JP2006059814A - ハンダコネクタを囲む圧縮性フィルム - Google Patents
ハンダコネクタを囲む圧縮性フィルム Download PDFInfo
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- JP2006059814A JP2006059814A JP2005238111A JP2005238111A JP2006059814A JP 2006059814 A JP2006059814 A JP 2006059814A JP 2005238111 A JP2005238111 A JP 2005238111A JP 2005238111 A JP2005238111 A JP 2005238111A JP 2006059814 A JP2006059814 A JP 2006059814A
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- 229910052709 silver Inorganic materials 0.000 description 1
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Abstract
【解決手段】 無鉛コネクタをデバイス上に形成し、該無鉛コネクタを圧縮性フィルムにより囲み、デバイスを支持体に結合し(すなわち、無鉛コネクタがデバイスを支持体に電気的に接続し)、支持体とデバイスとの間の隙間を絶縁性のアンダーフィルで埋めるデバイス支持構造体及びその形成方法を開示する。
【選択図】 図6
Description
本発明は図面を参照しながら以下の詳細な説明からより一層理解されるであろう。
12:コネクタ
20:圧縮性材料
30:マスク
60:支持体
62:アンダーフィル
90:チャネル
Claims (28)
- 支持体と、
前記支持体に結合されるデバイスと、
前記デバイスを前記支持体に電気接続するハンダコネクタと、
前記ハンダコネクタの側面を囲む圧縮性フィルムと、
前記支持体と前記デバイスとの間の隙間を埋める絶縁性材料と、
を含むデバイス支持構造体。 - 前記圧縮性フィルムは、前記ハンダコネクタの融点以上で安定である請求項1に記載の構造体。
- 前記圧縮性フィルムは、前記ハンダコネクタが溶融されたときに、前記絶縁性材料を損傷することなく、前記ハンダコネクタの膨張を吸収するだけの十分な圧縮性を有する請求項1に記載の構造体。
- 前記圧縮性フィルムが、前記支持体と前記デバイスとの間でパターンに形成される請求項1に記載の構造体。
- 前記パターンが、前記デバイスと前記支持体との間に前記絶縁性材料で埋められるチャネル有する請求項4に記載の構造体。
- 前記パターンが、斜めのストライプからなる請求項4に記載の構造体。
- 前記パターンが、矩形からなる請求項4に記載の構造体。
- 支持体と、
前記支持体に結合されるデバイスと、
前記デバイスを前記支持体に電気接続する無鉛コネクタと、
前記無鉛コネクタの側面を囲む圧縮性フィルムと、
前記支持体と前記デバイスとの間の隙間を埋める絶縁性のアンダーフィルと、
を含むデバイス支持構造体。 - 前記圧縮性フィルムは、前記無鉛コネクタの融点以上で安定である請求項8に記載の構造体。
- 前記圧縮性フィルムは、前記無鉛コネクタが溶融されたときに、前記アンダーフィルを損傷することなく、前記無鉛コネクタの膨張を吸収するだけの十分な圧縮性を有する請求項8に記載の構造体。
- 前記圧縮性フィルムが、前記支持体と前記デバイスとの間でパターンに形成される請求項8に記載の構造体。
- 前記パターンが、前記デバイスと前記支持体との間に前記アンダーフィルで埋められるチャネルを有する請求項11に記載の構造体。
- 前記パターンが、斜めのストライプからなる請求項11に記載の構造体。
- 前記パターンが、矩形からなる請求項11に記載の構造体。
- デバイス上にハンダコネクタを形成し、
前記ハンダコネクタの側面を圧縮性フィルムで囲み、
前記デバイスを支持体に結合して、前記ハンダコネクタが前記デバイスを前記支持体に電気的に接続するようにし、
前記支持体と前記デバイスとの間の隙間を絶縁性材料で埋める、
ことを含むデバイス支持構造体を形成する方法。 - 前記ハンダコネクタを溶融することをさらに含み、前記圧縮性フィルムが前記ハンダコネクタの融点以上で安定である請求項15に記載の方法。
- 前記ハンダコネクタを溶融することをさらに含み、前記圧縮性フィルムが、前記ハンダコネクタが溶融されたときに、前記絶縁性材料を損傷することなく、前記ハンダコネクタの膨張を吸収するだけの十分な圧縮性を有する請求項15に記載の方法。
- 前記ハンダコネクタの側面を前記圧縮性フィルムで囲むことが、前記支持体と前記デバイスとの間で前記圧縮性フィルムをパターンに形成する請求項15に記載の方法。
- 前記パターンが、前記デバイスと前記支持体との間に前記絶縁性材料で埋められるチャネルを有する請求項18に記載の方法。
- 前記パターンが、前記圧縮性フィルムの斜めのストライプを含む請求項18に記載の方法。
- 前記ハンダコネクタの側面を前記圧縮性フィルムで囲むことが、前記圧縮性フィルムを前記ハンダコネクタの側面に一部の高さまで配置する請求項15に記載の方法。
- デバイス上に無鉛コネクタを形成し、
前記無鉛コネクタの側面を圧縮性フィルムで囲み、
前記デバイスを支持体に結合して、前記無鉛コネクタが前記デバイスを前記支持体に電気的に接続するようにし、
前記支持体と前記デバイスとの間の隙間を絶縁性のアンダーフィルで埋める、
ことを含むデバイス支持構造体を形成する方法。 - 前記無鉛コネクタを溶融することをさらに含み、前記圧縮性フィルムが前記無鉛コネクタの融点以上で安定である請求項22に記載の方法。
- 前記無鉛コネクタを溶融することをさらに含み、前記圧縮性フィルムが、前記無鉛コネクタが溶融されたときに、前記アンダーフィルを損傷することなく、前記無鉛コネクタの膨張を吸収するだけの十分な圧縮性を有する請求項22に記載の方法。
- 前記無鉛コネクタの側面を前記圧縮性フィルムで囲むことが、前記支持体と前記デバイスとの間で前記圧縮性フィルムをパターンに形成する請求項22に記載の方法。
- 前記パターンが、前記デバイスと前記支持体との間に前記アンダーフィルで埋められるチャネルを有する請求項25に記載の方法。
- 前記パターンが、斜めのストライプからなる請求項25に記載の方法。
- 前記無鉛コネクタの側面を前記圧縮性フィルムで囲むことが、前記圧縮性フィルムを前記無鉛コネクタの側面に一部の高さまで配置する請求項22に記載の方法。
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US10/711,076 US7332821B2 (en) | 2004-08-20 | 2004-08-20 | Compressible films surrounding solder connectors |
US10/711076 | 2004-08-20 |
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US20140291834A1 (en) * | 2013-03-27 | 2014-10-02 | Micron Technology, Inc. | Semiconductor devices and packages including conductive underfill material and related methods |
US9711474B2 (en) * | 2014-09-24 | 2017-07-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor package structure with polymeric layer and manufacturing method thereof |
WO2016064350A1 (en) * | 2014-10-23 | 2016-04-28 | Agency For Science, Technology And Research | Method of bonding a first substrate and a second substrate |
KR102458034B1 (ko) | 2015-10-16 | 2022-10-25 | 삼성전자주식회사 | 반도체 패키지, 반도체 패키지의 제조방법, 및 반도체 모듈 |
US10597486B2 (en) | 2016-11-02 | 2020-03-24 | Seagate Technology Llc | Encapsulant composition for use with electrical components in hard disk drives, and related electrical components and hard disk drives |
CN108538726B (zh) * | 2017-03-03 | 2022-08-26 | Tdk株式会社 | 半导体芯片的制造方法 |
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US7566649B2 (en) | 2009-07-28 |
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US20080009101A1 (en) | 2008-01-10 |
CN100399560C (zh) | 2008-07-02 |
CN1738042A (zh) | 2006-02-22 |
US20060040567A1 (en) | 2006-02-23 |
US7332821B2 (en) | 2008-02-19 |
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