EP2969373A4 - Plate-forme d'ablation par laser pour cellules solaires - Google Patents

Plate-forme d'ablation par laser pour cellules solaires

Info

Publication number
EP2969373A4
EP2969373A4 EP14775131.7A EP14775131A EP2969373A4 EP 2969373 A4 EP2969373 A4 EP 2969373A4 EP 14775131 A EP14775131 A EP 14775131A EP 2969373 A4 EP2969373 A4 EP 2969373A4
Authority
EP
European Patent Office
Prior art keywords
solar cells
laser ablation
ablation platform
platform
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14775131.7A
Other languages
German (de)
English (en)
Other versions
EP2969373A1 (fr
Inventor
Rohit Dey
Jeffrey L Franklin
Giridhar Basappa
Marulasiddeswara Karisiddappa
Penchala N Kankanala
Christopher T Lane
James M Gee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP2969373A1 publication Critical patent/EP2969373A1/fr
Publication of EP2969373A4 publication Critical patent/EP2969373A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Laser Beam Processing (AREA)
EP14775131.7A 2013-03-13 2014-01-31 Plate-forme d'ablation par laser pour cellules solaires Withdrawn EP2969373A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361780657P 2013-03-13 2013-03-13
PCT/US2014/014306 WO2014158346A1 (fr) 2013-03-13 2014-01-31 Plate-forme d'ablation par laser pour cellules solaires

Publications (2)

Publication Number Publication Date
EP2969373A1 EP2969373A1 (fr) 2016-01-20
EP2969373A4 true EP2969373A4 (fr) 2016-11-16

Family

ID=51624997

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14775131.7A Withdrawn EP2969373A4 (fr) 2013-03-13 2014-01-31 Plate-forme d'ablation par laser pour cellules solaires

Country Status (4)

Country Link
EP (1) EP2969373A4 (fr)
CN (1) CN105073333B (fr)
TW (1) TWI630970B (fr)
WO (1) WO2014158346A1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2940740A1 (fr) * 2014-05-02 2015-11-04 Applied Materials, Inc. Balayage de bord et alignement
KR20170001452A (ko) * 2015-06-26 2017-01-04 주식회사 코윈디에스티 고속 텍스쳐링 방법 및 시스템
JP2017113788A (ja) * 2015-12-24 2017-06-29 株式会社リコー 光加工装置
CN105810769B (zh) * 2016-05-24 2019-02-22 晋能清洁能源科技股份公司 一种背钝化太阳能电池的激光开槽结构
CN106077954B (zh) * 2016-07-11 2018-01-30 长沙理工大学 一种非熔透激光焊接方法
CN106112280B (zh) * 2016-07-11 2018-03-13 长沙理工大学 一种激光穿孔加工方法
CN106064278B (zh) * 2016-07-11 2018-01-19 长沙理工大学 一种基于局部真空气氛的镀锌钢板激光搭接焊接方法
WO2018127295A1 (fr) * 2017-01-09 2018-07-12 Applied Materials Italia S.R.L. Appareil de traitement de substrats utilisés dans la fabrication de cellules solaires, système de fabrication de cellules solaires et procédé de traitement de substrats utilisés dans la fabrication de cellules solaires
CN106944745A (zh) * 2017-04-22 2017-07-14 山东拜科通新材料科技有限公司 一种加工大幅面电路的激光加工方法
CN108666374B (zh) * 2018-05-18 2020-03-17 通威太阳能（安徽）有限公司 一种背面钝化矩阵点式激光开槽导电结构
JP6740299B2 (ja) 2018-08-24 2020-08-12 ファナック株式会社 加工条件調整装置及び機械学習装置
CN110202256A (zh) * 2019-06-27 2019-09-06 常州捷佳创智能装备有限公司 三轴扫描振镜激光装置、电池片加工设备及其控制方法
CN111618447B (zh) * 2020-05-20 2022-04-01 Tcl华星光电技术有限公司 一种基板双侧激光切割装置及切割方法
DE102022109021A1 (de) * 2022-04-13 2023-10-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und Vorrichtung zum Ausbilden einer Struktur an einem Werkstück

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110126712A1 (en) * 2009-04-24 2011-06-02 Peter Gefter Separating contaminants from gas ions in corona discharge ionizing bars
CN202129246U (zh) * 2011-05-30 2012-02-01 昆山元崧电子科技有限公司 Pcb板表面除尘及静电消除设备
US20130052768A1 (en) * 2011-08-24 2013-02-28 Applied Materials, Inc. High speed laser scanning system for silicon solar cell fabrication

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6300593B1 (en) * 1999-12-07 2001-10-09 First Solar, Llc Apparatus and method for laser scribing a coated substrate
US7154066B2 (en) * 2002-11-06 2006-12-26 Ultratech, Inc. Laser scanning apparatus and methods for thermal processing
FR2883503B1 (fr) * 2005-03-23 2020-11-06 Datacard Corp Machine de marquage laser a haute cadence
JPWO2008053915A1 (ja) * 2006-11-02 2010-02-25 ナブテスコ株式会社 スキャナ光学システム、レーザ加工装置、及び、スキャナ光学装置
JP4085127B1 (ja) * 2007-10-02 2008-05-14 株式会社エムアンドシー 除滓吸引装置
JP2010044272A (ja) * 2008-08-14 2010-02-25 Omron Corp レーザ照射装置
CN101722369A (zh) * 2008-10-18 2010-06-09 江苏扬力数控机床有限公司 一种数控激光切割机的光程调整装置
KR20130059337A (ko) * 2010-03-30 2013-06-05 아이엠알에이 아메리카, 인코포레이티드. 레이저 기반 재료 가공 장치 및 방법들
JP5383920B2 (ja) * 2010-09-01 2014-01-08 三菱電機株式会社 レーザ加工装置および基板位置検出方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110126712A1 (en) * 2009-04-24 2011-06-02 Peter Gefter Separating contaminants from gas ions in corona discharge ionizing bars
CN202129246U (zh) * 2011-05-30 2012-02-01 昆山元崧电子科技有限公司 Pcb板表面除尘及静电消除设备
US20130052768A1 (en) * 2011-08-24 2013-02-28 Applied Materials, Inc. High speed laser scanning system for silicon solar cell fabrication

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 201215, Derwent World Patents Index; AN 2012-C18519, XP002762603 *
See also references of WO2014158346A1 *

Also Published As

Publication number Publication date
CN105073333A (zh) 2015-11-18
EP2969373A1 (fr) 2016-01-20
TW201434569A (zh) 2014-09-16
CN105073333B (zh) 2017-10-31
TWI630970B (zh) 2018-08-01
WO2014158346A1 (fr) 2014-10-02

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Legal Events

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