KR930014905A - 기밀 패키지된 고밀도 상호연결(hdi)전자시스템 - Google Patents

기밀 패키지된 고밀도 상호연결(hdi)전자시스템 Download PDF

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Publication number
KR930014905A
KR930014905A KR1019920024373A KR920024373A KR930014905A KR 930014905 A KR930014905 A KR 930014905A KR 1019920024373 A KR1019920024373 A KR 1019920024373A KR 920024373 A KR920024373 A KR 920024373A KR 930014905 A KR930014905 A KR 930014905A
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South Korea
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support surface
cavity
component
component support
electronic
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KR1019920024373A
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English (en)
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알버트 필리온 레이몬드
폴 코느룸프 윌리암
스탠리 버나드 에드워드
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아더 엠. 킹
제네랄 일렉트릭 캄파니
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Publication of KR930014905A publication Critical patent/KR930014905A/ko

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    • H01L2924/3011—Impedance

Abstract

고밀도 상호연결(HDI)전자시스템에 특히 적합한 기밀패키지는 기밀 패키지의 베이스로서 역할을 하는 세라믹 기판을 사용한다. 상기 기판은 밀봉 패키지 뚜껑을 위한 땜납링 또는 용접링을 포함하는 시일링을 브릿지하는 한세트의 내부접촉점과 한세트의 외부접촉점 사이에 전기적 연속성을 제공하는 매설된 도체를 갖는 동시 열처리된 본체를 포함한다. 상기 외부접촉점은 리드 프레임에 직접 연결될 수 있다. 리드 프레임의 리드들은 절단후에 직접 인쇄회로기판에 부착될 수 있다.

Description

기밀 패키지된 고밀도 상호연결(HDI)전자시스템
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 리드프레임에 연결되어 있는 패키지된 전자시스템의 평면도,
제2도는 땜납 시일링을 사용한 발명의 실시예를 상세히 나타낸 것으로, 제1도의 선 2-2을 따라 취한 단면도,
제3도는 세라믹 HDI기관 및 패키지 베이스를 포함하는 동시 열처리된 본체를 열처리기 전의 중간제조 단계를 나타낸 것으로, 제2도에 대응하는 단면도,
제4도는 용접 시일링을 사용한 발명의 실시예를 나타낸 것으로 제2도와 비교될 수 있는 단면도.

Claims (19)

  1. 부품지지표면을 갖는 세라믹 기판과, 상기 부품지지표면상에 배치되며, 그 위에 접촉패드를 갖는 적어도 하나의 전자부품과, 상기 부품지지표면상에 배치되어 상기 적어도 하나의 전자부품을 둘러싸는 시일링과, 상기 부품지지표면상에 배치되고 상기 시일링의 외측에 위치된 한세트의 대응 외부접촉점과, 상기 세라믹 기판내에 적어도 부분적으로 매설되고 상기 내, 외부 세트의 접촉점 사이에 연장된 한세트의 전기도체와, 적어도 몇개의 상기 부품접촉패드와 적어도 몇개의 상기 내부접촉점 사이에 각기 연장된 전기적 연결부와, 상기 시일링부에 부착되고, 상기 전자부품 및 상기 전기적 연결부를 둘러싸는 패키지 뚜껑을 포함하는 패키지된 전자시스템.
  2. 제1항에 있어서, 상기 세라믹 기판과, 상기 세라믹 기판내에 적어도 부분적으로 매설된 상기 세트의 전기도체는 동시 열처리된 본체를 포함하는 패키지된 전자시스템.
  3. 제1항에 있어서, 적어도 몇개의 상기 부품접촉패드와 적어도 몇개의 상기 내부접촉점 사이에 연장된 상기 전기적 연결부는, 절연성재료 및 전도성재료의 개재층들을 가지며, 상기 세라믹 기판의 일부분, 상기 전자부품 및 상기 내부세트의 접촉점위에 배열되는 다층 상호 연결 구조체를 포함하는 패키지된 전자시스템.
  4. 제3항에 있어서, 상기 부품지지표면은 적어도 하나의 공동을 포함하며, 상기 전자부품의 주요표면이 상기 공동을 둘러싸는 상기 부품지지표면의 일부분과 실질적으로 동일한 평면이 되도록 상기 전자부품이 상기 공동내에 배치되어 있는 패키지된 전자시스템.
  5. 제1항에 있어서, 상기 세라믹 기판을 통하여 상기 시일링으로부터 상기 부품지지표면의 반대표면까지 연장된 전기적 관통접속부를 더 포함하며, 상기 전기적 관통접속부는 그를 통하여 상기 시일링 및 상기 패키지 뚜껑이 접지되게 하는 패키지된 전자시스템.
  6. 제5항에 있어서, 상기 세라믹 기판과, 상기 세라믹 기판내에 적어도 부분적으로 매설된 상기 세트의 전기도체 및 상기 전기적 관통접속부는 동시 열처리된 본체를 포함하는 패키지된 전자시스템.
  7. 제1항에 있어서, 상기 부품지지표면상에 배치된 부가적인 전자부품을 포함하는 패키지된 전자시스템.
  8. 제7항에 있어서, 상기 부품지지표면이 적어도 하나의 공동을 포함하며, 상기 전자부품의 주요표면이 상기 공동을 둘러싸는 상기 부품지지표면의 일부분과 실질적으로 동일한 평면이 되도록 각각의 상기 전자부품이 상기 공동에 배치되어 있는 패키지된 전자시스템.
  9. 제8항에 있어서, 적어도 몇개의 상기 부품접촉패드와 적어도 몇개의 상기 내부 접촉점사이에 각기 연장된 전기적 연결부는 절연성물질 및 전도성물질의 개재층들을 가지며 상기 세라믹 기판의 상기 부분, 상기 전자부품 및 상기 내부세트의 접촉점 위에 배치되는 다층 상호연결 구조체를 포함하는 패키지된 전자시스템.
  10. 제1항에 있어서, 상기 시일링이 땜납 시일링을 포함하는 패키지된 전자시스템.
  11. 제1항에 있어서, 상기 시일링이 용접 시일링을 포함하는 전자시스템.
  12. 제1항에 있어서, 상기 부품지지표면은 적어도 하나의 공동을 포함하며, 상기 전자부품의 주요표면이 상기 공동을 둘러싸는 상기 부품지지표면의 일부분과 실질적으로 동일한 평면이 되도록 상기 전자부품이 상기 공동내에 배치되어 있고, 상기 시일링이 상기 공동을 둘러싸는 땜납 시일링을 포함하는 패키지된 전자시스템.
  13. 제1항에 있어서, 상기 부품지지표면은 적어도 하나의 공동을 포함하며, 상기 전자부품의 주요표면이 상기 공동을 둘러싸는 상기 부품지지표면의 일부분과 실질적으로 동일한 평면이 되도록 상기 전자부품이 상기 공동내에 배치되어 있고, 상기 부품지지표면은 상기 공동을 둘러싸는 상기 부품지지표면의 일부분에 대해 움푹패인 돌출표면을 갖는 주변 돌출부를 포함하며, 상기 시일링이 상기 돌출표면상에 배치된 용접링을 포함하며, 상기 용접링은 그 주요표면이 상기 공동을 둘러싸는 상기 부품지지표면의 상기 부분과 실질적으로 동일한 평면이 되도록 하는 두께를 갖고 있는 패키지된 전자시스템.
  14. 제1항에 있어서, 리드 프레임을 더 포함하며, 적어도 몇개의 상기 외부 접촉점은 상기 리드프레임의 개개의 대응리드들에 연결되어 있는 패키지된 전자시스템.
  15. 부품지지표면을 갖는 비전도성 기판을 포함하는 패키지 베이스와, 상기 부품지지표면에 배치된 다수의 전자부품과, 상기 부품지지표면상에 배치되어 상기 전자부품을 둘러싸는 시일링과, 상기 부품지지표면상에 배치되고 상기 시일링에 의해 둘러싸이는 한세트의 내부접촉점 및 상기 부품지지표면상에 배치되고 상기 시일링의 외측에 위치된 한세트의 대응 외부접촉점과, 상기 기판내에 적어도 부분적으로 매설되고 상기 내,외부 세트의 접촉점 사이에 연상된 한세의 전기도체와, 절연성물질 및 전도성물질의 개재층을 가지며 상기 전자부품, 상기 기판의 일부분 및 상기 내부세트의 접촉점위에 배치되어 있는 다층 상호연결 구조체와, 상기 시일링에 기밀되게 부착되고 상기 전자부품 및 상기 다층 상호연결구조체를 둘러싸는 패키지 뚜껑을 포함하는 기밀 패키지된 전자시스템.
  16. 제15항에 있어서, 상기 기판을 통하여 상기 시일링으로부터 상기 부품지지표면의 반대표면까지 연장된 전기적 관통접속부를 더 포함하며 상기 전기적 관통접속부는 그를 통한 상기 시일링 및 상기 패키지 뚜껑이 접지되게 하는 기밀 패키지된 전자시스템.
  17. 제15항에 있어서, 리드 프레임을 더 포함하며, 적어도 몇개의 상기 외부 접촉점은 상기 리드프레임의 개개의 대응리드들에 연결되어 있는 기밀 패키지된 전자시스템.
  18. 제15항에 있어서, 상기 부품지지표면은 적어도 하나의 공동을 포함하며, 상기 전자부품의 주요표면이 상기 공동을 둘러싸는 상기 부품지지표면의 일부분과 실질적으로 동일한 평면이 되도록 상기 전자부품의 상기 공동내에 배치되어 있고, 상기 시일링은 상기 공동을 둘러싸는 상기 부품지지표면의 상기 부분위에 땜납 시일링을 포함하는 기밀 패키지된 전자시스템.
  19. 제15항에 있어서, 상기 부품지지표면은 적어도 하나의 공동을 포함하며, 상기 전자부품의 주요표면이 상기 공동을 둘러싸는 상기 부품지지표면의 일부분과 실질적으로 동일한 평면이 되도록 상기 전자부품이 상기 공동내에 배치되어 있고, 상기 부품지지표면은 상기 공동을 둘러싸는 상기 부품지지표면의 상기 부분에 대해 움푹 패인 돌출표면을 갖는 주변 돌출부를 더 포함하며, 상기 시일링이 상기 돌출 표면상에 배치된 용접링을 포함하며, 상기 용접링은 그 주요표면이 상기 공동을 둘러싸는 상기 부품지지표면의 상기 부분과 실질적으로 동일한 평면이 되도록 하눈 두께를 갖고 있는 기밀 패키지된 전자시스템.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920024373A 1991-12-16 1992-12-15 기밀 패키지된 고밀도 상호연결(hdi)전자시스템 KR930014905A (ko)

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EP0547807A2 (en) 1993-06-23

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