WO2010122667A1

WO2010122667A1 - Laser processing method, laser processing system and processing controller

Info

Publication number: WO2010122667A1
Application number: PCT/JP2009/058197
Authority: WO
Inventors: 浩一印藤
Original assignee: 三菱電機株式会社
Priority date: 2009-04-24
Filing date: 2009-04-24
Publication date: 2010-10-28
Also published as: JP5236071B2; CN102341212B; CN102341212A; KR101270287B1; TW201038348A; TWI371331B; JPWO2010122667A1; KR20110106381A

Abstract

Disclosed is a laser processing method for performing laser processing on a plurality of works simultaneously with a plurality of laser beams, wherein the difference in the number of punched holes, which is the difference between the number of processing holes for recording first information initially set in a first work and those for recording second information initially set in a second work, is calculated, and as many additional processing holes as the difference in the number of punched holes are set to processing holes smaller in number. After additional processing holes are set to the processing holes smaller in number, the processing holes for recording first information and the processing holes for recording second information are irradiated simultaneously with laser beams, thus forming processed holes for recording first and second information.

Description

LASER PROCESSING METHOD, LASER PROCESSING DEVICE, AND PROCESSING CONTROL DEVICE

The present invention relates to a laser processing method, a laser processing apparatus, and a processing control apparatus for simultaneously laser processing a plurality of workpieces with a plurality of laser beams.

A laser processing apparatus for simultaneously laser processing a plurality of workpieces (workpieces) includes a plurality of processing heads and a plurality of processing tables. For example, when the laser processing apparatus is a laser processing apparatus having two heads (two processing heads), the processing table is disposed below each processing head (see, for example, Patent Document 1). Such a laser processing apparatus may engrave (form) a product processing hole (product processing hole) and information (processing hole for information recording) such as a product number on a workpiece. This stamp is formed so as to represent a character, a symbol, or the like by arranging a plurality of processed holes other than the product.

The 2-head laser processing apparatus irradiates the laser beam so that the same product processing hole is formed in each processing table when forming the product processing hole. In addition, when forming a processing hole (engraved) unique to each product, such as a product number, a two-head laser processing apparatus irradiates one processing table with laser light and imprints on one processing table. After forming, the other processing table was irradiated with laser light to form a mark on the other processing table. In other words, when a separate character or the like is engraved on each processing table, the left workpiece is engraved after the right workpiece is engraved. When forming the marking on one processing table, the laser beam to the other processing table is blocked by a shutter or the like so that the other processing table is not irradiated with the laser beam.

JP 2008-055458 A

However, in the case where a shutter is arranged in the conventional two-head laser processing apparatus and marking is performed sequentially on each processing table, there is a problem that the tact time of the marking time becomes long. For example, when the number management information is imprinted on each workpiece, the workpiece is imprinted in the order of the right machining table and the left machining table. For this reason, when a different character is imprinted on the left and right machining tables, the engraving time is twice as long as when the same character is imprinted on the left and right machining tables.

This invention is made in view of the above, Comprising: Obtaining the laser processing method, laser processing apparatus, and processing control apparatus which can stamp information in a short time when marking different information on the workpiece | work on each table. Objective.

In order to solve the above-described problems and achieve the object, the present invention provides a laser machining method for simultaneously machining a plurality of workpieces with a plurality of laser beams. The first information recording initially set in the first workpiece among the workpieces, which is set in the information recording area for each workpiece in which the machining holes for information recording are arranged by arranging them at a predetermined position on the first workpiece A hole number difference calculating step for calculating a hole number difference between a processing hole for use and a second information recording processing hole initially set in a second work among the works, and the first information recording An additional machining hole having the same number as the difference in the number of holes is set in the minority side machining hole, which is the machining hole having the smaller number of machining holes out of the machining holes for processing and the second information recording machining hole. Machining hole addition step and minority side machining The first and second information recording processing holes and the second information recording processing holes after the setting of the additional processing holes are simultaneously irradiated with laser light. And a processing hole forming step for forming a processing hole for recording information.

In the laser processing method according to the present invention, laser processing is performed by setting additional processing holes as many as the difference in the number of holes in the processing hole having the smaller number of processing holes among the processing information recording holes. There is an effect that information can be imprinted in a short time when different information is imprinted on the workpiece.

FIG. 1 is a diagram illustrating a configuration of a laser processing apparatus according to the first embodiment. FIG. 2 is a diagram illustrating the configuration of the laser processing mechanism according to the first embodiment. FIG. 3 is a diagram for explaining an arrangement position of the marking area. FIG. 4 is a diagram showing the configuration of the marking area. FIG. 5 is a flowchart showing a processing procedure of laser processing. FIG. 6 is a diagram illustrating an example of a marking setting area set in the marking area. FIG. 7 is a diagram for explaining additional candidate coordinates. FIG. 8 is a diagram for explaining additional setting marking holes. FIG. 9 is a diagram for explaining the processing order in the minority region. FIG. 10 is a diagram illustrating an example of a marking hole formed in the minority region. FIG. 11 is a diagram for explaining additional candidate coordinates when a plurality of additional candidate coordinates are set between the marking setting areas. FIG. 12 is a diagram illustrating a configuration of a laser processing apparatus according to the second embodiment. FIG. 13 is a diagram illustrating a configuration of a laser processing mechanism according to the second embodiment. FIG. 14 is a diagram for explaining a dummy area when a dummy area is provided in a scan area used in a product area.

Hereinafter, a laser processing method, a laser processing apparatus, and a processing control apparatus according to an embodiment of the present invention will be described in detail based on the drawings. Note that the present invention is not limited to the embodiments.
Embodiment 1 FIG.

FIG. 1 is a diagram showing a configuration of a laser processing apparatus according to the first embodiment. The laser processing apparatus 1A has two heads that irradiate a workpiece (workpiece WL, WR described later) with laser light to form a machining hole in the left side (L axis side) workpiece WL and the right side (R axis side) workpiece WR. This is a laser processing apparatus.

The laser processing apparatus 1A according to the present embodiment includes a processing hole for a product (a product processing hole H described later) and a processing hole for information recording (a marking hole hL, hR described later) on the workpieces WL and WR. It is formed by laser processing.

The marking hole (first information recording processing hole) hL and the marking hole (second information recording processing hole) hR are, for example, information about the product such as product numbers formed on the workpieces WL and WR (hereinafter referred to as the product numbers). (Referred to as product information). Specifically, the marking holes hL and hR are formed so as to represent characters, symbols, figures, and the like by arranging one to a plurality of processed holes (processed holes that are not products). Product information is information unique to each product, and is different for each product. Therefore, the processing holes constituting the marking holes hL and hR have different arrangements for each product to be stamped.

The laser processing apparatus 1A forms one to a plurality of products in each work WL, WR by forming a plurality of product processing holes H in each work WL, WR. In the following, one product is formed for each workpiece WL, WR, a marking hole hL is stamped on the product formed on the workpiece WL, and a stamping hole hR is stamped on the product formed on the workpiece WR. Will be described. In the following description, the product information (engraved character) is a one-digit product number.

The laser processing apparatus 1A uses the processing program 3 to form the marking holes hL and hR on the products of the workpieces WL and WR according to the products to be formed on the workpieces WL and WR. 1 A of laser processing apparatuses form the marking holes hL and hR in the predetermined area | region (The marking area | region SL and SR mentioned later) on a product. The laser processing apparatus 1A includes a processing control apparatus 10A and a laser processing mechanism (laser processing unit) 20A.

The machining control device 10A is connected to the laser machining mechanism 20A. The machining control device 10A according to the present embodiment controls the laser machining mechanism 20A so that the marking hole hL and the marking hole hR are formed simultaneously. The laser processing mechanism 20A performs laser processing on the workpieces WL and WR based on a processing instruction from the processing control apparatus 10A.

Next, the configuration of the processing control apparatus 10A will be described. The processing control apparatus 10A includes an input unit 11, a processing hole number counting unit 12, a hole number difference calculation unit 13, a differential processing position selection unit (processing hole addition unit) 14, a processing order calculation unit 15, a processing instruction unit 16, and marking information. A storage unit 17 and a control unit 19 are provided.

The input unit 11 inputs the machining program 3 for machining the workpieces WL and WR and various instruction information from the user. The input unit 11 sends the inputted machining program 3 to the machining hole number counting unit 12 and the like, and sends the inputted instruction information to the control unit 19.

The stamp information storage unit 17 is a memory or the like that stores stamp information regarding the stamp holes hL and hR. The marking information includes information on the arrangement of the marking holes hL and hR constituting the marking characters in the marking areas (information recording areas) SL and SR, and the holes of the marking holes hL and hR constituting the marking characters in the marking areas SL and SR. It includes information relating to the interposition (for example, intermediate coordinates between the marking hole hL and the marking hole hL) (hereinafter referred to as inter-hole coordinates) and information relating to the processing order of the marking holes hL and hR constituting the marking character. The marking holes hL and hR constituting the marking character are arranged with a predetermined interval. Accordingly, the coordinates between the holes are determined based on the interval at which the marking holes hL and hR are arranged.

The inter-hole coordinates are spare stamp hole candidate coordinates (additional candidate coordinates described later) prepared in advance for forming the marking hole hL and the marking hole hR at the same time (simultaneous processing start and simultaneous processing end). Cx). The coordinates between the holes are additionally set in a region (hereinafter referred to as a minority side region) having a smaller number of the marking holes hL and hR constituting the marking character in the marking regions SL and SR among the marking regions SL and SR. This is a candidate coordinate of a marking hole (an additional setting marking hole bx described later). Of the marking holes hL and hR, the marking hole in the minority region is the minority processing hole.

The marking holes hL and hR are formed at positions specified by the machining program 3. For example, when the product information formed on the workpiece WL is the product number “1”, the product number “1” and the position of the marking area SL that forms the product number are set in the machining program 3. The marking information storage unit 17 stores in advance the arrangement of the marking holes hL necessary for marking the stamped character “1”, the inter-hole coordinates regarding the marking holes hL, and the like.

The machining hole number counting unit 12 extracts product information to be formed on the workpieces WL and WR from the machining program 3 and also arranges the arrangement of the marking holes hL and hR corresponding to the product information (engraved characters) as a marking information storage unit. 17 is extracted. The processing hole number counting unit 12 counts the number of the marking holes hL and hR (the number of processing holes). The processed hole number counting unit 12 sends the counted processed hole numbers of the marking holes hL and hR to the hole number difference calculating unit 13.

The hole number difference calculating unit 13 uses the number of processed holes hL and hR counted by the processed hole number counting unit 12 to use the difference in the number of processed holes between the stamped hole hL and the stamped hole hR (difference in the number of stamped holes). Is calculated. The hole number difference calculating unit 13 uses the information indicating which of the marking region SL and the marking region SR is the minority side region and the calculated difference in the number of stamped holes to the difference machining position selecting unit 14 as hole number difference information. send.

The difference machining position selection unit 14 extracts from the stamp information storage unit 17 the coordinates between the holes of the stamp character set in the minority region. The differential machining position selection unit 14 selects the same number of additional candidate coordinates Cx as the difference in the number of stamped holes from the additional candidate coordinates Cx set as the inter-hole coordinates. For example, when the number of marking holes is 4 holes, the differential machining position selection unit 14 selects four additional candidate coordinates Cx from the additional candidate coordinates Cx set in the inter-hole information. The additional candidate coordinates Cx selected by the differential machining position selection unit 14 become an additional setting marking hole bx and are added to the minority region. The additional candidate coordinates Cx in the hole-to-hole information selected by the differential machining position selection unit 14 may be any additional candidate coordinates Cx, for example, 4 in order from the set upper side (in order of lower setting numbers). Two additional candidate coordinates Cx are selected.

The machining order calculation unit 15 uses the additional setting marking hole bx formed in the additional marking position and the initial setting marking hole ax that is initially set in the minority side region, and the small number with the additional setting marking hole bx added. The processing order of the processing holes in the side region is calculated. For example, the processing order calculation unit 15 calculates the processing order in the minority region so that the processing time in the minority region is the shortest. Further, the machining order calculation unit 15 may calculate the machining order in the minority region so that the moving distance of the machining position from the machining hole to the machining hole is the shortest. Further, the machining order calculation unit 15 may distribute the machining position and the machining order so that the movement distance of the machining position becomes greater than a predetermined distance in order to prevent the temperature of the workpieces WL and WR from increasing at each machining position.

The processing instruction unit 16 outputs a processing instruction specifying the positions of the product processing hole H and the marking holes hL and hR to the laser processing mechanism 20A using the processing program 3, the marking information, and the processing order of the minority region.

The control unit 19 controls the input unit 11, the processed hole number counting unit 12, the hole number difference calculating unit 13, the differential processing position selecting unit 14, the processing order calculating unit 15, the processing instruction unit 16, and the marking information storage unit 17. The product information set in the machining program is not limited to specific characters and may be actual coordinates of the marking holes hL and hR for forming the product information.

Next, the configuration of the laser processing mechanism 20A will be described. FIG. 2 is a diagram illustrating the configuration of the laser processing mechanism according to the first embodiment. In FIG. 2, the structural example of the laser processing mechanism which multi-axialized the laser beam 2 is shown. The laser processing mechanism 20A is configured to perform laser processing with an R-axis and L-axis actuator (for example, galvano), and includes a spectroscope 28, two sets of laser heads 29L and 29R, and workpieces WL and WR. And processing tables 25L and 25R.

The laser heads 29L and 29R have galvano scan mirrors 22a and 22b,

galvano scanners

23a and 23b, and an fθ lens 24, respectively. The laser beam 2 output from the laser oscillator is split by the spectroscope 28, and the split laser beam 2 is simultaneously supplied to the laser heads 29L and 29R. Then, the laser beam 2 irradiated from the laser heads 29L and 29R simultaneously drills the workpieces WL and WR.

The galvano scan mirror 22a is a first galvano scan mirror that receives the laser beam 2 output from a laser oscillator (not shown). The galvano scan mirror 22a is connected to the drive shaft of the galvano scanner 23a, and the drive shaft of the galvano scanner 23a faces the Z-axis direction. The mirror surface of the galvano scan mirror 22a is displaced with the rotation of the drive shaft of the galvano scanner 23a, and deflects and scans the optical axis of the incident laser beam 2 in a first direction (for example, the X-axis direction). Send to the mirror 22b.

The galvano scan mirror 22b is a second galvano scan mirror that receives the laser light 2 from the galvano scan mirror 22a. The galvano scan mirror 22b is connected to the drive shaft of the galvano scanner 23b, and the drive shaft of the galvano scanner 23b faces the Y-axis direction. The mirror surface of the galvano scan mirror 22b is displaced in accordance with the rotation of the drive shaft of the galvano scanner 23b, and the second direction (for example, the Y-axis direction) is substantially perpendicular to the optical axis of the incident laser beam 2 in the first direction. Are deflected and scanned and sent to the fθ lens 24.

The fθ lens 24 collects and irradiates the laser beam 2 that is two-dimensionally scanned in the XY plane onto the workpieces WL and WR. The workpieces WL and WR such as printed circuit board materials and ceramic green sheets have a planar shape, and the processing table 25 places the workpieces WL and WR in the XY plane.

In the laser processing mechanism 20A, the processing table 25 is moved in the XY plane, and the laser light 2 is two-dimensionally scanned by the

galvano scanners

23a and 23b. As a result, product processing holes H and marking holes hL and hR are formed in the workpieces WL and WR in the scan area that is within the range in which the laser beam 2 can be two-dimensionally scanned by the

galvano scanners

23a and 23b. In FIG. 2, the two-head laser processing mechanism 20A has been described, but the laser processing mechanism 20A may have four or more heads.

Next, the marking areas SL and SR in which the marking holes hL and hR are formed will be described. FIG. 3 is a diagram for explaining the arrangement position of the marking area, and FIG. 4 is a diagram illustrating the configuration of the marking area.

As shown in FIG. 3, the laser beam 2 is split by the spectrometer 28, and the split laser beam 2 is irradiated to the workpieces WL and WR, respectively. The coordinates (in-work coordinates) on the workpiece WL of the laser light 2 irradiated to the workpieces WL and WR are the same coordinates as the in-work coordinates on the workpiece WR. Thereby, the same product processing hole H is formed on the same coordinates on the workpieces WL and WR, and the same product is formed on the workpieces WL and WR.

A marking area SL for forming a marking hole hL is provided at a predetermined position on the workpiece WL (for example, near the end of the workpiece WL), and a predetermined position on the workpiece WR (for example, near the end of the workpiece WR). A marking region SR for forming the marking hole hR is provided. In the present embodiment, the marking area SL and the marking area SR are set as the same in-work area, and different marking characters are simultaneously formed in the marking areas SL and SR. In other words, the product processing hole H is formed at the same in-work coordinates by the laser beam 2 irradiated at the same timing, whereas the marking holes hL and hR are different depending on the laser beam 2 irradiated at the same timing. Formed in the workpiece coordinates.

Since the marking area SL and the marking area SR are similar areas, the configuration of the marking area SL will be described here. As shown in FIG. 4, the marking area SL is a rectangular area, and a plurality of square areas (marking hole candidates BL) are arranged in a matrix in the vertical direction (row direction) and the horizontal direction (column direction). ing. In FIG. 4, columns, rows, column numbers, row numbers, and the like are shown in the marking area SL. However, this is shown for convenience of explanation, and these characters and characters are shown in the actual marking area SL. No area is arranged, and only the marking hole candidate BL is arranged.

FIG. 4 shows a case where 65 marking hole candidates BL are arranged in the marking area SL (5 horizontal rows) × (13 vertical rows) = 65. The marking hole candidate BL is a processing hole candidate for forming the marking hole hL, and a predetermined marking hole candidate BL is set as an actual marking hole hL from the candidates. In FIG. 4, the square area set in the actual marking hole hL among the marking hole candidates BL is indicated by the marking setting area AL. Among the marking hole candidates BL, a part of the marking hole candidates BL is set in the marking setting area AL, whereby one character such as the numeral “1” is represented in one marking area SL. . One to a plurality of marking areas SL are arranged on the product on the workpiece WL, and one to a plurality of characters are formed by the one to the plurality of marking areas SL. In the present embodiment, a case will be described in which one marking area SL is arranged in the product of the workpiece WL, and one marking area SR is arranged in the product of the workpiece WR.

Note that the marking hole candidate BL and the marking setting area AL are not limited to a square area, but may be any area such as a rectangular area or a circular area. In addition, the marking areas SL and SR are not limited to rectangular areas, but may be any area such as a circular area.

Next, the processing procedure of laser processing will be described. FIG. 5 is a flowchart showing a processing procedure of laser processing. The machining program 3 is input from the input unit 11 to the machining control apparatus 10A (step S10). The input unit 11 sends the input machining program 3 to the machining hole count unit 12 and the machining instruction unit 16.

The machining hole number counting unit 12 extracts product information formed on the workpieces WL and WR from the machining program 3 and arranges the marking holes hL and hR corresponding to the marking characters of the product information (the marking areas SL and SR). The processing hole is extracted from the stamp information storage unit 17. The processing hole number counting unit 12 counts the number of processing holes in the marking holes hL and hR constituting each marking character (step S20). The processed hole number counting unit 12 sends the processed number of processed holes hL and hR in the marked regions SL and SR to the hole number difference calculating unit 13.

The hole number difference calculation unit 13 uses the number of machining holes in the marking areas SL and SR counted by the machining hole number counting unit 12 to calculate the difference in the number of machining holes in the marking areas SL and SR as the number of marking holes. (Step S30). The hole number difference calculation unit 13 uses a difference machining position selection unit as information on which of the marking region SL and the marking region SR is the minority side region and the calculated marking hole number difference as hole number difference information. 14

Here, a specific example of the marking character, the minority region, and the number of marking holes set in the marking areas SL and SR will be described. FIG. 6 is a diagram illustrating an example of a marking setting area set in the marking area. FIG. 6 shows a case where a stamped character “1” is formed in the stamped region SL and a stamped character “2” is formed in the stamped region SR.

In the marking area SL, one marking hole hL is formed in each marking setting area AL, so that a marking character of “1” is formed in the marking area SL. In the marking area SR, one marking hole hR is formed in each marking setting area AR, so that a marking character “2” is formed in the marking area SR. FIG. 6 shows a case where nine marking setting areas AL are set in the marking area SL, and thirteen marking setting areas AR are set in the marking area SR. Therefore, in this case, the minority area is the marking area SL, and the number of marking holes is 4 holes.

After calculating the difference in the number of stamped holes, the differential machining position selecting unit 14 extracts from the stamped information storage unit 17 the coordinates between the holes of the stamped characters set in the minority side area. The differential machining position selection unit 14 selects four additional candidate coordinates Cx, which are the same as the difference in the number of stamped holes, from the additional candidate coordinates Cx set as the inter-hole coordinates. The differential machining position selection unit 14 sets an additional setting marking hole bx in the selected additional candidate coordinate Cx, and adds the additional setting marking hole bx to the minority side region.

FIG. 7 is a diagram for explaining additional candidate coordinates, and FIG. 8 is a diagram for explaining additional setting stamp holes. As shown in FIG. 7, in the marking area SL, additional candidate coordinates C1 to C7 are set between the marking setting area AL and the marking setting area AL as additional candidate coordinates Cx which are coordinates between holes. In the present embodiment, by setting any of the additional candidate coordinates C1 to C7 to the additional setting marking hole bx, the number of marking holes hL in the marking area SL, the number of marking holes hR in the marking area SR, and To the same number.

For example, when the differential machining position selection unit 14 selects additional candidate coordinates C1 to C4, as shown in FIG. 8, additional setting marking holes b1 to b4 are set as additional setting marking holes bx in the additional candidate coordinates C1 to C4. The Also, one initial setting marking hole ax is set in each marking setting area AL. Specifically, the initial setting marking holes a1 to a9 are set as the initial setting marking holes ax in the marking setting area AL in the marking area SL. Thereby, 13 marking holes hL (the same number of marking holes hL as the marking holes hR) including the initial setting marking holes a1 to a9 and the additional setting marking holes b1 to b4 are set in the marking area SL. It will be. In this way, the differential machining position selection unit 14 sets the additional setting marking hole bx as many as the marking hole number difference in the marking character with the smaller number of marking holes (step S40).

The processing order calculation unit 15 calculates the processing order of all the marking holes hL in the minority side region based on the positions of all the marking holes hL including the initial setting marking holes ax and the additional setting marking holes bx (step) S50). For example, the processing order calculation unit 15 calculates the processing order in the minority region so that the moving distance of the processing position from the marking hole to the marking hole is the shortest. For example, when calculating the processing order in the marking area SL shown in FIG. 8, based on the positions of the 13 marking holes hL including the initial setting marking holes a1 to a9 and the additional setting marking holes b1 to b4. Then, the processing order of the marking holes hL in the marking area SL is calculated.

FIG. 9 is a diagram for explaining the processing order in the minority region. FIG. 9 shows the processing order when the processing order is set in the marking area SL shown in FIG. The processing order calculation unit 15 includes an initial marking hole a1 to a9 and an additional setting marking hole b1 to b4. To extract. FIG. 9 shows a case where the initial setting marking hole a1 is extracted from the initial setting marking holes a1 to a9 and the additional setting marking holes b1 to b4 as the end marking holes constituting the marking character “1”. ing. Thereafter, the processing order calculation unit 15 sequentially extracts the marking holes adjacent to the marking holes extracted from the initial setting marking holes a2 to a9 and the additional setting marking holes b1 to b4, and the extracted order is defined as the processing order. To do. The processing order calculation unit 15 extracts marking holes in the order shown in (1) to (13), for example.
(1) Extract an initial marking hole a1 located at the end of the marking character.
(2) An additional setting marking hole b1 adjacent to the initial setting marking hole a1 is extracted.
(3) An initial setting marking hole a2 adjacent to the additional setting marking hole b1 is extracted.
(4) Extract the initial marking hole a3 adjacent to the initial marking hole a2.
(5) An additional setting marking hole b2 adjacent to the initial setting marking hole a3 is extracted.
(6) An initial setting marking hole a4 adjacent to the additional setting marking hole b2 is extracted.
(7) An additional setting marking hole b3 adjacent to the initial setting marking hole a4 is extracted.
(8) An initial setting marking hole a5 adjacent to the additional setting marking hole b3 is extracted.
(9) An additional setting marking hole b4 adjacent to the initial setting marking hole a5 is extracted.
(10) An initial setting marking hole a6 adjacent to the additional setting marking hole b4 is extracted.
(11) Extract the initial marking hole a7 adjacent to the initial marking hole a6.
(12) Extract the initial marking hole a8 adjacent to the initial marking hole a7.
(13) Extract an initial marking hole a9 adjacent to the initial marking hole a8.
The processing order calculation unit 15 sets the order of the marking holes extracted in (1) to (13) as the processing order of the marking holes in the marking area SL.

The processing instruction unit 16 outputs a processing instruction specifying the positions of the product processing hole H and the marking holes hL and hR to the laser processing mechanism 20A using the processing program 3, the marking information, and the processing order of the minority region. Specifically, the machining instruction unit 16 sends a machining instruction for the product machining hole H to the workpieces WL and WR based on the machining program 3. Further, the processing instruction unit 16 sends a processing instruction for the marking hole hL to the marking region SL based on the marking information and the processing order calculated by the processing order calculation unit 15. Further, the processing instruction unit 16 sends a processing instruction for the marking hole hR to the marking region SR based on the marking information.

FIG. 10 is a diagram illustrating an example of a marking hole formed in the minority region. FIG. 10 shows a case where the marking holes hL are formed at the positions of the initial setting marking holes a1 to a9 and the additional setting marking holes b1 to b4 described in FIG. In the present embodiment, the stamp character is formed by setting the additional stamp hole bx in the coordinates between the holes between the initial stamp hole ax and the initial stamp hole ax constituting the stamp character. It is possible to form a stamped character without greatly affecting the appearance.

In the present embodiment, a case has been described in which one additional candidate coordinate Cx is set as an inter-hole coordinate between the marking setting area AL and the marking setting area AL. A plurality of additional candidate coordinates Cx may be set as inter-hole coordinates between the setting area AL.

FIG. 11 is a diagram for explaining additional candidate coordinates when a plurality of additional candidate coordinates are set between the marking setting areas. FIG. 11 shows a case where two additional candidate coordinates Cx are set between the marking setting areas AL in the marking area SL. In the marking area SL of FIG. 11, additional candidate coordinates C11 and C12 are set between the marking setting area ALs where the additional candidate coordinates C1 are set in the marking area SL shown in FIG. 7, and the additional candidate coordinates C2 are set. Additional candidate coordinates C13 and C14 are set between the setting areas AL. Similarly, additional candidate coordinates C15 and C16, additional candidate coordinates C17 and C18, additional candidate coordinates C19, and additional candidate coordinates C19, between the marking setting areas AL in which additional candidate coordinates C3 to C7 are set in the marking area SL shown in FIG. C20, additional candidate coordinates C21 and C22, and additional candidate coordinates C23 and C24 are set.

Thereby, even if the difference in the number of marking holes is large, a number of additional setting marking holes bx can be set. Therefore, the number of marking holes hL in the marking area SL, the number of marking holes hR in the marking area SR, and Can be made the same number. FIG. 11 shows a case where two additional candidate coordinates Cx are set between the marking setting areas AL in the marking area SL. However, 3 is set between one marking setting area AL in the marking areas SL and SR. Two or more additional candidate coordinates Cx may be set. Further, the additional candidate coordinates Cx set between one marking setting area AL need not be the same number between the marking setting areas AL, and are set between the marking setting areas AL according to the dimension between the marking setting areas AL. The number of additional candidate coordinates Cx may be determined.

Further, a plurality of types of additional candidate coordinates Cx may be set between the marking setting areas AL in the marking areas SL and SR. For example, both the additional candidate coordinates Cx shown in FIG. 11 and the additional candidate coordinates Cx shown in FIG. 7 may be set. When a plurality of types of additional candidate coordinates Cx are set between the marking setting areas AL, the differential machining position selection unit 14 determines which type of additional candidate coordinates Cx based on the size of the number of marking holes, machining conditions, and the like. Determine whether to use. The processing conditions are, for example, the number of laser pulses in one marking hole hL, hR, the laser energy per pulse, the total laser energy irradiated to one marking hole hL, hR, the material of the workpiece WL, WR, the marking hole These are the hole intervals of hL and hR, the sizes of the marking holes hL and hR, and the like.

For example, when the number of laser pulses to one marking hole hL, hR is larger than a predetermined number, the difference machining position selection unit 14 determines that the additional candidate coordinates Cx set between one marking setting area AL are predetermined. It is determined that the marking information smaller than the number (hereinafter referred to as a small number of marking information) is used. Further, for example, when the laser energy per pulse is larger than a predetermined value, the differential machining position selection unit 14 determines to use marking information set in a small number. In addition, for example, when the total laser energy irradiated to one marking hole hL, hR is larger than a predetermined value, the differential machining position selection unit 14 determines to use a small number of marking information. Further, for example, when the laser beam irradiation resistance of the workpieces WL and WR is lower than a predetermined value, the differential machining position selection unit 14 determines to use a small number of marking information. Further, for example, when the hole interval between the marking holes hL and hR is narrower than a predetermined value, the differential machining position selection unit 14 determines to use a small number of marking information. Further, for example, when the size (diameter or depth) of the marking holes hL and hR is larger than a predetermined value, the differential machining position selection unit 14 determines that the marking information set in a small number is used. Further, for example, when the difference in the number of marking holes is larger than a predetermined number, the differential machining position selection unit 14 determines to use marking information set in a small number.

When a small number of marking information is used, the overlap between the additional setting marking holes bx and the overlapping between the additional setting marking holes bx and the initial setting marking holes ax are reduced, so that high-quality workpieces WL and WR can be performed. It becomes possible. In addition, it is possible to easily calculate a processing order for processing high-quality workpieces WL and WR. In addition, when the marking information having more than a predetermined number of additional candidate coordinates Cx set between one marking setting area AL is used, a large number of additional setting marking holes bx can be formed.

Further, in the present embodiment, a case has been described in which one marking region SL is arranged in the product of the workpiece WL and one marking region SR is arranged in the product of the workpiece WR. However, a plurality of workpieces WL and WR are included in the workpiece WL and WR. The marking areas SL and SR may be arranged. In this case, the above-described additional setting marking hole bx is provided for the first marking area SL and the first marking area SR (the first marking area SL, SR), and the first set within the same time. Are processed in the marking areas SL and SR. Similarly to the first set of marking areas SL and SR, the above-described additional setting marking holes bx are provided for the second and subsequent sets of marking areas SL and SR, and the second and subsequent sets of marking areas SL and SR are formed within the same time. Processing in SR.

Further, the additional setting marking hole bx formed in the marking area SL may partially or entirely overlap with other additional setting marking holes bx. Further, the additional setting marking hole bx formed in the marking area SL may partially or entirely overlap with the initial setting marking hole ax. When the additional setting marking hole bx is overlapped with the entire initial setting marking hole ax, the additional setting marking hole bx is set on the initial setting marking hole ax.

Whether or not the additional setting marking hole bx and the initial setting marking hole ax are overlapped may be determined based on an instruction externally input by the user, or based on the processing conditions of the workpieces WL and WR. The selection unit 14 may make the determination. By overlapping the additional setting marking hole bx and the initial setting marking hole ax, a large number of additional setting marking holes bx can be set in the marking areas SL and SR. Further, by not overlapping the additional setting marking hole bx and the initial setting marking hole ax, it is possible to form the high-quality marking holes hL and hR without causing processing defects even when the processing conditions are severe. Become.

It should be noted that the engraved characters formed by the engraved holes hL and hR are not limited to characters, symbols, figures, etc., but may be any information such as a two-dimensional barcode or a mark. Further, the product information is not limited to the product number, and may be any information such as a lot number and manufacturing date / time.

In the present embodiment, the case where the additional candidate coordinates Cx are registered in advance has been described. However, the differential machining position selection unit 14 may automatically set the additional candidate coordinates Cx. In this case, the differential machining position selection unit 14 sets additional candidate coordinates Cx based on the number of marking holes or machining conditions.

Thus, in the laser processing method of the present embodiment, in the laser processing apparatus 1A having two or more tables, the step of counting the number of the marking holes hL and hR for the left and right marking characters, and the marking holes hL and hR A step of calculating the number of stamped holes in the smaller number of characters to set an additional setting stamped hole bx, a step of calculating a processing order for processing the stamped character in the shortest, an additional setting stamped hole bx and an initial Machining the set marking hole ax.

As described above, according to the first embodiment, the additional setting marking hole bx is set in the minority region, and the number of the marking holes hL and hR of the marking characters formed in the marking areas SL and SR is made equal. Even when different stamp characters are formed in the stamp regions SL and SR, the stamp characters can be formed in the stamp regions SL and SR without using an optical shutter or the like. Therefore, different stamp characters can be formed in the stamp regions SL and SR with a simple configuration.

Further, since the stamp characters are formed in the stamp regions SL and SR without using an optical shutter or the like, the stamp characters can be formed in a short time. In addition, since the additional setting marking hole bx is provided in the minority side region, it is possible to form the marking character in a shorter time than when the additional setting marking hole bx is provided outside the minority side region.
Embodiment 2. FIG.

Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, the laser beam 2 having the difference in the number of marking holes is irradiated to the other area (another position different from the minority area) without irradiating the minority area.

FIG. 12 is a diagram showing the configuration of the laser processing apparatus according to the second embodiment. Of the constituent elements in FIG. 12, constituent elements that achieve the same functions as those of the laser processing apparatus 1 A according to the first embodiment shown in FIG.

The laser processing apparatus 1B has a processing control apparatus 10B and a laser processing mechanism 20B. The machining control device 10B is connected to the laser machining mechanism 20B. The machining control device 10B according to the present embodiment controls the laser machining mechanism 20B so that the marking hole hL and the marking hole hR are formed simultaneously. Specifically, the machining control device 10B irradiates a later-described damper 31 with laser light 2 having a difference in the number of marking holes, or blocks it with a shutter 32 described later. The laser processing mechanism 20B performs laser processing on the workpieces WL and WR based on a processing instruction from the processing control device 10B.

Next, the configuration of the machining control device 10B will be described. The processing control apparatus 10B includes an input unit 11, a processing hole number counting unit 12, a hole number difference calculating unit 13, a processing instruction unit 16, a marking information storage unit 17, an irradiation control instruction unit 18, and a control unit 19.

The irradiation control instruction unit 18 sends a control instruction to the laser processing mechanism 20B based on the number difference of the marking holes calculated by the hole number difference calculation unit 13. The irradiation control instruction unit 18 sends a control instruction for irradiating the laser beam 2 for forming the same number of marking holes as the difference in the number of marking holes toward the damper 31 or a control instruction for shutting it off by the shutter 32 to the laser processing mechanism 20B. . The laser beam 2 for forming the same number of marking holes as the difference in the number of marking holes is the same number of pulse lasers as the laser beam 2 irradiated to form the additional setting marking hole bx described in the first embodiment. Thereby, in this embodiment, instead of forming the additional setting marking hole bx with the laser beam 2 with the difference in the number of marking holes, the laser processing mechanism 20B is configured not to irradiate the minority region with the laser beam 2 with the difference in the number of marking holes. Control.

Next, the configuration of the laser processing mechanism 20B will be described. FIG. 13 is a diagram illustrating a configuration of a laser processing mechanism according to the second embodiment. Of the constituent elements in FIG. 13, constituent elements that achieve the same functions as those of the laser processing mechanism 20 A of the first embodiment shown in FIG. 2 are given the same numbers, and redundant descriptions are omitted. The laser processing mechanism 20B includes a spectrometer 28, two sets of laser heads 30L and 30R, and processing tables 25L and 25R on which the workpieces WL and WR are placed.

The laser heads 30L and 30R have a damper 31 and a shutter 32, respectively, as compared with the laser heads 29L and 29R of the first embodiment. The damper 31 has a function of absorbing the laser beam 2, and the laser beam 2 with a difference in the number of imprinted holes in the minority side region is irradiated on the damper 31, whereby the laser beam with a difference in the number of imprinted holes in the minority side region. 2 is not irradiated to a small number of regions. The damper 31 is disposed in the vicinity of the fθ lens 24, and the laser light 2 having the difference in the number of marking holes in the minority side region is guided to the damper 31 from the galvano scan mirror 22b.

The shutter 32 has a function of blocking the laser beam 2, and the laser beam 2 having a difference in the number of marking holes in the minority side region is blocked by the shutter 32, whereby the laser beam having a difference in the number of marking holes in the minority side region. 2 is not irradiated to a small number of regions. The shutter 32 is disposed so as to be freely opened and closed before the galvano scan mirror 22a. By closing the shutter 32, the laser light 2 to the galvano scan mirror 22a can be blocked. The damper 31 and the shutter 32 may be arranged at a position different from the position shown in FIG.

Next, the control process of the irradiation control instruction unit 18 will be described. The irradiation control instruction unit 18 determines which one of the damper 31 and the shutter 32 to use based on the number of marking holes calculated by the hole number difference calculation unit 13. For example, the irradiation control instruction unit 18 uses the damper 31 when the number of marking holes is less than a predetermined number, and uses the shutter 32 when the number of marking holes is a predetermined number or more. When using the damper 31, the irradiation control instruction unit 18 controls the laser processing mechanism 20 B so as to irradiate the damper 31 with the laser beam 2 having a difference in the number of marking holes in the minority side region. Further, when the shutter 32 is used, the irradiation control instruction unit 18 controls the laser processing mechanism 20 B so that the laser light 2 with the difference in the number of marking holes in the minority side region is blocked by the shutter 32.

Note that the irradiation control instruction unit 18 may determine which of the damper 31 and the shutter 32 to use based on the processing conditions. For example, when the number of laser pulses to one marking hole hL, hR is smaller than a predetermined number, the irradiation control instruction unit 18 determines to use the damper 31. Moreover, the irradiation control instruction | indication part 18 judges that the damper 31 is used, for example, when the laser energy per pulse is larger than a predetermined value. Moreover, the irradiation control instruction | indication part 18 judges that the damper 31 is used, for example, when the total laser energy irradiated to one marking hole hL and hR is larger than predetermined value. Moreover, the irradiation control instruction | indication part 18 judges that the damper 31 is used, for example, when the laser beam irradiation tolerance of the workpiece | work WL and WR is lower than a predetermined value. Moreover, the irradiation control instruction | indication part 18 judges that the damper 31 is used, for example, when the hole space | interval of the marking holes hL and hR is narrower than a predetermined value. Moreover, the irradiation control instruction | indication part 18 judges that the damper 31 is used, for example, when the size of the marking holes hL and hR is larger than a predetermined value. Moreover, the irradiation control instruction | indication part 18 judges that the damper 31 is used, for example, when the number difference of a marking hole is larger than predetermined number.

In the present embodiment, the laser heads 30L and 30R each have both the damper 31 and the shutter 32. However, the laser heads 30L and 30R have either the damper 31 or the shutter 32, respectively. The structure which has may be sufficient. When the laser heads 30 L and 30 R have the damper 31, the laser beam 2 with the difference in the number of marking holes is irradiated to the damper 31. Further, when the laser heads 30 L and 30 R have the shutter 32, the laser light 2 with the difference in the number of marking holes is blocked by the shutter 32. When the laser heads 30L and 30R have only one of the damper 31 and the shutter 32, the irradiation control instruction unit 18 does not need to determine which of the damper 31 and the shutter 32 is used.

Further, instead of the damper 31, a dummy region (region on the workpiece WL, WR different from the minority side region) for irradiating the laser beam 2 with the difference in the number of marking holes in the minority side region may be provided. This dummy area may be provided in the product area on the workpieces WL and WR, or may be provided outside the product area on the workpieces WL and WR. When the dummy area is provided in the product area on the workpieces WL and WR, since the distance between the initial setting marking hole ax and the additional setting marking hole bx is shortened, the marking holes hL and hR can be formed in a short time. It becomes. Further, when the dummy area is provided outside the product area on the workpieces WL and WR, the dummy area can be arranged at various positions on the workpiece, so that the dummy area can be easily arranged.

Further, a dummy area may be provided in the same scan area as the product area (in the scan areas of the

galvano scanners

23a and 23b). In this case, it is possible to form the marking holes hL and hR in a short time even if the dummy area is arranged outside the product area on the workpieces WL and WR.

FIG. 14 is a diagram for explaining a dummy area when a dummy area is provided in the scan area used in the product area. FIG. 14 shows a dummy region d used when laser processing the product region PL on the workpiece WL.

When laser processing the product region PL, a plurality of scan areas G are provided, and each scan area G is irradiated with laser light. For example, when the marking area SL is arranged at the end of the product area PL (lower right in FIG. 14), the scan area G when laser processing the marking area SL is the area outside the product area PL and the product area ( In some cases, the product is placed across the product area. In such a case, the dummy area d can be provided in the scan areas of the

galvano scanners

23a and 23b by arranging the dummy area d in the vicinity of the marking area SL of the outside product area.

Further, the machining control device 10B may have both functions of the machining control devices 10A and 10B. In this case, the machining control device 10B includes an input unit 11, a machining hole count unit 12, a hole number difference calculation unit 13, a differential machining position selection unit 14, a machining order calculation unit 15, a machining instruction unit 16, and a marking information storage unit 17. The irradiation control instruction unit 18 and the control unit 19 are included. In the machining control device 10B, the differential machining position selection unit 14 determines whether to use the additional setting marking hole bx or the damper 31 or the shutter 32 based on the size of the marking hole number difference, the processing conditions, and the like.

For example, when the number of laser pulses to one marking hole hL, hR is less than a predetermined number, the differential machining position selection unit 14 determines to use the additional setting marking hole bx. Further, for example, when the laser energy per pulse is smaller than a predetermined value, the differential machining position selection unit 14 determines to use the additional setting marking hole bx. Further, for example, when the total laser energy irradiated to one marking hole hL, hR is smaller than a predetermined value, the differential machining position selection unit 14 determines to use the additional setting marking hole bx. Further, for example, when the laser beam irradiation resistance of the workpieces WL and WR is lower than a predetermined value, the differential machining position selection unit 14 determines to use the additional setting marking hole bx. Further, for example, when the hole interval between the marking holes hL and hR is narrower than a predetermined value, the differential machining position selection unit 14 determines to use the additional setting marking hole bx. Further, for example, when the size of the marking holes hL and hR is smaller than a predetermined value, the differential machining position selection unit 14 determines to use the additional setting marking hole bx. Further, for example, when the difference in the number of marking holes is smaller than a predetermined number, the differential machining position selection unit 14 determines to use the additional setting marking hole bx.

Note that the processing order calculation unit 15 may calculate the processing order of the marking holes hL and hR within the minority region based on the size of the number of marking holes, processing conditions, and the like. The machining order calculation unit 15 calculates the machining order so that the burden on the workpieces WL and WR (working defects of the workpieces WL and WR) is reduced based on the size difference between the number of engraved holes and the machining conditions.

As described above, according to the second embodiment, since the laser beam 2 having the difference in the number of marking holes is not irradiated to the minority side region using the damper 31, the shutter 32, the dummy region d, etc., the marking regions SL, SR Even when different stamped characters are formed, the stamped characters can be easily formed in a short time.

As described above, the laser processing method, laser processing apparatus, and processing control apparatus according to the present invention are suitable for simultaneous processing of a plurality of workpieces performed by a plurality of laser beams.

1A, 1B Laser processing device 2 Laser light 10A, 10B Processing control device 12 Processing hole count unit 13 Hole number difference calculation unit 14 Differential processing position selection unit 15 Processing order calculation unit 16 Processing instruction unit 17 Stamping information storage unit 18 Irradiation

control Instruction unit

20A, 20B

Laser processing mechanism

22a, 22b

Galvano scan mirror

23a,

23b Galvano scanner

25L, 25R Processing table 29L, 29R, 30L, 30R Laser head 31 Damper 32 Shutter a1-a9 Initial setting marking hole b1-b4 Additional setting marking Hole d Dummy area hL, hR Marking hole AL, AR Marking setting area BL, BR Marking hole candidate C1 to C7, C11 to C24 Additional candidate coordinates H Product machining hole SL, SR Stamping area WL, WR Workpiece

Claims

In a laser processing method for simultaneously laser processing a plurality of workpieces with a plurality of laser beams,
Of the workpieces, set in the information recording area for each workpiece in which the machining holes for information recording are arranged by arranging the machining holes different from the machining holes for products at predetermined positions on each workpiece The difference in the number of holes between the first information recording machining hole initially set in the first workpiece and the second information recording machining hole initially set in the second workpiece of the workpiece is calculated. A hole number difference calculating step,
The same number as the difference in the number of holes is added to the minority-side processed hole, which is the processed hole having the smaller number of processed holes, of the first information recording processed hole and the second information recording processed hole. Machining hole addition step to set the machining hole,
After the additional machining hole is set in the minority side machining hole, the first information recording machining hole and the second information recording machining hole are simultaneously irradiated with laser light to Processing hole forming step for forming processing holes for first and second information recording;
A laser processing method comprising:
2. The laser processing method according to claim 1, wherein in the processing hole adding step, the additional processing holes are arranged between the processing holes of the minority side processing holes.
The laser processing method according to claim 2, wherein the processing hole adding step includes arranging a plurality of the additional processing holes between the processing holes.
The laser machining method according to claim 1, wherein the machining hole adding step is arranged such that the additional machining hole is at least partially overlapped with another additional machining hole or a minority side machining hole.
After the processing hole addition step, the processing time for the first or second information recording processing hole after setting the same number of additional processing holes as the difference in the number of holes in the minority side processing hole is the shortest processing time. A processing order setting step for setting the processing order
2. The laser processing method according to claim 1, wherein the processing hole forming step forms the first and second information recording processing holes in accordance with a set processing order.
In a laser processing method for simultaneously laser processing a plurality of workpieces with a plurality of laser beams,
Of the workpieces, set in the information recording area for each workpiece in which the machining holes for information recording are arranged by arranging the machining holes different from the machining holes for products at predetermined positions on each workpiece The difference in the number of holes between the first information recording machining hole initially set in the first workpiece and the second information recording machining hole initially set in the second workpiece of the workpiece is calculated. A hole number difference calculating step,
Of the first information recording processing hole and the second information recording processing hole, the same number as the difference in the number of holes is added to the minority side processing hole which is the processing hole having the smaller number of processing holes. Based on the difference in the number of holes or the processing conditions related to the laser processing, whether to set a processing hole or irradiate a laser beam having a difference in the number of holes to a position different from the region where the minority side processing holes are arranged An irradiation condition determination step determined by
When setting the additional processing hole, the first information recording processing hole and the second information recording processing hole after setting the additional processing hole in the minority side processing hole. When the laser beam having the difference in the number of holes is irradiated to the other position, the first information recording processing hole and the second information recording are controlled. An irradiation control step for simultaneously irradiating the processing hole with laser light and controlling to irradiate the different position with the laser light of the hole number difference;
A laser processing method comprising:
7. The another position is a region on the workpiece different from a region where a damper that absorbs the laser light, a shutter that blocks the laser light, or the minority side machining hole is disposed. The laser processing method as described in.
In the irradiation condition determination step, when it is determined that the other position is irradiated with the laser beam, an area on the workpiece different from an area where the damper, the shutter, or the minority side machining hole is arranged as the other position. The laser processing method according to claim 7, wherein which one is selected is determined based on the difference in the number of holes or a processing condition relating to the laser processing.
In a laser processing apparatus that simultaneously processes a plurality of workpieces with a plurality of laser beams,
Of the workpieces, set in the information recording area for each workpiece in which the machining holes for information recording are arranged by arranging the machining holes different from the machining holes for products at predetermined positions on each workpiece The difference in the number of holes between the first information recording machining hole initially set in the first workpiece and the second information recording machining hole initially set in the second workpiece of the workpiece is calculated. A hole number difference calculating unit,
The same number as the difference in the number of holes is added to the minority-side processed hole, which is the processed hole having the smaller number of processed holes, of the first information recording processed hole and the second information recording processed hole. Machining hole addition part to set the machining hole,
After the additional machining hole is set in the minority side machining hole, the first information recording machining hole and the second information recording machining hole are simultaneously irradiated with laser light to A laser processing unit for forming first and second information recording processing holes;
A laser processing apparatus comprising:
In a processing control device that controls to laser process a plurality of workpieces simultaneously with a plurality of laser beams,
Of the workpieces, set in the information recording area for each workpiece in which the machining holes for information recording are arranged by arranging the machining holes different from the machining holes for products at predetermined positions on each workpiece The difference in the number of holes between the first information recording machining hole initially set in the first workpiece and the second information recording machining hole initially set in the second workpiece of the workpiece is calculated. A hole number difference calculating unit,
The same number as the difference in the number of holes is added to the minority-side processed hole, which is the processed hole having the smaller number of processed holes, of the first information recording processed hole and the second information recording processed hole. Machining hole addition part to set the machining hole,
After the additional machining hole is set in the minority side machining hole, the first information recording machining hole and the second information recording machining hole are simultaneously irradiated with laser light to A processing instruction unit for outputting a processing instruction so as to form processing holes for first and second information recording;
A processing control apparatus comprising: