DE112007001065T5 - Verfahren und Vorrichtung zur Laserbearbeitung - Google Patents

Verfahren und Vorrichtung zur Laserbearbeitung Download PDF

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Publication number
DE112007001065T5
DE112007001065T5 DE112007001065T DE112007001065T DE112007001065T5 DE 112007001065 T5 DE112007001065 T5 DE 112007001065T5 DE 112007001065 T DE112007001065 T DE 112007001065T DE 112007001065 T DE112007001065 T DE 112007001065T DE 112007001065 T5 DE112007001065 T5 DE 112007001065T5
Authority
DE
Germany
Prior art keywords
workpiece
laser beam
laser
beam path
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112007001065T
Other languages
German (de)
English (en)
Inventor
Donald E. Beaverton Wile
Brian C. Hillsboro Johansen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of DE112007001065T5 publication Critical patent/DE112007001065T5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multi-focusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
DE112007001065T 2006-05-02 2007-05-01 Verfahren und Vorrichtung zur Laserbearbeitung Withdrawn DE112007001065T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/417,269 US7834293B2 (en) 2006-05-02 2006-05-02 Method and apparatus for laser processing
US11/417,269 2006-05-02
PCT/US2007/067945 WO2007130986A1 (en) 2006-05-02 2007-05-01 Method and apparatus for laser processing

Publications (1)

Publication Number Publication Date
DE112007001065T5 true DE112007001065T5 (de) 2009-04-23

Family

ID=38660278

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112007001065T Withdrawn DE112007001065T5 (de) 2006-05-02 2007-05-01 Verfahren und Vorrichtung zur Laserbearbeitung

Country Status (8)

Country Link
US (1) US7834293B2 (https=)
JP (3) JP2009535222A (https=)
KR (2) KR20140146666A (https=)
CN (1) CN101432857B (https=)
DE (1) DE112007001065T5 (https=)
GB (1) GB2451782A (https=)
TW (1) TWI386266B (https=)
WO (1) WO2007130986A1 (https=)

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US7947919B2 (en) * 2008-03-04 2011-05-24 Universal Laser Systems, Inc. Laser-based material processing exhaust systems and methods for using such systems
US8024060B2 (en) * 2008-06-16 2011-09-20 Electro Scientific Industries, Inc. Method for defining safe zones in laser machining systems
WO2010048733A1 (en) * 2008-10-29 2010-05-06 Oerlikon Solar Ip Ag, Trübbach Method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation
KR101448444B1 (ko) * 2010-06-10 2014-10-15 에스티에스반도체통신 주식회사 무선 신호 검사 기능을 가지는 비아 홀 가공용 레이저 장치 및 그 가공 방법
US8263899B2 (en) * 2010-07-01 2012-09-11 Sunpower Corporation High throughput solar cell ablation system
SG11201402324VA (en) * 2011-11-16 2014-06-27 Applied Materials Inc Laser scribing systems, apparatus, and methods
CN103600171B (zh) * 2013-04-28 2015-12-09 宝山钢铁股份有限公司 一种金属板上下料及切割的方法及系统
CN103600170B (zh) * 2013-04-28 2015-08-26 宝山钢铁股份有限公司 一种纵向金属板上下料与切割方法及其系统
US10618131B2 (en) * 2014-06-05 2020-04-14 Nlight, Inc. Laser patterning skew correction
KR102781391B1 (ko) 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
CN108367389B (zh) 2015-11-23 2020-07-28 恩耐公司 激光加工方法和装置
JP6382901B2 (ja) * 2016-09-29 2018-08-29 ファナック株式会社 レーザー加工システム
CN110139727B (zh) 2016-12-30 2022-04-05 伊雷克托科学工业股份有限公司 用于延长镭射处理设备中的光学器件生命期的方法和系统
JP6844901B2 (ja) * 2017-05-26 2021-03-17 株式会社ディスコ レーザ加工装置及びレーザ加工方法
KR20250039487A (ko) 2018-06-05 2025-03-20 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
DE102018119313B4 (de) * 2018-08-08 2023-03-30 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats und Anlage zum Durchführen des Verfahrens
KR102122778B1 (ko) * 2018-10-10 2020-06-15 (주)성현 테크놀로지 레이저 및 드릴을 이용한 미세 홀 가공방법
TWI843784B (zh) 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
WO2020251782A1 (en) 2019-06-10 2020-12-17 Electro Scientific Industries, Inc. Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same
CN110899998A (zh) * 2019-11-29 2020-03-24 上海精测半导体技术有限公司 一种激光切割设备以及校准方法
KR102429862B1 (ko) * 2019-12-12 2022-08-05 두원포토닉스 주식회사 이종파장의 레이저 빔을 이용한 레이저 가공 장치 및 그 방법
JP7575971B2 (ja) * 2021-03-09 2024-10-30 Ｊｓｗアクティナシステム株式会社 レーザ照射装置、レーザ照射方法、及び有機ｅｌディスプレイの製造方法
CN113618262B (zh) * 2021-10-12 2021-12-14 江油星联电子科技有限公司 一种铝基印制电路板用开料装置
CN116072583B (zh) 2023-02-13 2024-01-30 无锡星微科技有限公司 一种基于视觉的晶圆预对准平台以及对准方法

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US6407363B2 (en) 2000-03-30 2002-06-18 Electro Scientific Industries, Inc. Laser system and method for single press micromachining of multilayer workpieces

Also Published As

Publication number Publication date
US7834293B2 (en) 2010-11-16
JP2009535222A (ja) 2009-10-01
KR101509549B1 (ko) 2015-04-06
CN101432857B (zh) 2011-07-06
US20070257012A1 (en) 2007-11-08
GB0820346D0 (en) 2008-12-17
TWI386266B (zh) 2013-02-21
JP2016074040A (ja) 2016-05-12
GB2451782A (en) 2009-02-11
TW200800457A (en) 2008-01-01
KR20140146666A (ko) 2014-12-26
CN101432857A (zh) 2009-05-13
WO2007130986A1 (en) 2007-11-15
KR20090005121A (ko) 2009-01-12
JP2013126691A (ja) 2013-06-27
JP6147325B2 (ja) 2017-06-14

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Legal Events

Date Code Title Description
R005 Application deemed withdrawn due to failure to request examination

Effective date: 20140503