CN102341212B - Laser processing method, laser processing system and processing controller - Google Patents
Laser processing method, laser processing system and processing controller Download PDFInfo
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- CN102341212B CN102341212B CN200980157832.1A CN200980157832A CN102341212B CN 102341212 B CN102341212 B CN 102341212B CN 200980157832 A CN200980157832 A CN 200980157832A CN 102341212 B CN102341212 B CN 102341212B
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- machining hole
- hole
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- information recording
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Disclosed is a laser processing method for performing laser processing on a plurality of works simultaneously with a plurality of laser beams, wherein the difference in the number of punched holes, which is the difference between the number of processing holes for recording first information initially set in a first work and those for recording second information initially set in a second work, is calculated, and as many additional processing holes as the difference in the number of punched holes are set to processing holes smaller in number. After additional processing holes are set to the processing holes smaller in number, the processing holes for recording first information and the processing holes for recording second information are irradiated simultaneously with laser beams, thus forming processed holes for recording first and second information.
Description
Technical field
The present invention relates to a kind of laser processing, laser processing device and Working control device that utilizes multiple laser multiple workpiece to be carried out simultaneously to Laser Processing.
Background technology
The laser processing device that multiple workpiece (machined object) is carried out simultaneously to Laser Processing has multiple processing heads and multiple processing work platform.For example, the laser processing device that is two processing heads (processing head is 2) at laser processing device, configure processing work platform (for example,, with reference to patent documentation 1) at the downside of each processing head respectively.Sometimes utilize the information (information recording machining hole) such as this laser processing device mint-mark on workpiece (formation) machining hole for product (product machining hole) and production code member.This mint-mark is formed as, and by the multiple machining holes beyond product are arranged, thereby shows word or mark etc.
The laser processing device of two processing heads, in the time forming product machining hole, irradiates laser in the mode that forms identical product machining hole on each processing work platform.In addition, the laser processing device of two processing heads is in the time forming the peculiar machining holes of each product (mint-mark) such as production code member, on a processing work platform, irradiate laser, on a processing work platform, form after mint-mark, irradiate laser to another processing work platform, on another processing work platform, form mint-mark.In other words, on each processing work platform, different word of mint-mark etc., the workpiece on right side is being carried out after mint-mark, the workpiece in left side is being carried out to mint-mark.And, form mint-mark on a processing work platform time, utilize optical gate etc. by the laser cutting to another processing work platform, not irradiate laser to another processing work platform.
Patent documentation 1: TOHKEMY 2008-055458 communique
Summary of the invention
But, in the laser processing device of above-mentioned existing pair of processing head, configure optical gate, carry out successively in the situation of the mint-mark on each processing work platform, there is the elongated problem of pitch time of mint-mark time.For example, the in the situation that of sheet number management being carried out to mint-mark by information on each workpiece, with the order of the processing work platform in the processing work platform on right side, left side to mint-mark on workpiece.Therefore, on processing work platform to the left and right mint-mark different literals, compared with the situation of the same word of mint-mark on processing work platform to the left and right, need the mint-mark time of 2 times.
The present invention In view of the foregoing proposes, and its object is, obtains a kind of laser processing, laser processing device and Working control device, and it can be on the workpiece on each workbench when the different information of mint-mark, with shorter time mint-mark information.
In order to solve above-mentioned problem, achieve the goal, the invention provides a kind of laser processing, in the method, utilize multiple laser to carry out Laser Processing to multiple workpiece simultaneously, it is characterized in that, comprise following step, that is: the poor calculation procedure of hole count, in this step, the poor calculating of hole count to the 1st information recording with machining hole and the 2nd information recording machining hole, these information recordings with machining hole by the machining hole different from product machining hole being arranged in to the position of the regulation on described each workpiece, be set in thus for configuration information record and use in the information recording area of each described workpiece of machining hole, wherein, the 1st information recording is initially set on the 1st workpiece in described workpiece with machining hole, the 2nd information recording is initially set on the 2nd workpiece in described workpiece with machining hole, machining hole appends step, in this step, is minority side machining hole to described the 1st information recording with machining hole and described the 2nd information recording machining hole of the less person of machining hole hole count in machining hole, sets the machining hole that appends with the poor equal number of described hole count, and machining hole forms step, in this step, to irradiate laser for described the 1st information recording machining hole and described the 2nd information recording machining hole that append after machining hole described in described minority side machining hole setting simultaneously, form the described the 1st and the 2nd information recording machining hole.
The effect of invention
Due to laser processing involved in the present invention, machining hole to information recording with the less person of machining hole hole count in machining hole, set with the appending machining hole of the poor equal number of hole count and carry out Laser Processing, so there is following effect,, mint-mark information at short notice when the different information of mint-mark on each workpiece.
Accompanying drawing explanation
Fig. 1 is the figure that represents the structure of the related laser processing device of embodiment 1.
Fig. 2 is the figure that represents the structure of the related laser processing mechanism of embodiment 1.
Fig. 3 is the figure of the allocation position for inscribed regions is described.
Fig. 4 is the figure that represents the structure of inscribed regions.
Fig. 5 is the flow chart that represents the processing handling process of Laser Processing.
Fig. 6 is the figure that represents an example of the mint-mark setting regions of setting in inscribed regions.
Fig. 7 is the figure that appends candidate coordinate for illustrating.
Fig. 8 appends for illustrating the figure that sets mint-mark hole.
Fig. 9 is the figure for the processing sequence in territory, minority lateral areas is described.
Figure 10 is the figure that represents an example in the mint-mark hole forming in territory, minority lateral areas.
Figure 11 is being set with multiple figure that append candidate coordinate append candidate coordinate in the situation that for illustrating between mint-mark setting regions.
Figure 12 is the figure that represents the structure of the related laser processing device of embodiment 2.
Figure 13 is the figure that represents the structure of the related laser processing mechanism of embodiment 2.
Figure 14 is the figure that is provided with the pseudo-region pseudo-region in the scanning area using in product area for illustrating.
The explanation of symbol
1A, 1B laser processing device
2 laser
10A, 10B Working control device
12 machining hole counting number portions
The poor calculating part of 13 hole count
14 difference Working position selection portions
15 processing sequence calculating parts
16 processing instruction units
17 mint-mark information storage parts
18 irradiate control instruction unit
20A, 20B laser processing mechanism
22a, 22b electric scanning speculum
23a, 23b electrical scanner
25L, 25R processing work platform
29L, 29R, 30L, 30R laser head
31 attenuators
32 optical gates (shutter)
A1～a9 initial setting mint-mark hole
B1～b4 appends and sets mint-mark hole
D puppet (dummy) region
HL, hR mint-mark hole
AL, AR mint-mark setting regions
BL, BR mint-mark hole candidate
C1～C7, C11～C24 append candidate coordinate
H product machining hole
SL, SR inscribed regions
WL, WR workpiece
The specific embodiment
Based on accompanying drawing, describe related laser processing, laser processing device and the Working control device of embodiments of the present invention in detail below.In addition, the present invention is not limited by present embodiment.
Embodiment 1
Fig. 1 is the figure that represents the structure of the related laser processing device of embodiment 1.Laser processing device 1A is the laser processing device of two processing heads, irradiates laser to workpiece (workpiece WL described later, WR), the upper machining hole that forms of the workpiece WR of the workpiece WL of (L axle side) and right side (R axle side) in left side.
The laser processing device 1A of present embodiment forms machining hole for product (product machining hole H described later) and machining hole (mint-mark described later hole hL, hR) for information recording on workpiece WL, WR by Laser Processing.
Mint-mark hole (the 1st information recording machining hole) hL and mint-mark hole (the 2nd information recording machining hole) hR form (mint-mark), for example, be illustrated in the information (hereinafter referred to as product information) relevant to product of the production code member etc. of each workpiece WL, the upper formation of WR.Specifically, mint-mark hole hL, hR are formed as by 1～multiple machining holes (not becoming the machining hole of product) are arranged, thereby show word, mark, figure etc.Product information is the exclusive information of each product, each product difference.Therefore, the machining hole of formation mint-mark hole hL, hR has different configurations for each product that carries out mint-mark.
Laser processing device 1A is by form multiple product machining hole H on each workpiece WL, WR, thereby on each workpiece WL, WR, forms 1～multiple products., 1 product of each formation on each workpiece WL, WR is described below, and on the product above forming to workpiece WL, mint-mark goes out mint-mark hole hL, on the product above forming to workpiece WR, mint-mark goes out the situation of mint-mark hole hR.In addition, below, illustrate that product information (mint-mark word) is the situation of the production code member of 1.
Laser processing device 1A uses procedure 3, forms mint-mark hole hL, the hR corresponding with the product forming on each workpiece WL, WR on the product of workpiece WL, WR.In the regulation region (inscribed regions SL described later, SR) of laser processing device 1A on product, form mint-mark hole hL, hR.Laser processing device 1A has Working control device 10A and laser processing mechanism (Laser Processing portion) 20A.
Working control device 10A is connected with laser processing mechanism 20A.The Working control device 10A of present embodiment controls laser processing mechanism 20A, to form mint-mark hole hL and mint-mark hole hR simultaneously.The processing indication of laser processing mechanism 20A based on from Working control device 10A, carries out the Laser Processing of each workpiece WL, WR.
The structure of Working control device 10A is described below.Working control device 10A has input part 11, machining hole counting number portion 12, the poor calculating part 13 of hole count, difference Working position selection portion (machining hole appends portion) 14, processing sequence calculating part 15, processing instruction unit 16, mint-mark information storage part 17, control part 19.
Input part 11 is inputted procedure 3 that workpiece WL, WR are processed and the various indication informations from user.Input part 11 to 12 transmissions such as grade of machining hole counting number portion, sends by the indication information of input the procedure 3 of input to control part 19.
Mint-mark information storage part 17 is memories of the mint-mark information that storage is relevant to mint-mark hole hL, hR etc.Mint-mark packets of information forms containing following information,, the information relevant to the configuration of mint-mark hole hL, hR that forms mint-mark word in inscribed regions (information recording area) SL, SR, with in inscribed regions SL, SR, form information (coordinate between hereinafter referred to as hole) that between the hole of mint-mark hole hL, hR of mint-mark word, position (middle coordinate of for example mint-mark hole hL and mint-mark hole hL) is relevant and the information relevant with the processing sequence of mint-mark hole hL, the hR of formation mint-mark word.Form mint-mark hole hL, the hR of mint-mark word with the arranged spaced of regulation.Therefore, between hole, coordinate is configuration space based on mint-mark hole hL, hR and definite.
Between hole, coordinate is in order to make mint-mark hole hL and mint-mark hole hR form (start processing finish processing) and the mint-mark hole candidate coordinate (the candidate coordinate Cx that appends described later) of pre-prepd preparation in during same time simultaneously simultaneously.Between hole, coordinate is in inscribed regions SL, SR, to form the candidate coordinate that appends the mint-mark hole (described later appending set mint-mark hole bx) of setting in a side the region (hereinafter referred to as territory, minority lateral areas) of negligible amounts of mint-mark hole hL, hR of mint-mark word in inscribed regions SL, SR.In mint-mark hole hL, hR, the mint-mark hole in territory, minority lateral areas becomes minority side machining hole.
Mint-mark hole hL, hR are formed on the position of being specified by procedure 3.For example, the product information forming on workpiece WL is production code member " 1 ", by production code member " 1 " and the set positions of inscribed regions SL that forms production code member in procedure 3.In mint-mark information storage part 17, pre-stored mint-mark " 1 " is coordinate etc. between the configuration of necessary mint-mark hole hL and the hole relevant to above-mentioned mint-mark hole hL when printed text word at the moment.
Machining hole counting number portion 12 is extracted in the product information that workpiece WL, WR form in procedure 3, and extracts the mint-mark hole hL corresponding with this product information (mint-mark word), the configuration of hR from mint-mark information storage part 17.The quantity (processing hole count) of machining hole counting number portion 12 to each mint-mark hole hL, hR is counted.Machining hole counting number portion 12 sends the processing hole count of the mint-mark hole hL, the hR that count to get to the poor calculating part 13 of hole count.
The poor calculating part 13 of hole count utilizes the mint-mark hole hL being counted to get by machining hole counting number portion 12, the processing hole count of hR, and poor (mint-mark hole count is poor) of the processing hole count to mint-mark hole hL and mint-mark hole hR calculated.The poor calculating part 13 of hole count is poor as the poor information of hole count with the mint-mark hole count calculating using the information which is territory, minority lateral areas in inscribed regions SL and inscribed regions SR, sends to difference Working position selection portion 14.
Difference Working position selection portion 14 is extracted coordinate between the hole of the mint-mark word that territory, minority lateral areas sets from mint-mark information storage part 17.What difference Working position selection portion 14 was set coordinate between hole appends in candidate coordinate Cx, select with the poor equal number of mint-mark hole count append candidate coordinate Cx.For example, mint-mark hole count is poor be 4 holes in the situation that, what difference Working position selection portion 14 was set information between hole appends in candidate coordinate Cx, selects 4 and appends candidate coordinate Cx.Selected by difference Working position selection portion 14 append candidate coordinate Cx become append set mint-mark hole bx, be appended to territory, minority lateral areas.Between the hole of being selected by difference Working position selection portion 14 in information, append candidate coordinate Cx, can be to append arbitrarily candidate coordinate Cx, for example, select successively 4 to append candidate coordinate Cx from the upper side (to set numbering order from low to high) setting.
Processing sequence calculating part 15 uses and appends the initial setting mint-mark hole ax that sets initial setting in mint-mark hole bx and territory, minority lateral areas that appends forming on mint-mark position, and the processing sequence of having appended the machining hole in the territory, minority lateral areas of setting mint-mark hole bx is calculated.Processing sequence calculating part 15, for example so that become the shortest mode the process time in territory, minority lateral areas, calculates the processing sequence in territory, minority lateral areas.In addition, processing sequence calculating part 15 also can, so that the Working position displacement from machining hole to machining hole becomes the shortest mode, calculate the processing sequence in territory, minority lateral areas.In addition, processing sequence calculating part 15, in order to prevent in the workpiece WL at each Working position place, the temperature rise of WR, also can be more than or equal to so that the displacement of Working position is increased to the mode of predetermined distance, and Working position and processing sequence are disperseed.
Processing instruction unit 16 is used the processing sequence in procedure 3, mint-mark information, territory, minority lateral areas, exports the processing indication that the position of product machining hole H and mint-mark hole hL, hR is specified to laser processing mechanism 20A.
Control part 19 is controlled input part 11, machining hole counting number portion 12, the poor calculating part 13 of hole count, difference Working position selection portion 14, processing sequence calculating part 15, processing instruction unit 16, mint-mark information storage part 17.In addition, the product information of setting in procedure is not limited to concrete word etc., can be also the mint-mark hole hL that is used to form product information, the actual coordinate of hR.
The structure of laser processing mechanism 20A is described below.Fig. 2 is the figure that represents the structure of the related laser processing mechanism of embodiment 1.In Fig. 2, show the structure example of the laser processing mechanism that laser 2 multiaxises are formed.Laser processing mechanism 20A is configured to and utilizes the actuator (for example, electrical scanner) of R axle, L axle to carry out Laser Processing, has processing work platform 25L, the 25R of optical splitter 28,2 groups of laser head 29L, 29R and mounting workpiece WL, WR.
Laser head 29L, 29R have respectively electric scanning speculum 22a, 22b, electrical scanner 23a, 23b and f θ lens 24.The laser 2 of laser oscillator output is carried out light splitting by optical splitter 28, and the laser 2 after light splitting is supplied with to laser head 29L, 29R simultaneously.Then the laser 2, irradiating from laser head 29L, 29R is implemented perforate processing at workpiece WL, WR separately simultaneously.
Electric scanning speculum 22a is the 1st electric scanning speculum receiving by the laser 2 of the illustrated laser oscillator output of omission.Electric scanning speculum 22a is connected with the driving shaft of electrical scanner 23a, and the driving shaft of electrical scanner 23a is towards Z-direction.The reflecting surface of electric scanning speculum 22a be accompanied by electrical scanner 23a driving shaft rotation and be subjected to displacement, make the optical axis of the laser 2 of incident for example, carry out deflection scanning along the 1st direction (X-direction), and send to electric scanning speculum 22b.
Electric scanning speculum 22b is the 2nd electric scanning speculum receiving from the laser 2 of electric scanning speculum 22a.Electric scanning speculum 22b is connected with the driving shaft of electrical scanner 23b, and the driving shaft of electrical scanner 23b is towards Y direction.The reflecting surface of electric scanning speculum 22b be accompanied by electrical scanner 23b driving shaft rotation and be subjected to displacement, make incident laser 2 optical axis along with the 1st direction roughly orthogonal the 2nd direction (for example Y direction) carry out deflection scanning, and send to f θ lens 24.
F θ lens 24 by the laser 2 that carries out two-dimensional scan in XY face to focus irradiation on workpiece WL, WR.Workpiece WL, the WR such as printed base plate material or ceramic green sheet (ceramic green sheet) have flat shape, and processing work platform 25 loads workpiece WL, WR in XY plane.
In laser processing mechanism 20A, processing work platform 25 is moved in XY plane, and utilize electrical scanner 23a, 23b to make laser 2 carry out two-dimensional scan.Thus, be on workpiece WL, the WR in scanning area, to form product machining hole H and mint-mark hole hL, hR utilizing electrical scanner 23a, 23b to make laser 2 carry out in the scope of two-dimensional scan.In addition, in Fig. 2, the laser processing mechanism 20A of two processing heads is illustrated, but laser processing mechanism 20A also can have and is more than or equal to 4 processing heads.
The inscribed regions SL, the SR that form mint-mark hole hL, hR are described below.Fig. 3 is the figure of the allocation position for inscribed regions is described, Fig. 4 is the figure that represents the structure of inscribed regions.
As shown in Figure 3, laser 2 is carried out light splitting by optical splitter 28, and the laser 2 after light splitting irradiates to workpiece WL, WR respectively.Coordinate (workpiece internal coordinate) on the workpiece WL of the laser 2 irradiating to workpiece WL, WR and the workpiece internal coordinate on workpiece WR are identical coordinates.Thus, on workpiece WL, WR, form identical product machining hole H with same coordinate, on workpiece WL, WR, form identical product.
Near assigned position (for example, the end of workpiece WL) on workpiece WL, be provided for forming the inscribed regions SL of mint-mark hole hL, near assigned position (for example, the end of workpiece WR) on workpiece WR, is provided for forming the inscribed regions SR of mint-mark hole hR.In the present embodiment, this inscribed regions SL and inscribed regions SR are made as to identical workpiece inner region, on inscribed regions SL, SR, form different mint-mark words simultaneously.In other words, product machining hole H utilizes the laser 2 irradiating under same timing to form with identical workpiece internal coordinate, and on the other hand, mint-mark hole hL, hR utilize the laser 2 irradiating under same timing to form with different workpiece internal coordinates.
Because inscribed regions SL and inscribed regions SR are identical regions,, the structure of inscribed regions SL is described so here.Inscribed regions SL is rectangular-shaped region as shown in Figure 4, and upper at longitudinal (line direction) and horizontal (column direction), multiple square area (mint-mark hole candidate BL) are with rectangular arrangement.In addition, in Fig. 4, in inscribed regions SL, recorded column and row, column number, line number etc., but this records for the convenience illustrating, in actual inscribed regions SL, be unworthy of being set up and state word and region, only configure mint-mark hole candidate BL.
In Fig. 4, show in inscribed regions SL the situation of the mint-mark hole candidate BL that arranges (horizontal 5 row) × (vertical 13 row)=65.Mint-mark hole candidate BL is the candidate that forms the machining hole of mint-mark hole hL, from this candidate, the mint-mark hole candidate BL of regulation is set as to actual mint-mark hole hL.In Fig. 4, the square area that is set as actual mint-mark hole hL in the candidate BL of mint-mark hole is represented with mint-mark setting regions AL.By in the candidate BL of mint-mark hole, a part of mint-mark hole candidate BL being set as to mint-mark setting regions AL, thereby utilize 1 inscribed regions SL to show 1 word of numeral " 1 " etc. etc.In product on workpiece WL, configuration 1～multiple inscribed regions SL, form 1～multiple words etc. by 1～multiple inscribed regions SL.In the present embodiment, illustrate and in the product of workpiece WL, configure 1 inscribed regions SL, in the product of workpiece WR, configure the situation of 1 inscribed regions SR.
In addition, mint-mark hole candidate BL and mint-mark setting regions AL are not limited to square area, can be also the regions of the arbitrary shape such as rectangular region or border circular areas.In addition, inscribed regions SL, SR are not limited to rectangular area, can be also the regions of the arbitrary shapes such as border circular areas.
The processing handling process of Laser Processing is described below.Fig. 5 is the flow chart that represents the processing handling process of Laser Processing.The input procedure 3 (step S10) from input part 11 to Working control device 10A.Input part 11 sends the procedure of input 3 to machining hole counting number portion 12 and processing instruction unit 16.
Machining hole counting number portion 12 is extracted in the product information that workpiece WL, WR form in procedure 3, and the configuration (machining hole in inscribed regions SL, SR) of extracting mint-mark hole hL, the hR corresponding with the mint-mark word of this product information from mint-mark information storage part 17.Machining hole counting number portion 12 to forming the mint-mark hole hL of each mint-mark word, the processing hole count of hR is counted (step S20).Machining hole counting number portion 12 sends the processing hole count of mint-mark hole hL, hR in the inscribed regions SL counting to get, SR to the poor calculating part 13 of hole count.
The poor calculating part 13 of hole count uses the processing hole count in inscribed regions SL, the SR being counted to get by machining hole counting number portion 12, and the difference of the processing hole count in inscribed regions SL, SR is poor and calculate (step S30) as mint-mark hole count.The poor calculating part 13 of hole count is poor with the mint-mark hole count calculating by the information which is territory, minority lateral areas in inscribed regions SL and inscribed regions SR, sends to difference Working position selection portion 14 as the poor information of hole count.
Mint-mark word, territory, minority lateral areas, the poor concrete example of mint-mark hole count in inscribed regions SL, SR, set are described here.Fig. 6 is the figure that represents an example of the mint-mark setting regions of setting in inscribed regions.In Fig. 6, be illustrated in inscribed regions SL and form mint-mark word " 1 ", in inscribed regions SR, form the situation of mint-mark word " 2 ".
In inscribed regions SL, by form respectively 1 mint-mark hole hL in each mint-mark setting regions AL, thereby in inscribed regions SL, form mint-mark word " 1 ".In addition, in inscribed regions SR, by form respectively 1 mint-mark hole hR in each mint-mark setting regions AR, thereby in inscribed regions SR, form mint-mark word " 2 ".In Fig. 6, be illustrated in inscribed regions SL and be set with 9 mint-mark setting regions AL, in inscribed regions SR, be set with the situation of 13 mint-mark setting regions AR.Therefore, in the case, a few regions is inscribed regions SL, and mint-mark hole count is poor is 4 holes.
To mint-mark hole count is poor calculate after, difference Working position selection portion 14 is extracted in coordinate between the hole of the mint-mark word of setting territory, minority lateral areas from mint-mark information storage part 17.4 of selecting with the poor equal number of mint-mark hole count from appending candidate coordinate Cx of setting as coordinate between hole of difference Working position selection portion 14 append candidate coordinate Cx.Difference Working position selection portion 14 to select append candidate coordinate Cx place set append set mint-mark hole bx, by this append set mint-mark hole bx be appended to territory, minority lateral areas.
Fig. 7 is the figure that appends candidate coordinate for illustrating, Fig. 8 appends for illustrating the figure that sets mint-mark hole.As shown in Figure 7, in inscribed regions SL, between mint-mark setting regions AL and mint-mark setting regions AL, append candidate coordinate Cx and set and append candidate coordinate C1～C7 as coordinate between hole.In the present embodiment, set mint-mark hole bx by any of appending candidate coordinate C1～C7 is set as appending, making thus the quantity of the mint-mark hole hR in quantity and the inscribed regions SR of the mint-mark hole hL in inscribed regions SL is equal number.
For example, in the situation that difference Working position selection portion 14 has selected to append candidate coordinate C1～C4, as shown in Figure 8, set mint-mark hole bx and setting and append and set mint-mark hole b1～b4 as appending appending candidate coordinate C1～C4 place.In addition, in each mint-mark setting regions AL, set respectively 1 initial setting mint-mark hole ax.Specifically, in the mint-mark setting regions AL in inscribed regions SL, set initial setting mint-mark hole a1～a9 as initial setting mint-mark hole ax.Thus, in inscribed regions SL, set by initial setting mint-mark hole a1～a9 and append the mint-mark hole hL (with the mint-mark hole hL of mint-mark hole hR equal number) that sets 13 holes forming of mint-mark hole b1～b4.As noted above, difference Working position selection portion 14 is set with appending of the poor equal number of mint-mark hole count and is set mint-mark hole bx (step S40) in the less mint-mark word of mint-mark hole count.
Processing sequence calculating part 15, based on by initial setting mint-mark hole ax with append the position of setting all mint-marks hole hL of forming of mint-mark hole bx, calculates (step S50) to the processing sequence of all mint-marks hole hL in territory, minority lateral areas.Processing sequence calculating part 15 for example, to make the Working position displacement from mint-mark hole to mint-mark hole become the shortest mode, calculates the processing sequence in territory, minority lateral areas.For example, in the case of the processing sequence in the inscribed regions SL shown in Fig. 8 is calculated, based on by initial setting mint-mark hole a1～a9 and the position of appending the mint-mark hole hL that sets 13 holes forming of mint-mark hole b1～b4, the processing sequence of the mint-mark hole hL in inscribed regions SL is calculated.
Fig. 9 is the figure for the processing sequence in territory, minority lateral areas is described.In Fig. 9, show in the case of setting the processing sequence processing sequence in the inscribed regions SL shown in Fig. 8.Processing sequence calculating part 15 from initial setting mint-mark hole a1～a9, append and set the b1～b4 of mint-mark hole, extract the end that forms mint-mark word mint-mark hole and and other mint-mark holes between the mint-mark hole etc. of adjacent negligible amounts.In Fig. 9, show from initial setting mint-mark hole a1～a9, append and set the b1～b4 of mint-mark hole, extract the situation of initial setting mint-mark hole a1 as forming the mint-mark hole, end of mint-mark word " 1 ".Then, processing sequence calculating part 15 is from initial setting mint-mark hole a2～a9 and append to set the b1～b4 of mint-mark hole and extract successively the mint-mark hole adjacent with the mint-mark hole extracting, using sequence of extraction as processing sequence.Processing sequence calculating part 15 for example extracts mint-mark hole with the order shown in (1)～(13).
(1) extraction is positioned at the initial setting mint-mark hole a1 of the end of mint-mark word.
(2) extract append adjacent with initial setting mint-mark hole a1 and set mint-mark hole b1.
(3) extract the initial setting mint-mark hole a2 adjacent with appending setting mint-mark hole b1.
(4) extract the initial setting mint-mark hole a3 adjacent with initial setting mint-mark hole a2.
(5) extract append adjacent with initial setting mint-mark hole a3 and set mint-mark hole b2.
(6) extract the initial setting mint-mark hole a4 adjacent with appending setting mint-mark hole b2.
(7) extract append adjacent with initial setting mint-mark hole a4 and set mint-mark hole b3.
(8) extract the initial setting mint-mark hole a5 adjacent with appending setting mint-mark hole b3.
(9) extract append adjacent with initial setting mint-mark hole a5 and set mint-mark hole b4.
(10) extract the initial setting mint-mark hole a6 adjacent with appending setting mint-mark hole b4.
(11) extract the initial setting mint-mark hole a7 adjacent with initial setting mint-mark hole a6.
(12) extract the initial setting mint-mark hole a8 adjacent with initial setting mint-mark hole a7.
(13) extract the initial setting mint-mark hole a9 adjacent with initial setting mint-mark hole a8.
Processing sequence calculating part 15 is set as the order in the mint-mark hole of extracting with (1)～(13) processing sequence in the mint-mark hole in inscribed regions SL.
Processing instruction unit 16 is used the processing sequence in procedure 3, mint-mark information, territory, minority lateral areas, is used to specify the processing indication of the position of product machining hole H and mint-mark hole hL, hR to laser processing mechanism 20A output.Specifically, processing instruction unit 16 sends the processing indication of product machining hole H for workpiece WL, WR based on procedure 3.In addition, the processing sequence that processing instruction unit 16 calculates based on mint-mark information, processing sequence calculating part 15, sends the processing indication of mint-mark hole hL for inscribed regions SL.In addition, processing instruction unit 16, based on mint-mark information, sends the processing indication of mint-mark hole hR for inscribed regions SR.
Figure 10 is the figure that is illustrated in an example in the mint-mark hole forming in territory, minority lateral areas.In Figure 10, show illustrated in fig. 8 at initial setting mint-mark hole a1～a9 and append the situation of setting the position of mint-mark hole b1～b4 and be formed with mint-mark hole hL.In the present embodiment, set mint-mark hole bx and form mint-mark word owing to setting on coordinate between the hole between initial setting mint-mark hole ax and initial setting mint-mark hole ax forming mint-mark word to append, so can form mint-mark word under the state that can not cause on the outward appearance of mint-mark word larger impact.
In addition, in the present embodiment, for between mint-mark setting regions AL and mint-mark setting regions AL, setting respectively 1 situation of appending candidate coordinate Cx as coordinate between hole is illustrated, but also can, between mint-mark setting regions AL and mint-mark setting regions AL, set multiple candidate coordinate Cx that append as coordinate between hole.
Figure 11 is setting multiple figure that append candidate coordinate append candidate coordinate in the situation that for illustrating between mint-mark setting regions.In Figure 11, show between the mint-mark setting regions AL in inscribed regions SL and set respectively 2 situations of appending candidate coordinate Cx.In the inscribed regions SL of Figure 11, in the inscribed regions SL shown in Fig. 7, set between the mint-mark setting regions AL that appends candidate coordinate C1, candidate coordinate C11, C12 are appended in setting, are setting between the mint-mark setting regions AL that appends candidate coordinate C2, set and append candidate coordinate C13, C14.In the same manner, in the inscribed regions SL shown in Fig. 7, set between the mint-mark setting regions AL that appends candidate coordinate C3～C7, set and append candidate coordinate C15, C16 respectively, append candidate coordinate C17, C18, append candidate coordinate C19, C20, append candidate coordinate C21, C22, append candidate coordinate C23, C24.
Thus, even poor larger in the situation that in mint-mark hole count, also set mint-mark hole bx owing to can setting to append in a large number, therefore, can make the quantity of the mint-mark hole hR in quantity and the inscribed regions SR of the mint-mark hole hL in inscribed regions SL is equal number.In addition, in Figure 11, show between the mint-mark setting regions AL in inscribed regions SL and set respectively 2 situations of appending candidate coordinate Cx, but also can, between the mint-mark setting regions AL in inscribed regions SL, SR, be more than or equal to 3 in the setting of 1 place and append candidate coordinate Cx.In addition, needn't be all equal number for every place for the candidate coordinate Cx that appends setting at 1 place between mint-mark setting regions AL, also can and mint-mark setting regions AL between size corresponding and determine the quantity of appending candidate coordinate Cx of setting between mint-mark setting regions AL.
In addition, also can between the each mint-mark setting regions AL in inscribed regions SL, SR, set the multiple candidate coordinate Cx that appends.For example, also can set appending shown in Figure 11 and append these two kinds of candidate coordinate Cx shown in candidate coordinate Cx and Fig. 7.Between each mint-mark setting regions AL, setting multiplely append candidate coordinate Cx in the situation that, difference Working position selection portion 14 is based on mint-mark hole count extent and processing conditions etc., and which kind of judgement used append candidate coordinate Cx.Processing conditions is for example the total laser energy irradiating to the laser energy of 1 mint-mark hole hL, the laser pulse quantity that hR sends, each pulse, to 1 mint-mark hole hL, hR, the material of workpiece WL, WR, span, the size of mint-mark hole hL, hR etc. of mint-mark hole hL, hR.
Difference Working position selection portion 14 more than specified quantity, is judged as the mint-mark information (setting mint-mark information hereinafter referred to as minority) that candidate coordinate Cx is less than specified quantity of appending using for setting at 1 place between mint-mark setting regions AL in the laser pulse quantity for example sent to 1 mint-mark hole hL, hR.In addition, difference Working position selection portion 14 is greater than setting at the laser energy of for example each pulse, is judged as and uses minority to set mint-mark information.In addition, difference Working position selection portion 14 is greater than setting at the total laser energy for example irradiating to 1 mint-mark hole hL, hR, is judged as and uses minority to set mint-mark information.In addition, difference Working position selection portion 14, is judged as and uses minority to set mint-mark information lower than setting in the Ear Mucosa Treated by He Ne Laser Irradiation patience of for example workpiece WL, WR.In addition, difference Working position selection portion 14, in the case of the span of for example mint-mark hole hL, hR is narrower than setting, is judged as and uses minority to set mint-mark information.In addition, difference Working position selection portion 14 is greater than setting in for example size of mint-mark hole hL, hR (diameter and the degree of depth), is judged as and uses minority to set mint-mark information.In addition, difference Working position selection portion 14, for example mint-mark hole count is poor be greater than specified quantity in the situation that, is judged as and uses minority to set mint-mark information.
Due in the situation that using minority to set mint-mark information, append and set overlapping between the bx of mint-mark hole and append overlapping the tailing off of setting between mint-mark hole bx and initial setting mint-mark hole ax, so can carry out workpiece WL, the WR processing of high-quality.In addition, can also easily calculate the processing sequence of workpiece WL, the WR processing for carrying out high-quality.In addition, that between using for mint-mark setting regions AL, sets at 1 place appends the mint-mark information of candidate coordinate Cx more than specified quantity, can form to append in a large number to set mint-mark hole bx.
In addition, in the present embodiment, for configure 1 inscribed regions SL in the product of workpiece WL, the situation that configures 1 inscribed regions SR in the product of workpiece WR is illustrated, but also can on workpiece WL, WR, configure multiple inscribed regions SL, SR.In the case, for the 1st inscribed regions SL and the 1st inscribed regions SR (the 1st group of inscribed regions SL, SR), above-mentioned appending is set and sets mint-mark hole bx, carry out the 1st group of processing in inscribed regions SL, SR at one time.Then, with the 1st group of inscribed regions SL, SR in the same manner, for the 2nd group of later inscribed regions SL, SR, above-mentioned appending is set and sets mint-mark hole bx, carry out the 2nd group of processing in later inscribed regions SL, SR at one time.
In addition, appending of forming in inscribed regions SL set mint-mark hole bx and also can be appended and set mint-mark hole bx part or all is overlapping with other.In addition, appending of forming in inscribed regions SL set mint-mark hole bx also can part or all be overlapping with initial setting mint-mark hole ax.Set mint-mark hole bx and initial setting mint-mark hole ax all overlapping in the situation that making to append, on initial setting mint-mark hole ax, set and append setting mint-mark hole bx.
For whether make to append set mint-mark hole bx and initial setting mint-mark hole ax overlapping, can, based on being determined from the indication of outside input by user, also can be judged by difference Working position selection portion 14 by the processing conditions based on workpiece WL, WR.By make to append set mint-mark hole bx and initial setting mint-mark hole ax overlapping, can in inscribed regions SL, SR, set thus and append in a large number setting mint-mark hole bx.In addition, by make to append set mint-mark hole bx and initial setting mint-mark hole ax not overlapping, even thus in the situation that processing conditions is strict, can not cause that processing is bad yet, can form mint-mark hole hL, the hR of high-quality.
In addition, the mint-mark word being formed by mint-mark hole hL, hR is not limited to word, mark, figure etc., can be also the information arbitrarily such as two-dimensional bar, mark.In addition, product information is not limited to production code member, can be also the information arbitrarily such as Mission Number, build date.
In addition, in the present embodiment, there is the situation of appending candidate coordinate Cx to be illustrated for login in advance, but also can automatically set and append candidate coordinate Cx by difference Working position selection portion 14.In the case, difference Working position selection portion 14 is poor and processing conditions based on mint-mark hole count, sets and appends candidate coordinate Cx.
As noted above, the laser processing of present embodiment, for having the laser processing device 1A that is more than or equal to 2 workbench, comprises following step: the step that the quantity of mint-mark hole hL, the hR of the mint-mark word to left and right is counted; The poor calculating of mint-mark hole count in the word of the negligible amounts to mint-mark hole hL, hR, sets and appends the step of setting mint-mark hole bx; Calculate the step for mint-mark word being carried out to the processing sequence of the shortest processing; And the step of processing appending setting mint-mark hole bx and initial setting mint-mark hole ax.
As noted above, according to embodiment 1, set mint-mark hole bx owing to setting to append in territory, minority lateral areas, making the quantity of mint-mark hole hL, the hR of the mint-mark word forming in inscribed regions SL, SR is equal number, even so form in inscribed regions SL, SR different mint-mark words, also mint-mark word can be in inscribed regions SL, SR, formed, and Optic gate etc. needn't be made.Therefore, can utilize simple structure in inscribed regions SL, SR, to form different mint-mark words.
In addition, owing to needn't making Optic gate etc., just can in inscribed regions SL, SR, form mint-mark word, so can form at short notice mint-mark word.In addition, set mint-mark hole bx and be arranged in territory, minority lateral areas owing to appending, so be arranged on compared with the extra-regional situation of minority side with appending setting mint-mark hole bx, can form at short notice mint-mark word.
Embodiment 2
, use Figure 12～Figure 14 below, embodiments of the present invention 2 are described.In embodiment 2, not by with the poor corresponding laser 2 of mint-mark hole count to minority side area illumination, and to other regions (other positions different from territory, minority lateral areas) irradiate.
Figure 12 is the figure that represents the structure of the related laser processing device of embodiment 2.In each inscape of Figure 12, for realizing the inscape of same function with the laser processing device 1A of the embodiment 1 shown in Fig. 1, mark identical numbering, the repetitive description thereof will be omitted.
Laser processing device 1B has Working control device 10B and laser processing mechanism 20B.Working control device 10B is connected with laser processing mechanism 20B.The Working control device 10B of present embodiment controls laser processing mechanism 20B, to form mint-mark hole hL and mint-mark hole hR simultaneously.Specifically, Working control device 10B will irradiate or utilize optical gate 32 described later to cut off to attenuator 31 described later with the poor corresponding laser 2 of mint-mark hole count.The processing indication of laser processing mechanism 20B based on from Working control device 10B, carries out the Laser Processing of workpiece WL, WR.
The structure of Working control device 10B is described below.Working control device 10B has input part 11, machining hole counting number portion 12, the poor calculating part 13 of hole count, processing instruction unit 16, mint-mark information storage part 17, irradiates and control instruction unit 18, control part 19.
The mint-mark hole count that irradiation control instruction unit 18 calculates based on the poor calculating part 13 of hole count is poor, sends and controls indication to laser processing mechanism 20B.Irradiate and control instruction unit 18 and send the control indication that is used to form the control indication of irradiating to attenuator 31 with the laser 2 in the mint-mark hole of the poor equal number of mint-mark hole count or utilizes optical gate 32 to cut off to laser processing mechanism 20B.Be used to form with the laser 2 in the mint-mark hole of the poor equal number of mint-mark hole count and embodiment 1 in explanation, be used to form the pulse laser that appends laser 2 equal numbers of setting mint-mark hole bx and irradiate.Thus, in the present embodiment, replace to utilize to form to append with the poor corresponding laser 2 of mint-mark hole count and set mint-mark hole bx, but laser processing mechanism 20B is controlled, not make with the poor corresponding laser 2 of mint-mark hole count to minority side area illumination.
The structure of laser processing mechanism 20B is described below.Figure 13 is the figure that represents the structure of the related laser processing mechanism of embodiment 2.In each inscape of Figure 13, for realizing the inscape of same function with the laser processing mechanism 20A of the embodiment 1 shown in Fig. 2, mark identical numbering, the repetitive description thereof will be omitted.Laser processing mechanism 20B has processing work platform 25L, the 25R of optical splitter 28,2 groups of laser head 30L, 30R and mounting workpiece WL, WR.
Compared with laser head 29L, the 29R of laser head 30L, 30R and embodiment 1, there is respectively attenuator 31 and optical gate 32.Attenuator 31 has the function of absorbing laser 2, by by the irradiating to attenuator 31 with the poor corresponding laser 2 of mint-mark hole count of territory, minority lateral areas, thus irradiating to a few regions with the poor corresponding laser 2 of mint-mark hole count territory, minority lateral areas not.Attenuator 31 is configured near of f θ lens 24, being guided to attenuator 31 from electric scanning speculum 22b with the poor corresponding laser 2 of mint-mark hole count of territory, minority lateral areas.
Optical gate 32 has the function of laser 2 of cut-out, by utilizing optical gate 32 by the cutting off with the poor corresponding laser 2 of mint-mark hole count of territory, minority lateral areas, thus irradiating to a few regions with the poor corresponding laser 2 of mint-mark hole count territory, minority lateral areas not.Optical gate 32 is configured to be openedly and closedly arranged on the leading portion of electric scanning speculum 22a, by optical gate 32 is closed, thereby can cut off the laser 2 sending to electric scanning speculum 22a.In addition, attenuator 31 and optical gate 32 also can be configured on the position different from the position shown in Figure 13.
Below, illustrate and irradiate the control processing of controlling instruction unit 18.The mint-mark hole count that irradiation control instruction unit 18 calculates based on the poor calculating part 13 of hole count is poor, and which in use attenuator 31 and optical gate 32 determined.For example, irradiate and control instruction unit 18 mint-mark hole count is poor be less than specified quantity in the situation that, use attenuator 31, mint-mark hole count is poor be more than or equal to specified quantity in the situation that, make Optic gate 32.Irradiate and control instruction unit 18 in the situation that using attenuator 31, to laser processing mechanism, 20B controls, with irradiating to attenuator 31 with the poor corresponding laser 2 of mint-mark hole count territory, minority lateral areas.In addition, irradiate and control instruction unit 18 in the situation that making Optic gate 32, to laser processing mechanism, 20B controls, to utilize optical gate 32 to cut off with the poor corresponding laser 2 of mint-mark hole count the territory, minority lateral areas.
In addition, irradiating control instruction unit 18 also can be based on processing conditions, and which in use attenuator 31 and optical gate 32 determined.Irradiate control instruction unit 18 and be less than specified quantity in the laser pulse quantity of for example sending to 1 mint-mark hole hL, hR, be judged as and use attenuator 31.In addition, irradiate control instruction unit 18 and be greater than setting at the laser energy of for example each pulse, be judged as and use attenuator 31.In addition, irradiate and control instruction unit 18 in the case of being for example greater than setting to the total laser energy of 1 mint-mark hole hL, hR irradiation, be judged as and use attenuator 31.In addition, irradiate control instruction unit 18 in the Ear Mucosa Treated by He Ne Laser Irradiation patience of for example workpiece WL, WR lower than setting, be judged as and use attenuator 31.In addition, irradiate and control instruction unit 18 in the case of the span of for example mint-mark hole hL, hR is narrower than setting, be judged as and use attenuator 31.In addition, irradiate control instruction unit 18 and be greater than setting in for example size of mint-mark hole hL, hR, be judged as and use attenuator 31.In addition, irradiate and control instruction unit 18 for example mint-mark hole count is poor be greater than specified quantity in the situation that, be judged as and use attenuator 31.
In addition, in the present embodiment, there is respectively the two situation of attenuator 31 and optical gate 32 for laser head 30L, 30R and be illustrated, but laser head 30L, 30R also can adopt the some structures that have in attenuator 31 and optical gate 32.In the situation that laser head 30L, 30R have attenuator 31, will irradiate to attenuator 31 with the poor corresponding laser 2 of mint-mark hole count.In addition, in the situation that laser head 30L, 30R have optical gate 32, will utilize optical gate 32 to cut off with the poor corresponding laser 2 of mint-mark hole count.In addition, only have some in attenuator 31 and optical gate 32 at laser head 30L, 30R, irradiate and control instruction unit 18 and needn't determine and use which in attenuator 31 and optical gate 32.
In addition, also attenuator 31 be can replace and territory, minority lateral areas and the pseudo-region poor corresponding laser 2 of mint-mark hole count (region with territory, minority lateral areas on different workpiece WL, WR) are provided for irradiating.This puppet region can be arranged in the product area on workpiece WL, WR, also can be arranged on outside the product area on workpiece WL, WR.In the case of by pseudo-region division in the product area on workpiece WL, WR, due to initial setting mint-mark hole ax with append the distance of setting between the bx of mint-mark hole and shorten, so can form at short notice mint-mark hole hL, hR.In addition, in the case of by pseudo-region division in outside the product area on workpiece WL, WR, owing to configuring pseudo-region on the various positions on workpiece, so can easily configure pseudo-region.
In addition, also can be by pseudo-region division in the scanning area identical with product area (in the scanning area of electrical scanner 23a, 23b).In the case, even pseudo-area configurations, outside the product area on workpiece WL, WR, also can be formed to mint-mark hole hL, hR at short notice.
Figure 14 is the figure that is provided with the pseudo-region pseudo-region in the scanning area using in product area for illustrating.In Figure 14, show the pseudo-region d of use when the product area PL on workpiece WL is carried out to Laser Processing.
In the time that product area PL is carried out to Laser Processing, multiple scanning area G are set, irradiate laser for each scanning area G.For example, in the end that inscribed regions SL is disposed to product area PL (in Figure 14 for right lower quadrant) in the situation that, scanning area G when inscribed regions SL is carried out to Laser Processing, configures across the region (product exterior domain) in product area PL and product area outside sometimes.In this case, by near the pseudo-region d of the configuration inscribed regions SL at product exterior domain, thereby pseudo-region d can be arranged in the scanning area of electrical scanner 23a, 23b.
In addition, also can make Working control device 10B there is the two function of Working control device 10A, 10B.In the case, Working control device 10B comprises input part 11, machining hole counting number portion 12, the poor calculating part 13 of hole count, difference Working position selection portion 14, processing sequence calculating part 15, processing instruction unit 16, mint-mark information storage part 17, irradiates and control instruction unit 18, control part 19 and form.In this Working control device 10B, difference Working position selection portion 14 is based on mint-mark hole count extent and processing conditions etc., and judgement use is appended setting mint-mark hole bx and still used attenuator 31 and optical gate 32.
Difference Working position selection portion 14 is less than specified quantity in the laser pulse quantity of for example sending to 1 mint-mark hole hL, hR, is judged as to use to append to set mint-mark hole bx.In addition, difference Working position selection portion 14 is less than setting at the laser energy of for example every 1 pulse, is judged as to use to append to set mint-mark hole bx.In addition, difference Working position selection portion 14 is less than setting at the total laser energy for example irradiating to 1 mint-mark hole hL, hR, is judged as to use to append to set mint-mark hole bx.In addition, difference Working position selection portion 14, is judged as to use to append and sets mint-mark hole bx lower than setting in the Ear Mucosa Treated by He Ne Laser Irradiation patience of for example workpiece WL, WR.In addition, difference Working position selection portion 14, in the case of the span of for example mint-mark hole hL, hR is narrower than setting, is judged as to use to append and sets mint-mark hole bx.In addition, difference Working position selection portion 14 is less than setting in for example size of mint-mark hole hL, hR, is judged as to use to append to set mint-mark hole bx.In addition, difference Working position selection portion 14, for example mint-mark hole count is poor be less than specified quantity in the situation that, is judged as to use to append and sets mint-mark hole bx.
In addition, processing sequence calculating part 15 also can, based on mint-mark hole count extent and processing conditions etc., calculate the mint-mark hole hL in territory, minority lateral areas, the processing sequence of hR.Processing sequence calculating part 15 is based on mint-mark hole count extent and processing conditions etc., and calculating processing order, tails off with the burden (processing of workpiece WL, WR is bad) that makes workpiece WL, WR cause.
As noted above, according to embodiment 2, owing to using attenuator 31, optical gate 32, pseudo-region d etc., make with the poor corresponding laser 2 of mint-mark hole count not to minority side area illumination, even so form different mint-mark words, also can easily form at short notice mint-mark word on inscribed regions SL, SR.
Industrial applicibility
As noted above, laser processing, laser processing device and Working control device involved in the present invention, processing when being applicable to utilize multiple workpiece that multiple laser carries out.
Claims (10)
1. a laser processing in the method, utilizes multiple laser to carry out Laser Processing to multiple workpiece simultaneously,
It is characterized in that, comprise following step, that is:
The poor calculation procedure of hole count, in this step, the poor calculating of hole count to the 1st information recording with machining hole and the 2nd information recording machining hole, these information recordings with machining hole by the machining hole different from product machining hole being arranged in to the position of the regulation on described each workpiece, be set in thus for configuration information record and use in the information recording area of each described workpiece of machining hole, wherein, the 1st information recording is initially set on the 1st workpiece in described workpiece with machining hole, the 2nd information recording is initially set on the 2nd workpiece in described workpiece with machining hole,
Machining hole appends step, in this step, is minority side machining hole to described the 1st information recording with machining hole and described the 2nd information recording machining hole of the less person of machining hole hole count in machining hole, sets the machining hole that appends with the poor equal number of described hole count; And
Machining hole forms step, in this step, to irradiate laser for described the 1st information recording machining hole and described the 2nd information recording machining hole that append after machining hole described in described minority side machining hole setting simultaneously, form the described the 1st and the 2nd information recording machining hole.
2. laser processing according to claim 1, is characterized in that,
Append in step at described machining hole, between the machining hole of described minority side machining hole, described in configuration, append machining hole.
3. laser processing according to claim 2, is characterized in that,
Append in step at described machining hole, between described minority side machining hole, configure described in multiple and append machining hole.
4. laser processing according to claim 1, is characterized in that,
Append in step at described machining hole, described in append that machining hole is configured to append machining hole with other or minority side machining hole at least a portion is overlapping.
5. laser processing according to claim 1, is characterized in that,
Also comprise processing sequence and set step, in this step, append after step for described machining hole, set and the described the 1st or the 2nd information recording machining hole after machining hole that appends of the poor equal number of described hole count to described minority side machining hole, set the shortest processing sequence process time
Form in step at machining hole, according to the processing sequence of setting, form the described the 1st and the 2nd information recording machining hole.
6. a laser processing in the method, utilizes multiple laser to carry out Laser Processing to multiple workpiece simultaneously,
It is characterized in that, comprise following step, that is:
The poor calculation procedure of hole count, in this step, the poor calculating of hole count to the 1st information recording with machining hole and the 2nd information recording machining hole, these information recordings with machining hole by the machining hole different from product machining hole being arranged in to the position of the regulation on described each workpiece, be set in thus for configuration information record and use in the information recording area of each described workpiece of machining hole, wherein, the 1st information recording is initially set on the 1st workpiece in described workpiece with machining hole, the 2nd information recording is initially set on the 2nd workpiece in described workpiece with machining hole,
Illuminate condition determining step, in this step, poor or relevant to the described Laser Processing processing conditions based on described hole count, determine it is for described the 1st information recording machining hole and the described machining hole of the less person of machining hole hole count in machining hole for the 2nd information recording, i.e. minority side machining hole, set with the poor equal number of described hole count append machining hole, or will irradiate to other positions different with the configuring area of minority side machining hole from the poor corresponding laser of described hole count; And
Irradiate and control step, in this step, in the situation that appending machining hole described in setting, control to irradiate laser to described the 1st information recording machining hole and described the 2nd information recording machining hole that append after machining hole described in setting for described minority side machining hole simultaneously, in the case of irradiating with the poor corresponding laser of described hole count to described other positions, control to irradiate laser to described the 1st information recording machining hole and described the 2nd information recording machining hole simultaneously, and irradiate and the poor corresponding laser of described hole count to described other positions.
7. laser processing according to claim 6, is characterized in that,
Described other positions are attenuators of absorbing described laser, cut off the region on the optical gate of described laser or the described workpiece different from the configuring area of described minority side machining hole.
8. laser processing according to claim 7, is characterized in that,
In described illuminate condition determining step, in the situation that being defined as irradiating laser to described other positions, poor or relevant to the described Laser Processing processing conditions based on described hole count, determine as described other positions, select any in the region on described attenuator, described optical gate or the described workpiece different from the configuring area of described minority side machining hole.
9. a laser processing device, it utilizes multiple laser to carry out Laser Processing to multiple workpiece simultaneously,
It is characterized in that having:
The poor calculating part of hole count, it is poor calculating of hole count with machining hole and the 2nd information recording machining hole to the 1st information recording, these information recordings with machining hole by the machining hole different from product machining hole being arranged in to the position of the regulation on described each workpiece, be set in thus for configuration information record and use in the information recording area of each described workpiece of machining hole, wherein, the 1st information recording is initially set on the 1st workpiece in described workpiece with machining hole, and the 2nd information recording is initially set on the 2nd workpiece in described workpiece with machining hole;
Machining hole appends portion, and it is minority side machining hole to described the 1st information recording with machining hole and described the 2nd information recording machining hole of the less person of machining hole hole count in machining hole, sets the machining hole that appends with the poor equal number of described hole count; And
Laser Processing portion, it irradiates laser to described the 1st information recording machining hole and described the 2nd information recording machining hole that append after machining hole described in set for described minority side machining hole simultaneously, forms the described the 1st and the 2nd information recording machining hole.
10. a Working control device, it is controlled, to utilize multiple laser to carry out Laser Processing to multiple workpiece simultaneously,
It is characterized in that having:
The poor calculating part of hole count, it is poor calculating of hole count with machining hole and the 2nd information recording machining hole to the 1st information recording, these information recordings with machining hole by the machining hole different from product machining hole being arranged in to the position of the regulation on described each workpiece, be set in thus for configuration information record and use in the information recording area of each described workpiece of machining hole, wherein, the 1st information recording is initially set on the 1st workpiece in described workpiece with machining hole, and the 2nd information recording is initially set on the 2nd workpiece in described workpiece with machining hole;
Machining hole appends portion, and it is minority side machining hole to described the 1st information recording with machining hole and described the 2nd information recording machining hole of the less person of machining hole hole count in machining hole, sets the machining hole that appends with the poor equal number of described hole count; And
Processing instruction unit, its output processing indication, to irradiate laser to described the 1st information recording machining hole and described the 2nd information recording machining hole that append after machining hole described in set for described minority side machining hole simultaneously, form the described the 1st and the 2nd information recording machining hole.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2009/058197 WO2010122667A1 (en) | 2009-04-24 | 2009-04-24 | Laser processing method, laser processing system and processing controller |
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| CN102341212A CN102341212A (en) | 2012-02-01 |
| CN102341212B true CN102341212B (en) | 2014-07-09 |
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| JP (1) | JP5236071B2 (en) |
| KR (1) | KR101270287B1 (en) |
| CN (1) | CN102341212B (en) |
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| SG11201402324VA (en) * | 2011-11-16 | 2014-06-27 | Applied Materials Inc | Laser scribing systems, apparatus, and methods |
| TW201431634A (en) * | 2013-02-01 | 2014-08-16 | Pard Hardware Ind Co Ltd | Tool labeling method |
| JP6647888B2 (en) * | 2016-01-29 | 2020-02-14 | ビアメカニクス株式会社 | Laser processing method and laser processing apparatus |
| JP6499616B2 (en) * | 2016-06-10 | 2019-04-10 | ファナック株式会社 | Program creation device with function to optimize machining order |
| JP6783165B2 (en) * | 2017-02-28 | 2020-11-11 | ビアメカニクス株式会社 | Laser processing equipment and laser processing method |
| CN107127463A (en) * | 2017-05-27 | 2017-09-05 | 东莞市盛雄激光设备有限公司 | A kind of HDI circuit borings machine |
| CN110919168A (en) * | 2018-08-31 | 2020-03-27 | 大族激光科技产业集团股份有限公司 | Laser processing system and laser processing method |
| KR102125030B1 (en) * | 2018-12-07 | 2020-06-19 | 주식회사 이오테크닉스 | Apparatus for laser marking and method of laser marking using the same |
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| JP2004276089A (en) * | 2003-03-18 | 2004-10-07 | Sumitomo Heavy Ind Ltd | Method and device for dividing data for a plurality of axes in laser beam machining machine |
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| US20060000811A1 (en) * | 2004-06-30 | 2006-01-05 | Matsushita Electric Industrial Co., Ltd. | Diffractive optical element changer for versatile use in laser manufacturing |
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| JP2004276089A (en) * | 2003-03-18 | 2004-10-07 | Sumitomo Heavy Ind Ltd | Method and device for dividing data for a plurality of axes in laser beam machining machine |
| JP2007237242A (en) * | 2006-03-09 | 2007-09-20 | Hitachi Via Mechanics Ltd | Laser beam machining apparatus |
| JP2008010489A (en) * | 2006-06-27 | 2008-01-17 | Disco Abrasive Syst Ltd | Method of processing via hole |
Also Published As
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| KR20110106381A (en) | 2011-09-28 |
| TW201038348A (en) | 2010-11-01 |
| JPWO2010122667A1 (en) | 2012-10-22 |
| WO2010122667A1 (en) | 2010-10-28 |
| KR101270287B1 (en) | 2013-05-31 |
| JP5236071B2 (en) | 2013-07-17 |
| CN102341212A (en) | 2012-02-01 |
| TWI371331B (en) | 2012-09-01 |
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