JP2004276089A - Method and device for dividing data for a plurality of axes in laser beam machining machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To select the optimum dividing method by which the machining time is shortened with the distribution of data and the machining method, etc., when the machining objective position is divided into a plural number (n) of scanning units. <P>SOLUTION: The machining objective position is equally divided into n (n: number of the scanning units) from the hole positional range on a printed substrate 8. As the other case, describing the machining positional data with a collective unit pattern 9, the machining objective position is divided based on the position of the unit pattern. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multi-axis data division method and apparatus for allocating a processing target position to each of a plurality of scanning units in a laser processing machine that processes a single workpiece with a plurality (n) of scanning units. In particular, select the most suitable division method that shortens the processing time by data distribution, processing method, etc., suitable for use in laser drilling machine that irradiates laser beam and performs multiple drilling processing on printed wiring board etc. A method and apparatus for dividing data between multiple axes of a possible laser beam machine, a machining method and apparatus using the data division method and apparatus, a computer program for executing the machining method, and a computer program for realizing the machining apparatus And a computer-readable recording medium recorded in the computer program.
[0002]
[Prior art]
One laser drilling machine that irradiates a laser beam with a plurality of holes on a work such as a printed wiring board is split into two laser beams as proposed by the applicant in Patent Document 1. There is a laser drilling machine that drills a workpiece with one scanning unit.
[0003]
In such a biaxial laser processing machine, as shown in FIG. 1, the laser beam 12 output from the laser oscillator 10 is divided into two through an optical branching unit 14, and a biaxial scanning unit such as a galvano scanner is used. Input to the used galvano scanner units (also called processing heads) 21 and 22. Each of the galvano scanner units 21 and 22 positions a laser beam independently at a hole position on the printed circuit board 8 to be processed, and performs a hole. Since the operation range of the galvano scanner units 21 and 22 is about 50 mm square, the printed circuit board 8 is moved by the XY stage 30 when a region exceeding this is processed. In the figure, reference numeral 24 denotes, for example, a machining head moving axis for moving one machining head (first machining head 21 in the figure) to change the distance L between the two axes, and 32 denotes the printed circuit board 8 to the XY stage 30. It is an adsorption plate for adsorbing and fixing.
[0004]
In such a biaxial laser beam machine, as shown in FIG. 2, the area on the printed circuit board 8 to be simultaneously processed is determined by the distance L between the two galvano scanner units 21 and 22. At this time, the distance L between the galvano scanner units is equal to the division distance on the printed circuit board. Accordingly, the preferred conditions (number of holes, hole position arrangement, etc.) change which of the galvano scanner units 21 and 22 performs processing depending on where the division is made on the printed circuit board 8. In the figure, 8H is a hole to be processed of the printed circuit board 8.
[0005]
[Patent Document 1]
Japanese Patent No. 3213882 [0006]
[Problems to be solved by the invention]
However, conventionally, no method has been proposed for simply and accurately selecting an optimal dividing method for shortening the machining time.
[0007]
The present invention has been made to solve the above-described conventional problems, and an object of the present invention is to make it possible to select an optimal division method that shortens the processing time according to data distribution, a processing method, and the like.
[0008]
[Means for Solving the Problems]
According to the present invention, in a laser processing machine that processes a single workpiece with a plurality (n) (n is a natural number of 2 or more) of scanning units, when a processing target position is allocated to each of a plurality of scanning units, The problem is solved by dividing the machining range on the workpiece into n equal parts.
[0009]
The present invention also provides a unit pattern in which processing position data is collected when a processing target position is assigned to each of a plurality of scanning units in a laser processing machine that processes a workpiece with a plurality of scanning units. The above problem is solved by dividing based on the position of the unit pattern.
[0010]
The present invention also provides a processing method for performing processing using the data divided by the data dividing method.
[0011]
The present invention also provides a computer program for implementing the data dividing method or processing method.
[0012]
The present invention is also directed to a multi-axis data dividing device for assigning a processing target position to each of a plurality of scanning units for a laser processing machine that processes a workpiece with a plurality (n) of scanning units. The above-mentioned problem is similarly solved by providing means for dividing the machining range on the workpiece into n equal parts.
[0013]
The present invention also provides a machining position in a multi-axis data division device that allocates a machining target position to each of a plurality of scanning units for a laser processing machine that performs machining on a single workpiece by a plurality of scanning units. In the case where data is described in a unit pattern, a problem is solved by providing means for dividing the data based on the position of the unit pattern.
[0014]
The present invention also provides a processing apparatus including the data dividing apparatus.
[0015]
The present invention also provides a computer program for realizing the data dividing device or the processing device.
[0016]
The present invention also provides a computer-readable recording medium in which the computer program is recorded.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention applied to a two-axis (n = 2) laser drilling machine will be described in detail with reference to the drawings.
[0018]
In the first embodiment of the present invention, as shown in FIG. 3, the left and right halves are divided from the range of the hole position of the hole 8H to be processed on the printed board 8.
[0019]
Specifically, out of the hole coordinates on the printed circuit board 8, the hole x1 having the minimum coordinate in the X direction and the hole x2 having the maximum coordinate are extracted, and the two points are divided into two equal parts according to the following equation: A division position L is obtained.
[0020]
L = (| x1 | + | x2 |) / 2 (1)
[0021]
The left and right galvano scanner units 21 and 22 are set at intervals of the division positions L.
[0022]
In this division method, regions on the printed circuit board 8 processed by the galvano scanner units 21 and 22 have the same area. Even if the hole arrangements in the left and right regions are not equal, the laser light from each galvano scanner unit is guided to a predetermined hole position. If the number of holes is different in the processing block of the left and right galvano scanner units (the range that can be processed within the operating range of the galvano scanner), the laser beam with the smaller number of holes is blocked by a shutter, etc. 8 is not irradiated.
[0023]
According to this embodiment, even if the hole arrangement is not equal on the left and right, it can be used for all printed boards. If the number of holes in each of the left and right regions is about the same, almost all holes can be processed simultaneously.
[0024]
The number of galvano scanner units is not limited to two. When there are n galvano scanner units in the same direction (lateral direction), the area obtained by dividing the hole position data by the number n of scanner units is defined as the division position as shown in the following equation. Just do it.
[0025]
L = (| x1 | + | x2 |) / n (2)
[0026]
Next, a second embodiment of the present invention will be described.
[0027]
In the present embodiment, when the processing hole position data is described in a unit pattern 9 of m1 to m12 as shown in FIG. 4, the processing hole position data is divided based on the position of the unit pattern.
[0028]
Specifically, from the hole coordinates on the printed circuit board 8 described for each unit pattern 9, starting from the hole (x1) of the minimum coordinate in the X direction of the unit pattern, from the equal distance pitch P between each pattern, Thus, the division position L is obtained.
[0029]
L = (m / 2) × P (3)
[0030]
Here, m is the number of patterns in the X direction (a natural number greater than or equal to 2), and when m is an odd number, it is rounded up as follows.
[0031]
L = {(m + 1) / 2} × P (4)
[0032]
The left and right galvano scanner units 21 and 22 are set at intervals of the division positions L.
[0033]
In this dividing method, the hole arrangement on the printed circuit board 8 processed by both the galvano scanner units 21 and 22 becomes equal. Accordingly, when the number m of pattern rows is an even number, two laser beams guided from the two galvano scanner units 21 and 22 onto the printed circuit board 8 are always irradiated simultaneously. When the number m of pattern rows is an odd number, irradiation to the uniaxial galvano scanner unit is blocked by a shutter or the like.
[0034]
In order to maintain accuracy, the biaxial galvano scanner unit is not moved during machining. Therefore, if the distance pitch between patterns is not equal, only the same pitch portion is machined at the same time. Therefore, manual division is performed at a position as shown in FIG. 5, or the pitch described first in the CAD data is set to (pitch c). In these cases, patterns (1) and (2) are processed simultaneously.
[0035]
In the second embodiment, the same hole pattern is arranged on the substrate, and the division positions are determined so that the left and right galvano scanner units are directly above the respective patterns. For this reason, since the same hole pattern is machined in the machining area that each unit will handle, the number and position of holes are exactly the same.
[0036]
Accordingly, the machining operations of the respective galvano scanner units are exactly the same, so that there is no machining of only one axis (if the number of holes is different, the smaller axis is not machined), and an improvement in machining speed is expected.
[0037]
If there are patterns with different processing hole patterns, the number and positions of the holes are also different. Therefore, the pattern is the same as in the first embodiment, and division is not possible in the second embodiment.
[0038]
In the case where the pattern is different only in one part, the first and second embodiments are mixed.
[0039]
However, if the pitch between patterns is the same even in different patterns, the division in the second embodiment is possible, but the merit of the second embodiment is reduced because the number and positions of holes in the pattern are different.
[0040]
In each of the above embodiments, the beam is split into two by the optical path branching unit, the beam scanning means is the galvano scanner unit, and the workpiece moving means is the stage. The method of obtaining the beam and the type and combination of the beam / workpiece scanning / moving means are not limited to this, and a plurality of laser oscillators may be used from the beginning, for example, by the applicant in JP2000-71089A or JP2000-334634A. A screen cut system combining a linear motor XY stage and a high-speed processing machine as proposed, or a flash cut system may be used.
[0041]
Further, the object of application is not limited to a laser drilling machine that performs spot-like drilling, but can be similarly applied to a laser cutting machine, a fuse fusing machine, a marking device, an exposure device, etc. that perform linear machining.
[0042]
【The invention's effect】
According to the present invention, it is possible to select an optimal division method that shortens the processing time according to data distribution, a processing method, or the like when a processing target position is allocated to each of a plurality of scanning units.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram showing a basic configuration of a biaxial laser processing machine. FIG. 2 is a perspective view showing a concept of division in the biaxial laser processing machine. FIG. 3 is a second embodiment in the first embodiment of the present invention. FIG. 4 is a plan view showing a processing hole pattern division method according to the second embodiment of the present invention. FIG. 5 is a processing hole pattern division when the pitch between patterns is different in the second embodiment. Plan view showing the method 【Explanation of symbols】
8 ... Printed circuit board 8H ... Processing target hole 9 ... Unit pattern 10 ... Laser oscillator 12 ... Laser light 14 ... Optical path branching unit 21, 22 ... Galvano scanner unit (processing head)
24 ... Processing head moving axis L ... Distance between galvano scanner units 30 ... XY stage

Claims (9)

In a laser processing machine that processes one workpiece with a plurality (n) (n is a natural number of 2 or more) of scanning units, when assigning the processing target position to each of the plurality of scanning units,
A method of dividing data between a plurality of axes of a laser beam machine, wherein a machining range on a workpiece is divided into n equal parts. In a laser processing machine that processes a workpiece with a plurality of scanning units, when assigning the processing target position to each of the plurality of scanning units,
A method of dividing data between a plurality of axes of a laser beam machine, characterized in that when machining position data is described in a unit pattern, the division is performed based on the position of the unit pattern. A processing method, wherein processing is performed using data divided by the data dividing method according to claim 1. A computer program for executing the data dividing method according to claim 1 or 2 or the processing method according to claim 3. In a multi-axis data dividing device that allocates a processing target position to each of a plurality of scanning units for a laser processing machine that processes a workpiece with a plurality (n) of scanning units,
A device for dividing data between a plurality of axes of a laser beam machine, comprising means for dividing a machining range on a workpiece into n equal parts. In a multi-axis data dividing device for allocating a processing target position to each of a plurality of scanning units for a laser processing machine that processes a single workpiece with a plurality of scanning units,
An apparatus for dividing data between a plurality of axes of a laser beam machine, comprising means for dividing, when machining position data is described in a unit pattern, based on the position of the unit pattern. A processing apparatus comprising the data dividing apparatus according to claim 5. The computer program for implement | achieving the data division | segmentation apparatus of Claim 5 or 6, or the processing apparatus of Claim 7. A computer-readable recording medium on which the computer program according to claim 4 or 8 is recorded.

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