KR20170100611A - 비방사 측벽 재결합 감소를 위한 led 구조체 - Google Patents
비방사 측벽 재결합 감소를 위한 led 구조체 Download PDFInfo
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- KR20170100611A KR20170100611A KR1020177020694A KR20177020694A KR20170100611A KR 20170100611 A KR20170100611 A KR 20170100611A KR 1020177020694 A KR1020177020694 A KR 1020177020694A KR 20177020694 A KR20177020694 A KR 20177020694A KR 20170100611 A KR20170100611 A KR 20170100611A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
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- H01L33/14—
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- H01L33/0008—
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- H01L33/0075—
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- H01L33/06—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
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- Led Devices (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020217018569A KR102380538B1 (ko) | 2015-01-06 | 2015-12-07 | 비방사 측벽 재결합 감소를 위한 led 구조체 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562100348P | 2015-01-06 | 2015-01-06 | |
| US62/100,348 | 2015-01-06 | ||
| US14/853,614 US9484492B2 (en) | 2015-01-06 | 2015-09-14 | LED structures for reduced non-radiative sidewall recombination |
| US14/853,614 | 2015-09-14 | ||
| PCT/US2015/064295 WO2016111789A1 (en) | 2015-01-06 | 2015-12-07 | Led structures for reduced non-radiative sidewall recombination |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217018569A Division KR102380538B1 (ko) | 2015-01-06 | 2015-12-07 | 비방사 측벽 재결합 감소를 위한 led 구조체 |
| KR1020197027276A Division KR20190109586A (ko) | 2015-01-06 | 2015-12-07 | 비방사 측벽 재결합 감소를 위한 led 구조체 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20170100611A true KR20170100611A (ko) | 2017-09-04 |
Family
ID=56286945
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020197027276A Withdrawn KR20190109586A (ko) | 2015-01-06 | 2015-12-07 | 비방사 측벽 재결합 감소를 위한 led 구조체 |
| KR1020177020694A Ceased KR20170100611A (ko) | 2015-01-06 | 2015-12-07 | 비방사 측벽 재결합 감소를 위한 led 구조체 |
| KR1020217018569A Active KR102380538B1 (ko) | 2015-01-06 | 2015-12-07 | 비방사 측벽 재결합 감소를 위한 led 구조체 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020197027276A Withdrawn KR20190109586A (ko) | 2015-01-06 | 2015-12-07 | 비방사 측벽 재결합 감소를 위한 led 구조체 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217018569A Active KR102380538B1 (ko) | 2015-01-06 | 2015-12-07 | 비방사 측벽 재결합 감소를 위한 led 구조체 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9484492B2 (OSRAM) |
| EP (1) | EP3243223B1 (OSRAM) |
| JP (2) | JP2018505567A (OSRAM) |
| KR (3) | KR20190109586A (OSRAM) |
| CN (1) | CN107408603B (OSRAM) |
| WO (1) | WO2016111789A1 (OSRAM) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190035319A (ko) * | 2017-09-26 | 2019-04-03 | 삼성전자주식회사 | 발광 칩들을 포함하는 디스플레이 및 그 제조 방법 |
| KR20200023319A (ko) * | 2020-01-22 | 2020-03-04 | 엘지전자 주식회사 | 반도체 발광소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| KR20200029100A (ko) * | 2018-09-07 | 2020-03-18 | 삼성디스플레이 주식회사 | 발광 소자, 그의 제조 방법, 및 발광 소자를 구비한 표시 장치 |
| KR20220012337A (ko) * | 2019-05-24 | 2022-02-03 | 플레세이 세미컨덕터스 리미티드 | 패시베이션 층을 포함하는 발광 다이오드 전구체 |
| US12484347B2 (en) | 2018-11-06 | 2025-11-25 | The Regents Of The University Of California | Method of forming micro-LEDs with ultra-low leakage current |
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| US9865772B2 (en) | 2015-01-06 | 2018-01-09 | Apple Inc. | LED structures for reduced non-radiative sidewall recombination |
| US10297581B2 (en) | 2015-07-07 | 2019-05-21 | Apple Inc. | Quantum dot integration schemes |
| US10297719B2 (en) | 2015-08-27 | 2019-05-21 | Mikro Mesa Technology Co., Ltd. | Micro-light emitting diode (micro-LED) device |
| KR102402999B1 (ko) | 2015-08-31 | 2022-05-30 | 삼성디스플레이 주식회사 | 디스플레이 장치 및 이의 제조 방법 |
| DE102015120089A1 (de) * | 2015-11-19 | 2017-05-24 | Osram Opto Semiconductors Gmbh | Leuchtdiodenchip und Verfahren zur Herstellung eines Leuchtdiodenchips |
| KR102651054B1 (ko) * | 2016-02-22 | 2024-03-26 | 삼성디스플레이 주식회사 | 전사 장치, 이를 이용한 전사 방법 및 표시 장치 |
| US10132478B2 (en) | 2016-03-06 | 2018-11-20 | Svv Technology Innovations, Inc. | Flexible solid-state illumination devices |
| DE102016105407A1 (de) * | 2016-03-23 | 2017-09-28 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer elektronischen Vorrichtung und elektronische Vorrichtung |
| CN109155345B (zh) * | 2016-06-30 | 2022-10-28 | 苹果公司 | 用于减少的非辐射侧壁复合的led结构 |
| US10396241B1 (en) * | 2016-08-04 | 2019-08-27 | Apple Inc. | Diffusion revealed blocking junction |
| CN106340597B (zh) * | 2016-08-31 | 2019-01-18 | 纳晶科技股份有限公司 | 发光器件 |
| TWI648870B (zh) * | 2016-12-09 | 2019-01-21 | 英屬開曼群島商錼創科技股份有限公司 | 發光二極體晶片 |
| TWI646680B (zh) * | 2017-01-10 | 2019-01-01 | 英屬開曼群島商錼創科技股份有限公司 | 微型發光二極體晶片以及顯示面板 |
| US12015103B2 (en) * | 2017-01-10 | 2024-06-18 | PlayNitride Display Co., Ltd. | Micro light emitting diode display panel with option of choosing to emit light both or respectively of light-emitting regions |
| CN109216417B (zh) * | 2017-06-30 | 2023-10-17 | 乐金显示有限公司 | 显示装置 |
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- 2015-12-07 JP JP2017553307A patent/JP2018505567A/ja active Pending
- 2015-12-07 KR KR1020197027276A patent/KR20190109586A/ko not_active Withdrawn
- 2015-12-07 CN CN201580076368.9A patent/CN107408603B/zh active Active
- 2015-12-07 KR KR1020177020694A patent/KR20170100611A/ko not_active Ceased
- 2015-12-07 WO PCT/US2015/064295 patent/WO2016111789A1/en not_active Ceased
- 2015-12-07 KR KR1020217018569A patent/KR102380538B1/ko active Active
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| KR20190035319A (ko) * | 2017-09-26 | 2019-04-03 | 삼성전자주식회사 | 발광 칩들을 포함하는 디스플레이 및 그 제조 방법 |
| WO2019066223A1 (ko) * | 2017-09-26 | 2019-04-04 | 삼성전자주식회사 | 발광 칩들을 포함하는 디스플레이 및 그 제조 방법 |
| US11387220B2 (en) | 2017-09-26 | 2022-07-12 | Samsung Electronics Co., Ltd. | Display comprising light-emitting chips and manufacturing method therefor |
| KR20200029100A (ko) * | 2018-09-07 | 2020-03-18 | 삼성디스플레이 주식회사 | 발광 소자, 그의 제조 방법, 및 발광 소자를 구비한 표시 장치 |
| KR20230167334A (ko) * | 2018-09-07 | 2023-12-08 | 삼성디스플레이 주식회사 | 발광 소자, 그의 제조 방법, 및 발광 소자를 구비한 표시 장치 |
| US12484347B2 (en) | 2018-11-06 | 2025-11-25 | The Regents Of The University Of California | Method of forming micro-LEDs with ultra-low leakage current |
| KR20220012337A (ko) * | 2019-05-24 | 2022-02-03 | 플레세이 세미컨덕터스 리미티드 | 패시베이션 층을 포함하는 발광 다이오드 전구체 |
| KR20200023319A (ko) * | 2020-01-22 | 2020-03-04 | 엘지전자 주식회사 | 반도체 발광소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| US12490555B2 (en) | 2020-01-22 | 2025-12-02 | Lg Electronics Inc. | Display device using semiconductor light-emitting element and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3243223A1 (en) | 2017-11-15 |
| US20160197232A1 (en) | 2016-07-07 |
| CN107408603A (zh) | 2017-11-28 |
| KR20210076197A (ko) | 2021-06-23 |
| JP2020036038A (ja) | 2020-03-05 |
| WO2016111789A1 (en) | 2016-07-14 |
| KR20190109586A (ko) | 2019-09-25 |
| CN107408603B (zh) | 2020-04-14 |
| KR102380538B1 (ko) | 2022-03-29 |
| US9484492B2 (en) | 2016-11-01 |
| JP2018505567A (ja) | 2018-02-22 |
| EP3243223B1 (en) | 2022-06-08 |
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| S601 | Decision to reject again after remand of revocation | ||
| A107 | Divisional application of patent | ||
| PA0104 | Divisional application for international application |
St.27 status event code: A-0-1-A10-A18-div-PA0104 St.27 status event code: A-0-1-A10-A16-div-PA0104 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |