SG11201402324VA - Laser scribing systems, apparatus, and methods - Google Patents

Laser scribing systems, apparatus, and methods

Info

Publication number
SG11201402324VA
SG11201402324VA SG11201402324VA SG11201402324VA SG11201402324VA SG 11201402324V A SG11201402324V A SG 11201402324VA SG 11201402324V A SG11201402324V A SG 11201402324VA SG 11201402324V A SG11201402324V A SG 11201402324VA SG 11201402324V A SG11201402324V A SG 11201402324VA
Authority
SG
Singapore
Prior art keywords
methods
laser scribing
scribing systems
systems
laser
Prior art date
Application number
SG11201402324VA
Inventor
James Matthew Holden
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201402324VA publication Critical patent/SG11201402324VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
SG11201402324VA 2011-11-16 2012-11-15 Laser scribing systems, apparatus, and methods SG11201402324VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161560747P 2011-11-16 2011-11-16
PCT/US2012/065225 WO2013074752A1 (en) 2011-11-16 2012-11-15 Laser scribing systems, apparatus, and methods

Publications (1)

Publication Number Publication Date
SG11201402324VA true SG11201402324VA (en) 2014-06-27

Family

ID=48281042

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201402324VA SG11201402324VA (en) 2011-11-16 2012-11-15 Laser scribing systems, apparatus, and methods

Country Status (8)

Country Link
US (1) US20130122687A1 (en)
EP (1) EP2780932A4 (en)
JP (1) JP2015502041A (en)
KR (1) KR20140092402A (en)
CN (1) CN103959452A (en)
SG (1) SG11201402324VA (en)
TW (1) TW201334118A (en)
WO (1) WO2013074752A1 (en)

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DE102015211017B4 (en) * 2015-06-16 2017-06-14 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Method for unloading a cut-free part of the workpiece, associated laser cutting machine and computer program product
EP3296054B1 (en) * 2016-09-19 2020-12-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing a micro-machined workpiece by means of laser ablation
JP6340459B1 (en) * 2017-08-09 2018-06-06 株式会社ソディック Manufacturing method of wire dies
JP6968693B2 (en) * 2017-12-28 2021-11-17 株式会社ディスコ Processing equipment
KR102374612B1 (en) * 2019-08-22 2022-03-15 삼성디스플레이 주식회사 Laser apparatus and laser machining method
US11901232B2 (en) * 2020-06-22 2024-02-13 Applied Materials, Inc. Automatic kerf offset mapping and correction system for laser dicing

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JPS6240986A (en) * 1985-08-20 1987-02-21 Fuji Electric Corp Res & Dev Ltd Laser beam machining method
JP3165304B2 (en) * 1992-12-04 2001-05-14 株式会社半導体エネルギー研究所 Semiconductor device manufacturing method and semiconductor processing apparatus
EP0739260A1 (en) * 1994-10-18 1996-10-30 Laser Machining, Inc. Double x-y table system for use with a fixed beam laser system
JP2002096187A (en) * 2000-09-18 2002-04-02 Sumitomo Heavy Ind Ltd Laser beam machine and machining method
US7157038B2 (en) * 2000-09-20 2007-01-02 Electro Scientific Industries, Inc. Ultraviolet laser ablative patterning of microstructures in semiconductors
KR100401752B1 (en) * 2000-11-27 2003-10-17 삼성전자주식회사 Vertical type sawing apparatus
US6559411B2 (en) * 2001-08-10 2003-05-06 First Solar, Llc Method and apparatus for laser scribing glass sheet substrate coatings
US20050155956A1 (en) * 2002-08-30 2005-07-21 Sumitomo Heavy Industries, Ltd. Laser processing method and processing device
JP4215677B2 (en) * 2003-08-25 2009-01-28 日立ビアメカニクス株式会社 Laser processing machine and laser processing method
US7699896B1 (en) * 2004-11-16 2010-04-20 Technolines, Llc Surface pretreatment of fabrics for laser writing applications
JP2007237242A (en) * 2006-03-09 2007-09-20 Hitachi Via Mechanics Ltd Laser beam machining apparatus
US7834293B2 (en) * 2006-05-02 2010-11-16 Electro Scientific Industries, Inc. Method and apparatus for laser processing
JP2008080346A (en) * 2006-09-26 2008-04-10 Sony Corp Laser beam machining device and laser beam machining method
JP2008110383A (en) * 2006-10-31 2008-05-15 Disco Abrasive Syst Ltd Laser beam machining apparatus
US7777155B2 (en) * 2007-02-21 2010-08-17 United Technologies Corporation System and method for an integrated additive manufacturing cell for complex components
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CN101999166A (en) * 2008-04-11 2011-03-30 应用材料股份有限公司 Dynamic scribe alignment for laser scribing, welding or any patterning system
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TWI519369B (en) * 2008-10-10 2016-02-01 Ｉｐｇ微系統有限公司 Laser machining systems,laser machining mathod, and optical head
TW201039956A (en) * 2008-11-19 2010-11-16 Applied Materials Inc Laser scribing platform with moving gantry
WO2010059595A2 (en) * 2008-11-19 2010-05-27 Applied Materials, Inc. Laser-scribing tool architecture
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Also Published As

Publication number Publication date
TW201334118A (en) 2013-08-16
EP2780932A4 (en) 2015-04-29
KR20140092402A (en) 2014-07-23
US20130122687A1 (en) 2013-05-16
WO2013074752A1 (en) 2013-05-23
CN103959452A (en) 2014-07-30
JP2015502041A (en) 2015-01-19
EP2780932A1 (en) 2014-09-24

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