MX349946B - Conexión por bola de contacto y bola de contacto y procedimiento para producir una conexión por bola de contacto. - Google Patents
Conexión por bola de contacto y bola de contacto y procedimiento para producir una conexión por bola de contacto.Info
- Publication number
- MX349946B MX349946B MX2015001754A MX2015001754A MX349946B MX 349946 B MX349946 B MX 349946B MX 2015001754 A MX2015001754 A MX 2015001754A MX 2015001754 A MX2015001754 A MX 2015001754A MX 349946 B MX349946 B MX 349946B
- Authority
- MX
- Mexico
- Prior art keywords
- contact
- contact bump
- terminal face
- displacement
- connection
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
La invención se refiere a una conexión (24) por bola de contacto y a un procedimiento para producir una conexión por bola de contacto entre un componente electrónico provisto de al menos una cara terminal (11) y un sustrato de contacto (26) que entre en contacto con el componente y que tenga al menos una segunda cara terminal (25), en la cual la primera cara terminal está provista de una bola de contacto (10) que tiene un borde elevado (15) y tiene al menos una clavija de desplazamiento (16) en un compartimento de desplazamiento (18) que está rodeado por el borde elevado y abierto hacia un extremo delantero de la bola de contacto, y en la cual, en una zona de contacto (31) con la primera cara terminal, la segunda cara terminal tiene un cordón de contacto (30) que se forma por desplazamiento de un material de contacto (29) de la segunda cara terminal hacia el compartimento de desplazamiento y que rodea la clavija de desplazamiento, teniendo dicho cordón de contacto una cresta de cordón (33) que está orientada hacia una parte inferior (17) del compartimento de desplazamiento y está elevada con respecto a una superficie de contacto de nivel (32) de la segunda cara terminal que rodea la zona de contacto.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012015811 | 2012-08-10 | ||
PCT/DE2013/000451 WO2014023287A2 (de) | 2012-08-10 | 2013-08-09 | Kontakthöckerverbindung sowie kontakthöcker und verfahren zur herstellung einer kontakthöckerverbindung |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2015001754A MX2015001754A (es) | 2015-09-16 |
MX349946B true MX349946B (es) | 2017-08-22 |
Family
ID=49303671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2015001754A MX349946B (es) | 2012-08-10 | 2013-08-09 | Conexión por bola de contacto y bola de contacto y procedimiento para producir una conexión por bola de contacto. |
Country Status (12)
Country | Link |
---|---|
US (1) | US10292270B2 (es) |
EP (1) | EP2883245B1 (es) |
JP (1) | JP6347781B2 (es) |
KR (1) | KR20150053902A (es) |
CN (1) | CN104737286B (es) |
BR (1) | BR112015002759B1 (es) |
CA (1) | CA2880408A1 (es) |
DE (1) | DE102013215771B4 (es) |
IN (1) | IN2015MN00491A (es) |
MX (1) | MX349946B (es) |
MY (1) | MY172360A (es) |
WO (1) | WO2014023287A2 (es) |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2716336B2 (ja) * | 1993-03-10 | 1998-02-18 | 日本電気株式会社 | 集積回路装置 |
US5483741A (en) * | 1993-09-03 | 1996-01-16 | Micron Technology, Inc. | Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice |
JPH0870019A (ja) * | 1994-08-30 | 1996-03-12 | Casio Comput Co Ltd | 電子部品の接続構造および接続方法 |
US5929521A (en) * | 1997-03-26 | 1999-07-27 | Micron Technology, Inc. | Projected contact structure for bumped semiconductor device and resulting articles and assemblies |
JPH11163036A (ja) * | 1997-09-17 | 1999-06-18 | Tamura Seisakusho Co Ltd | バンプ形成方法、はんだ接合用前処理方法、はんだ接合方法、バンプ形成装置、はんだ接合用前処理装置およびはんだ接合装置 |
US6028436A (en) * | 1997-12-02 | 2000-02-22 | Micron Technology, Inc. | Method for forming coaxial silicon interconnects |
US6045026A (en) * | 1998-02-23 | 2000-04-04 | Micron Technology, Inc. | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems |
JP2000114314A (ja) * | 1998-09-29 | 2000-04-21 | Hitachi Ltd | 半導体素子実装構造体およびその製造方法並びにicカード |
DE19905807A1 (de) | 1999-02-11 | 2000-08-31 | Ksw Microtec Ges Fuer Angewand | Verfahren zur Herstellung elektrisch leitender Verbindungen |
JP2001148401A (ja) * | 1999-11-18 | 2001-05-29 | Seiko Epson Corp | 半導体装置およびその製造方法 |
DE10157205A1 (de) | 2001-11-22 | 2003-06-12 | Fraunhofer Ges Forschung | Kontakthöcker mit profilierter Oberflächenstruktur sowie Verfahren zur Herstellung |
US7214569B2 (en) | 2002-01-23 | 2007-05-08 | Alien Technology Corporation | Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
US7015590B2 (en) | 2003-01-10 | 2006-03-21 | Samsung Electronics Co., Ltd. | Reinforced solder bump structure and method for forming a reinforced solder bump |
JP2005197488A (ja) * | 2004-01-08 | 2005-07-21 | Sony Corp | 突起電極及びボンディングキャピラリ並びに半導体チップ |
DE102004006457A1 (de) * | 2004-02-04 | 2005-08-25 | Bielomatik Leuze Gmbh + Co Kg | Verfahren und Vorrichtung zum kontinuierlichen Herstellen elektronischer Folienbauteile |
DE102005012496B3 (de) * | 2005-03-16 | 2006-10-26 | Technische Universität Berlin | Vorrichtung mit einem auf einem Montageteil montierten elektronischen Bauteil und Verfahren |
JP2006310477A (ja) * | 2005-04-27 | 2006-11-09 | Akita Denshi Systems:Kk | 半導体装置及びその製造方法 |
JP5117169B2 (ja) * | 2007-04-06 | 2013-01-09 | 株式会社日立製作所 | 半導体装置 |
US8102021B2 (en) * | 2008-05-12 | 2012-01-24 | Sychip Inc. | RF devices |
US8766450B2 (en) * | 2009-09-22 | 2014-07-01 | Samsung Electro-Mechanics Co., Ltd. | Lead pin for package substrate |
-
2013
- 2013-08-09 CA CA2880408A patent/CA2880408A1/en not_active Abandoned
- 2013-08-09 US US14/420,730 patent/US10292270B2/en active Active
- 2013-08-09 KR KR1020157004910A patent/KR20150053902A/ko not_active Application Discontinuation
- 2013-08-09 MX MX2015001754A patent/MX349946B/es active IP Right Grant
- 2013-08-09 CN CN201380042531.0A patent/CN104737286B/zh active Active
- 2013-08-09 BR BR112015002759-8A patent/BR112015002759B1/pt not_active IP Right Cessation
- 2013-08-09 DE DE102013215771.1A patent/DE102013215771B4/de active Active
- 2013-08-09 WO PCT/DE2013/000451 patent/WO2014023287A2/de active Application Filing
- 2013-08-09 EP EP13773172.5A patent/EP2883245B1/de active Active
- 2013-08-09 JP JP2015525737A patent/JP6347781B2/ja active Active
- 2013-08-09 IN IN491MUN2015 patent/IN2015MN00491A/en unknown
- 2013-08-09 MY MYPI2015700401A patent/MY172360A/en unknown
Also Published As
Publication number | Publication date |
---|---|
MX2015001754A (es) | 2015-09-16 |
DE102013215771A1 (de) | 2014-02-13 |
BR112015002759B1 (pt) | 2021-11-03 |
JP2015532780A (ja) | 2015-11-12 |
KR20150053902A (ko) | 2015-05-19 |
JP6347781B2 (ja) | 2018-06-27 |
US10292270B2 (en) | 2019-05-14 |
CN104737286A (zh) | 2015-06-24 |
EP2883245A2 (de) | 2015-06-17 |
DE102013215771B4 (de) | 2019-06-13 |
CN104737286B (zh) | 2018-09-25 |
MY172360A (en) | 2019-11-21 |
WO2014023287A3 (de) | 2014-04-03 |
CA2880408A1 (en) | 2014-02-13 |
IN2015MN00491A (es) | 2015-09-04 |
US20150208508A1 (en) | 2015-07-23 |
BR112015002759A2 (pt) | 2017-07-04 |
EP2883245B1 (de) | 2020-09-30 |
WO2014023287A2 (de) | 2014-02-13 |
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