KR20140146666A - 레이저 처리 방법 및 장치 - Google Patents

레이저 처리 방법 및 장치 Download PDF

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Publication number
KR20140146666A
KR20140146666A KR1020147033084A KR20147033084A KR20140146666A KR 20140146666 A KR20140146666 A KR 20140146666A KR 1020147033084 A KR1020147033084 A KR 1020147033084A KR 20147033084 A KR20147033084 A KR 20147033084A KR 20140146666 A KR20140146666 A KR 20140146666A
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KR
South Korea
Prior art keywords
laser beam
laser
processing
workpiece
beam path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020147033084A
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English (en)
Korean (ko)
Inventor
도널드 이. 와일
브라이언 시. 조한슨
Original Assignee
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 filed Critical 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Publication of KR20140146666A publication Critical patent/KR20140146666A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multi-focusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
KR1020147033084A 2006-05-02 2007-05-01 레이저 처리 방법 및 장치 Ceased KR20140146666A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/417,269 US7834293B2 (en) 2006-05-02 2006-05-02 Method and apparatus for laser processing
US11/417,269 2006-05-02
PCT/US2007/067945 WO2007130986A1 (en) 2006-05-02 2007-05-01 Method and apparatus for laser processing

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020087026659A Division KR101509549B1 (ko) 2006-05-02 2007-05-01 레이저 처리 방법 및 장치

Publications (1)

Publication Number Publication Date
KR20140146666A true KR20140146666A (ko) 2014-12-26

Family

ID=38660278

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020147033084A Ceased KR20140146666A (ko) 2006-05-02 2007-05-01 레이저 처리 방법 및 장치
KR1020087026659A Expired - Fee Related KR101509549B1 (ko) 2006-05-02 2007-05-01 레이저 처리 방법 및 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020087026659A Expired - Fee Related KR101509549B1 (ko) 2006-05-02 2007-05-01 레이저 처리 방법 및 장치

Country Status (8)

Country Link
US (1) US7834293B2 (https=)
JP (3) JP2009535222A (https=)
KR (2) KR20140146666A (https=)
CN (1) CN101432857B (https=)
DE (1) DE112007001065T5 (https=)
GB (1) GB2451782A (https=)
TW (1) TWI386266B (https=)
WO (1) WO2007130986A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210024612A (ko) * 2018-08-08 2021-03-05 로저스 저매니 게엠베하 금속-세라믹 기판을 처리하는 방법, 상기 방법을 수행하기 위한 시스템 및 상기 방법에 의해 제조된 금속-세라믹 기판

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007012815B4 (de) * 2007-03-16 2024-06-06 Dmg Mori Ultrasonic Lasertec Gmbh Verfahren und Vorrichtung zur Bildung eines Gesenks
US7947919B2 (en) * 2008-03-04 2011-05-24 Universal Laser Systems, Inc. Laser-based material processing exhaust systems and methods for using such systems
US8024060B2 (en) * 2008-06-16 2011-09-20 Electro Scientific Industries, Inc. Method for defining safe zones in laser machining systems
WO2010048733A1 (en) * 2008-10-29 2010-05-06 Oerlikon Solar Ip Ag, Trübbach Method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation
KR101448444B1 (ko) * 2010-06-10 2014-10-15 에스티에스반도체통신 주식회사 무선 신호 검사 기능을 가지는 비아 홀 가공용 레이저 장치 및 그 가공 방법
US8263899B2 (en) * 2010-07-01 2012-09-11 Sunpower Corporation High throughput solar cell ablation system
SG11201402324VA (en) * 2011-11-16 2014-06-27 Applied Materials Inc Laser scribing systems, apparatus, and methods
CN103600171B (zh) * 2013-04-28 2015-12-09 宝山钢铁股份有限公司 一种金属板上下料及切割的方法及系统
CN103600170B (zh) * 2013-04-28 2015-08-26 宝山钢铁股份有限公司 一种纵向金属板上下料与切割方法及其系统
US10618131B2 (en) * 2014-06-05 2020-04-14 Nlight, Inc. Laser patterning skew correction
KR102781391B1 (ko) 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
CN108367389B (zh) 2015-11-23 2020-07-28 恩耐公司 激光加工方法和装置
JP6382901B2 (ja) * 2016-09-29 2018-08-29 ファナック株式会社 レーザー加工システム
CN110139727B (zh) 2016-12-30 2022-04-05 伊雷克托科学工业股份有限公司 用于延长镭射处理设备中的光学器件生命期的方法和系统
JP6844901B2 (ja) * 2017-05-26 2021-03-17 株式会社ディスコ レーザ加工装置及びレーザ加工方法
KR20250039487A (ko) 2018-06-05 2025-03-20 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
KR102122778B1 (ko) * 2018-10-10 2020-06-15 (주)성현 테크놀로지 레이저 및 드릴을 이용한 미세 홀 가공방법
TWI843784B (zh) 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
WO2020251782A1 (en) 2019-06-10 2020-12-17 Electro Scientific Industries, Inc. Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same
CN110899998A (zh) * 2019-11-29 2020-03-24 上海精测半导体技术有限公司 一种激光切割设备以及校准方法
KR102429862B1 (ko) * 2019-12-12 2022-08-05 두원포토닉스 주식회사 이종파장의 레이저 빔을 이용한 레이저 가공 장치 및 그 방법
JP7575971B2 (ja) * 2021-03-09 2024-10-30 Ｊｓｗアクティナシステム株式会社 レーザ照射装置、レーザ照射方法、及び有機ｅｌディスプレイの製造方法
CN113618262B (zh) * 2021-10-12 2021-12-14 江油星联电子科技有限公司 一种铝基印制电路板用开料装置
CN116072583B (zh) 2023-02-13 2024-01-30 无锡星微科技有限公司 一种基于视觉的晶圆预对准平台以及对准方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60210390A (ja) * 1984-04-05 1985-10-22 Kokusan Denki Co Ltd レ−ザ加工方法及び装置
JPS61125712A (ja) * 1984-11-26 1986-06-13 Matsushita Electric Works Ltd 多層印刷配線板の孔穿設法
JPS61172003A (ja) * 1985-01-28 1986-08-02 Hitachi Ltd プリント基板パタ−ン検査装置
JPS62144890A (ja) * 1985-12-20 1987-06-29 Mitsubishi Electric Corp レ−ザ裁断機
DE3743902A1 (de) * 1986-12-26 1988-07-07 Mitsubishi Electric Corp Laserbearbeitungsvorrichtung
US5111406A (en) * 1990-01-05 1992-05-05 Nicolet Instrument Corporation Method for determining drill target locations in a multilayer board panel
JP2578035B2 (ja) * 1991-08-28 1997-02-05 日本写真印刷株式会社 基板位置決め方法
JPH0620899A (ja) 1992-07-01 1994-01-28 Nikon Corp 薄膜除去装置
JP3253784B2 (ja) * 1993-12-17 2002-02-04 日立ビアメカニクス株式会社 多層プリント基板の内層パターン位置検出方法および穴明け加工方法並びにその装置
US5841099A (en) 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
JPH09506827A (ja) * 1994-10-18 1997-07-08 レーザー マシーニング， インコーポレイテッド 固定ビームレーザシステムとともに用いるダブルｘ−ｙテーブルシステム
JP3077539B2 (ja) * 1994-12-22 2000-08-14 松下電器産業株式会社 レーザ加工方法
JPH08290282A (ja) * 1995-04-21 1996-11-05 Sanyo Mach Works Ltd レーザ溶接装置
JPH1058173A (ja) * 1996-08-27 1998-03-03 Nikon Corp レーザ加工装置
US7732732B2 (en) * 1996-11-20 2010-06-08 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US5948291A (en) * 1997-04-29 1999-09-07 General Scanning, Inc. Laser beam distributor and computer program for controlling the same
EP0927597B1 (en) * 1997-11-03 2000-09-06 RAINER S.r.l. Machine for cutting sheet metal and similar
JPH11221690A (ja) * 1998-02-09 1999-08-17 Mitsubishi Electric Corp レーザ加工装置およびレーザ加工方法
EP0937532B1 (en) * 1998-02-19 2002-11-06 M J Technologies Limited Laser drilling with optical feedback
US6340806B1 (en) * 1999-12-28 2002-01-22 General Scanning Inc. Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train
JP3364464B2 (ja) * 2000-01-18 2003-01-08 川崎重工業株式会社 自動加工装置
WO2001074529A2 (en) 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
JP2002011588A (ja) * 2000-06-28 2002-01-15 Sumitomo Heavy Ind Ltd レーザドリル加工機及びレーザを用いた加工方法
JP4132014B2 (ja) 2001-03-28 2008-08-13 凸版印刷株式会社 レーザ加工装置及び加工方法
JP3855684B2 (ja) * 2001-06-05 2006-12-13 松下電器産業株式会社 レーザ加工装置およびレーザ加工方法
JP2003112278A (ja) 2001-09-28 2003-04-15 Matsushita Electric Ind Co Ltd 加工装置及びその加工方法
WO2003080283A1 (en) * 2002-03-26 2003-10-02 Mitsubishi Denki Kabushiki Kaisha Laser beam positioning device for laser machining, apparatus
JP4143334B2 (ja) * 2002-05-24 2008-09-03 日立ビアメカニクス株式会社 プリント基板穴明け用レーザ加工機の制御方法
US6580054B1 (en) * 2002-06-10 2003-06-17 New Wave Research Scribing sapphire substrates with a solid state UV laser
US6610961B1 (en) * 2002-07-25 2003-08-26 Matsushita Electric Industrial Co., Ltd. System and method of workpiece alignment in a laser milling system
US6706999B1 (en) * 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
JP4215677B2 (ja) * 2003-08-25 2009-01-28 日立ビアメカニクス株式会社 レーザ加工機及びレーザ加工方法
US20050205778A1 (en) * 2003-10-17 2005-09-22 Gsi Lumonics Corporation Laser trim motion, calibration, imaging, and fixturing techniques
FR2883503B1 (fr) * 2005-03-23 2020-11-06 Datacard Corp Machine de marquage laser a haute cadence

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210024612A (ko) * 2018-08-08 2021-03-05 로저스 저매니 게엠베하 금속-세라믹 기판을 처리하는 방법, 상기 방법을 수행하기 위한 시스템 및 상기 방법에 의해 제조된 금속-세라믹 기판

Also Published As

Publication number Publication date
US7834293B2 (en) 2010-11-16
JP2009535222A (ja) 2009-10-01
KR101509549B1 (ko) 2015-04-06
DE112007001065T5 (de) 2009-04-23
CN101432857B (zh) 2011-07-06
US20070257012A1 (en) 2007-11-08
GB0820346D0 (en) 2008-12-17
TWI386266B (zh) 2013-02-21
JP2016074040A (ja) 2016-05-12
GB2451782A (en) 2009-02-11
TW200800457A (en) 2008-01-01
CN101432857A (zh) 2009-05-13
WO2007130986A1 (en) 2007-11-15
KR20090005121A (ko) 2009-01-12
JP2013126691A (ja) 2013-06-27
JP6147325B2 (ja) 2017-06-14

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