KR910010223A - 배선재료 및 이것을 이용한 액정표시장치 - Google Patents

배선재료 및 이것을 이용한 액정표시장치 Download PDF

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KR910010223A
KR910010223A KR1019900019728A KR900019728A KR910010223A KR 910010223 A KR910010223 A KR 910010223A KR 1019900019728 A KR1019900019728 A KR 1019900019728A KR 900019728 A KR900019728 A KR 900019728A KR 910010223 A KR910010223 A KR 910010223A
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alloy
alloys
tan
layer
metal
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KR1019900019728A
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KR970009491B1 (ko
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미쯔히시 이게다
미찌오 무로오까
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아오이 죠이찌
가부시끼가이샤 도시바
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4825Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body for devices consisting of semiconductor layers on insulating or semi-insulating substrates, e.g. silicon on sapphire devices, i.e. SOS
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1343Electrodes
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136213Storage capacitors associated with the pixel electrode
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • G02F1/13629Multilayer wirings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

내용 없음

Description

배선재료 및 이것을 이용한 액정표시장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도, 제2도 및 제3도는 본 발명에 관한 적층형 배선재료의 특성예를 나타낸 곡선도.

Claims (7)

  1. TaN 합금, Ta-Mo-N 합금, Ta-Nb-N 합금 및 Ta-W-N 합금으로 이루어진 군에서 선택된 적어도 1종의 금속으로 구성된 제1의 금속층과, 전술한 제1의 합금층상에 일체적으로 형성된 Ta, Ta-Mo 합금,Ta-Nb 합금, Ta-W 합금, Ta-N 합금, Ta-Mo-N 합금, Ta-Nb-N 합금 및 Ta-W-N 합금으로 이루어진 군에서 선택된 적어도 한종의 금속으로 구성된 제2의 금속층으로 이루어진 것을 특징으로 하는 적층형 배선재료(단, 제2층 Mo의 조성비는 26원자% 이하, Nb,W 의 조성비는 각각 40원자% 이하.)
  2. 제1항에 있어서, TaN 합금을 제1의 금속으로 하는 전술한 제1의 TaN 합금보다도 N 의 함유량이 적은 (0을 포함) TaN 합금을 제2의 금속으로 하는 것을 특징으로 하는 적층형 배선재료.
  3. 제1항에 있어서, 제1의 금속으로 하는 TaN 합금속상에 일체적으로 형성된 제2의 금속층으로 하여 TaN 합금 층의 적어도 표면이 산화막화하여 이루어진 것을 특징으로 하는 적층형 배선재료.
  4. 절연성 기판과, 전술한 절연성 기판면에 설치된 전자소자와, 전술한 전자소자에 전기적으로 접속하는 절연성 기판면에 설치된 구동용 배선을 구비하여 이루어진 전자장치에 있어서, 전술한 구동용 배선이 TaN 합금, Ta-Mo-N 합금,Ta-Nb-N 합금, Ta-W-N 합금으로 이루어진 군에서 선택된 적어도 1종의 금속으로 구성된 제1의 금속층과, 전술한 제1의 및 합금 층상에 일체적으로 형성된 Ta,Ta-Mo 합금, Ta-Nb 합금, Ta-W 합금, Ta-N 합금,Ta-Mo-N 합금, Ta-Nb-N 합금 및 Ta-W-N 합금으로 이루어진 군에서 선택된 적어도 1종의 금속으로 구성된 제2의 금속층으로 이루어진 적층형의 배선재료(단 Mo 의 조성비는 26원자% 이하, Nb·W 의 조성비는 각각 40원자% 이하)로 형성되어 있는 것을 특징으로 하는 전자장치.
  5. 구동용 배선기판과, 전술한 구동용 배선기판에 대향하여 설치된 표시전극판과 전술한 구동용 배선기판-표시전극판 사이에 전체적으로 액체가 봉입된 액정재료 층을 구비한 액정표시장치에 있어서, 구동용 신호배선 혹은 구동용 배선기판에 탑재, 장치된 전자부품 소자의 전극이 TaN 합금, Ta-Mo-N 합금,Ta-Nb-N 합금 및 Ta-W-N 합금으로 이루어진 군에서 선택된 적어도 1종의 금속으로 구성된 제1의 금속층과, 전술한 제1의 합금층상에 일체적으로 형성된 Ta,Ta-Mo 합금, Ta-Nb 합금, Ta-W 합금, Ta-N 합금,Ta-Mo-N 합금,Ta-Nb-N 합금 및 Ta-W-N 합금으로 이루어진 군에서 선택된 적어도 1종의 금속으로 구성된 제2의 금속층으로 이루어진 적층형의 배선재료(단 Mo 의 조성비는 26원자%이하, Nb·W 의 조성비는 각각 40원자% 이하)로 이루어진 적층형의 배선 재료로 형성되어 있는 것을 특징으로 하는 액정 표시장치.
  6. 제5항에 있어서, 구동용 신호배선 혹은 구동용 배선기판에 탑재, 장치된 전자부품 소자의 전극이 TaN 을 제1의 합금층으로 하고, 전술한 TaN 합금층상에 일체적으로 형성된 제1의 합금층을 이루는 TaN 에서 N 의 함유량이 적은 (0을 포함) TaN 을 제2의 합금층으로 이루어진 적층형의 배선재료로 형성되어 있는 것을 특징으로 하는 액정표시장치.
  7. 구동용 배선기판과 전술한 구동용 배선기판에 대향하여 설치된 표시전극판과, 전술한 구동용 배선기판 - 표시전극판 사이에 전체적으로 액체가 봉입된 액정재료층을 구비한 액정표시 장치에 있어서, 구동용 신호배선이 혹은 구동용 배선기판에 탑재, 장치된 전자부품 소장의 전극이 TaN 을 제1의 합금층으로 하고 전술한 제1의 합금층 상에 일체적으로 형성된 제2의 금속층으로서 TaN 합금층의 적어도 표면이 산화막화하게 되는 적층형의 배선재료로 형성되어 있는 것을 특징으로 하는 액정표시장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900019728A 1989-11-30 1990-11-30 배선재료와 이를 이용한 전자장치 및 액정표시장치 KR970009491B1 (ko)

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JP??01-313674 1989-11-30
JP01-313674 1989-11-30
JP31367489 1989-11-30
JP??02-047028 1990-02-26
JP02-047028 1990-02-26
JP4702890 1990-02-26

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KR970009491B1 KR970009491B1 (ko) 1997-06-13

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EP (1) EP0430702B1 (ko)
KR (1) KR970009491B1 (ko)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100430744B1 (ko) * 1995-06-14 2004-08-25 가부시끼가이샤 히다치 세이사꾸쇼 고집적도대면적lcd디스플레이용tft패널과그제조방법및액정표시장치

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264728A (en) * 1989-11-30 1993-11-23 Kabushiki Kaisha Toshiba Line material, electronic device using the line material and liquid crystal display
JPH0555575A (ja) * 1991-08-29 1993-03-05 Sharp Corp 半導体装置
JP3172841B2 (ja) * 1992-02-19 2001-06-04 株式会社日立製作所 薄膜トランジスタとその製造方法及び液晶表示装置
JPH05341315A (ja) * 1992-06-08 1993-12-24 Hitachi Ltd 薄膜トランジスタ基板、液晶表示パネルおよび液晶表示装置
KR950010661B1 (ko) * 1992-11-07 1995-09-21 엘지전자주식회사 티에프티 엘씨디(tft-lcd)용 신호선 제조방법 및 구조
JPH06186590A (ja) * 1992-12-21 1994-07-08 Sharp Corp アクティブマトリクス型液晶表示パネル
SG86965A1 (en) * 1993-02-10 2002-03-19 Seiko Epson Corp Nonlinear resistance element, manufacturing fabrication method thereof, and liquid crystal display device
EP0636922B1 (en) * 1993-02-10 2001-11-14 Seiko Epson Corporation Non-linear resistance element, method of its manufacture, and liquid crystal display
US5506449A (en) * 1993-03-24 1996-04-09 Kawasaki Steel Corporation Interconnection structure for semiconductor integrated circuit and manufacture of the same
US5644415A (en) * 1993-12-20 1997-07-01 Casio Computer Co., Ltd. Liquid crystal display device having wide field angle
US5600153A (en) 1994-10-07 1997-02-04 Micron Technology, Inc. Conductive polysilicon lines and thin film transistors
JP3494720B2 (ja) * 1994-11-01 2004-02-09 株式会社半導体エネルギー研究所 半導体装置及びその作製方法、ならびにアクティブマトリクス型の液晶ディスプレー及びイメージセンサー
US5777710A (en) * 1995-04-28 1998-07-07 Canon Kabushiki Kaisha Electrode substrate, making the same, liquid crystal device provided therewith, and making the same
US5804838A (en) * 1995-05-26 1998-09-08 Micron Technology, Inc. Thin film transistors
US5835177A (en) * 1995-10-05 1998-11-10 Kabushiki Kaisha Toshiba Array substrate with bus lines takeout/terminal sections having multiple conductive layers
JP2865039B2 (ja) * 1995-12-26 1999-03-08 日本電気株式会社 薄膜トランジスタ基板の製造方法
KR100192447B1 (ko) * 1996-05-15 1999-06-15 구자홍 액정표시장치의 제조방법
KR100241287B1 (ko) * 1996-09-10 2000-02-01 구본준 액정표시소자 제조방법
KR100278561B1 (ko) * 1996-10-15 2001-02-01 포만 제프리 엘 테이퍼를구비하며에칭성이감소된다층의금속샌드위치구조및그형성방법
JP2988399B2 (ja) * 1996-11-28 1999-12-13 日本電気株式会社 アクティブマトリクス基板
KR100248123B1 (ko) 1997-03-04 2000-03-15 구본준 박막트랜지스터및그의제조방법
US5936831A (en) * 1997-03-06 1999-08-10 Lucent Technologies Inc. Thin film tantalum oxide capacitors and resulting product
JP3270361B2 (ja) 1997-06-09 2002-04-02 日本電気株式会社 薄膜トランジスタアレイ及びその製造方法
JP2985124B2 (ja) * 1997-06-12 1999-11-29 株式会社日立製作所 液晶表示装置
EP0895282A3 (en) * 1997-07-30 2000-01-26 Canon Kabushiki Kaisha Method of preparing a SOI substrate by using a bonding process, and SOI substrate produced by the same
JPH11112002A (ja) * 1997-10-07 1999-04-23 Semiconductor Energy Lab Co Ltd 半導体装置およびその製造方法
KR100338008B1 (ko) * 1997-11-20 2002-10-25 삼성전자 주식회사 질화 몰리브덴-금속 합금막과 그의 제조 방법, 액정표시장치용 배선과 그의 제조 방법 및 액정 표시 장치와 그의 제조방법
US6346175B1 (en) * 1997-11-20 2002-02-12 International Business Machines Corporation Modification of in-plate refractory metal texture by use of refractory metal/nitride layer
TWI226470B (en) 1998-01-19 2005-01-11 Hitachi Ltd LCD device
JP3119228B2 (ja) 1998-01-20 2000-12-18 日本電気株式会社 液晶表示パネル及びその製造方法
JP4126156B2 (ja) * 1998-01-30 2008-07-30 株式会社日立製作所 液晶表示装置
JP3592535B2 (ja) * 1998-07-16 2004-11-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6204521B1 (en) 1998-08-28 2001-03-20 Micron Technology, Inc. Thin film transistors
EP1129480A1 (en) * 1998-10-05 2001-09-05 Kulicke & Soffa Investments, Inc Semiconductor copper bond pad surface protection
JP2000275663A (ja) * 1999-03-26 2000-10-06 Hitachi Ltd 液晶表示装置とその製造方法
TW444257B (en) 1999-04-12 2001-07-01 Semiconductor Energy Lab Semiconductor device and method for fabricating the same
US6114735A (en) * 1999-07-02 2000-09-05 Micron Technology, Inc. Field effect transistors and method of forming field effect transistors
JP2001053283A (ja) 1999-08-12 2001-02-23 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
US6409930B1 (en) 1999-11-01 2002-06-25 Bmc Industries, Inc. Lamination of circuit sub-elements while assuring registration
US6468439B1 (en) 1999-11-01 2002-10-22 Bmc Industries, Inc. Etching of metallic composite articles
US6365057B1 (en) 1999-11-01 2002-04-02 Bmc Industries, Inc. Circuit manufacturing using etched tri-metal media
WO2001059849A1 (fr) * 2000-02-09 2001-08-16 Matsushita Electric Industrial Co., Ltd. Transistor a film mince a gachette en alliage molybdene-tungstene
JP4118484B2 (ja) 2000-03-06 2008-07-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2001257350A (ja) * 2000-03-08 2001-09-21 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP4118485B2 (ja) * 2000-03-13 2008-07-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4700160B2 (ja) 2000-03-13 2011-06-15 株式会社半導体エネルギー研究所 半導体装置
JP4683688B2 (ja) 2000-03-16 2011-05-18 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
JP4393662B2 (ja) 2000-03-17 2010-01-06 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
US6900084B1 (en) 2000-05-09 2005-05-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a display device
US6781646B2 (en) 2000-07-28 2004-08-24 Hitachi, Ltd. Liquid crystal display device having gate electrode with two conducting layers, one used for self-aligned formation of the TFT semiconductor regions
US7071037B2 (en) * 2001-03-06 2006-07-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
SG116443A1 (en) * 2001-03-27 2005-11-28 Semiconductor Energy Lab Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same.
JP3810681B2 (ja) * 2001-12-20 2006-08-16 シャープ株式会社 薄膜トランジスタ基板および液晶表示装置
TWI230292B (en) * 2002-12-09 2005-04-01 Lg Philips Lcd Co Ltd Array substrate having color filter on thin film transistor structure for LCD device and method of fabricating the same
KR101844972B1 (ko) 2009-11-27 2018-04-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작방법

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3701931A (en) * 1971-05-06 1972-10-31 Ibm Gold tantalum-nitrogen high conductivity metallurgy
JPS4988076A (ko) * 1972-12-27 1974-08-22
US3877063A (en) * 1973-06-27 1975-04-08 Hewlett Packard Co Metallization structure and process for semiconductor devices
US4251326A (en) * 1978-12-28 1981-02-17 Western Electric Company, Inc. Fabricating an RC network utilizing alpha tantalum
FR2505070B1 (fr) * 1981-01-16 1986-04-04 Suwa Seikosha Kk Dispositif non lineaire pour un panneau d'affichage a cristaux liquides et procede de fabrication d'un tel panneau d'affichage
DE3229203A1 (de) * 1982-08-05 1984-02-09 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiterbauelement und verfahren zu dessen herstellung
JPS59131974A (ja) * 1983-01-18 1984-07-28 セイコーエプソン株式会社 液晶表示装置
US4829363A (en) * 1984-04-13 1989-05-09 Fairchild Camera And Instrument Corp. Structure for inhibiting dopant out-diffusion
GB2169746B (en) * 1984-11-13 1988-09-14 Sharp Kk Thin film transistor
US4730903A (en) * 1985-01-23 1988-03-15 Semiconductor Energy Laboratory Co., Ltd. Ferroelectric crystal display panel and manufacturing method thereof
JPS61206243A (ja) * 1985-03-08 1986-09-12 Mitsubishi Electric Corp 高融点金属電極・配線膜を用いた半導体装置
JPS61296764A (ja) * 1985-06-25 1986-12-27 Mitsubishi Electric Corp 金属電極配線膜を有する半導体装置
JPH0715990B2 (ja) * 1985-09-11 1995-02-22 三菱電機株式会社 半導体装置
DE3689843T2 (de) * 1986-03-06 1994-09-01 Toshiba Kawasaki Kk Steuerschaltung einer Flüssigkristallanzeige.
JPH07105486B2 (ja) * 1986-09-05 1995-11-13 株式会社東芝 電極配線材料
US5170244A (en) * 1986-03-06 1992-12-08 Kabushiki Kaisha Toshiba Electrode interconnection material, semiconductor device using this material and driving circuit substrate for display device
JPS6373660A (ja) * 1986-09-17 1988-04-04 Fujitsu Ltd 半導体装置
GB2213987A (en) * 1987-12-18 1989-08-23 Philips Electronic Associated MIM devices and liquid crystal display devices incorporating such devices
JPH01291467A (ja) * 1988-05-19 1989-11-24 Toshiba Corp 薄膜トランジスタ
JPH0675143B2 (ja) * 1988-09-09 1994-09-21 シャープ株式会社 アクティブマトリクス基板
US4933743A (en) * 1989-03-11 1990-06-12 Fairchild Semiconductor Corporation High performance interconnect system for an integrated circuit
US5264728A (en) * 1989-11-30 1993-11-23 Kabushiki Kaisha Toshiba Line material, electronic device using the line material and liquid crystal display
US5164850A (en) * 1990-01-29 1992-11-17 Sanyo Electric Co., Ltd. Liquid crystal device including tantalum nitride with specific nitriding ratio

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100430744B1 (ko) * 1995-06-14 2004-08-25 가부시끼가이샤 히다치 세이사꾸쇼 고집적도대면적lcd디스플레이용tft패널과그제조방법및액정표시장치

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