TWI371331B - Method and device of laser processing and control device of processing - Google Patents

Method and device of laser processing and control device of processing

Info

Publication number
TWI371331B
TWI371331B TW098121335A TW98121335A TWI371331B TW I371331 B TWI371331 B TW I371331B TW 098121335 A TW098121335 A TW 098121335A TW 98121335 A TW98121335 A TW 98121335A TW I371331 B TWI371331 B TW I371331B
Authority
TW
Taiwan
Prior art keywords
processing
control device
laser processing
laser
control
Prior art date
Application number
TW098121335A
Other languages
Chinese (zh)
Other versions
TW201038348A (en
Inventor
Kouichi Indou
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of TW201038348A publication Critical patent/TW201038348A/en
Application granted granted Critical
Publication of TWI371331B publication Critical patent/TWI371331B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW098121335A 2009-04-24 2009-06-25 Method and device of laser processing and control device of processing TWI371331B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/058197 WO2010122667A1 (en) 2009-04-24 2009-04-24 Laser processing method, laser processing system and processing controller

Publications (2)

Publication Number Publication Date
TW201038348A TW201038348A (en) 2010-11-01
TWI371331B true TWI371331B (en) 2012-09-01

Family

ID=43010802

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098121335A TWI371331B (en) 2009-04-24 2009-06-25 Method and device of laser processing and control device of processing

Country Status (5)

Country Link
JP (1) JP5236071B2 (en)
KR (1) KR101270287B1 (en)
CN (1) CN102341212B (en)
TW (1) TWI371331B (en)
WO (1) WO2010122667A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130122687A1 (en) * 2011-11-16 2013-05-16 Applied Materials, Inc. Laser scribing systems, apparatus, and methods
TW201431634A (en) * 2013-02-01 2014-08-16 Pard Hardware Ind Co Ltd Tool labeling method
JP6647888B2 (en) * 2016-01-29 2020-02-14 ビアメカニクス株式会社 Laser processing method and laser processing apparatus
JP6499616B2 (en) * 2016-06-10 2019-04-10 ファナック株式会社 Program creation device with function to optimize machining order
JP6783165B2 (en) * 2017-02-28 2020-11-11 ビアメカニクス株式会社 Laser processing equipment and laser processing method
CN107127463A (en) * 2017-05-27 2017-09-05 东莞市盛雄激光设备有限公司 A kind of HDI circuit borings machine
CN110919168A (en) * 2018-08-31 2020-03-27 大族激光科技产业集团股份有限公司 Laser processing system and laser processing method
KR102125030B1 (en) * 2018-12-07 2020-06-19 주식회사 이오테크닉스 Apparatus for laser marking and method of laser marking using the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4271969B2 (en) * 2003-03-18 2009-06-03 住友重機械工業株式会社 Method and apparatus for dividing data between multiple axes of laser beam machine
US20060000811A1 (en) * 2004-06-30 2006-01-05 Matsushita Electric Industrial Co., Ltd. Diffractive optical element changer for versatile use in laser manufacturing
JP2007237242A (en) * 2006-03-09 2007-09-20 Hitachi Via Mechanics Ltd Laser beam machining apparatus
JP4787091B2 (en) * 2006-06-27 2011-10-05 株式会社ディスコ Via hole processing method

Also Published As

Publication number Publication date
CN102341212B (en) 2014-07-09
KR20110106381A (en) 2011-09-28
WO2010122667A1 (en) 2010-10-28
JP5236071B2 (en) 2013-07-17
CN102341212A (en) 2012-02-01
TW201038348A (en) 2010-11-01
KR101270287B1 (en) 2013-05-31
JPWO2010122667A1 (en) 2012-10-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees