DE3883354T2 - Verdrahtungsverfahren und Gerät für elektronische Schaltungsplatten oder dergleichen. - Google Patents

Verdrahtungsverfahren und Gerät für elektronische Schaltungsplatten oder dergleichen.

Info

Publication number
DE3883354T2
DE3883354T2 DE88119876T DE3883354T DE3883354T2 DE 3883354 T2 DE3883354 T2 DE 3883354T2 DE 88119876 T DE88119876 T DE 88119876T DE 3883354 T DE3883354 T DE 3883354T DE 3883354 T2 DE3883354 T2 DE 3883354T2
Authority
DE
Germany
Prior art keywords
electronic circuit
circuit boards
wiring method
wiring
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88119876T
Other languages
English (en)
Other versions
DE3883354D1 (de
Inventor
Hiroshi Ekureru Ninom Hasegawa
Toshiyuki Amimoto
Mitsukiyo Tani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE3883354D1 publication Critical patent/DE3883354D1/de
Application granted granted Critical
Publication of DE3883354T2 publication Critical patent/DE3883354T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1007—Running or continuous length work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
DE88119876T 1987-12-11 1988-11-29 Verdrahtungsverfahren und Gerät für elektronische Schaltungsplatten oder dergleichen. Expired - Fee Related DE3883354T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62312235A JPH0691360B2 (ja) 1987-12-11 1987-12-11 細線成形方法

Publications (2)

Publication Number Publication Date
DE3883354D1 DE3883354D1 (de) 1993-09-23
DE3883354T2 true DE3883354T2 (de) 1994-01-05

Family

ID=18026800

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88119876T Expired - Fee Related DE3883354T2 (de) 1987-12-11 1988-11-29 Verdrahtungsverfahren und Gerät für elektronische Schaltungsplatten oder dergleichen.

Country Status (5)

Country Link
US (1) US4934044A (de)
EP (1) EP0319827B1 (de)
JP (1) JPH0691360B2 (de)
KR (1) KR910008632B1 (de)
DE (1) DE3883354T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5156557A (en) * 1990-11-06 1992-10-20 Yazaki Corporation Electrical interconnection assembly, process of and apparatus for manufacturing the same and wire laying jig therefor
JPH05101144A (ja) * 1991-10-03 1993-04-23 Fujitsu Ltd 自動配線方法
CN1119768C (zh) * 1996-02-12 2003-08-27 大卫·芬恩 与导线接触用的方法和设备
CN102257837A (zh) * 2008-12-22 2011-11-23 三洋电机株式会社 扬声器单元、扬声器单元的制造方法及携带式信息终端
CN112157183A (zh) * 2020-09-01 2021-01-01 秦满生 一种夹角定型机

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2995357A (en) * 1958-06-09 1961-08-08 Hardy B Dennis Workpiece holder
US3608190A (en) * 1969-06-13 1971-09-28 Inforex Routing pins for wiring apparatus
JPS53145061A (en) * 1977-05-23 1978-12-16 Fujitsu Ltd Wiring substrate
FR2458978A2 (fr) * 1979-06-07 1981-01-02 Commissariat Energie Atomique Procede et dispositif d'interconnexions de composants electronique
JPS55166991A (en) * 1979-06-15 1980-12-26 Nippon Electric Co Method of fixing wire to printed circuit board
JPS5816186A (ja) * 1981-07-22 1983-01-29 Kawasaki Heavy Ind Ltd 高温粉粒体の冷却方法
JPS59124793A (ja) * 1982-12-31 1984-07-18 富士通株式会社 ワイヤの掻き分け方法
US4627162A (en) * 1983-11-04 1986-12-09 Augat Incorporated Method of producing a wired circuit board
FR2567709B1 (fr) * 1984-07-11 1990-11-09 Nec Corp Ensemble a paillette comprenant un substrat de cablage multi-couche
US4600138A (en) * 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
US4724612A (en) * 1986-06-17 1988-02-16 Monogram Industries, Inc. Method for winding wires to make a harness

Also Published As

Publication number Publication date
DE3883354D1 (de) 1993-09-23
EP0319827B1 (de) 1993-08-18
JPH0691360B2 (ja) 1994-11-14
EP0319827A3 (en) 1990-01-17
EP0319827A2 (de) 1989-06-14
US4934044A (en) 1990-06-19
KR890011510A (ko) 1989-08-14
JPH01154600A (ja) 1989-06-16
KR910008632B1 (ko) 1991-10-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee