JP4386012B2 - バンプ接合体の製造方法 - Google Patents
バンプ接合体の製造方法 Download PDFInfo
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- JP4386012B2 JP4386012B2 JP2005241358A JP2005241358A JP4386012B2 JP 4386012 B2 JP4386012 B2 JP 4386012B2 JP 2005241358 A JP2005241358 A JP 2005241358A JP 2005241358 A JP2005241358 A JP 2005241358A JP 4386012 B2 JP4386012 B2 JP 4386012B2
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- Prior art keywords
- bump
- bumps
- tip
- gravity
- bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13016—Shape in side view
- H01L2224/13018—Shape in side view comprising protrusions or indentations
- H01L2224/13019—Shape in side view comprising protrusions or indentations at the bonding interface of the bump connector, i.e. on the surface of the bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8134—Bonding interfaces of the bump connector
- H01L2224/81345—Shape, e.g. interlocking features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81897—Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- Wire Bonding (AREA)
Description
図1は、本発明の第1実施形態に係るバンプ接合体10の概略断面構成を示す図である。このバンプ接合体は、2つの接合部材11、12同士をバンプ21、22を介して電気的・機械的に接続してなる。
なお、上記実施形態の製造方法においては、第1の接合部材11と第2の接合部材12との間に、アンダーフィル樹脂やNCF(Non Conducive Film)などからなる樹脂フィルムを介在させてもよい。
なお、上記実施形態では、複数個の第1のバンプ21の先端面21aと複数個の第2のバンプ22の先端面22aとでは、互いの傾斜の方向が反対になっていたが、第1のバンプ21の先端面21aと第2のバンプ22の先端面22aとで、傾斜方向が同じであってもよい。
12a…第2の接合部材の一面、21…第1のバンプ、
21a…第1のバンプの先端面、22…第2のバンプ、
22a…第2のバンプの先端面、G…複数個のバンプの重心。
Claims (5)
- 第1の接合部材(11)の一面(11a)に複数個の第1のバンプ(21)を設け、前記第1の接合部材(11)の前記一面(11a)に対向させる第2の接合部材(12)の一面(12a)のうちそれぞれの前記第1のバンプ(21)と対向する位置に第2のバンプ(22)を設け、
前記第1の接合部材(11)と前記第2の接合部材(12)とを互いの一面(11a、12a)にて対向させ、
それぞれの前記第1のバンプ(21)の先端面(21a)と前記第2のバンプ(22)の先端面(22a)とを接触させて電気的に接続してなるバンプ接合体の製造方法において、
前記複数個の第1のバンプ(21)および前記複数個の第2のバンプ(22)のうち少なくとも一方のバンプ群において、個々のバンプ(21、22)の先端面(21a、22a)を、複数個のバンプ(21、22)の重心(G)と当該個々のバンプ(21、22)とを結ぶ方向に沿って傾斜し且つ当該傾斜の方向が各バンプ(21、22)間で前記重心(G)に向かって同じとなっている傾斜面となるように形成し、
その後、前記第1のバンプ(21)の先端面(21a)と前記第2のバンプ(22)の先端面(22a)との接触を行うことを特徴とするバンプ接合体の製造方法。 - 前記傾斜の方向は、前記バンプ(21、22)の先端面(21a、22a)における前記重心(G)側の端部が、それとは反対側の端部よりも低くなる方向であることを特徴とする請求項1に記載のバンプ接合体の製造方法。
- 前記傾斜の方向は、前記バンプ(21、22)の先端面(21a、22a)における前記重心(G)側の端部が、それとは反対側の端部よりも高くなる方向であることを特徴とする請求項1に記載のバンプ接合体の製造方法。
- 前記複数個の第1のバンプ(21)および前記複数個の第2のバンプ(22)の両方のバンプ群において、個々のバンプ(21、22)の先端面(21a、22a)を前記傾斜面となるように形成することを特徴とする請求項1ないし3のいずれか1つに記載のバンプ接合体の製造方法。
- 前記複数個の第1のバンプ(21)の先端面(21a)と前記複数個の第2のバンプ(22)の先端面(22a)とでは、互いの傾斜の方向が反対になるようにすることを特徴とする請求項4に記載のバンプ接合体の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2005241358A JP4386012B2 (ja) | 2005-08-23 | 2005-08-23 | バンプ接合体の製造方法 |
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JP2005241358A JP4386012B2 (ja) | 2005-08-23 | 2005-08-23 | バンプ接合体の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2007059538A JP2007059538A (ja) | 2007-03-08 |
JP4386012B2 true JP4386012B2 (ja) | 2009-12-16 |
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JP2005241358A Expired - Fee Related JP4386012B2 (ja) | 2005-08-23 | 2005-08-23 | バンプ接合体の製造方法 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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EP2197782B1 (en) * | 2007-09-12 | 2020-03-04 | Smoltek AB | Connecting and bonding adjacent layers with nanostructures |
JPWO2009107357A1 (ja) * | 2008-02-29 | 2011-06-30 | 住友ベークライト株式会社 | 半田の接続方法、電子機器およびその製造方法 |
JP6602544B2 (ja) * | 2015-03-06 | 2019-11-06 | 三菱重工業株式会社 | 接合方法 |
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