FR2423953A1 - Circuit imprime a composants electroniques incorpores et son procede de fabrication - Google Patents

Circuit imprime a composants electroniques incorpores et son procede de fabrication

Info

Publication number
FR2423953A1
FR2423953A1 FR7811315A FR7811315A FR2423953A1 FR 2423953 A1 FR2423953 A1 FR 2423953A1 FR 7811315 A FR7811315 A FR 7811315A FR 7811315 A FR7811315 A FR 7811315A FR 2423953 A1 FR2423953 A1 FR 2423953A1
Authority
FR
France
Prior art keywords
circuit
plastics
multilayer printed
printed circuit
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7811315A
Other languages
English (en)
Other versions
FR2423953B1 (fr
Inventor
Alain Laurent
Georges Nocture
Philippe Jourdain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR7811315A priority Critical patent/FR2423953A1/fr
Publication of FR2423953A1 publication Critical patent/FR2423953A1/fr
Application granted granted Critical
Publication of FR2423953B1 publication Critical patent/FR2423953B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32153—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/32175—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic
    • H01L2224/32188—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic the layer connector connecting to a bonding area protruding from the surface of the item
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    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/4805—Shape
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    • H01L2224/48091—Arched
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Circuit imprimé multicouche à composants électroniques et collecteur thermique incorporée. Les cristaux semi-conducteurs 23 sont, d'une part, fixés directement sur le collecteur thermique 15 et, d'autre part, noyés dans la matière isolante 27 du stratifié 10. Le collecteur thermique 15 borde le circuit sur l'essentiel de sa surface et a sa face 22 libre pour la dissipation des calories. Application aux appareillages électroniques.
FR7811315A 1978-04-18 1978-04-18 Circuit imprime a composants electroniques incorpores et son procede de fabrication Granted FR2423953A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7811315A FR2423953A1 (fr) 1978-04-18 1978-04-18 Circuit imprime a composants electroniques incorpores et son procede de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7811315A FR2423953A1 (fr) 1978-04-18 1978-04-18 Circuit imprime a composants electroniques incorpores et son procede de fabrication

Publications (2)

Publication Number Publication Date
FR2423953A1 true FR2423953A1 (fr) 1979-11-16
FR2423953B1 FR2423953B1 (fr) 1981-06-26

Family

ID=9207244

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7811315A Granted FR2423953A1 (fr) 1978-04-18 1978-04-18 Circuit imprime a composants electroniques incorpores et son procede de fabrication

Country Status (1)

Country Link
FR (1) FR2423953A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524250A1 (fr) * 1982-03-26 1983-09-30 Socapex Carte imprimee electrique et thermique, procede de fabrication d'une telle carte et systeme d'interconnexion thermique et electrique utilisant une telle carte
FR2541018A1 (fr) * 1983-02-16 1984-08-17 Radiotechnique Compelec Procede de dissipation thermique, appareil de lecture-ecriture, et carte electronique a dissipation thermique elevee
FR2556916A1 (fr) * 1983-12-16 1985-06-21 Rca Corp Procede pour fabriquer un substrat de circuit electronique presentant une ou plusieurs ouvertures traversantes
US4682414A (en) * 1982-08-30 1987-07-28 Olin Corporation Multi-layer circuitry
FR2670987A1 (fr) * 1990-12-21 1992-06-26 Telecommunications Sa Procede de realisation d'au moins une traversee conductrice a travers un trou traversant d'un substrat isolant.
EP1827065A2 (fr) 1997-02-03 2007-08-29 Ibiden Co., Ltd. Plaquette à circuit imprimé et procédé de fabrication correspondant

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3187226A (en) * 1961-08-07 1965-06-01 Curtiss Wright Corp Miniaturized electrical apparatus with combined heat dissipating and insulating structure
US4046442A (en) * 1975-05-07 1977-09-06 Burroughs Corporation Pluggable semiconductor device package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3187226A (en) * 1961-08-07 1965-06-01 Curtiss Wright Corp Miniaturized electrical apparatus with combined heat dissipating and insulating structure
US4046442A (en) * 1975-05-07 1977-09-06 Burroughs Corporation Pluggable semiconductor device package

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/66 *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524250A1 (fr) * 1982-03-26 1983-09-30 Socapex Carte imprimee electrique et thermique, procede de fabrication d'une telle carte et systeme d'interconnexion thermique et electrique utilisant une telle carte
EP0090727A1 (fr) * 1982-03-26 1983-10-05 Socapex Carte imprimée électrique et thermique, procédé de fabrication d'une telle carte, et système d'interconnexion thermique et électrique utilisant une telle carte
US4682414A (en) * 1982-08-30 1987-07-28 Olin Corporation Multi-layer circuitry
FR2541018A1 (fr) * 1983-02-16 1984-08-17 Radiotechnique Compelec Procede de dissipation thermique, appareil de lecture-ecriture, et carte electronique a dissipation thermique elevee
FR2556916A1 (fr) * 1983-12-16 1985-06-21 Rca Corp Procede pour fabriquer un substrat de circuit electronique presentant une ou plusieurs ouvertures traversantes
FR2670987A1 (fr) * 1990-12-21 1992-06-26 Telecommunications Sa Procede de realisation d'au moins une traversee conductrice a travers un trou traversant d'un substrat isolant.
EP1827065A2 (fr) 1997-02-03 2007-08-29 Ibiden Co., Ltd. Plaquette à circuit imprimé et procédé de fabrication correspondant
EP1827065A3 (fr) * 1997-02-03 2007-10-10 Ibiden Co., Ltd. Plaquette à circuit imprimé et procédé de fabrication correspondant
US7552531B2 (en) 1997-02-03 2009-06-30 Ibiden Co., Ltd. Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit

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