KR101270287B1 - Laser processing method, laser processing system and processing controller - Google Patents

Abstract

In the laser processing method of laser processing a plurality of workpieces simultaneously by a plurality of laser lights, WHEREIN: The 1st information recording process hole initially set to a 1st workpiece, and the 2nd information recording process hole initially set to a 2nd workpiece | work. The first after calculating the stamping hole aberration which is the hole aberration, setting the additional processing hole equal to the marking hole aberration to the processing hole of the smaller hole number, and setting the additional processing hole to the processing hole of the smaller hole number The laser beam is irradiated to the information recording processing hole and the second information recording processing hole at the same time to form the first and second information recording processing holes.

Description

LASER PROCESSING METHOD, LASER PROCESSING SYSTEM AND PROCESSING CONTROLLER}

The present invention relates to a laser processing method, a laser processing apparatus, and a processing control device for simultaneously laser processing a plurality of works with a plurality of laser lights.

The laser processing apparatus which laser-processes several workpiece (workpiece) simultaneously is provided with the some processing head and the some processing table. For example, when the laser processing apparatus is a two-head (two processing head) laser processing apparatus, each processing table is arrange | positioned under each processing head (for example, refer patent document 1). Such a laser processing apparatus may inscribe (form) the processing hole (product processing hole) for a product, and information (processing hole for information recording), such as a product number, on a workpiece | work. This stamp is formed so that a letter, a symbol, etc. may be shown by arranging several process holes other than a product.

The two-head laser processing apparatus irradiates laser light so that the same product processing hole is formed in each processing table when forming the product processing hole. In addition, when the two-head laser processing apparatus forms processing holes (engraving) peculiar to each product such as a product number, the laser beam is irradiated to one processing table to form a stamp on one processing table, and then the other. The laser beam was irradiated to the processing table of the side, and the engraving on the other processing table was formed. In other words, when engraving different characters etc. in each processing table, after imprinting the workpiece | work of the right side, the workpiece | work of the left side was carved. The laser light applied to the other processing table is blocked by a shutter or the like so that the laser light is not irradiated onto the other processing table when the engraving is formed on one processing table.

[Patent Document 1] Japanese Unexamined Patent Application Publication No. 2008-055458

However, when the shutter is arranged in the conventional two-head laser processing apparatus and the stamping on each processing table is performed in sequence, there is a problem that the tact time of the stamping time becomes long. For example, when the number management information is carved into each work, the work is carved into the work in the order of the right processing table and the left processing table. For this reason, when imprinting another character in the left-right process table, the double time stamping time was required compared with the case of imprinting the same character in the left-right process table.

This invention is made | formed in view of the said problem, and an object of this invention is to obtain the laser processing method, laser processing apparatus, and processing control apparatus which can imprint information in a short time when imprinting other information on the workpiece | work on each table.

MEANS TO SOLVE THE PROBLEM In order to solve the above-mentioned subject and achieve the objective, this invention is a laser processing method which laser-processes a several workpiece | work simultaneously with a several laser beam, WHEREIN: The processing hole different from the processing hole for products is prescribed | regulated on each said workpiece | work. The first information recording processing hole initially set in the first work among the workpieces set in the information recording area for each of the workpieces on which the information recording processing holes are arranged by being arranged at a position; 2 The minority side which is a hole aberration calculation step which calculates the hole aberration with the processing hole for information recording, and the processing hole of the one with the smaller hole number of the processing hole among the said 1st information recording process hole, and the said 2nd information recording process hole. A processing hole addition step of setting additional processing holes equal to the hole aberration in the processing holes, and the minority side processing holes; A processing hole for simultaneously irradiating a laser beam to the first information recording processing hole and the second information recording processing hole after setting the additional processing hole in the first hole to form the first and second information recording processing holes; It is characterized by including a formation step.

In the laser processing method according to the present invention, laser processing is performed by setting additional processing holes equal to the number of hole aberrations in the processing holes with the smaller number of processing holes in the information recording processing holes, thereby imprinting different information on each work. In this case, the information can be engraved in a short time.

1 is a diagram illustrating a configuration of a laser processing apparatus according to the first embodiment.
FIG. 2 is a diagram illustrating a configuration of a laser processing mechanism according to the first embodiment. FIG.
3 is a view for explaining an arrangement position of a marking area.
4 is a diagram illustrating a configuration of a marking area.
5 is a flowchart showing a processing procedure of laser processing.
6 is a diagram illustrating an example of a marking setting region set in the marking region.
7 is a diagram for explaining additional candidate coordinates.
8 is a diagram for explaining additionally set marking holes.
9 is a diagram for explaining a machining procedure in the minority region.
It is a figure which shows an example of the marking hole formed in the minority side area | region.
11 is a diagram for explaining additional candidate coordinates when a plurality of additional candidate coordinates are set between the marking setting regions.
It is a figure which shows the structure of the laser processing apparatus which concerns on Embodiment 2. FIG.
It is a figure which shows the structure of the laser processing mechanism which concerns on Embodiment 2. FIG.
FIG. 14 is a diagram for explaining a dummy area in the case where a dummy area is provided in a scan area used in a product area.

EMBODIMENT OF THE INVENTION Below, the laser processing method, laser processing apparatus, and processing control apparatus which concern on embodiment of this invention are demonstrated in detail based on drawing. In addition, this invention is not limited by this embodiment.

Embodiment 1

1 is a diagram illustrating a configuration of a laser processing apparatus according to the first embodiment. 1 A of laser processing apparatuses irradiate a laser beam to a workpiece | work (work WL, WR mentioned later), and a process hole is provided to the workpiece | work WL of the left side (L-axis side), and the workpiece | work WR of the right side (R-axis side). It is a two-head laser processing apparatus for forming a.

The laser processing apparatus 1A of this embodiment has a processing hole for a product (product processing hole H to be described later) and an information recording processing hole (marking holes hL and hR to be described later) on the workpieces WL and WR. Is formed by laser processing.

The marking hole (the first information recording processing hole, hL) and the marking hole (the second information recording processing hole, hR) are related to products, such as a product number formed on each workpiece | work WL and WR, for example. It is formed (inscribed) to represent information (hereinafter referred to as product information). Specifically, the marking holes hL and hR are formed so as to represent letters, symbols, figures, and the like by arranging one to a plurality of processing holes (work holes not made of products). Product information is information unique to each product, and varies from product to product. Therefore, the processing holes constituting the marking holes hL and hR have different arrangements for the products to be stamped.

The laser processing apparatus 1A forms 1-several products in each workpiece | work WL and WR by forming several product processing hole H in each workpiece | work WL and WR. Hereinafter, while forming one product in each workpiece | work WL and WR, the marking hole hL is imprinted on the product formed in the workpiece | work WL, and the hole imprinted in the product formed in the workpiece | work WR is shown below. The case where (hR) is carved is demonstrated. In addition, below, the case where a product information (a stamp character) is a one-digit product number is demonstrated.

The laser processing apparatus 1A uses the machining program 3 to form marking holes hL and hR corresponding to products formed on the respective workpieces WL and WR on the products of the workpieces WL and WR. . The laser processing apparatus 1A forms the marking holes hL and hR in a predetermined area (marking areas SL and SR described later) on the product. The laser processing apparatus 1A has a processing control apparatus 10A and a laser processing mechanism (laser processing part, 20A).

The processing control apparatus 10A is connected to the laser processing mechanism 20A. The processing control apparatus 10A of the present embodiment controls the laser processing mechanism 20A so as to simultaneously form the marking hole hL and the marking hole hR. 20 A of laser processing mechanisms perform the laser processing of each workpiece | work WL and WR based on the process instruction | command from 10 A of process control apparatuses.

Next, the structure of the process control apparatus 10A is demonstrated. The processing control device 10A includes an input unit 11, a processing hole counting unit 12, a hole aberration calculating unit 13, a differential processing position selecting unit (processing hole adding unit 14), and a processing sequence calculating unit 15 And a processing instruction unit 16, a stamping information storage unit 17, and a control unit 19.

The input part 11 inputs the machining program 3 which processes the workpiece | work WL, WR, and various instruction | indication information from a user. The input unit 11 sends the input machining program 3 to the machining hole count unit 12 and the like, and sends the input instruction information to the controller 19.

The marking information storage unit 17 is a memory for storing marking information relating to the marking holes hL and hR. The marking information is information on the arrangement of the marking holes hL and hR constituting the marking character in the marking area (information recording area SL, SR), and the marking hole constituting the marking character in the marking area SL, SR. (hL, hR) information (for example, intermediate coordinates of the marking hole hL and the marking hole hL) between the holes (hereinafter referred to as the inter-hole coordinates), and the marking holes constituting the imprinted characters hL , hR) is configured to include information on the processing sequence. The marking holes hL and hR constituting the marking character are arranged at predetermined intervals. Therefore, the inter-hole coordinates are determined based on the intervals at which the imprinting holes hL and hR are arranged.

The inter-hole coordinates are preliminary marking hole candidate coordinates prepared in advance (additional candidate coordinates Cx to be described later) in order to form the marking hole hL and the marking hole hR at the same time (processing starts simultaneously and ends processing at the same time). to be. The inter-hole coordinates are in the region (hereinafter referred to as the minority side region) in which the number of the marking holes hL and hR constituting the imprinted characters in the marking regions SL and SR is smaller among the marking regions SL and SR. It is a candidate coordinate of the marking hole which will be set further (additional marking hole bx mentioned later). The marking hole of the minority side area | region among the marking hole hL and hR turns into a minority side process hole.

The marking holes hL and hR are formed at positions designated by the machining program 3. For example, when the product information formed in the workpiece | work WL is the product number "1", the position of the marking area SL which forms the product number "1" and a product number is set in the process program 3. In the marking information storage unit 17, the arrangement of the marking holes hL necessary for marking the marking characters of "1" in advance, the inter-hole coordinates with respect to the marking holes hL, and the like are stored.

The machining hole counting unit 12 extracts product information to be formed on the workpieces WL and WR from the machining program 3, and also marks holes hL and hR corresponding to the product information (engraving characters). ) Is extracted from the imprint information storage unit 17. The machining hole count unit 12 counts the number of machining holes hL and hR (the number of machining holes). The machining hole count part 12 sends the machining hole number of the counting marking holes hL and hR to the hole aberration calculation part 13.

The hole aberration calculating unit 13 uses the number of processing holes of the marking holes hL and hR counted by the processing hole count unit 12 to determine the number of processing holes of the marking holes hL and the marking holes hR. The difference (stamping hole aberration) is calculated. The hole aberration calculating unit 13 sends to the differential machining position selection unit 14 the information of which the minority side of the marking area SL and the marking area SR is and the calculated marking hole aberration as hole aberration information. .

The differential machining position selection unit 14 extracts, from the stamping information storage unit 17, the inter-hole coordinates of the stamping character set in the minority side region. The differential machining position selection unit 14 selects the additional candidate coordinates Cx equal to the stamping hole aberration from the additional candidate coordinates Cx set in the inter-hole coordinates. For example, when the marking hole aberration is four holes, the differential machining position selection unit 14 selects four additional candidate coordinates Cx among the additional candidate coordinates Cx set in the inter-hole information. The additional candidate coordinates Cx selected by the differential machining position selection unit 14 become additionally set engraving holes bx, and are added to the minority side region. The additional candidate coordinates Cx in the inter-hole information selected by the differential machining position selection unit 14 may be any additional candidate coordinates Cx, for example, four additional candidates in order from the set upper side (lower order of setting number). Coordinate Cx is selected.

The machining order calculation unit 15 uses the additionally set marking hole bx formed at the additional stamping position and the initially set marking hole ax initially set in the minority side region, in the minority region where the additionally set marking hole bx is added. Calculate the processing sequence of the processing hole. The machining order calculation part 15 calculates the machining procedure in a minority side area | region so that the machining time in a minority side area | region may be shortest, for example. Moreover, the processing order calculation part 15 can also calculate the processing order in the minority side area | region so that the movement distance of the processing position from a processing hole to a processing hole may be shortest. In addition, in order to prevent the temperature rise of the workpiece | work WL and WR in each machining position, the machining order calculation part 15 may distribute a machining position and a machining sequence so that the movement distance of a machining position may become more than predetermined distance.

The machining instruction unit 16 uses a machining program 3, marking information, and a machining order of the minority side region to generate a machining instruction specifying a position of the product machining hole H and the marking holes hL and hR. Output to 20A).

The control unit 19 includes an input unit 11, a processing hole counting unit 12, a hole aberration calculating unit 13, a differential processing position selecting unit 14, a processing sequence calculating unit 15, a processing instruction unit 16, The stamping information storage unit 17 is controlled. The product information set in the machining program is not limited to specific characters and the like, and may be actual coordinates of the marking holes hL and hR for forming the product information.

Next, the structure of the laser processing mechanism 20A is demonstrated. FIG. 2 is a diagram illustrating a configuration of a laser processing mechanism according to the first embodiment. FIG. In FIG. 2, the structural example of the laser processing mechanism which multiaxialized the laser beam 2 is shown. The laser processing mechanism 20A is configured to perform laser processing with an actuator of R-axis and L-axis (for example, galvano), and has a spectrometer 28 and two pairs of laser heads 29L, 29R. The work tables 25L and 25R on which the workpieces WL and WR are mounted are provided.

The laser heads 29L and 29R each have galvano scanner mirrors 22a and 22b, galvano scanners 23a and 23b and an fθ lens 24, respectively. The laser light 2 output by the laser oscillator is spectroscopically by the spectrometer 28, and the spectroscopic laser light 2 is simultaneously supplied to the laser heads 29L and 29R. Then, the laser light 2 irradiated from the laser heads 29L and 29R simultaneously performs perforation processing on the respective workpieces WL and WR.

The galvano scanner mirror 22a is a first galvano scanner mirror that receives the laser light 2 output by a laser oscillator not shown. The galvano scanner mirror 22a is connected to the drive shaft of the galvano scanner 23a, and the drive shaft of the galvano scanner 23a faces the Z-axis direction. The mirror surface of the galvano scanner mirror 22a displaces in accordance with the rotation of the drive shaft of the galvano scanner 23a, and deflects the optical axis of the incident laser light 2 in the first direction (for example, the X axis direction). Scanning is carried out to the galvano scanner mirror 22b.

The galvano scanner mirror 22b is a second galvano scanner mirror that receives the laser light 2 from the galvano scanner mirror 22a. The galvano scanner mirror 22b is connected to the drive shaft of the galvano scanner 23b, and the drive shaft of the galvano scanner 23b faces the Y-axis direction. The mirror surface of the galvano scanner mirror 22b is displaced according to the rotation of the drive shaft of the galvano scanner 23b, and the second direction (for example, orthogonal to the optical axis of the incident laser light 2 substantially perpendicular to the first direction). Deflective scanning in the Y-axis direction) is sent to the fθ lens 24.

The fθ lens 24 condenses and irradiates the laser light 2 scanned two-dimensionally in the XY plane onto the workpieces WL and WR. Work WL, WR, such as a printed circuit board material and a ceramic green sheet, has a planar shape, and the processing table 25 mounts the work WL, WR in XY plane.

In the laser processing mechanism 20A, the processing table 25 is moved within the XY plane, and the laser light 2 is scanned two-dimensionally by the galvano scanners 23a and 23b. Thereby, the workpiece processing hole H and the marking hole hL, in the workpiece | work WL, WR in the scan area in the range which can scan the laser beam 2 two-dimensionally by the galvano scanner 23a, 23b. hR) is formed. In addition, in FIG. 2, although 20A of 2 head laser processing mechanisms were demonstrated, 4 head or more of 20 A of laser processing mechanisms may be sufficient.

Next, the marking areas SL and SR in which the marking holes hL and hR are formed will be described. 3 is a view for explaining an arrangement position of a marking area, and FIG. 4 is a diagram illustrating a configuration of the marking area.

As shown in FIG. 3, the laser light 2 is spectroscopically by the spectrometer 28, and the spectroscopic laser light 2 is irradiated to the workpieces WL and WR, respectively. Coordinates (coordinates within the workpiece) on the workpiece WL of the laser light 2 irradiated to the workpieces WL, WR and the coordinates within the workpiece on the workpiece WR are the same coordinates. Thereby, the same product processing hole H is formed in the same coordinate on the workpiece | work WL and WR, and the same product is formed on the workpiece | work WL and WR.

In a predetermined position (for example, near the end of the workpiece WL) on the workpiece WL, a marking region SL for forming the marking hole hL is provided, and a predetermined position (for example, the workpiece WR) is provided. In the vicinity of the end part of WR, the marking area | region SR for forming the marking hole hR is provided. In this embodiment, this marking area | region SL and the marking area | region SR are made into the same workpiece | work area, and the other marking characters are simultaneously formed in marking area | region SL and SR. In other words, the product processing hole H is formed at the same work coordinates by the laser light 2 irradiated at the same timing, whereas the marking holes hL and hR are applied to the laser light 2 irradiated at the same timing. By other coordinates in the workpiece.

Since the marking area SL and the marking area SR are the same areas, the configuration of the marking area SL will be described here. As shown in FIG. 4, the stamped area SL is a spherical area, and a plurality of square areas (marked hole candidates BL) in the vertical direction (row direction) and the horizontal direction (column direction). The matrix is arranged in a shape. In FIG. 4, columns, rows, column numbers, row numbers, and the like are described in the marking area SL, but these are described for convenience of description, and such characters or areas are not arranged in the actual marking area SL. Only the marking hole candidate BL is arrange | positioned.

In FIG. 4, the marking hole candidate BL of (5 horizontal columns) X (13 vertical lines) = 65 is shown in the marking area | region SL. The marking hole candidate BL is a candidate of the processing hole which forms the marking hole hL, and among these candidates, the predetermined marking hole candidate BL is set to the actual marking hole hL. In FIG. 4, the square area | region set to the actual marking hole hL among the marking hole candidate BL is shown by the marking setting area | region AL. Among the marking hole candidates BL, some of the marking hole candidates BL are set to the marking setting area AL, so that one letter or the like such as the numeral “1” is displayed in one marking area SL. 1 to 2 marking area | region SL is arrange | positioned at the product on the workpiece | work WL, and 1 to a plurality of letters etc. are formed by 1 to plurality of marking area | region SL. This embodiment demonstrates the case where one marking area | region SL is arrange | positioned at the product of the workpiece | work WL, and one marking area | region SR is arrange | positioned at the product of the workpiece | work WR.

In addition, the marking hole candidate BL and the marking setting area | region AL may not be limited to a square area | region, but may be an area | region of any shape, such as a rectangular area | region and a circular area | region. In addition, the marking areas SL and SR are not limited to the spherical area but may be areas of any shape such as a circular area.

Next, the processing procedure of laser processing is demonstrated. 5 is a flowchart showing a processing procedure of laser processing. The machining program 3 is input to the machining control device 10A from the input unit 11 (step S10). The input unit 11 sends the input machining program 3 to the machining hole count unit 12 and the machining instruction unit 16.

The machining hole counting unit 12 extracts product information to be formed on the workpieces WL and WR from the machining program 3, and also stamps holes hL and hR corresponding to the engraving characters of the product information. The arrangement (processing holes in the marking areas SL and SR) is extracted from the marking information storage unit 17. The machining hole count unit 12 counts the machining hole numbers of the marking holes hL and hR constituting each engraving character (step S20). The machining hole count part 12 sends the machining hole number of the marking holes hL and hR in the counting marking areas SL and SR to the hole aberration calculating part 13.

The hole aberration calculating unit 13 imprints a difference in the number of machining holes in the marking areas SL and SR by using the machining holes in the marking areas SL and SR counted by the machining hole count unit 12. It calculates as aberration (step S30). The hole aberration calculating unit 13 uses the information of which area is the minority side of the marking area SL and the marking area SR and the calculated marking hole aberration as the hole aberration information to the differential machining position selection unit 14. send.

Here, specific examples of the marking characters, the minority side region, and the marking hole aberrations set in the marking regions SL and SR will be described. 6 is a diagram illustrating an example of a marking setting region set in the marking region. In FIG. 6, the marking character which is "1" is formed in the marking area | region SL, and the marking character which is "2" is formed in the marking area | region SR is shown.

In the marking area SL, one marking hole hL is formed in the marking setting area AL, whereby a marking character of "1" is formed in the marking area SL. In addition, each marking hole hR is formed in the marking area | region SR in the marking area | region SR, and the marking character which is "2" is formed in the marking area | region SR. FIG. 6 shows a case where nine marking setting areas AL are set in the marking area SL, and thirteen marking setting areas AR are set in the marking area SR. In this case, therefore, the minority region is the marking region SL, and the marking hole aberration is four holes.

After calculating the marking hole aberration, the differential machining position selection unit 14 extracts from the marking information storage unit 17 the coordinates between the holes of the marking characters set in the minority side region. The differential machining position selection unit 14 selects four additional candidate coordinates Cx which are the same number as the stamped hole aberration from the additional candidate coordinates Cx set as the inter-hole coordinates. The differential machining position selection unit 14 sets an additional setting marking hole bx to the selected additional candidate coordinate Cx, and adds this additional setting marking hole bx to the minority side region.

FIG. 7 is a diagram for explaining additional candidate coordinates, and FIG. 8 is a diagram for describing additional setting marking holes. As shown in FIG. 7, in the marking area SL, additional candidate coordinates C1 to C7 are set between the marking setting area AL and the marking setting area AL as additional candidate coordinates Cx which are inter-hole coordinates. do. In this embodiment, the number of marking holes hL in the marking area SL and the number of marking holes hR in the marking area SR are set by setting any of the additional candidate coordinates C1 to C7 to the additional setting marking holes bx. The same number.

For example, when the differential machining position selector 14 selects the additional candidate coordinates C1 to C4, as shown in FIG. 8, the additional setting marking holes b1 to the additional candidate coordinates C1 to C4 as additional setting marking holes bx. b4 is set. Incidentally, one initial marking hole ax is set in each marking setting area AL. Specifically, initial marking holes a1 to a9 are set as the initial marking holes ax in the marking setting area AL in the marking area SL. Thereby, in the marking area | region SL, the marking hole hL which is 13 holes which consists of initial stage marking holes a1-a9 and the additional setup marking holes b1-b4 (the same number of marking holes (hR) hL)) is set. In this way, the differential machining position selection unit 14 sets the additionally set marking holes bx equal to the marking hole aberration to the marking characters having the smaller number of marking holes (step S40).

The machining order calculation unit 15 calculates the machining order of all the marking holes hL in the minority region based on the positions of all the marking holes hL including the initial marking holes ax and the additional marking holes bx. (Step S50). The machining order calculation part 15 calculates the machining procedure in the minority side area | region so that the movement distance of the machining position from a marking hole to a marking hole may be shortest, for example. For example, when calculating the processing order in the marking area | region SL shown in FIG. 8, the marking hole hL which is 13 holes which consists of initial stage marking holes a1-a9 and the additional setup marking holes b1-b4 is carried out. Based on the position, the machining procedure of the marking hole hL in the marking area SL is calculated.

It is a figure for demonstrating the processing procedure in the minority side area | region. In FIG. 9, the processing procedure at the time of setting a processing order in the marking area | region SL shown in FIG. 8 is shown. The machining order calculation part 15 extracts the marking hole of the edge part which comprises a marking character, the marking hole with the adjacent number with another marking hole, etc. from among the initialization marking hole a1-a9 and the additional setting marking hole b1-b4. In FIG. 9, the initial stage marking hole a1 was extracted as a marking hole of the edge part which comprises "1" which is a marking character among the initial stage marking holes a1-a9 and the additional stage marking holes b1-b4. Thereafter, the machining sequence calculation unit 15 sequentially extracts the marking holes adjacent to the marking holes extracted from the initially set marking holes a2 to a9 and the additional marking holes b1 to b4, and uses the extracted sequence as the processing order. The machining order calculation part 15 extracts the marking hole in the order shown, for example in (1)-(13).

(1) The initial marking hole a1 located at the end of the marking character is extracted.

(2) The additional-setup marking hole b1 adjacent to the initialization marking hole a1 is extracted.

(3) The initial setup marking hole a2 adjacent to the additional setup marking hole b1 is extracted.

(4) The initialization marking hole a3 adjacent to the initialization marking hole a2 is extracted.

(5) The additional-setup marking hole b2 adjacent to the initialization marking hole a3 is extracted.

(6) The initial setup marking hole a4 adjacent to the additional setup marking hole b2 is extracted.

(7) The additional-setup marking hole b3 adjacent to the initialization marking hole a4 is extracted.

(8) The initialization marking hole a5 adjacent to the additional setting marking hole b3 is extracted.

(9) The additional-setup marking hole b4 adjacent to the initialization marking hole a5 is extracted.

(10) The initial setup marking hole a6 adjacent to the additional setup marking hole b4 is extracted.

(11) The initialization marking hole a7 adjacent to the initialization marking hole a6 is extracted.

(12) The initialization marking hole a8 adjacent to the initialization marking hole a7 is extracted.

(13) The initialization marking hole a9 adjacent to the initialization marking hole a8 is extracted.

The processing order calculation part 15 sets the order of the marking hole extracted by (1)-(13) to the processing order of the marking hole in the marking area | region SL.

The machining instruction unit 16 uses a machining program 3, marking information, and a machining order of the minority side region to generate a machining instruction specifying a position of the product machining hole H and the marking holes hL and hR. Output to 20A). Specifically, the machining instruction unit 16 sends a machining instruction of the product machining hole H to the workpieces WL and WR based on the machining program 3. Moreover, the process instruction | command part 16 sends the process instruction | indication of the marking hole hL to the marking area | region SL based on the marking information and the process order which the process order calculation part 15 calculated. Moreover, the process instruction | command part 16 sends the process instruction | indication of the marking hole hR to the marking area | region SR based on marking information.

It is a figure which shows an example of the marking hole formed in the minority side area | region. In FIG. 10, the case where the marking hole hL is formed in the position of the initialization marking hole a1-a9 and the additional setting marking hole b1-b4 demonstrated in FIG. In this embodiment, since the additional setting marking hole bx is set to the inter-hole coordinate between the initial marking hall ax and initial marking hall ax which comprise a marking character, the marking character is formed, and it has a big influence on the appearance of a marking character. I can form an imprinted letter without giving it.

In addition, in this embodiment, although the case where one additional candidate coordinate Cx was set as the inter-hole coordinates between the marking setting area | region AL and the marking setting area | region AL was demonstrated, the marking setting area | region AL It is also possible to set a plurality of additional candidate coordinates Cx as the inter-hole coordinates between and the imprinting setting area AL.

11 is a diagram for explaining additional candidate coordinates when a plurality of additional candidate coordinates are set between the marking setting regions. In FIG. 11, the case where two additional candidate coordinates Cx are set between the marking setting area | region AL in the marking area | region SL is shown. In the marking area | region SL of FIG. 11, additional candidate coordinates C11 and C12 are set between the marking setting area | region AL which set the additional candidate coordinates C1 in the marking area | region SL shown in FIG. Additional candidate coordinates C13 and C14 are set between the marking setting areas AL where C2 is set. Similarly, the additional candidate coordinates C15, C16, the additional candidate coordinates C17, C18, and the additional candidate coordinates are respectively between the marking setting regions AL in which the additional candidate coordinates C3 to C7 are set in the marking area SL shown in FIG. C19, C20, additional candidate coordinates C21, C22, and additional candidate coordinates C23, C24 are set.

Thereby, even if the marking hole aberration is large, many additional setting marking holes bx can be set, so that the number of marking holes hL in the marking area SL and the number of marking holes hR in the marking area SR are adjusted. The same number becomes possible. In addition, although FIG. 11 shows the case where two additional candidate coordinates Cx are set between the marking setting area | regions AL in the marking area | region SL, one marking setting area | region AL in the marking area | regions SL and SR is shown. It is also possible to set three or more additional candidate coordinates Cx between). In addition, the additional candidate coordinates Cx to be set between one marking setting area AL do not have to be the same number among the marking setting areas AL, and the marking setting area according to the dimension between the marking setting areas AL is required. The number of additional candidate coordinates Cx set between (AL) may be determined.

In addition, a plurality of types of additional candidate coordinates Cx may be set between each of the marking setting areas AL in the marking areas SL and SR. For example, both the additional candidate coordinates Cx shown in FIG. 11 and the additional candidate coordinates Cx shown in FIG. 7 may be set. When a plurality of kinds of additional candidate coordinates Cx are set between the respective engraving setting areas AL, the differential machining position selection unit 14 selects some additional candidate coordinates Cx based on the size of the marking hole aberration, the processing conditions, and the like. Determine whether to use. The processing conditions are, for example, the number of laser pulses for one marking hole (hL, hR), the laser energy per pulse, the total laser energy irradiated to one marking hole (hL, hR), the work (WL, WR). ), The hole spacing of the marking holes hL and hR, the size of the marking holes hL and hR, and the like.

For example, when the number of laser pulses for one marking hole hL and hR is larger than a predetermined number, the differential machining position selection unit 14 sets additional candidate coordinates set between one marking setting area AL. It is determined that Cx uses stamping information smaller than a predetermined number (hereinafter, referred to as decimal-set stamping information). In addition, the differential machining position selection unit 14 determines that, for example, when the laser energy per pulse is larger than a predetermined value, the stamping information set in a small number is used. In addition, the differential machining position selection unit 14 determines that, for example, when the laser energy of the sum total irradiated to one of the marking holes hL and hR is larger than the predetermined value, the stamping information set in a small number is used. Further, the differential machining position selection unit 14 determines that, for example, when the laser light irradiation resistance of the workpieces WL and WR is lower than a predetermined value, the stamping information set in a small number is used. Further, the differential machining position selection unit 14 determines that, for example, when the hole spacing of the marking holes hL and hR is narrower than a predetermined value, the stamping information set in a small number is used. In addition, the differential machining position selection unit 14 determines that, for example, when the size (diameter or depth) of the marking holes hL and hR is larger than a predetermined value, the stamping information set in a small number is used. In addition, the differential machining position selection unit 14 determines that, for example, when the marking hole aberration is larger than the predetermined number, the stamping information set in a small number is used.

In the case of using the set number of stamping information, the overlap between the additionally set marking holes bx and the overlap of the additionally set marking holes bx and the initially set marking holes ax are reduced, so that machining of the high-quality workpieces WL and WR is performed. It becomes possible. In addition, it is possible to easily calculate a machining procedure for performing machining of the high-quality workpieces WL and WR. Moreover, when the additional candidate coordinate Cx set between one marking setting area AL uses the marking information more than a predetermined number, it becomes possible to form many additional setting marking holes bx.

Moreover, in this embodiment, although the case where one marking area | region SL is arrange | positioned at the product of the workpiece | work WL and one marking area | region SR is arrange | positioned to the product of the workpiece | work WR was demonstrated, A plurality of marking areas SL and SR may be disposed in WL and WR. In this case, the above-described additional setting marking holes bx are provided for the first marking area SL and the first marking area SR (first pair marking areas SL and SR), and the first pair of markings are performed within the same time. Processing in the engraving areas SL and SR is performed. As with the first pair of marking areas SL and SR, the above-described additional setting marking holes bx are provided for the second and subsequent marking areas SL and SR, and the second and subsequent marking areas SL are provided within the same time. And SR).

In addition, some or all of the additionally set marking holes bx formed in the marking area SL may overlap with other additionally set marking holes bx. Further, the additionally set marking hole bx formed in the marking area SL may overlap some or all of the initial marking hole ax. When the additional setting marking hole bx overlaps with all of the initial marking hole ax, the additional setting marking hole bx is set on the initial marking hole ax.

Whether to overlap the additionally set marking hole bx and the initial setting marking hole ax may be determined based on an externally input instruction from the user, and the differential machining position selection unit 14 is based on the machining conditions of the workpieces WL and WR. You can also judge. By overlapping the additionally set marking holes bx and the initializing marking holes ax, it is possible to set a plurality of additionally set marking holes bx in the marking areas SL and SR. In addition, by not overlapping the additionally set marking holes bx and the initial setting marking holes ax, it is possible to form high quality marking holes hL and hR without causing machining defects even when the machining conditions are severe.

The marking characters formed by the marking holes hL and hR are not limited to characters, symbols, figures, and the like, and may be any type of information such as a two-dimensional bar code or a mark. The product information is not limited to the product number, and may be any information such as a lot number and a production date and time.

In addition, in this embodiment, although the case where the additional candidate coordinate Cx was registered previously was demonstrated, the differential machining position selection part 14 can also set the additional candidate coordinate Cx automatically. In this case, the differential machining position selection unit 14 sets the additional candidate coordinates Cx based on the stamp hole aberration and the machining conditions.

Thus, the laser processing method of this embodiment is a laser processing apparatus 1A provided with 2 or more tables which counts the number of the marking holes hL and hR of left and right marking characters, and marking holes hL and hR. Calculating the stamping hole aberration from the letter with the smaller number and setting the additional marking hole bx, calculating the processing sequence for processing the stamping character at the shortest, additional setting marking hole bx and initial A step of processing the set stamping hole ax is included.

Thus, according to Embodiment 1, since the additional setting marking hole bx is set in the minority side area | region, and the number of marking holes hL and hR of the marking character formed in the marking area | region SL and SR is made the same number, it is a marking area | region Even in the case of forming different marking characters in the SL and SR, the marking characters can be formed in the marking regions SL and SR without using an optical shutter or the like. Therefore, different marking characters can be formed in the marking areas SL and SR with a simple and easy configuration.

In addition, since a stamp character is formed in the marking areas SL and SR without using an optical shutter or the like, the stamp character can be formed in a short time. In addition, since the additional setting marking hole bx is provided in the minority side area | region, a marking character can be formed in a short time rather than providing the additional setting marking hole bx other than the minority side area | region.

Embodiment 2 Fig.

Next, Embodiment 2 of this invention is described using FIGS. 12-14. In Embodiment 2, the laser beam 2 of the carved hole number difference is irradiated to another area | region (a separate position different from a decimal side area | region), without irradiating to a fractional side area | region.

It is a figure which shows the structure of the laser processing apparatus which concerns on Embodiment 2. FIG. Of each component of FIG. 12, the same number is attached | subjected about the component which achieves the same function as the laser processing apparatus 1A of Embodiment 1 shown in FIG. 1, and the overlapping description is abbreviate | omitted.

The laser processing apparatus 1B has the process control apparatus 10B and the laser processing mechanism 20B. The processing control apparatus 10B is connected to the laser processing mechanism 20B. The processing control apparatus 10B of this embodiment controls the laser processing mechanism 20B so that the marking hole hL and the marking hole hR may be formed simultaneously. Specifically, the processing control device 10B irradiates the damper 31 to be described later with the laser light 2 having the stamped hole number difference, or blocks the shutter 32 to be described later. The laser processing mechanism 20B performs laser processing of the workpieces WL and WR based on the processing instruction from the processing control device 10B.

Next, the structure of the process control apparatus 10B is demonstrated. The processing control apparatus 10B includes an input unit 11, a processing hole counting unit 12, a hole aberration calculating unit 13, a processing instruction unit 16, a stamping information storage unit 17, an irradiation control instruction unit 18, It has a control unit 19.

The irradiation control instructing unit 18 sends a control instruction to the laser processing mechanism 20B based on the stamping hole aberration calculated by the hole aberration calculating unit 13. The irradiation control instruction part 18 laser-processes the control instruction which irradiates the damper 31 with the laser light 2 for forming the marking hole of the same number as the marking hole aberration, or the control instruction which blocks | blocks with the shutter 32. Send to instrument 20B. The laser light 2 for forming the same number of marking holes as the marking hole aberration is the same number of pulse lasers as the laser light 2 irradiated to form the additionally set marking hole bx described in the first embodiment. As a result, in the present embodiment, instead of forming the additionally set marking holes bx with the laser light 2 having the marking hole difference, the laser light is not irradiated to the fractional side region with the laser light 2 having the marking hole difference. The processing mechanism 20B is controlled.

Next, the structure of the laser processing mechanism 20B is demonstrated. It is a figure which shows the structure of the laser processing mechanism which concerns on Embodiment 2. FIG. Of each component of FIG. 13, the same code | symbol is attached | subjected about the component which achieves the same function as the laser processing mechanism 20A of Embodiment 1 shown in FIG. 2, and the overlapping description is abbreviate | omitted. The laser processing mechanism 20B includes a spectrometer 28, two pairs of laser heads 30L and 30R, and processing tables 25L and 25R on which the workpieces WL and WR are placed.

The laser heads 30L and 30R have a damper 31 and a shutter 32 as compared with the laser heads 29L and 29R of the first embodiment. The damper 31 has a function of absorbing the laser light 2, and the laser light 2 having the difference in the number of holes stamped in the minority side region is irradiated to the damper 31, thereby inducing the difference in the number of holes in the minority side region. The laser light 2 is not irradiated to the minority region. The damper 31 is arranged in the vicinity of the fθ lens 24, and the laser light 2 of the carved hole difference in the minority side region is guided to the damper 31 from the galvano scanner mirror 22b.

The shutter 32 has a function of blocking the laser light 2, and the laser light 2 of the stamped hole difference in the minority side region is cut off by the shutter 32, whereby The laser light 2 is not irradiated to the minority region. The shutter 32 is attached to the front end of the galvano scanner mirror 22a so as to be opened and closed, and the laser light 2 to the galvano scanner mirror 22a can be blocked by closing the shutter 32. Moreover, the damper 31 and the shutter 32 can also be arrange | positioned at the position different from the position shown in FIG.

Next, the control process of the irradiation control instruction | indication part 18 is demonstrated. The irradiation control instruction unit 18 determines which of the damper 31 and the shutter 32 to use based on the stamped hole aberration calculated by the hole aberration calculating unit 13. For example, the irradiation control instruction unit 18 uses the damper 31 when the marking hole aberration is less than a predetermined number, and uses the shutter 32 when the marking hole aberration is a predetermined number or more. When the damper 31 is used, the irradiation control instruction unit 18 controls the laser processing mechanism 20B to irradiate the damper 31 with the laser light 2 having the difference in the number of holes stamped in the minority region. In addition, when the shutter 32 is used, the irradiation control instruction unit 18 controls the laser processing mechanism 20B so as to block the laser light 2 of the carved hole difference in the minority region by the shutter 32. In addition, when the shutter 32 is used, the irradiation control instruction unit 18 controls the laser processing mechanism 20B so as to block the laser light 2 having the difference in the number of holes in the minority region by the shutter 32.

In addition, the irradiation control instruction | indication part 18 can also determine which of the damper 31 and the shutter 32 to use based on a processing condition. The irradiation control instruction unit 18 determines that the damper 31 is used, for example, when the number of laser pulses for one of the marking holes hL and hR is smaller than a predetermined number. In addition, the irradiation control instruction | indication part 18 determines that the damper 31 is used, for example, when the laser energy per pulse is larger than predetermined value. In addition, the irradiation control instruction | indication part 18 determines that the damper 31 is used, for example, when the total laser energy irradiated to one marking hole hL and hR is larger than a predetermined value. In addition, the irradiation control instruction | indication part 18 determines that the damper 31 is used, for example, when the laser beam irradiation tolerance of the workpiece | work WL and WR is lower than predetermined value. In addition, the irradiation control instruction | indication part 18 determines that the damper 31 is used, for example, when the hole space | interval of the marking holes hL and hR is narrower than a predetermined value. In addition, the irradiation control instruction | indication part 18 determines that the damper 31 is used, for example, when the size of the marking holes hL and hR is larger than a predetermined value. Moreover, the irradiation control instruction | indication part 18 determines that the damper 31 is used, for example, when the marking hole aberration is larger than a predetermined number.

In addition, in this embodiment, the case where the laser heads 30L and 30R have both the damper 31 and the shutter 32 was demonstrated, respectively, but the laser heads 30L and 30R are the damper 31 and the shutter, respectively. The structure which has either of (32) may be sufficient. When the laser heads 30L and 30R have the damper 31, the laser light 2 of the carved hole number difference is irradiated to the damper 31. As shown in FIG. In addition, when the laser heads 30L and 30R have the shutter 32, the laser light 2 of the carved hole number difference is interrupted by the shutter 32. As shown in FIG. In addition, when the laser heads 30L and 30R have only one of the damper 31 and the shutter 32, the irradiation control instruction unit 18 needs to determine which of the damper 31 and the shutter 32 to use. There is no.

In addition, instead of the damper 31, a dummy area (area on the workpieces WL and WR different from the minority side area) for irradiating the laser light 2 of the stamped hole difference in the minority side area may be provided. The dummy region may be provided in the product region on the workpieces WL and WR, or may be provided in addition to the product region on the workpieces WL and WR. When the dummy region is provided in the product region on the workpieces WL and WR, the distance between the initial marking hole ax and the additional marking hole bx becomes short, so that the marking holes hL and hR can be formed in a short time. In addition, when the dummy region is provided outside the product regions on the workpieces WL and WR, the dummy regions can be arranged at various positions on the workpiece, so that the dummy regions can be easily arranged.

Further, the dummy area may be provided in the same scan area (in the scan areas of the galvano scanners 23a and 23b) as the product area. In this case, even if the dummy region is disposed outside the product regions on the workpieces WL and WR, it is possible to form the marking holes hL and hR in a short time.

FIG. 14 is a diagram for explaining a dummy area in the case where a dummy area is provided in a scan area used in a product area. In FIG. 14, the dummy area | region d used when carrying out the laser processing of the product area | region PL on the workpiece | work WL is shown.

When laser-machining the product area | region PL, the some scanning area G is provided and laser light is irradiated for every scanning area G. As shown in FIG. For example, when the marking area | region SL is arrange | positioned at the edge part (lower-right part in FIG. 14) of the product area | region PL, the scan area G at the time of laser processing the marking area | region SL is carried out. May be disposed over the product region PL and an outer region (out-product region) of the product region. In such a case, the dummy area d can be provided in the scan areas of the galvano scanners 23a and 23b by arranging the dummy area d in the vicinity of the marking area SL of the non-product area.

Moreover, the process control apparatus 10B may have the function of both the process control apparatuses 10A and 10B. In this case, the processing control device 10B includes the input unit 11, the processing hole counting unit 12, the hole aberration calculating unit 13, the differential processing position selecting unit 14, the processing sequence calculating unit 15, and processing It is comprised including the instruction | indication part 16, the marking information memory | storage part 17, the irradiation control instruction | indication part 18, and the control part 19. As shown in FIG. In the processing control device 10B, the differential machining position selection unit 14 uses the additionally set marking holes bx or the damper 31 and the shutter 32 based on the size of the marking hole aberration, the processing conditions, and the like. To judge.

For example, when the number of laser pulses for one marking hole hL and hR is smaller than a predetermined number, the differential machining position selection unit 14 determines that the additional setting marking hole bx is used. In addition, the differential machining position selection unit 14 determines that, for example, when the laser energy per pulse is smaller than the predetermined value, the additionally set engraving hole bx is used. In addition, the differential machining position selection unit 14 determines that, for example, when the laser energy of the sum total irradiated to one of the marking holes hL and hR is smaller than the predetermined value, the additional setting marking hole bx is used. In addition, the differential machining position selection unit 14 determines that the additionally set engraving hole bx is used, for example, when the laser light irradiation resistance of the workpieces WL and WR is lower than a predetermined value. In addition, the differential machining position selection unit 14 determines that the additionally set engraving hole bx is used, for example, when the hole spacing of the marking holes hL and hR is narrower than a predetermined value. In addition, the differential machining position selection unit 14 determines that, for example, when the size of the marking holes hL and hR is smaller than a predetermined value, the additional setting marking hole bx is used. In addition, the differential machining position selection unit 14 determines that, for example, when the stamping hole aberration is smaller than the predetermined number, the additionally set marking hole bx is used.

Further, the machining order calculation unit 15 may calculate the machining order of the marking holes hL and hR in the minority region based on the size of the marking hole aberration, the processing conditions, and the like. The machining order calculation unit 15 calculates the machining order so that the burden (working failure of the workpieces WL and WR) on the workpieces WL and WR is reduced based on the size of the stamp hole aberration, the machining conditions, and the like.

Thus, according to Embodiment 2, since the laser beam 2 of marking hole difference is irradiated to the fractional side area | region by using the damper 31, the shutter 32, the dummy area | region d, etc., it is a marking area | region Even in the case of forming other engraving characters on the SL and SR, the marking characters can be easily formed in a short time.

[Industrial Availability]

As mentioned above, the laser processing method, the laser processing apparatus, and the processing control apparatus which concern on this invention are suitable for the simultaneous processing of the several workpiece | work performed by several laser beams.

1A, 1B: laser processing device
2: laser light
10A, 10B: Process Control Unit
12: machining hole counting part
13: hole aberration calculator
14: differential machining position selector
15: processing sequence calculation unit
16: processing indicator
17: stamping information storage unit
18: probe control indicator
20A, 20B: Laser Processing Apparatus
22a, 22b: galvano scanner mirror
23a, 23b: galvano scanner
25L, 25R: Machining Table
29L, 29R, 30L, 30R: Laser Head
31: Damper
32: shutter
a1-a9: Initial stamping hole
b1 to b4: Additional setting stamping hole
d: dummy area
hL, hR: stamping hole
AL, AR: engraving setting area
BL, BR: imprinted hole candidate
C1 to C7, C11 to C24: Additional candidate coordinates
H: product processing hole
SL, SR: engraving area
WL, WR: Walk

Claims (10)

In the laser processing method of laser processing a plurality of workpieces simultaneously by a plurality of laser lights,
The first information initially set in the first of the work pieces, which is set in the information recording area for each work in which the processing holes for information recording are arranged by arranging processing holes different from the work holes for products at predetermined positions on the respective works. A hole aberration calculating step of calculating a hole aberration between a recording processing hole and a second information recording processing hole initially set to a second work among the workpieces;
The processing hole which sets the additional process hole of the same number as the said hole aberration to the minority side process hole which is a process hole with the smaller hole number of the process hole among the said 1st information recording process hole and the said 2nd information recording process hole. Additional steps,
The first and second information recording processing holes are irradiated with laser light simultaneously to the first information recording processing hole and the second information recording processing hole after setting the additional processing hole in the minority side processing hole. And a processing hole forming step of forming a hole. The laser processing method according to claim 1, wherein in the processing hole adding step, the additional processing hole is disposed between processing holes of the minority side processing hole. The laser processing method according to claim 2, wherein in the processing hole addition step, a plurality of the additional processing holes are disposed between the processing holes. The laser processing method according to claim 1, wherein the processing hole adding step is arranged such that the additional processing hole overlaps another additional processing hole or a minority processing hole. The processing time is the shortest in the processing hole for the first or second information recording after setting the additional processing holes equal to the hole aberration in the minority side processing hole after the processing hole adding step. Further comprising a machining sequence setting step for setting a machining sequence to be made,
The processing hole forming step forms the first and second information recording processing holes in accordance with a set processing procedure. In the laser processing method of laser processing a plurality of workpieces simultaneously by a plurality of laser lights,
The first information initially set in the first of the work pieces, which is set in the information recording area for each work in which the processing holes for information recording are arranged by arranging processing holes different from the work holes for products at predetermined positions on the respective works. A hole aberration calculating step of calculating a hole aberration between a recording processing hole and a second information recording processing hole initially set to a second work among the workpieces;
Whether additional processing holes equal to the above-described aberration are set in a minority side processing hole of which the hole number of the processing hole among the first information recording processing hole and the second information recording processing hole is smaller. An irradiation condition determination step of determining whether or not to irradiate the laser light of the hole number difference to a position different from the region where the minority side processing hole is arranged, based on the hole aberration or the processing conditions related to the laser processing;
When setting the additional processing hole, the laser beam is simultaneously irradiated to the first information recording processing hole and the second information recording processing hole after setting the additional processing hole in the minority side processing hole. When irradiating the laser light of the difference in number of holes to the separate position, the laser beam is simultaneously irradiated to the first information recording processing hole and the second information recording processing hole, and the And a irradiation control step of controlling to irradiate the laser light of the difference in number of holes. The laser processing method according to claim 6, wherein the separate position is an area on the workpiece different from a damper that absorbs the laser light, a shutter that blocks the laser light, or an area where the minority side processing hole is disposed. . The said irradiation condition determination step of Claim 7 WHEREIN: When it determines with irradiating a laser beam to the said separate position, when it is determined that the said damper, the said shutter, or the said minority side processing hole is arrange | positioned as the said separate position on the said workpiece | work The laser processing method characterized by selecting which area | region is selected based on the said hole aberration or the processing conditions concerning the said laser processing. In the laser processing apparatus which laser-processes a several workpiece | work simultaneously with a some laser light,
By arranging a processing hole different from a processing hole for a product at a predetermined position on each of the workpieces, the first information set in the information recording area for each of the workpieces on which the information recording processing holes are arranged and initially set to the first one of the workpieces. A hole aberration calculating unit for calculating a hole aberration between the recording processing hole and the second information recording processing hole initially set in the second work of the workpiece;
The processing hole which sets the additional process hole of the same number as the said hole aberration to the minority side process hole which is a process hole with the smaller hole number of the process hole among the said 1st information recording process hole and the said 2nd information recording process hole. Add-on,
The first and second information recording processing holes are irradiated with laser light simultaneously to the first information recording processing hole and the second information recording processing hole after setting the additional processing hole in the minority side processing hole. Laser processing apparatus having a laser processing portion for forming a. In the processing control device for controlling a plurality of workpieces to be laser processed at the same time by a plurality of laser light,
The first information initially set in the first of the work pieces, which is set in the information recording area for each work in which the processing holes for information recording are arranged by arranging processing holes different from the work holes for products at predetermined positions on the respective works. A hole aberration calculating unit for calculating a hole aberration between the recording processing hole and the second information recording processing hole initially set in the second work of the workpiece;
The processing hole which sets the additional process hole of the same number as the said hole aberration to the minority side process hole which is a process hole with the smaller hole number of the process hole among the said 1st information recording process hole and the said 2nd information recording process hole. Add-on,
The first and second information recording processing holes are irradiated with laser light simultaneously to the first information recording processing hole and the second information recording processing hole after setting the additional processing hole in the minority side processing hole. And a processing instruction unit for outputting a processing instruction to form a recess.

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