KR20170100611A - 비방사 측벽 재결합 감소를 위한 led 구조체 - Google Patents

비방사 측벽 재결합 감소를 위한 led 구조체 Download PDF

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Publication number
KR20170100611A
KR20170100611A KR1020177020694A KR20177020694A KR20170100611A KR 20170100611 A KR20170100611 A KR 20170100611A KR 1020177020694 A KR1020177020694 A KR 1020177020694A KR 20177020694 A KR20177020694 A KR 20177020694A KR 20170100611 A KR20170100611 A KR 20170100611A
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South Korea
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layer
led
diode
light emitting
emitting diode
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Korean (ko)
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데이비드 피. 보어
켈리 맥그로디
다니엘 아서 헤이거
제임스 마이클 퍼킨스
아르판 차크라보르티
장-자크 피. 드롤레
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애플 인크.
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Priority to KR1020217018569A priority Critical patent/KR102380538B1/ko
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/816Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
    • H01L33/14
    • H01L33/0008
    • H01L33/0075
    • H01L33/06
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0137Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/821Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Led Device Packages (AREA)
KR1020177020694A 2015-01-06 2015-12-07 비방사 측벽 재결합 감소를 위한 led 구조체 Ceased KR20170100611A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020217018569A KR102380538B1 (ko) 2015-01-06 2015-12-07 비방사 측벽 재결합 감소를 위한 led 구조체

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562100348P 2015-01-06 2015-01-06
US62/100,348 2015-01-06
US14/853,614 US9484492B2 (en) 2015-01-06 2015-09-14 LED structures for reduced non-radiative sidewall recombination
US14/853,614 2015-09-14
PCT/US2015/064295 WO2016111789A1 (en) 2015-01-06 2015-12-07 Led structures for reduced non-radiative sidewall recombination

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KR1020217018569A Division KR102380538B1 (ko) 2015-01-06 2015-12-07 비방사 측벽 재결합 감소를 위한 led 구조체
KR1020197027276A Division KR20190109586A (ko) 2015-01-06 2015-12-07 비방사 측벽 재결합 감소를 위한 led 구조체

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KR20170100611A true KR20170100611A (ko) 2017-09-04

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KR1020197027276A Withdrawn KR20190109586A (ko) 2015-01-06 2015-12-07 비방사 측벽 재결합 감소를 위한 led 구조체
KR1020177020694A Ceased KR20170100611A (ko) 2015-01-06 2015-12-07 비방사 측벽 재결합 감소를 위한 led 구조체
KR1020217018569A Active KR102380538B1 (ko) 2015-01-06 2015-12-07 비방사 측벽 재결합 감소를 위한 led 구조체

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KR1020197027276A Withdrawn KR20190109586A (ko) 2015-01-06 2015-12-07 비방사 측벽 재결합 감소를 위한 led 구조체

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Country Status (6)

Country Link
US (1) US9484492B2 (OSRAM)
EP (1) EP3243223B1 (OSRAM)
JP (2) JP2018505567A (OSRAM)
KR (3) KR20190109586A (OSRAM)
CN (1) CN107408603B (OSRAM)
WO (1) WO2016111789A1 (OSRAM)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190035319A (ko) * 2017-09-26 2019-04-03 삼성전자주식회사 발광 칩들을 포함하는 디스플레이 및 그 제조 방법
KR20200023319A (ko) * 2020-01-22 2020-03-04 엘지전자 주식회사 반도체 발광소자를 이용한 디스플레이 장치 및 이의 제조방법
KR20200029100A (ko) * 2018-09-07 2020-03-18 삼성디스플레이 주식회사 발광 소자, 그의 제조 방법, 및 발광 소자를 구비한 표시 장치
KR20220012337A (ko) * 2019-05-24 2022-02-03 플레세이 세미컨덕터스 리미티드 패시베이션 층을 포함하는 발광 다이오드 전구체
US12484347B2 (en) 2018-11-06 2025-11-25 The Regents Of The University Of California Method of forming micro-LEDs with ultra-low leakage current

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9865772B2 (en) 2015-01-06 2018-01-09 Apple Inc. LED structures for reduced non-radiative sidewall recombination
US10297581B2 (en) 2015-07-07 2019-05-21 Apple Inc. Quantum dot integration schemes
US10297719B2 (en) 2015-08-27 2019-05-21 Mikro Mesa Technology Co., Ltd. Micro-light emitting diode (micro-LED) device
KR102402999B1 (ko) 2015-08-31 2022-05-30 삼성디스플레이 주식회사 디스플레이 장치 및 이의 제조 방법
DE102015120089A1 (de) * 2015-11-19 2017-05-24 Osram Opto Semiconductors Gmbh Leuchtdiodenchip und Verfahren zur Herstellung eines Leuchtdiodenchips
KR102651054B1 (ko) * 2016-02-22 2024-03-26 삼성디스플레이 주식회사 전사 장치, 이를 이용한 전사 방법 및 표시 장치
US10132478B2 (en) 2016-03-06 2018-11-20 Svv Technology Innovations, Inc. Flexible solid-state illumination devices
DE102016105407A1 (de) * 2016-03-23 2017-09-28 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer elektronischen Vorrichtung und elektronische Vorrichtung
CN109155345B (zh) * 2016-06-30 2022-10-28 苹果公司 用于减少的非辐射侧壁复合的led结构
US10396241B1 (en) * 2016-08-04 2019-08-27 Apple Inc. Diffusion revealed blocking junction
CN106340597B (zh) * 2016-08-31 2019-01-18 纳晶科技股份有限公司 发光器件
TWI648870B (zh) * 2016-12-09 2019-01-21 英屬開曼群島商錼創科技股份有限公司 發光二極體晶片
TWI646680B (zh) * 2017-01-10 2019-01-01 英屬開曼群島商錼創科技股份有限公司 微型發光二極體晶片以及顯示面板
US12015103B2 (en) * 2017-01-10 2024-06-18 PlayNitride Display Co., Ltd. Micro light emitting diode display panel with option of choosing to emit light both or respectively of light-emitting regions
CN109216417B (zh) * 2017-06-30 2023-10-17 乐金显示有限公司 显示装置
CN109860364B (zh) * 2017-08-30 2020-09-01 天津三安光电有限公司 发光二极管
US20220384688A1 (en) * 2017-08-30 2022-12-01 Xiamen San'an Optoelectronics Co., Ltd. Micro light-emitting diode and micro light-emitting diode array
US10325889B1 (en) 2018-01-12 2019-06-18 Mikro Mesa Technology Co., Ltd. Display device including LED devices with selective activation function
WO2019147589A1 (en) 2018-01-24 2019-08-01 Apple Inc. Micro led based display panel
US10644196B2 (en) 2018-03-30 2020-05-05 Facebook Technologies, Llc Reduction of surface recombination losses in micro-LEDs
US10622519B2 (en) 2018-03-30 2020-04-14 Facebook Technologies, Llc Reduction of surface recombination losses in micro-LEDs
US20190305188A1 (en) * 2018-03-30 2019-10-03 Facebook Technologies, Llc Reduction of surface recombination losses in micro-leds
US10468552B2 (en) * 2018-03-30 2019-11-05 Facebook Technologies, Llc High-efficiency micro-LEDs
TWI672466B (zh) * 2018-04-11 2019-09-21 台灣愛司帝科技股份有限公司 微型發光二極體顯示器及其製作方法
KR102579057B1 (ko) 2018-06-11 2023-09-14 샤먼 산안 옵토일렉트로닉스 컴퍼니 리미티드 발광 어셈블리
DE202019103446U1 (de) * 2018-06-19 2019-11-29 Soraa, Inc. Lichtemittierende Gruppe-III-Nitrid-Diode mit hohem Wirkungsgrad
CN108598867B (zh) * 2018-06-26 2020-06-12 扬州乾照光电有限公司 Dbr结构芯片及其制备方法
KR102136579B1 (ko) * 2018-07-27 2020-07-22 서울대학교산학협력단 표시 장치
CN111933771B (zh) * 2018-07-28 2023-02-17 厦门三安光电有限公司 微发光二极管及其显示装置
CN115775852A (zh) * 2018-08-10 2023-03-10 林宏诚 流体移转系统、发光二极管装置及制作方法、发光及显示设备
US11139342B2 (en) 2018-09-26 2021-10-05 Nitride Semiconductors Co., Ltd. UV-LED and display
US11201265B2 (en) 2018-09-27 2021-12-14 Lumileds Llc Micro light emitting devices
US10923628B2 (en) 2018-09-27 2021-02-16 Lumileds Llc Micrometer scale light emitting diode displays on patterned templates and substrates
US10964845B2 (en) 2018-09-27 2021-03-30 Lumileds Llc Micro light emitting devices
US10811460B2 (en) 2018-09-27 2020-10-20 Lumileds Holding B.V. Micrometer scale light emitting diode displays on patterned templates and substrates
TWI804685B (zh) * 2018-09-27 2023-06-11 美商亮銳公司 於圖案化模板及基板上之微米級發光二極體顯示器
KR102601950B1 (ko) * 2018-11-16 2023-11-14 삼성전자주식회사 Led 소자, led 소자의 제조 방법 및 led 소자를 포함하는 디스플레이 장치
KR102701758B1 (ko) 2018-11-27 2024-09-04 삼성디스플레이 주식회사 발광 소자, 이의 제조 방법 및 발광 소자를 구비한 표시 장치
CN109755359A (zh) * 2019-01-15 2019-05-14 江西兆驰半导体有限公司 一种发光二极管芯片的制造方法
EP3696300A1 (de) 2019-02-18 2020-08-19 Aixatech GmbH Verfahren zur herstellung eines verbundmaterialkörpers insbesondere für die verwendung bei der herstellung von elektronischen oder optoelektronischen bauelementen
US10680035B1 (en) * 2019-03-12 2020-06-09 Mikro Mesa Technology Co., Ltd. Micro light-emitting diode display device and micro light-emitting diode driving circuit
KR102737506B1 (ko) 2019-03-18 2024-12-05 삼성전자주식회사 반도체 발광소자 및 그 제조 방법
US11677042B2 (en) * 2019-03-29 2023-06-13 Meta Platforms Technologies, Llc Regrowth of epitaxial layer for surface recombination velocity reduction in light emitting diodes
US11158761B2 (en) * 2019-05-07 2021-10-26 Facebook Technologies, Llc Bonding methods for light emitting diodes
EP3745474A1 (en) * 2019-05-28 2020-12-02 OSRAM Opto Semiconductors GmbH Optoelectronic device and method for manufacturing an optoe-lectronic device
FI128613B (en) * 2019-06-19 2020-08-31 Comptek Solutions Oy Optoelectronic device
DE102019117207A1 (de) * 2019-06-26 2020-12-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Leuchtdiodenchip und verfahren zur herstellung eines leuchtdiodenchips
JP7323783B2 (ja) 2019-07-19 2023-08-09 日亜化学工業株式会社 発光装置の製造方法及び発光装置
JP7403201B2 (ja) * 2019-07-19 2023-12-22 信一郎 高谷 化合物半導体ヘテロ接合バイポーラトランジスタ
TWI707466B (zh) * 2019-07-23 2020-10-11 國立中興大學 亮度均勻之被動式微發光二極體陣列裝置
CN110534473B (zh) * 2019-07-29 2022-04-05 中国科学院微电子研究所 化合物半导体与硅基互补金属氧化物半导体晶圆的异构集成方法及异构集成器件
DE102019121580A1 (de) * 2019-08-09 2021-02-11 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauelement mit reduzierter absorption und verfahren zur herstellung eines bauelements
KR102892292B1 (ko) 2019-08-19 2025-11-26 삼성전자주식회사 디스플레이 장치
GB2586862B (en) * 2019-09-06 2021-12-15 Plessey Semiconductors Ltd LED precursor incorporating strain relaxing structure
GB2586861B (en) * 2019-09-06 2022-01-19 Plessey Semiconductors Ltd Light Emitting Diode and method of forming a Light Emitting Diode
US11798974B2 (en) * 2019-09-27 2023-10-24 Seoul Viosys Co., Ltd. Light emitting device for display and display apparatus having the same
DE102019126506A1 (de) 2019-10-01 2021-04-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung von optoelektronischen halbleiterchips und optoelektronischer halbleiterchip
US11309464B2 (en) 2019-10-14 2022-04-19 Facebook Technologies, Llc Micro-LED design for chief ray walk-off compensation
KR20210055611A (ko) * 2019-11-06 2021-05-17 에피스타 코포레이션 반도체 소자 및 이를 포함하는 반도체 컴포넌트
US11424289B2 (en) 2019-11-14 2022-08-23 Meta Platforms Technologies, Llc In situ selective etching and selective regrowth of epitaxial layer for surface recombination velocity reduction in light emitting diodes
GB2590450B (en) * 2019-12-18 2022-01-05 Plessey Semiconductors Ltd Light emitting diode precursor
FR3105568B1 (fr) * 2019-12-19 2021-12-17 Commissariat Energie Atomique Procede pour fabriquer un substrat comprenant une couche d’ingan relaxee
EP3855513A3 (en) 2020-01-22 2021-11-03 Samsung Electronics Co., Ltd. Semiconductor led and method of manufacturing the same
KR102871497B1 (ko) 2020-01-22 2025-10-15 삼성전자주식회사 반도체 발광 다이오드 및 그 제조 방법
KR20220140890A (ko) * 2020-01-22 2022-10-18 포로 테크놀로지스 리미티드 반도체 구조체 및 제작 방법
KR102866518B1 (ko) 2020-02-03 2025-09-30 삼성전자주식회사 반도체 발광소자 및 디스플레이 장치
CN111341893B (zh) * 2020-03-03 2021-03-26 中国科学院半导体研究所 一种AlGaN基二极管及其制备方法
DE102020106113A1 (de) * 2020-03-06 2021-09-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierender halbleiterkörper, strahlungsemittierender halbleiterchip und verfahren zur herstellung eines strahlungsemittierenden halbleiterkörpers
US11569415B2 (en) * 2020-03-11 2023-01-31 Lumileds Llc Light emitting diode devices with defined hard mask opening
CN113451108B (zh) * 2020-03-24 2024-06-25 中国科学院苏州纳米技术与纳米仿生研究所 一种超柔性透明半导体薄膜及其制备方法
GB2593698B (en) 2020-03-30 2022-12-07 Plessey Semiconductors Ltd Monolithic electronic device
KR102506449B1 (ko) * 2020-04-23 2023-03-07 삼성전자주식회사 표시 장치
CN115668519A (zh) * 2020-05-19 2023-01-31 谷歌有限责任公司 光发射元件应变管理层的组合
CN115606004A (zh) * 2020-05-19 2023-01-13 谷歌有限责任公司(Us) 利用侧壁空穴注入增强的基于量子阱的led结构
US11362237B2 (en) * 2020-06-02 2022-06-14 Facebook Technologies, Llc High-efficiency red micro-LED with localized current aperture
KR102870852B1 (ko) 2020-06-24 2025-10-13 삼성전자주식회사 반도체 발광 소자
US11764095B2 (en) 2020-07-10 2023-09-19 Samsung Electronics Co., Ltd. Wet alignment method for micro-semiconductor chip and display transfer structure
TW202221937A (zh) * 2020-08-04 2022-06-01 英商普羅科技有限公司 Led裝置及製造方法
TWI858136B (zh) * 2020-09-18 2024-10-11 許華珍 一種顯示裝置
KR20220045478A (ko) 2020-10-05 2022-04-12 삼성전자주식회사 마이크로 발광 디스플레이 장치 및 그 제조 방법
US11600656B2 (en) 2020-12-14 2023-03-07 Lumileds Llc Light emitting diode device
CN114744092B (zh) * 2021-01-08 2025-04-18 鑫天虹(厦门)科技有限公司 减少非辐射复合的微发光二极体的制作方法及制作机台
US20240128400A1 (en) * 2021-03-05 2024-04-18 The Regents Of The University Of California Method to improve the performance of gallium-containing micron-sized light-emitting devices
US20220320366A1 (en) * 2021-03-31 2022-10-06 Semileds Corporation Method To Remove An Isolation Layer On The Corner Between The Semiconductor Light Emitting Device To The Growth Substrate
DE102021109960A1 (de) * 2021-04-20 2022-10-20 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierender halbleiterchip und verfahren zur herstellung eines strahlungsemittierenden halbleiterchips
DE102021207298A1 (de) * 2021-07-09 2023-01-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung eines strahlungsemittierenden halbleiterchips und strahlungsemittierender halbleiterchip
CN113851568A (zh) * 2021-08-19 2021-12-28 厦门大学 一种利用原子层沉积技术提高微型led调制带宽的办法
KR20230033773A (ko) 2021-09-01 2023-03-09 삼성디스플레이 주식회사 발광 소자 및 이를 포함하는 표시 장치
JP7367743B2 (ja) * 2021-10-18 2023-10-24 信越半導体株式会社 接合型半導体ウェーハの製造方法
DE112021008444T5 (de) * 2021-11-10 2024-09-12 Ams-Osram International Gmbh Verfahren zur herstellung eines optoelektronischen halbleiterchips
DE102021129843A1 (de) 2021-11-16 2023-05-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung einer vielzahl strahlungsemittierender halbleiterchips und strahlungsemittierender halbleiterchip
CN114188453A (zh) * 2021-11-30 2022-03-15 重庆康佳光电技术研究院有限公司 垂直led芯片及其制备方法、led阵列及显示面板
JP7272412B1 (ja) 2021-12-03 2023-05-12 信越半導体株式会社 接合型半導体ウェーハの製造方法
KR20240129066A (ko) * 2022-01-14 2024-08-27 에이엠에스-오스람 인터내셔널 게엠베하 광전자 디바이스를 프로세싱하는 방법 및 광전자 디바이스
CN118661271A (zh) * 2022-01-31 2024-09-17 上海显耀显示科技有限公司 一种具有再生长层的微型led面板及其制造方法
KR20230130201A (ko) * 2022-03-02 2023-09-12 삼성디스플레이 주식회사 발광 소자 및 이를 포함한 표시 장치, 및 발광 소자의 제조 방법
US12148863B2 (en) 2022-03-24 2024-11-19 Meta Platforms Technologies, Llc Directional light extraction from micro-LED via localization of light emitting area using mesa sidewall epitaxy
DE102022119108A1 (de) * 2022-07-29 2024-02-01 Ams-Osram International Gmbh Optoelektronisches halbleiterbauelement und verfahren zur herstellung zumindest eines optoelektronischen halbleiterbauelements
JP7422449B1 (ja) * 2022-09-06 2024-01-26 アルディーテック株式会社 発光ダイオードチップ集積装置
CN115458647B (zh) * 2022-10-31 2025-08-19 天津三安光电有限公司 一种垂直led芯片结构及其制造方法及发光装置
KR20240174913A (ko) * 2023-06-08 2024-12-18 삼성디스플레이 주식회사 발광 소자 및 이를 포함하는 표시 장치
DE102023132870A1 (de) * 2023-11-24 2025-05-28 Ams-Osram International Gmbh Optoelektronisches bauelement und verfahren
WO2025165671A1 (en) * 2024-01-30 2025-08-07 Meta Platforms Technologies, Llc Band gap engineering with self-aligned process

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680855B2 (ja) * 1984-04-19 1994-10-12 日本電気株式会社 埋め込み構造半導体レーザ
JPS62162383A (ja) * 1986-01-11 1987-07-18 Fumio Inaba 半導体発光装置
JPS63143889A (ja) * 1986-12-08 1988-06-16 Ricoh Co Ltd 半導体発光装置
JPS63196089A (ja) 1987-02-10 1988-08-15 Furukawa Electric Co Ltd:The 半導体発光素子の製造方法
JPH02114675A (ja) * 1988-10-25 1990-04-26 Sumitomo Electric Ind Ltd 半導体発光素子ならびにその製造方法
US5138624A (en) 1989-11-16 1992-08-11 The Boeing Company Multiwavelength LED and laser diode optical source
JP2655943B2 (ja) * 1991-02-28 1997-09-24 シャープ株式会社 半導体発光素子及びその製造方法
JPH0555711A (ja) 1991-08-22 1993-03-05 Furukawa Electric Co Ltd:The 半導体レーザ素子とその製造方法
JP2812024B2 (ja) * 1991-10-17 1998-10-15 日本電気株式会社 面発光素子の製造方法
JPH05218498A (ja) 1992-02-03 1993-08-27 Mitsubishi Kasei Corp 横方向に接合を有する発光ダイオード
JPH05275802A (ja) * 1992-03-27 1993-10-22 Fuji Xerox Co Ltd 半導体レーザの製造方法
JPH06163981A (ja) * 1992-11-25 1994-06-10 Victor Co Of Japan Ltd 半導体装置
US5614734A (en) 1995-03-15 1997-03-25 Yale University High efficency LED structure
JPH09162441A (ja) * 1995-12-05 1997-06-20 Toshiba Corp 半導体装置及びその製造方法
JP3782230B2 (ja) * 1998-03-30 2006-06-07 株式会社東芝 半導体レーザ装置の製造方法及びiii−v族化合物半導体素子の製造方法
DE10039435A1 (de) * 2000-08-11 2002-02-28 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement mit erhöhter Strahlungsauskopplung und Herstellungsverfahren hierfür
JP3585817B2 (ja) 2000-09-04 2004-11-04 ユーディナデバイス株式会社 レーザダイオードおよびその製造方法
US6891202B2 (en) * 2001-12-14 2005-05-10 Infinera Corporation Oxygen-doped Al-containing current blocking layers in active semiconductor devices
JP2004281559A (ja) * 2003-03-13 2004-10-07 Toshiba Corp 半導体発光素子
US6906353B1 (en) * 2003-11-17 2005-06-14 Jds Uniphase Corporation High speed implanted VCSEL
DE102004029412A1 (de) * 2004-02-27 2005-10-13 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines solchen Halbleiterchips
JP4655920B2 (ja) * 2005-12-22 2011-03-23 日立電線株式会社 半導体発光素子
JP5017865B2 (ja) * 2006-01-17 2012-09-05 富士電機株式会社 半導体装置
JP4903643B2 (ja) * 2007-07-12 2012-03-28 株式会社東芝 半導体発光素子
JP5170869B2 (ja) * 2007-11-05 2013-03-27 古河電気工業株式会社 光半導体素子及び光半導体素子の製造方法
KR100903103B1 (ko) * 2007-12-05 2009-06-16 우리엘에스티 주식회사 화합물 반도체를 이용한 발광소자
JP2009224480A (ja) * 2008-03-14 2009-10-01 Panasonic Corp 2波長半導体レーザ装置
DE102008018928A1 (de) 2008-04-15 2009-10-22 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
KR20110049799A (ko) * 2008-08-19 2011-05-12 라티스 파워(지앙시) 코포레이션 양면 패시베이션을 갖는 반도체 발광 디바이스 제작 방법
CN102067346B (zh) * 2008-08-19 2013-09-04 晶能光电(江西)有限公司 具有钝化层的半导体发光器件及其制造方法
EP2249406B1 (en) * 2009-05-04 2019-03-06 LG Innotek Co., Ltd. Light emitting diode
JP5356292B2 (ja) * 2010-03-19 2013-12-04 株式会社東芝 半導体発光素子及び半導体発光装置
US8237174B2 (en) * 2010-05-10 2012-08-07 National Central University LED structure
DE102010026518B4 (de) * 2010-07-08 2025-02-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Leuchtdiodenchip und Verfahren zur Herstellung einer Mehrzahl von Leuchtdiodenchips
US9093818B2 (en) * 2010-07-15 2015-07-28 The Regents Of The University Of California Nanopillar optical resonator
CN103415935B (zh) * 2011-03-14 2016-09-14 皇家飞利浦有限公司 具有重新分布用于倒装芯片安装的垂直接触件的led
JP6035736B2 (ja) * 2011-10-26 2016-11-30 ソニー株式会社 発光素子およびその製造方法、並びに発光装置
JP2014204095A (ja) * 2013-04-10 2014-10-27 信越半導体株式会社 半導体発光素子及びその製造方法
US8987765B2 (en) * 2013-06-17 2015-03-24 LuxVue Technology Corporation Reflective bank structure and method for integrating a light emitting device
US8928021B1 (en) 2013-06-18 2015-01-06 LuxVue Technology Corporation LED light pipe
US9450147B2 (en) 2013-12-27 2016-09-20 Apple Inc. LED with internally confined current injection area

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190035319A (ko) * 2017-09-26 2019-04-03 삼성전자주식회사 발광 칩들을 포함하는 디스플레이 및 그 제조 방법
WO2019066223A1 (ko) * 2017-09-26 2019-04-04 삼성전자주식회사 발광 칩들을 포함하는 디스플레이 및 그 제조 방법
US11387220B2 (en) 2017-09-26 2022-07-12 Samsung Electronics Co., Ltd. Display comprising light-emitting chips and manufacturing method therefor
KR20200029100A (ko) * 2018-09-07 2020-03-18 삼성디스플레이 주식회사 발광 소자, 그의 제조 방법, 및 발광 소자를 구비한 표시 장치
KR20230167334A (ko) * 2018-09-07 2023-12-08 삼성디스플레이 주식회사 발광 소자, 그의 제조 방법, 및 발광 소자를 구비한 표시 장치
US12484347B2 (en) 2018-11-06 2025-11-25 The Regents Of The University Of California Method of forming micro-LEDs with ultra-low leakage current
KR20220012337A (ko) * 2019-05-24 2022-02-03 플레세이 세미컨덕터스 리미티드 패시베이션 층을 포함하는 발광 다이오드 전구체
KR20200023319A (ko) * 2020-01-22 2020-03-04 엘지전자 주식회사 반도체 발광소자를 이용한 디스플레이 장치 및 이의 제조방법
US12490555B2 (en) 2020-01-22 2025-12-02 Lg Electronics Inc. Display device using semiconductor light-emitting element and manufacturing method thereof

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JP2020036038A (ja) 2020-03-05
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KR102380538B1 (ko) 2022-03-29
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