IN2015MN00491A - - Google Patents

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Publication number
IN2015MN00491A
IN2015MN00491A IN491MUN2015A IN2015MN00491A IN 2015MN00491 A IN2015MN00491 A IN 2015MN00491A IN 491MUN2015 A IN491MUN2015 A IN 491MUN2015A IN 2015MN00491 A IN2015MN00491 A IN 2015MN00491A
Authority
IN
India
Prior art keywords
contact
terminal face
displacement
bead
compartment
Prior art date
Application number
Other languages
English (en)
Inventor
Carsten Nieland
Frank Kriebel
Original Assignee
Smartrac Technology Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smartrac Technology Gmbh filed Critical Smartrac Technology Gmbh
Publication of IN2015MN00491A publication Critical patent/IN2015MN00491A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/18—Printed circuits structurally associated with non-printed electric components
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    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76885—By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Measuring Leads Or Probes (AREA)
IN491MUN2015 2012-08-10 2013-08-09 IN2015MN00491A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012015811 2012-08-10
PCT/DE2013/000451 WO2014023287A2 (de) 2012-08-10 2013-08-09 Kontakthöckerverbindung sowie kontakthöcker und verfahren zur herstellung einer kontakthöckerverbindung

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IN2015MN00491A true IN2015MN00491A (es) 2015-09-04

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KR (1) KR20150053902A (es)
CN (1) CN104737286B (es)
BR (1) BR112015002759B1 (es)
CA (1) CA2880408A1 (es)
DE (1) DE102013215771B4 (es)
IN (1) IN2015MN00491A (es)
MX (1) MX349946B (es)
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US5483741A (en) * 1993-09-03 1996-01-16 Micron Technology, Inc. Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice
JPH0870019A (ja) * 1994-08-30 1996-03-12 Casio Comput Co Ltd 電子部品の接続構造および接続方法
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
JPH11163036A (ja) * 1997-09-17 1999-06-18 Tamura Seisakusho Co Ltd バンプ形成方法、はんだ接合用前処理方法、はんだ接合方法、バンプ形成装置、はんだ接合用前処理装置およびはんだ接合装置
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US6045026A (en) * 1998-02-23 2000-04-04 Micron Technology, Inc. Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
JP2000114314A (ja) * 1998-09-29 2000-04-21 Hitachi Ltd 半導体素子実装構造体およびその製造方法並びにｉｃカード
DE19905807A1 (de) 1999-02-11 2000-08-31 Ksw Microtec Ges Fuer Angewand Verfahren zur Herstellung elektrisch leitender Verbindungen
JP2001148401A (ja) * 1999-11-18 2001-05-29 Seiko Epson Corp 半導体装置およびその製造方法
DE10157205A1 (de) 2001-11-22 2003-06-12 Fraunhofer Ges Forschung Kontakthöcker mit profilierter Oberflächenstruktur sowie Verfahren zur Herstellung
US7214569B2 (en) 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
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JP2005197488A (ja) * 2004-01-08 2005-07-21 Sony Corp 突起電極及びボンディングキャピラリ並びに半導体チップ
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MX2015001754A (es) 2015-09-16
DE102013215771A1 (de) 2014-02-13
BR112015002759B1 (pt) 2021-11-03
JP2015532780A (ja) 2015-11-12
KR20150053902A (ko) 2015-05-19
JP6347781B2 (ja) 2018-06-27
US10292270B2 (en) 2019-05-14
CN104737286A (zh) 2015-06-24
EP2883245A2 (de) 2015-06-17
DE102013215771B4 (de) 2019-06-13
CN104737286B (zh) 2018-09-25
MY172360A (en) 2019-11-21
WO2014023287A3 (de) 2014-04-03
MX349946B (es) 2017-08-22
CA2880408A1 (en) 2014-02-13
US20150208508A1 (en) 2015-07-23
BR112015002759A2 (pt) 2017-07-04
EP2883245B1 (de) 2020-09-30
WO2014023287A2 (de) 2014-02-13

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