CN104737286B - 接触凸块连接以及接触凸块和用于建立凸块接触连接的方法 - Google Patents

接触凸块连接以及接触凸块和用于建立凸块接触连接的方法 Download PDF

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CN104737286B
CN104737286B CN201380042531.0A CN201380042531A CN104737286B CN 104737286 B CN104737286 B CN 104737286B CN 201380042531 A CN201380042531 A CN 201380042531A CN 104737286 B CN104737286 B CN 104737286B
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CN104737286A (zh
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卡斯滕·尼兰
弗兰克·克里贝尔
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Si Maida Science And Technology Ltd Co
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Si Maida Science And Technology Ltd Co
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Abstract

本发明涉及一种接触凸块连接(24)和一种用于在设有至少一个第一连接面(11)的电子器件和与所述器件接触的具有至少一个第二连接面(25)的接触衬底(26)之间建立接触凸块连接(24)的方法，其中所述第一连接面设有接触凸块(10)，所述接触凸块具有边缘突出部(15)和在由所述边缘突出部至少部分地围绕的并且朝向所述接触凸块的头端部敞开的挤入空间(18)中具有至少一个挤入销(16)，并且所述第二连接面在与所述第一连接面的接触区域(31)中具有通过将所述第二连接面的接触材料(29)挤入所述挤入空间中而构成的围绕所述挤入销的接触凸起部(30)，所述接触凸起部具有朝向所述挤入空间的底部(17)的并且相对于所述第二连接面的围绕所述接触区域的平坦的接触表面(32)凸起的凸冠(33)。

Description

接触凸块连接以及接触凸块和用于建立凸块接触连接的方法
技术领域
本发明涉及一种在设有至少一个第一连接面的电子器件和与所述器件接触的具有至少一个第二连接面的接触衬底之间的接触凸块连接以及一种用于建立接触凸块连接的接触凸块和一种用于建立接触凸块连接的方法。
背景技术
开头所提到的类型的接触凸块连接通常用于芯片的连接面与接触衬底的连接面的接触。尤其是，这类接触凸块连接(其中芯片借助于所谓的“倒装芯片”法用其与接触衬底的连接面相对的连接面设置在接触衬底上)用于制造所谓的“无接触的芯片卡”，所述无接触的芯片卡借助于与接触衬底的连接面接触的天线实现在芯片和数据读取设备之间无接触的数据传输。
一般而言，芯片的“倒装芯片”接触需要预备芯片的具有接触凸块的连接面，所述接触凸块在专业术语上也通常称为“Bump(凸块)”。借助于接触凸块可能的是，使芯片的连接面与接触衬底的连接面能导电地接触，而不需要电线导体或者其他与芯片无关的接触装置。
从DE 101 57 205 A1中已知一种用于制造接触凸块的方法，所述方法实现了接触凸块的构成，所述接触凸块具有特别的表面形貌，所述表面形貌具有接触凸块的上部分，所述上部分具有隆起部，所述隆起部例如柱状或者星状地构成并且要实现对连接材料的改进的容纳，所述连接材料(例如粘合材料或者焊接材料)要实现建立设置在芯片的连接面上的接触凸块与接触衬底的连接面之间的能导电的连接。此外，接触凸块的已知的表面形貌要实现使接触衬底的连接面上的氧化层破裂并且最终也通过接触凸块的隆起部的接合建立与接触衬底的连接面的机械连接。
对此，提出接触凸块的表面形貌，所述表面形貌具有在接触凸块的接触底座上不同地构成的或者不同地设置的隆起部，其中所述隆起部要么位于接触底座的中央区域中要么位于边缘底座的边缘区域中并且要通过接合到接触衬底的连接面的接触材料中实现与接触衬底的接触材料化部的局部咬合。
在试验中现已证明：具有上文所描述的类型的接触凸块的接触凸块连接的特征在于高剪切强度。然而，在芯片与接触衬底分离的试验中所达到的抗拉强度并不令人满意，使得在已知的接触凸块连接中为了足够的机械保护除了接触凸块和接触衬底的接触材料化部之间的机械连接外还需要在芯片和接触衬底之间使用粘合剂。
基本上在使用粘合剂用于机械上可保持或者可受载地接触接触衬底上的芯片时已证实不利的是：由于粘合剂连接的硬化通常需要的反应时间在建立这类连接时可实现的产品数量是有限的。
发明内容
因此，本发明基于下述目的：提出一种接触凸块连接，所述接触凸块连接在不使用附加的连接材料如尤其是粘合剂的情况下已实现建立可持久保持的、耐受实际中出现的机械负荷的机械连接。
该目的通过具有根据本发明的实施例的特征的接触凸块连接实现。
在根据本发明的接触凸块连接中，第一连接面设有接触凸块，所述接触凸块具有边缘突出部和在通过边缘突出部包入的并且朝向接触凸块的头端部敞开的挤入空间中具有至少一个挤入销，并且第二连接面在与第一连接面的接触区域中具有通过将第二连接面的接触材料挤入到挤入空间中而构成的围绕挤入销的接触凸起部，所述接触凸起部具有朝向挤入空间的底部的并且相对于第二连接面的围绕接触区域的平坦的接触表面凸起的凸冠。
根据本发明的接触凸块连接因此具有设置在第一连接面上的接触凸块和第二连接面的接触材料之间的形状配合，其中挤入空间通过接触销具有内部的限界部并且通过边缘突出部具有外部的限制部，即在接触凸块的挤入空间内显著地进行接触材料挤入，使得构成朝向挤入空间的底部延伸的凸冠并且在接触凸块与接触材料之间得到相应地伸至远处的轴向侵入部。由于挤入空间通过挤入销和边缘突出部不仅径向在内部而且径向在外部限界，接触材料不仅被加载有径向向内而且被加载有径向向外的压力，使得一方面在接触材料与挤入销之间的并且另一方面在接触材料与边缘突出部之间的接触面上实现接触材料对边缘突出部的表面形貌的贴合，其中通过接触材料填充挤入空间的壁的表面形貌中的可能的不平坦部或者凹处并且填满挤入空间的壁中的可能的侧凹部。
由此结果是：不仅提供电子器件(即例如芯片)的接触凸块和接触衬底的接触材料之间的轴向侵入部，而且除此之外也提供接触凸块和接触材料的径向侵入部或者径向的彼此接合部，使得能够由接触凸块连接吸收对接触凸块连接起分离作用的拉伸负荷。
这样的拉伸负荷例如在芯片卡受到弯曲负荷的情况下出现，所述弯曲负荷实际中是危害芯片卡的功能的决定性负荷。
在接触凸块连接的一个优选的实施方式中，边缘突出部环绕地构成并且在周边对挤入空间限界，使得实现特别强的挤入效果。
已证实对于实现接触凸块连接的大抗拉强度特别有利的是，挤入销的自由端设置在边缘突出部的上边缘之下，即挤入空间被划分为从挤入销的自由端延伸直至边缘突出部的上边缘的无挤入阻挡的挤入空间部段和从挤入空间的底部延伸直至挤入销的自由端部的设有挤入销作为挤入阻挡的带挤入阻挡的挤入空间部段。
无挤入阻挡的挤入空间部段在建立这类接触凸块连接时首先以接触材料来填充，其中在建立连接时的压入阻挡在该第一阶段期间由于在该无挤入阻挡的空间中不存在挤入阻挡的事实能够以比较小的压入力来执行。在压入过程继续时首先随着接触材料继续挤入到带挤入阻挡的挤入空间部段中出现由带挤入阻挡的空间中的内压提高引起的压入力升高。由此可能的是，在对接触材料的机械接触开始时，已经用尽可能小的压入力建立接触凸块的目标明确的定位并且在实现接触之后才提高压入力，以便最后通过在挤入空间中构成凸冠来结束机械可受载的形状配合的连接的建立。
尤其有利的是，带挤入阻挡的挤入空间部段构成为环形空间，使得在接触凸块和接触材料之间的接触平面中得到对称的压力负荷。
尤其有利的是，第一连接面由芯片或者芯片模块的连接面形成并且第二连接面由天线导体的连接端部形成，使得用于构成天线导体的材料同时形成接触衬底的连接面的接触材料并因此实现了接触凸块和在接触衬底上构成的电子器件(即天线导体)之间的特别直接的接触。
根据本发明的接触凸块具有根据本发明的实施例的特征。
根据本发明，接触凸块具有边缘突出部和在由边缘突出部围绕的并且朝向接触凸块的头端部敞开的挤入空间中具有至少一个挤入销，所述挤入销与通过边缘突出部径向在外侧限界的挤入空间组合地具有已经在上文中详细阐述的优点。
优选地，边缘突出部环绕地构成并且在周边对挤入空间限界，使得边缘突出部围绕挤入空间并且实现了特别强的挤入效果。
优选地，挤入销的自由端部设置在边缘突出部的上边缘之下，使得接触凸块具有已经在上文中所阐述的将挤入空间划分为挤入销之上的无挤入阻挡的挤入空间部段和带挤入阻挡的挤入空间部段的构造，所述带挤入阻挡的挤入空间部段从挤入空间的底部伸展直至挤入销的自由端。
优选地，通过在挤入空间中设置挤入销，在边缘突出部和挤入销之间构成环形空间。
根据本发明的方法具有根据本发明的实施例的特征。
根据本发明，为了建立连接面的机械连接，将设置在第一连接面上的接触凸块压入到第二连接面的接触材料的接触表面中，即在接触凸块的挤入空间中第二连接面的接触材料在侵入边缘突出部和挤入销中期间关于压入方向不仅通过边缘突出部径向向内而且通过挤入销径向向外以压力来加载，以便实现已经在上文中详细阐述的接触材料对挤入空间的通过挤入空间中的边缘突出部径向在外部限界的壁面和挤入空间的径向在内侧通过挤入销形成挤入空间的壁面的有利的径向贴合或者到其中的有利的侵入。
优选地，在建立连接的第一阶段中，第二连接面的接触材料在接触凸块的挤入空间中通过接触凸块的边缘突出部径向向内以压力来加载直至达到连接销的自由端部，并且在建立连接的第二阶段中在接触凸块继续侵入第二连接面的接触材料中的情况下接触材料通过边缘突出部和连接销不仅径向向内而且径向向外以压力来加载。
如果第一连接面的接触凸块到第二连接面的接触材料中的压入叠加有振动，那么能够进一步促进接触材料到挤入空间的壁面中的侵入深度。
优选地，叠加振动在横向于压入方向的平面中进行，其中尤其能够使用本身已知的超声装置来在背侧上横向于压入方向给芯片加载压入力和振动。
替选地或者还是补充地，叠加振动也能够沿着压入方向进行。
已证实特别有利的是，应用所述方法来建立设有第一连接面的构成为芯片的电子器件和与所述器件接触的构成为天线衬底的接触衬底之间的接触凸块连接，其中天线导体的连接端部同时构成接触衬底的连接面。
附图说明
接下来，参照附图详细阐述了接触凸块的以及借助于接触凸块所建立的接触凸块连接的优选的实施方式。
附图示出：
图1以剖视图示出接触凸块；
图2示出在图1中所示的接触凸块按照图1中的剖面线II-II的横截面视图；
图3以剖视图示出接触凸块连接；
图4至图6示出建立接触凸块连接的不同的阶段。
具体实施方式
图1示出接触凸块10，所述接触凸块设置在芯片12的连接面11上，其中与接触凸块相邻的芯片表面设有钝化部13。
在图1和图2中示出的接触凸块10具有接触凸块基底14，所述接触凸块基底设有在此闭合的环形环绕的边缘突出部15和中央的挤入销16，所述挤入销设置在通过边缘突出部15径向向外限界的挤入空间18的底部17上。
在图1和图2中示出的接触凸块10基本上能够以不同的方式和方法来制造，其中借助于在芯片12的连接面11上与光刻法组合的无电流的钯沉积或者钯合金的沉积的制造尤其适合于制造接触凸块10，如例如在WO 2000/048242 A1中所描述的那样，其内容通过引用结合到本申请文件中。
借助于沉积法能够制造在图1中示出的接触凸块10的表面的形貌，其中径向在外部对挤入空间18限界的基本上朝向挤入空间开口19锥形地扩宽的外壁20和挤入空间的通过挤入销16限定的锥形地朝向挤入空间开口19渐缩的内壁21设有不均匀部，所述不均匀部构成凸起22和凹处23。
图3示出接触凸块连接24，其中设置在芯片12的连接面11上的接触凸块10与接触衬底26的连接面25连接，其中在当前情况下连接面25通过天线导体27的连接端部形成，所述连接端部线状地或者以例如通过涂层产生的印制导线结构的形式设置在这里构成为载体膜28的衬底上。
为了建立在图3中示出的接触凸块连接24，将接触凸块10从上方压入到通过天线导体27的连接端部形成的连接面25中，其中在当前情况下通过天线导体27形成的接触材料29挤入到挤入空间18中，直至最后在压入过程结束时产生接触材料29的变形，如在图3中所示出的那样，即在挤入空间18内构成围绕挤入销16的接触凸起部30，所述接触凸起部具有朝向挤入空间18的底部17的并且相对于围绕在接触凸块10与连接面25之间的接触区域31的接触表面32凸起的凸冠33。
在图4至图6中示意性地示出在其不同的阶段中的压入过程，其中图4示出在刚要侵入连接面25的仍平坦地构成的接触表面32中之前的接触凸块10。图5示出第一挤入阶段，其中接触材料29通过挤入空间开口19侵入挤入空间部段34中，所述挤入空间部段不具有挤入体，使得接触材料29到挤入空间部段34中的挤入主要由于在径向上从外部通过挤入空间18的外壁20作用到接触材料29上的挤入压力Fa产生。
在压入过程继续时，被挤入到挤入空间18中的接触材料29如在图6中所示出的那样到达具有挤入销16作为挤入体的挤入空间部段35，使得在挤入空间部段35中向内的挤入压力Fi不仅从径向在外部通过挤入空间18的外壁20而且从径向在内部通过由挤入销16形成的内壁21作用于接触材料，由此在构成在图3中示出的凸冠33的情况下加速地并且结合有对于压入所需的力的升高地来进行挤入。
由于作用于接触材料29的外压力Fa和作用于接触材料29的内压力Fi，实现接触材料29贴合挤入空间18的外壁20和内壁21，其中接触材料遵循外壁20和内壁21中的凸起22的轮廓并且同样被压入到外壁20和内壁21的凹处23中，使得不仅在接触凸块10与接触材料29之间沿着压入方向36而且横向于或者径向于压入方向36进行轴向接合。
对于期望附加地加强电子器件(即例如芯片)与接触衬底之间的机械连接的情况，可以在接触凸块的周围环境中和/或在接触衬底的连接面的周围环境中建立接触凸块连接之前或者之后将聚合物粘合剂施加到电子器件和/或接触衬底上。
尤其是，在使用压敏性粘合剂的情况下，可以在建立接触凸块连接期间进行粘合剂的交联。在使用温度敏感性粘合剂的情况下，在建立接触凸块连接之后可以通过事后的温度加载进行交联。
基本上，在没有附加的粘接连接的情况下也提供了在机械上可充分受负荷的接触凸块连接，使得用于粘合剂的交联或硬化的可能的反应时间对建立接触凸块连接所需的时间没有影响。在建立接触凸块连接的情况下连接时间仅由压入过程的持续时间来确定。

Claims (15)

1.一种在电子器件和与所述电子器件接触的接触衬底(26)之间的接触凸块连接(24)，所述电子器件设有至少一个第一连接面(11)，所述接触衬底(26)具有至少一个第二连接面(25)，
其特征在于，
所述第一连接面设有接触凸块(10)，所述接触凸块具有边缘突出部(15)，所述边缘突出部环形地围绕挤入空间(18)，所述挤入空间朝向所述接触凸块的头端部敞开，和所述接触凸块在挤入空间(18)中在所述挤入空间的底部(17)处具有至少一个挤入销(16)，并且
其中所述第二连接面在与所述接触凸块(10)的接触区域(31)中通过接触材料(29)挤入所述挤入空间中而构成围绕所述挤入销的接触凸起部(30)，所述接触凸起部具有朝向所述挤入空间的底部(17)的并且相对于所述第二连接面的围绕所述接触区域(31)的部分凸起的凸冠(33)。
2.根据权利要求1所述的接触凸块连接，
其特征在于，
所述边缘突出部(15)环绕地构成并且在周边对所述挤入空间(18)限界。
3.根据权利要求1或2所述的接触凸块连接，
其特征在于，
所述挤入销(16)的自由端部设置在所述边缘突出部(15)的上边缘之下，即所述挤入空间(18)被划分为从所述挤入销的自由端部延伸直至所述边缘突出部的上边缘的无挤入阻挡的挤入空间部段(34)和从所述挤入空间的底部(17)延伸直至所述挤入销的自由端部的带挤入阻挡的挤入空间部段(35)，所述带挤入阻挡的挤入空间部段(35)设有所述挤入销作为挤入阻挡。
4.根据权利要求3所述的接触凸块连接，
其特征在于，
所述带挤入阻挡的挤入空间部段(35)构成为环形空间。
5.根据权利要求1或2所述的接触凸块连接，
其特征在于，
所述第一连接面(11)由芯片(12)或者芯片模块的连接面形成并且所述第二连接面(25)由天线导体(27)的连接端部形成。
6.一种用于建立根据权利要求1至5中任一项所述的接触凸块连接(24)的接触凸块(10)，
其特征在于，
所述接触凸块具有边缘突出部(15)，所述边缘突出部环形地围绕挤入空间(18)，所述挤入空间朝向所述接触凸块的头端部敞开，和所述接触凸块在挤入空间(18)中在所述挤入空间的底部(17)处具有至少一个挤入销(16)。
7.根据权利要求6所述的接触凸块，
其特征在于，
所述边缘突出部(15)环绕地构成并且在周边对所述挤入空间(18)限界。
8.根据权利要求6或7所述的接触凸块，
其特征在于，
所述挤入销(16)的自由端部设置在所述边缘突出部(15)的上边缘之下。
9.根据权利要求6或7所述的接触凸块，
其特征在于，
通过在所述挤入空间(18)中设置所述挤入销(16)，在所述边缘突出部(15)和所述挤入销(16)之间构成环形空间。
10.一种用于在电子器件和与所述电子器件接触的接触衬底(26)之间建立根据权利要求1至5中任一项所述的接触凸块连接(24)的方法，所述电子器件设有至少一个第一连接面(11)，所述接触衬底(26)具有至少一个第二连接面(25)，
其特征在于，
为了建立连接面(11，25)的机械连接，将设置在所述第一连接面(11)上的接触凸块(10)压入所述第二连接面(25)的接触材料(29) 的接触表面(32)中，即在所述接触凸块的挤入空间(18)中对所述第二连接面的接触材料在所述边缘突出部(15)和所述挤入销(16)侵入所述第二连接面的接触材料中期间关于压入方向(36)不仅通过所述边缘突出部径向向内而且通过所述挤入销径向向外以压力来加载。
11.根据权利要求10所述的方法，
其特征在于，
在建立连接的第一阶段中，对所述第二连接面(25)的接触材料(29)在所述接触凸块(10)的挤入空间(18)中通过所述接触凸块的边缘突出部(15)径向向内以压力来加载，直至达到所述连接销(16)的自由端部，并且在建立连接的第二阶段中在所述接触凸块继续侵入到所述第二连接面的接触材料中时对所述接触材料通过所述边缘突出部和所述连接销不仅径向向内而且径向向外以压力来加载。
12.根据权利要求10或11所述的方法，
其特征在于，
所述第一连接面(11)的所述接触凸块(10)到所述第二连接面(25)的所述接触材料(29)中的压入与振动叠加。
13.根据权利要求12所述的方法，
其特征在于，
所述与振动叠加在横向于所述压入方向(36)的平面中进行。
14.根据权利要求12所述的方法，
其特征在于，
所述与振动叠加沿着压入方向(36)进行。
15.一种将根据权利要求10至14中任一项所述的方法用于制造包括芯片(12)和天线的收发器的应用，即设置在芯片衬底上的所述芯片的设有接触凸块(10)的第一连接面(11)与设置在天线衬底上的天线的连接面接触，所述连接面通过天线导体(27)的连接端部形成，其中所述接触凸块具有边缘突出部(15)，所述边缘突出部环形地围绕挤入空间(18)，所述挤入空间朝向所述接触凸块的头端部敞开，和所述接触凸块在挤入空间(18)中在所述挤入空间的底部(17)处具有至少一个挤入销(16)。
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