FR2883503B1 - Machine de marquage laser a haute cadence - Google Patents
Machine de marquage laser a haute cadence Download PDFInfo
- Publication number
- FR2883503B1 FR2883503B1 FR0502904A FR0502904A FR2883503B1 FR 2883503 B1 FR2883503 B1 FR 2883503B1 FR 0502904 A FR0502904 A FR 0502904A FR 0502904 A FR0502904 A FR 0502904A FR 2883503 B1 FR2883503 B1 FR 2883503B1
- Authority
- FR
- France
- Prior art keywords
- laser marking
- marking machine
- laser
- high rate
- supports
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D29/00—Independent underground or underwater structures; Retaining walls
- E02D29/02—Retaining or protecting walls
- E02D29/0258—Retaining or protecting walls characterised by constructional features
- E02D29/0266—Retaining or protecting walls characterised by constructional features made up of preformed elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/0342—Observing magnetic fields related to the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/0344—Observing the speed of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/44—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements
- B41J2/442—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements using lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/47—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
- B41J2/471—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/41—Marking using electromagnetic radiation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K1/00—Methods or arrangements for marking the record carrier in digital fashion
- G06K1/12—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
- G06K1/126—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching by photographic or thermographic registration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/19—Specific article or web
- B65H2701/1914—Cards, e.g. telephone, credit and identity cards
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D2600/00—Miscellaneous
- E02D2600/20—Miscellaneous comprising details of connection between elements
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D2600/00—Miscellaneous
- E02D2600/40—Miscellaneous comprising stabilising elements
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Theoretical Computer Science (AREA)
- Electromagnetism (AREA)
- Mining & Mineral Resources (AREA)
- General Engineering & Computer Science (AREA)
- Structural Engineering (AREA)
- Civil Engineering (AREA)
- Paleontology (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Laser Beam Processing (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Lasers (AREA)
- Dot-Matrix Printers And Others (AREA)
- Duplication Or Marking (AREA)
Abstract
La présente invention concerne une machine de marquage laser (5, 5', 5") de supports (81), éventuellement de cartes (8) comportant éventuellement des circuits intégrés (80), caractérisée en ce que la machine de marquage laser comprend:- au moins une chambre laser (59, 59', 59") comportant au moins deux emplacements de marquage (52a, 52a', 52a", 52b, 52b', 52b", 54a', 54a", 54b', 54b") pour recevoir des supports (81) à marquer sur au moins une face par au moins un moyen de marquage laser (52, 52', 52") comportant des moyens optiques permettant de dévier le faisceau laser (509) sur l'un des emplacements de marquage (52a, 52a', 52a", 52b, 52b', 52b", 54a', 54a", 54b', 54b"),- au moins un dispositif de transfert (2) comportant un chemin de transfert transportant les supports (81) à marquer ou marqués vers ou hors de la chambre laser (59, 59', 59").
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0502904A FR2883503B1 (fr) | 2005-03-23 | 2005-03-23 | Machine de marquage laser a haute cadence |
US11/136,719 US7329830B2 (en) | 2005-03-23 | 2005-05-25 | High-rate laser marking machine |
SG200601828A SG126095A1 (en) | 2005-03-23 | 2006-03-21 | High-rate laser marking machine |
CA002540562A CA2540562A1 (fr) | 2005-03-23 | 2006-03-21 | Marqueuse laser a haute vitesse |
AT06290461T ATE475144T1 (de) | 2005-03-23 | 2006-03-22 | LASERMARKIERMASCHINE MIT GROßER GESCHWINDIGKEIT |
DE602006015555T DE602006015555D1 (de) | 2005-03-23 | 2006-03-22 | Lasermarkiermaschine mit großer Geschwindigkeit |
TW095109817A TW200701080A (en) | 2005-03-23 | 2006-03-22 | High-rate laser marking machine |
EP06290461A EP1705600B1 (fr) | 2005-03-23 | 2006-03-22 | Machine de marquage laser à haute cadence |
EP08075212.4A EP1967982B1 (fr) | 2005-03-23 | 2006-03-22 | Machine de marquage laser à haute vitesse |
CN200610105456XA CN1927597B (zh) | 2005-03-23 | 2006-03-23 | 高速激光标印机 |
KR1020060026575A KR20060103194A (ko) | 2005-03-23 | 2006-03-23 | 고속 레이저 마킹 머신 |
JP2006080114A JP2006297483A (ja) | 2005-03-23 | 2006-03-23 | 高速レーザマーキングマシン |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0502904A FR2883503B1 (fr) | 2005-03-23 | 2005-03-23 | Machine de marquage laser a haute cadence |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2883503A1 FR2883503A1 (fr) | 2006-09-29 |
FR2883503B1 true FR2883503B1 (fr) | 2020-11-06 |
Family
ID=35929990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0502904A Active FR2883503B1 (fr) | 2005-03-23 | 2005-03-23 | Machine de marquage laser a haute cadence |
Country Status (11)
Country | Link |
---|---|
US (1) | US7329830B2 (fr) |
EP (2) | EP1967982B1 (fr) |
JP (1) | JP2006297483A (fr) |
KR (1) | KR20060103194A (fr) |
CN (1) | CN1927597B (fr) |
AT (1) | ATE475144T1 (fr) |
CA (1) | CA2540562A1 (fr) |
DE (1) | DE602006015555D1 (fr) |
FR (1) | FR2883503B1 (fr) |
SG (1) | SG126095A1 (fr) |
TW (1) | TW200701080A (fr) |
Families Citing this family (30)
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FR2898528B1 (fr) * | 2006-03-14 | 2008-05-30 | Datacard Corp | Machine de marquage laser a haute cadence |
US7834293B2 (en) * | 2006-05-02 | 2010-11-16 | Electro Scientific Industries, Inc. | Method and apparatus for laser processing |
DE102006052380B4 (de) * | 2006-11-07 | 2013-04-25 | Mühlbauer Ag | Vorrichtung und Verfahren zum Einbringen von Informationen in einen Datenträger |
DE102007052999B4 (de) * | 2007-11-05 | 2015-05-21 | Volkswagen Ag | Verfahren zur Ansteuerung eines Laserscanners |
KR100869095B1 (ko) * | 2007-12-24 | 2008-11-17 | 주식회사 세다스미디어 | 레이저마킹장치 |
KR100966292B1 (ko) * | 2008-07-09 | 2010-06-28 | 주식회사 조성 | 반도체 패키지 마킹 장치와 그 작동방법 |
FR2939516B1 (fr) * | 2008-12-05 | 2011-01-21 | Thales Sa | Telemetre |
FR2939421B1 (fr) | 2008-12-05 | 2011-01-14 | Datacard Corp | Dispositif ascenseur pour machine de personnalisation et machine de personnalisation munie d'un dispositif ascenseur |
DE102009031871B4 (de) * | 2009-07-06 | 2013-10-24 | Nanosec Gesellschaft Für Nanotechnologie In Der Sicherheitstechnik MBH | Verfahren und Vorrichtung zur Laserbeschriftung |
KR101135537B1 (ko) * | 2010-07-16 | 2012-04-13 | 삼성모바일디스플레이주식회사 | 레이저 조사 장치 |
JP5825647B2 (ja) * | 2010-07-23 | 2015-12-02 | エントラスト・データカード・コーポレイシヨン | 一連の携帯用オブジェクトを個人化する方法および装置 |
KR101299235B1 (ko) * | 2011-11-08 | 2013-08-22 | 주식회사 이오테크닉스 | 카드 마킹 유닛 및 이를 이용한 카드 마킹 방법 |
US9387691B2 (en) | 2011-12-20 | 2016-07-12 | First Solar, Inc. | Method and apparatus for laser marking an object |
AT512386B1 (de) * | 2012-01-12 | 2016-09-15 | Medek & Schoerner Gmbh | Vorrichtung zur lasermarkierung von langgestreckten körpern |
US8786650B1 (en) * | 2012-03-07 | 2014-07-22 | Express Scripts, Inc. | Systems and methods for pharmacy messaging |
JP6373272B2 (ja) | 2012-10-22 | 2018-08-15 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 対象物にマーキングを施すための方法及び装置 |
EP2969373A4 (fr) * | 2013-03-13 | 2016-11-16 | Applied Materials Inc | Plate-forme d'ablation par laser pour cellules solaires |
KR101425814B1 (ko) * | 2013-03-26 | 2014-08-06 | 와이제이링크 주식회사 | 레이저마킹 장치 |
DE102015110264A1 (de) * | 2015-06-25 | 2016-12-29 | Cl Schutzrechtsverwaltungs Gmbh | Vorrichtung zur generativen Herstellung wenigstens eines dreidimensionalen Objekts |
FR3046112B1 (fr) * | 2015-12-23 | 2019-06-14 | Idemia France | Procede de realisation d'images selectivement visibles en variant l'angle d'observation par gravure au travers d'un reseau lenticulaire |
DE202016009207U1 (de) * | 2016-01-08 | 2023-12-08 | Entrust Corporation | Kartendruckmechanismus mit Kartenrückführweg |
DE102016112878A1 (de) * | 2016-07-13 | 2018-01-18 | Slcr Lasertechnik Gmbh | Verfahren und Vorrichtung zum Aufbringen eines Codes auf eine unbehandelte oder behandelte Tierhaut |
US10814668B2 (en) * | 2016-11-08 | 2020-10-27 | Jeffery James Jackson | Kiosk and method for making puzzle tags |
CN107284040B (zh) * | 2017-06-05 | 2018-12-18 | 沈阳友联电子装备有限公司 | 一种ic卡激光打标方法及打标装置 |
CN107175415A (zh) * | 2017-07-12 | 2017-09-19 | 裴向东 | 一种激光增强装置及电弧焊接系统 |
CN107570883A (zh) * | 2017-10-17 | 2018-01-12 | 深圳华创兆业科技股份有限公司 | 激光铣切装置 |
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CN114994247A (zh) * | 2020-11-29 | 2022-09-02 | 昆山富瑞捷机电设备有限公司 | 一种基于自动镭标的检查装置 |
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KR100191892B1 (ko) * | 1995-11-30 | 1999-06-15 | 이형도 | 광검출장치 |
US5937270A (en) * | 1996-01-24 | 1999-08-10 | Micron Electronics, Inc. | Method of efficiently laser marking singulated semiconductor devices |
US6417484B1 (en) * | 1998-12-21 | 2002-07-09 | Micron Electronics, Inc. | Laser marking system for dice carried in trays and method of operation |
US6262388B1 (en) * | 1998-12-21 | 2001-07-17 | Micron Electronics, Inc. | Laser marking station with enclosure and method of operation |
JP3254430B2 (ja) * | 1999-01-18 | 2002-02-04 | サンクス株式会社 | レーザマーカ装置 |
US6420792B1 (en) * | 1999-09-24 | 2002-07-16 | Texas Instruments Incorporated | Semiconductor wafer edge marking |
DE10026499A1 (de) * | 2000-05-27 | 2001-12-06 | Isola Ag | Vorrichtung und Verfahren zur Beschriftung von kupferkaschierten Laminaten |
US6359253B1 (en) * | 2000-07-12 | 2002-03-19 | Advanced Micro Devices, Inc. | Unit-in-tray pocket checker |
JP2003010985A (ja) * | 2001-06-29 | 2003-01-15 | Toppan Forms Co Ltd | レーザ加工による真正マーク内蔵部材 |
DE10146820B4 (de) * | 2001-09-19 | 2005-02-24 | Tampoprint Gmbh | Dekoriervorrichtung und Verfahren zum Dekorieren von Oberflächen |
JP2003145284A (ja) * | 2001-11-13 | 2003-05-20 | Meidensha Corp | 製造番号印字装置 |
JP2003260578A (ja) | 2002-03-07 | 2003-09-16 | Printing Bureau Ministry Of Finance | 冊子穿孔搬送装置 |
JP2003290939A (ja) * | 2002-03-28 | 2003-10-14 | Sunx Ltd | レーザマーキング装置 |
JP4134590B2 (ja) * | 2002-04-23 | 2008-08-20 | 松下電工株式会社 | メモリーカード成形品のレーザーマーキング方法、メモリーカード成形品、メモリーカード用熱可塑性樹脂組成物の流動性評価方法 |
FR2840831B1 (fr) * | 2002-06-17 | 2005-01-14 | Erca Formseal | Dispositif et procede pour marquer des articles a l'aide d'un rayon laser |
DE102004022744A1 (de) | 2004-05-07 | 2005-11-24 | Atlantic Zeiser Gmbh | Verfahren zum Bearbeiten von Informationsträgern, insbesondere von Identifikationsmitteln, wie Pässen, ID-Karten o. dgl. und Einrichtung zur Durchführung |
-
2005
- 2005-03-23 FR FR0502904A patent/FR2883503B1/fr active Active
- 2005-05-25 US US11/136,719 patent/US7329830B2/en active Active
-
2006
- 2006-03-21 SG SG200601828A patent/SG126095A1/en unknown
- 2006-03-21 CA CA002540562A patent/CA2540562A1/fr not_active Abandoned
- 2006-03-22 AT AT06290461T patent/ATE475144T1/de not_active IP Right Cessation
- 2006-03-22 EP EP08075212.4A patent/EP1967982B1/fr not_active Revoked
- 2006-03-22 TW TW095109817A patent/TW200701080A/zh unknown
- 2006-03-22 DE DE602006015555T patent/DE602006015555D1/de active Active
- 2006-03-22 EP EP06290461A patent/EP1705600B1/fr not_active Revoked
- 2006-03-23 JP JP2006080114A patent/JP2006297483A/ja active Pending
- 2006-03-23 KR KR1020060026575A patent/KR20060103194A/ko not_active Application Discontinuation
- 2006-03-23 CN CN200610105456XA patent/CN1927597B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US7329830B2 (en) | 2008-02-12 |
CN1927597B (zh) | 2011-10-12 |
JP2006297483A (ja) | 2006-11-02 |
TW200701080A (en) | 2007-01-01 |
SG126095A1 (en) | 2006-10-30 |
EP1967982B1 (fr) | 2016-08-03 |
EP1705600A2 (fr) | 2006-09-27 |
EP1967982A3 (fr) | 2008-11-12 |
ATE475144T1 (de) | 2010-08-15 |
EP1705600A3 (fr) | 2006-12-13 |
FR2883503A1 (fr) | 2006-09-29 |
US20060213879A1 (en) | 2006-09-28 |
KR20060103194A (ko) | 2006-09-28 |
CA2540562A1 (fr) | 2006-09-23 |
CN1927597A (zh) | 2007-03-14 |
EP1967982A2 (fr) | 2008-09-10 |
DE602006015555D1 (de) | 2010-09-02 |
EP1705600B1 (fr) | 2010-07-21 |
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