltd. Lead pin for package substrate

Also Published As

Publication number Publication date
MX2015001754A (es) 2015-09-16
DE102013215771A1 (de) 2014-02-13
BR112015002759B1 (pt) 2021-11-03
JP2015532780A (ja) 2015-11-12
KR20150053902A (ko) 2015-05-19
JP6347781B2 (ja) 2018-06-27
US10292270B2 (en) 2019-05-14
CN104737286A (zh) 2015-06-24
EP2883245A2 (de) 2015-06-17
DE102013215771B4 (de) 2019-06-13
CN104737286B (zh) 2018-09-25
MY172360A (en) 2019-11-21
WO2014023287A3 (de) 2014-04-03
CA2880408A1 (en) 2014-02-13
IN2015MN00491A (es) 2015-09-04
US20150208508A1 (en) 2015-07-23
BR112015002759A2 (pt) 2017-07-04
EP2883245B1 (de) 2020-09-30
WO2014023287A2 (de) 2014-02-13

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