JP2005197488A - 突起電極及びボンディングキャピラリ並びに半導体チップ - Google Patents
突起電極及びボンディングキャピラリ並びに半導体チップ Download PDFInfo
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Abstract
【解決手段】 半導体チップ2に設けられた電極3上に形成された台座部4と、この台座部の略中央部に形成された突起部5を備えるバンプ1において、台座部を囲繞すると共に突起部よりも高さが低い円形状の第1の凸部6と、台座部から突出して第1の凸部を囲繞すると共に突起部よりも高さが低い円形状の第2の凸部7を形成する。
【選択図】 図1
Description
以下、図面を参酌しながら従来のフリップチップ方式による実装技術について説明を行う。
また、バンプの形成とは別に、図8(b)で示す様に、半導体チップを実装する回路基板104の端子105に接合材料であるはんだ106を搭載する。
この時、実装ノズルからは、はんだの溶融温度以上の熱が半導体チップに供給され、回路基板に搭載されたはんだが溶融し、半導体チップの電極に形成されたバンプの表面をはんだが這い上がり、はんだがバンプを包み込む現象が生じる。また、はんだとバンプの間で相互拡散が起こり、回路基板の端子と半導体チップの電極の間が金属結合により電気的に接続される。
なお、ボールボンディング法により形成されたバンプは、図10に示す様な、半導体チップの電極上に形成された台座部117と、この台座部の略中央部から突出する突起部118を備える(例えば、特許文献3参照。)。
図1は本発明を適用した突起電極の一例を説明するための模式図であり、ここで示すバンプ1はAuを主成分とし、ボールボンディング法やメッキ法によって形成されており、半導体チップ2の電極3上に形成された台座部4と、この台座部の略中央部から突出して形成された突起部5と、台座部から突出して突起部を囲繞すると共に突起部よりも高さが低い円形状の第1の凸部6と、台座部から突出して第1の凸部を囲繞すると共に突起部よりも高さが低い円形状の第2の凸部7とを備える。
上記の様に構成されたバンプでは、第1の凸部及び第2の凸部若しくは第1の凹部及び第2の凹部が形成されたことによって、接合の際にバンプの台座部の側面へのはんだの這い上がりを抑制するダムの役割を果たすことができ、バンプの台座部の側面まではんだが達し難いために、隣接する電極間における電気的ショートの発生を可及的に少なくできる。
2 半導体チップ
3 電極
4 台座部
5 突起部
6 第1の凸部
7 第2の凸部
8 回路基板
9 端子
10 はんだ
11 第1の凹部
12 第2の凹部
13 ボンディングキャピラリ
14 挿通孔
15 第1の窪み部
16 第2の窪み部
17 第1の凸状部
18 第2の凸状部
Claims (11)
- 半導体チップに設けられた外部端子上に形成された台座部と、
該台座部の略中央部に形成された突起部を備える突起電極において、
前記台座部に凸部が形成され、
該凸部は前記突起部よりも高さが低い
ことを特徴とする突起電極。 - 前記凸部は、前記突起部を囲繞する様に形成された
ことを特徴とする請求項1に記載の突起電極。 - 前記突起部を囲繞する2以上の凸部が形成された
ことを特徴とする請求項2に記載の突起電極。 - 半導体チップに設けられた外部端子上に形成された台座部と、
該台座部の略中央部に形成された突起部を備える突起電極において、
前記台座部に凹部が形成された
ことを特徴とする突起電極。 - 前記凹部は、前記突起電極を囲繞する様に形成された
ことを特徴とする請求項4に記載の突起電極。 - 前記突起部を囲繞する2以上の凹部が形成された
ことを特徴とする請求項5に記載の突起電極。 - ボンディングワイヤーを挿通する挿通孔が形成されたボンディングキャピラリにおいて、
該ボンディングキャピラリの先端面に凸部若しくは凹部が形成された
ことを特徴とするボンディングキャピラリ。 - ボンディングキャピラリの先端面に、前記挿通孔を囲繞する凸部若しくは前記挿通孔を囲繞する凹部が形成された
ことを特徴とする請求項7に記載のボンディングキャピラリ。 - 前記挿通孔を囲繞する2以上の凸部若しくは前記挿通孔を囲繞する2以上の凹部が形成された
ことを特徴とする請求項8に記載のボンディングキャピラリ。 - 半導体チップ本体に設けられた外部端子上に突起電極が形成された半導体チップにおいて、
前記突起電極は、前記外部端子上に形成された台座部と、
該台座部の略中央部に形成された突起部を備え、
前記台座部に凸部が形成され、
該凸部は前記突起部よりも高さが低い
ことを特徴とする半導体チップ。 - 半導体チップ本体に設けられた外部端子上に突起電極が形成された半導体チップにおいて、
前記突起電極は、前記外部端子上に形成された台座部と、
該台座部の略中央部に形成された突起部を備え、
前記台座部に凹部が形成された
ことを特徴とする半導体チップ。
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