JP6759619B2 - Metal mask processing method for vapor deposition and metal mask processing equipment for vapor deposition - Google Patents

Description

The present invention relates to a metal mask processing method for vapor deposition and a metal mask processing apparatus for vapor deposition, which process the surface of a work piece with a pulsed laser beam.

In recent years, for example, in an organic EL display, there is a need for a metal mask for vapor deposition in which a metal plate is subjected to high-precision microfabrication on the order of micrometers or less to form through holes.

The metal mask for vapor deposition has an opening that matches the vapor deposition pattern, and the opening is composed of a plurality of through holes. Further, a large number of metal masks for vapor deposition are arranged imposition on one metal plate or a strip-shaped metal plate, and the number of through holes to be arranged is quite large, and these through holes are chemicals. It is processed collectively by the etching method.

The through holes of the metal mask for thin film deposition made by this chemical etching are mortar-shaped when viewed from the surface of the metal plate, so by forming these mortar-shaped recesses at the same positions on the front and back, the bottom part By connecting and opening through holes, the thickness of the metal in the through-hole portion can be made thinner than the metal portion in the other portion of the metal mask for vapor deposition. That is, since the vaporized vaporized material is passed through the through-hole portion, the passage distance of the vaporized material is shortened if the plate thickness is thin, so that there is an advantage that the vaporized vaporized material is less adhered.

However, the chemical etching process, when the etching amount varies depending on the location in the plane of the metal plate, in the case of trying to make a small fine pattern of through-pore size, variations in size of the through-hole after the Chemical etching often pore size Through-holes with non-standard defective parts are generated.

In the defective part of the through hole, if the etching amount is excessive, the metal is lost more than necessary, so it is almost impossible to correct it, but if the etching amount is small, etching is added. If it can be repaired, it can be etched into an appropriate shape to make a good product.

However, in order to repair the defective portion generated in a part of the metal plate, it is difficult to remove only a specific part of the metal plate by chemical etching. Therefore, there is a problem that most of the metal masks for vapor deposition in which defective portions are found are discarded without being corrected.

In response to this problem, in Patent Document 1, a concave portion is formed in the metal plate by etching from one surface of the metal plate of the metal mask using chemical etching, and the processing amount is easily controlled and partially formed in the concave portion. A technique for forming a through hole by a short pulse laser beam of 10 picoseconds or femtoseconds of 1 nanosecond or less, which can be processed and can perform ablation processing with less thermal action, has been disclosed. It is considered that this makes it possible to manufacture a metal mask for vapor deposition with few processing defects.

Japanese Unexamined Patent Publication No. 2015-021179

However, in Patent Document 1, metal processing by short pulse laser light has an advantage that metal can be uniformly and surely removed from the through hole portion, whereas the through hole portion formed by laser processing is a thick metal plate. A high vertical wall through hole is formed in the portion of. Therefore, when vapor deposition is performed with the thin-film deposition metal mask thus made, the length of the wall surface of the through hole through which the vapor-deposited material passes through the vapor-depositing metal mask becomes long, so that the vaporized vapor-deposited material adheres to the vertical wall surface and vapor-deposits. There was a problem of reduced efficiency. Further, the vaporized vaporized material adheres to the vertical wall surface, so that the through holes are easily clogged, which has a problem of shortening the life of the metal mask for vapor deposition.

Therefore, an object of the present invention is to provide a metal mask processing method for vapor deposition and a metal mask processing apparatus for vapor deposition capable of producing a metal mask for vapor deposition having through holes and mortar-shaped recesses .

In order to solve the above problems, the present invention is a processing apparatus for a metal mask for vapor deposition having a plurality of openings including through holes and mortar-shaped recesses around the through holes, and at least the metal mask for vapor deposition is stretched. The three-dimensional shape measurement data is generated by measuring the surface shapes of the XY table that moves the pulsed laser beam in the scanning direction while holding it, and the through holes of the metal mask for vapor deposition held in the XY table and the recesses around it. From the non-contact three-dimensional surface precision measuring means and the three-dimensional CAD data of the vapor-deposited metal mask, the unit processing area including the through-hole of the vapor-deposited metal mask and the recess around it is divided into a grid, and each of the through-holes in the grid. A means for creating a three-dimensional shape target grid data of a metal mask for vapor deposition composed of height information, and a height of the surface of the metal mask of 3 for each grid same as the three-dimensional shape target grid data from the three-dimensional shape measurement data. A means for converting to 3D shape measurement grid data, a means for calculating the height difference between the 3D shape measurement grid data and the 3D shape target grid data, and creating 3D shape processing depth grid data, and the above 3 means for creating a pulsed laser processing data from dimensions shape machining depth grid data, scanned in one-dimensional direction a short pulse pulsed laser beam of 1 nanosecond or less the deposition metal mask using the pulsed laser processing data a deposition metal mask processing apparatus for according to claim Rukoto includes a laser beam machining head including a laser beam scanning system of.

(Delete)

(Delete)

Further, in the present invention, the metal mask processing apparatus for vapor deposition according to claim 1 is used, and the metal mask for vapor deposition is irradiated with a pulse laser beam according to the pulse laser processing data created by the metal mask processing apparatus for vapor deposition. This is a metal mask processing method for vapor deposition, which is characterized by ablation processing.

(Delete)

According to the present invention, a laser processing head including a laser beam scanning system irradiates a spot of a pulsed laser beam on the surface of a metal mask for vapor deposition according to three- dimensional shape processing depth grid data, and a mortar of the metal mask for vapor deposition. the shape of the surface shaped for recess there is an effect that it is a child precisely machined.

It is a schematic block diagram of the metal mask processing apparatus for vapor deposition of 1st Embodiment. It is a schematic block diagram of the laser beam scanning system of the metal mask processing apparatus for vapor deposition of 1st Embodiment. It is explanatory drawing of 3D shape data of the metal mask for vapor deposition of 1st Embodiment. It is a top view of the metal mask for vapor deposition explaining the grid of 3D shape target grid data created by the processing pattern data creation means of the metal mask processing apparatus for thin film deposition of 1st Embodiment. It is sectional drawing of the metal mask for thin film deposition which shows the processing depth H of the 3D shape processing depth grid data created by the processing pattern data creating means of the metal mask processing apparatus for thin film deposition of 1st Embodiment.

Hereinafter, the metal mask processing method for vapor deposition and the metal mask processing apparatus for vapor deposition according to the embodiment of the present invention will be described with reference to the drawings.

<First Embodiment>
FIG. 1 is a schematic configuration diagram of a metal mask processing apparatus for vapor deposition according to the first embodiment. The metal mask processing apparatus for vapor deposition includes a laser processing unit 10, an XY table 40, and a laser processing control means 20. Here, a metal plate of a work piece (work W) for a metal mask for vapor deposition is placed on the XY table 40.

(Laser processing unit 10)
Depositing metal mask processing apparatus for the present embodiment, the integral over the laser processing unit 10, a non-contact three-dimensional surface precision measuring means 11 and the alignment camera 12 and the laser beam machining head 30, such as lasers microscope Install.

(Non-contact three-dimensional surface precision measuring means 11)
Non-contact 3D surface precision measuring means on the laser processing unit 10 11, constituted by lasers microscope or the like, through holes for deposition metal mask of the workpiece for deposition metal mask (workpiece W) W2 And the height of the minute recess W1 around it is measured. Then, the surface shape data is transmitted to the processing pattern data creating means 25 and stored.

(Laser beam processing head 30)
The laser beam processing head 30 on the laser processing unit 10 includes a pulse laser oscillator 31, a laser irradiation time control means 32, a beam shaper 33, and a laser beam scanning system.

(Pulse laser oscillator 31)
The pulse laser oscillator 31 of the laser beam processing head 30 oscillates a pulsed laser beam PL1 of a ps (picosecond) laser beam or an fs (femtosecond) laser beam emitted by an ultrashort pulse of a constant frequency.

The wavelength of the laser light of the pulse laser beam PL1 emitted from the pulse laser oscillator 31 is the light absorption rate light of the metal material including Cu, Ni, and SKD11 which is a difficult-to-cut material of the work piece (work W) of the metal plate. Considering the characteristics of the reflectance, it is desirable to use the second harmonic (wavelength: 532 nm) of the Nd: YAG laser.

By using an ultrashort pulse laser such as a ps (picosecond) laser beam or an fs (femtosecond) laser beam, the thermal effect of pulsed laser irradiation on the workpiece (work W) is reduced, and the heat of the workpiece is reduced. It has the effect of performing ablation processing with good processing quality with less deformation.

(Laser irradiation time control means 32)
As shown in FIG. 1, the laser irradiation time control means 32 of the laser beam processing head 30 includes an acoustic optical element (AOM) provided in the optical path between the pulse laser oscillator 31 and the laser beam scanning system, and Raman diffraction type electricity. Using an optical element (EOM), a pulsed laser beam PL2 in which the pulsed laser beam PL1 is cut off / passed is created from the pulsed laser oscillator 31 and emitted to the beam shaper 33.

Specifically, the laser irradiation time control means 32 controls the cutoff / passage of the pulsed laser beam PL1 according to the laser irradiation control signal created by the laser irradiation drive signal creation circuit 23, and turns on / off for processing the workpiece. Is controlled to create a modulated pulsed laser beam PL2. The modulated pulse laser beam PL2 switches between machining and non-machining of the workpiece (work W).

The laser irradiation control signal for controlling the laser irradiation time control means 32 is created by the laser irradiation drive signal creation circuit 23 in synchronization with the clock signal S1, and the data defining the laser irradiation control signal is the processing pattern data creation means 25. The processing format data created by the processing format data creating means 25d of the above is specified.

(Beam shaper 33)
The beam shaper 33 that received the pulsed laser beam PL2 uses a beam expander that expands the beam diameter at a constant magnification to obtain a pulsed laser beam PL3 that expands the beam diameter of the incident pulse laser beam PL2, and performs laser beam scanning. Irradiate the system.

(Laser beam scanning system)
As shown in FIG. 2, the laser beam scanning system of the laser beam processing head 30 is composed of a uniaxial scan mirror 34 using a polygon mirror rotating at a constant speed and an fθ lens 35. The laser beam scanning system control unit 21 controls the rotation speed of the uniaxial scan mirror 34 to a constant speed.

Further, the laser beam scanning system includes a rotation angle sensor that detects the rotation position of the uniaxial scan mirror 34 by the polygon mirror by a rotary encoder or the like. Then, the rotation angle sensor sends the detected rotation angle detection signal to the reference clock oscillation circuit 22.

The reference clock oscillation circuit 22 calculates the scanning position of the laser beam from the rotation angle detection signal, and generates the clock signal S1 synchronized with the scanning position. Then, the laser irradiation drive signal creating circuit 23 creates a laser irradiation control signal in synchronization with the clock signal S1 according to the machining format data created by the machining format data creating means 25d.

The laser irradiation time control means 32 controls the cutoff / passage of the pulsed laser beam PL1 according to the laser irradiation control signal to form the switched pulsed laser beam PL2.

As shown in FIG. 2, the beam shaper 33 shapes the pulsed laser beam PL2 to form the pulsed laser beam PL3. Then, the pulsed laser beam PL3 is reflected by the uniaxial scan mirror 34 with a polygon mirror rotating at a constant speed and scanned.

The laser beam is passed through the fθ lens 35 to form a pulsed laser beam PL4 that scans the surface of the work W held on the XY table 40 in the one-dimensional direction at a constant scanning speed V.
The surface of the work W is microfabricated by this pulsed laser beam PL4.

(XY table 40)
The XY table 40 holds the workpiece (work W) placed on it and moves in the X direction in the one-dimensional direction in which the pulsed laser beam is scanned and in the Y direction orthogonal to the X direction. The XY table 40 holds the metal plate of the workpiece W for the metal mask for vapor deposition by applying tension by the tensioning mechanism 41. The tensioning mechanism 41 includes a tension measuring means, and applies an appropriate tension to the workpiece W to hold it.

During the operation of finely processing the surface of the workpiece W, the XY table 40 keeps the XY table 40 in the Y direction orthogonal to the scanning direction of the pulsed laser beam PL4 formed by the laser beam scanning system of the laser beam processing head 30. Move in sequence.

(Modification example 1)
Here, as a modification 1, the method of moving the machining position to the work piece (work W) in the Y direction is changed to a method other than the method of moving the work piece (work W) in the Y direction from the XY table 40. By using a transport system (not shown), the laser processing unit 10 can be sequentially moved in the Y direction to move the processing position in the Y direction.

(Laser processing control means 20)
The laser processing control means 20 of the metal mask processing apparatus for vapor deposition of the present embodiment is composed of a calculation means such as a microprocessor (MPU) of a semiconductor integrated circuit and a storage means such as a semiconductor memory, and is processed by the metal mask processing apparatus for vapor deposition. Is integrated and controlled.

As shown in the block diagram of FIG. 1, the laser processing control means 20 includes a laser beam scanning system control unit 21, a reference clock oscillation circuit 22, a laser irradiation drive signal creation circuit 23, a mechanism drive control means 24, and a processing pattern data creation means. 25 is included.

(Laser beam scanning system control unit 21)
The laser beam scanning system control unit 21 rotates the uniaxial scan mirror 34 of the laser beam scanning system at a constant speed. The laser irradiation drive signal creation circuit 23 controls the laser irradiation time control means 32, and the mechanism drive control means 24 controls the operation of the pulse laser oscillator 31 and the operation of the XY table.

Specifically, the laser beam scanning system control unit 21 controls to rotate the uniaxial scan mirror 34 by the polygon mirror of the laser beam scanning system at a constant speed.

(Reference clock oscillation circuit 22)
The reference clock oscillation circuit 22 calculates the scanning position of the laser beam from the rotation angle detection signal of the rotation angle sensor of the rotation axis of the 1-axis scan mirror 34, and generates a clock signal S1 synchronized with the scanning position.

(Laser irradiation drive signal creation circuit 23)
Then, the laser irradiation drive signal creation circuit 23 sequentially creates a laser irradiation control signal according to the processing format data in synchronization with the clock signal S1 and transmits it to the laser irradiation time control means 32. Then, the laser irradiation time control means 32 switches the laser beam so that the pulsed laser beam PL4 switched according to the processing format data is scanned in the one-dimensional direction on the surface of the work W placed on the XY table 40.

(3D shape data)
First, three-dimensional shape data such as three-dimensional CAD data is input to the laser processing control means 20 from the outside. The three-dimensional shape data is three-dimensional representing a through hole W2 of a metal mask for vapor deposition (work W) and a recess W1 around the through hole W2 as shown in the perspective view of FIG. 3A and the cross-sectional view of FIG. 3B. Describe the shape.

The parameters of the three-dimensional shape data are formed by the shape data on the large through hole side of the through hole W2, the shape data on the small through hole side, and the large through hole and the small through hole in the unit processing area AR for each through hole W2. It has dimensional data of the three-dimensional shape of the unit processing area AR such as the taper angle θ of the concave portion W1. In addition, data representing the repeated arrangement of the three-dimensional shape such as the pitch of the through holes W2, the number of through holes W2 in the X direction, the number of through holes W2 in the Y direction, and the total number of through holes is stored.

According to this three-dimensional shape data, the surface of the recess W1 that substantially constitutes the wall surface of the through hole W2 of the metal mask for vapor deposition can be processed by tilting from the vertical. Alternatively, as the three-dimensional shape data, it is also possible to create three-dimensional shape data having the design data of the wall surface in which the wall surface of the through hole W2 is tilted from the vertical.

This three-dimensional shape data is registered as a recipe for each product type in the storage means of the laser processing control means 20, and the recipe is read out by the laser processing control means 20 at the time of processing.

The 3D CAD data can be created by the 3D shape design software of the calculation means of the laser processing control means 20. It is also possible to input the data of the three-dimensional CAD designed by the three-dimensional shape design means outside the metal mask processing apparatus for vapor deposition.

The laser processing control means 20 transmits the three-dimensional shape data of the unit processing area AR for each through hole W2 on the surface of the work W of the metal plate of the work piece for the metal mask for vapor deposition to the processing pattern data creating means 25. ..

(Machining pattern data creating means 25)
The machining pattern data creation means 25 is a three-dimensional shape target grid data creation means 25a, a three-dimensional shape measurement grid data creation means 25b, a three-dimensional shape machining depth grid data creation means 25c, and a machining format data creation means 25d. Constitute.

(Creation of 3D shape target grid data)
As shown in FIG. 4, the three-dimensional shape target grid data creating means 25a of the machining pattern data creating means 25 penetrates the metal mask for vapor deposition according to the three-dimensional shape data for each unit machining area AR received from the laser machining control means 20. The three-dimensional shape data representing the three-dimensional shape of the through hole W2 of the work W of the unit processing area AR for each hole W2 and the recess W1 around the hole W2 is converted into the three-dimensional shape target grid data.

That is, the unit processing area AR for each through hole W2 is divided into a plurality of minute divisions (grid grids) divided by a grid, and three-dimensional shape target grid data in which the depth information of the processing shape is recorded for each minute division is created. And remember.

(Creation of 3D shape measurement grid data)
Further, the three-dimensional shape measurement grid data creating means 25b of the machining pattern data creating means 25 receives the three-dimensional shape data of the surface of the workpiece measured by the non-contact three-dimensional surface precision measuring means 11, and the three-dimensional shape thereof. The data is converted into three-dimensional shape measurement grid data and stored.

In the 3D shape measurement grid data, the height of the surface is recorded for each minute grid grid (microsection) having the same dimensions as the 3D shape target grid data.

(Creation of 3D shape processing depth grid data)
Then, as shown in FIG. 5, the three-dimensional shape processing depth grid data creation means 25c of the processing pattern data creation means 25 is the difference in height between the three-dimensional shape target grid data and the three-dimensional shape measurement grid data. The processing depth H of the above is calculated, and the three-dimensional shape processing depth grid data in which the processing depth H of the difference in height is recorded for each grid is created.

(Creation of processing format data)
Further, the machining format data creating means 25d of the machining pattern data creating means 25 converts the three-dimensional shape machining depth grid data to create the machining format data for pulse laser machining. This processing format data is, for example, tabular data in which the number of light pulses of the pulsed laser beam is specified for each scanning line of the laser beam in the one-dimensional direction and for each scanning position of the laser beam.

In this way, when creating table-type machining format data described by the number of light pulses of the pulsed laser beam, the machining pattern data creating means 25 provides depth information and position information for each minute grid grid (microsection). By creating the intermediate data digitized in the above, there is an effect that the data conversion from the three-dimensional shape data to the processing format data can be easily performed.

(Processing procedure for metal mask for vapor deposition)
Next, the processing procedure of the metal mask for vapor deposition using the metal mask processing apparatus for vapor deposition of the present embodiment will be described.

(Step S1)
<Creation of 3D shape target grid data>
The storage means of the laser processing control means 20 of the metal mask processing apparatus for vapor deposition represents the three-dimensional shape of the through hole W2 of the work W of the unit processing area AR for each through hole W2 of the metal mask for vapor deposition and the recess W1 around the hole W2. Stores 3D shape data such as 3D CAD data.

At the time of machining, the laser machining control means 20 reads the three-dimensional shape data from the storage means, and the three-dimensional unit machining area AR for each through hole W2 on the surface of the work W of the metal plate of the work piece for the metal mask for vapor deposition. The shape data is input to the machining pattern data creating means 25.

3-dimensional shape target grid data generation unit 25a of the processing pattern data creating means 25 divides the unit machining area AR into a plurality of micro grid grating (microcompartments), each micro grid rated child specified in the three-dimensional shape data Three-dimensional shape target grid data that records the depth information of the processed shape to be processed is created and stored.

(Step S2)
<Holding the workpiece W on the XY table>
First, the work piece W of the metal plate for the metal mask for vapor deposition is held by applying tension to the tensioning mechanism 41 on the XY table 40. The tension mechanism 41 measures the tension applied to the workpiece W by using a tension measuring means, and applies and holds an appropriate tension to the workpiece W.

(Step S3)
Next, the laser processing control means 20 reads the alignment mark pre-patterned on the metal mask for vapor deposition (workpiece W) with the alignment camera 12.

The laser processing control means 20 corrects the posture of the metal mask for vapor deposition (workpiece W) by controlling the position of the XY table 40 according to the position of the alignment mark, and the metal mask for vapor deposition (workpiece W). The position of the origin of W) is aligned with the position of the laser processing unit 10.

(Step S4)
The laser processing control means 20 reads out the three-dimensional shape data stored in the storage means, calculates the design position of the through hole W2, and the mechanism drive control means 24 drives the XY table 40 to form a metal mask for vapor deposition (processed). The position of the first through hole W2 of the object W) is aligned with the position of the non-contact three-dimensional surface precision measuring means 11 of the laser processing unit 10.

(Step S5)
<Measurement process of surface shape of metal mask for vapor deposition>
Next, the laser processing control unit 20 controls the non-contact 3D surface precision measuring means 11, such as lasers microscope, the workpiece for deposition metal mask in a non-contact three-dimensional surface precision measuring means 11 The surface height of the through hole W2 and the fine recess W1 around the hole W2 is measured.

(Step S6)
<3D shape measurement grid data creation process>
Next, the three-dimensional shape measurement grid data creating means 25b of the machining pattern data creating means 25 receives the three-dimensional shape data of the surface of the workpiece measured by the non-contact three-dimensional surface precision measuring means 11, and the three-dimensional shape data is received. The shape data is converted into three-dimensional shape measurement grid data and stored.

(Step S7)
<3D shape processing depth grid data creation process>
Next, the 3D shape machining depth grid data creation means 25c of the machining pattern data creation means 25 calculates the difference between the 3D shape target grid data and the 3D shape measurement grid data, and the 3D shape machining depth grid. Create data.

(Step S8)
<Processing format data creation process>
Next, the machining format data creating means 25d of the machining pattern data creating means 25 converts the three-dimensional shape machining depth grid data to create the machining format data for pulse laser machining.

(Step S9)
<Laser ablation processing of metal mask for vapor deposition>
Based on the processing format data created in this way, pulse laser processing is performed on the surface of the workpiece (work W) for the metal mask for vapor deposition for each scanning line in the one-dimensional direction of the laser beam. The workpiece W is processed into the shape of the metal mask for vapor deposition as in a).

First, the laser processing control means 20 drives the XY table 40 to set the position of the first through hole W2 of the metal mask for vapor deposition (workpiece W) to the position of the laser beam processing head 30 of the laser processing unit 10. match.

The laser processing control means 20 generates the clock signal S1 by the reference clock oscillation circuit 22. The clock signal S1 is generated in synchronization with the scanning position for scanning the surface of the workpiece in the one-dimensional direction. Therefore, a rotation angle sensor such as a rotary encoder of the 1-axis scan mirror 34 of the polygon mirror constituting the laser beam scanning system of the laser beam processing head 30 creates a rotation angle detection signal and sends it to the reference clock oscillation circuit 22.

The reference clock oscillation circuit 22 calculates the scanning position of the pulse laser beam PL4 from the rotation angle detection signal, and generates the clock signal S1 in synchronization with the scanning position.

Next, the laser irradiation drive signal creation circuit 23 sequentially creates a laser irradiation control signal synchronized with the clock signal S1 according to the processing format data, and transmits the laser irradiation control signal to the laser irradiation time control means 32.

The laser beam processing head 30 emits the pulsed laser beam PL1 from the laser oscillator, and the laser irradiation time control means 32 switches between passing and blocking the pulsed laser beam PL1 according to the laser irradiation control signal received from the laser irradiation drive signal creation circuit 23. The pulsed laser beam PL2 is created.

Here, the laser irradiation drive signal creation circuit 23 sequentially creates a laser irradiation control signal synchronized with the clock signal S1 according to the processing format data, and transmits the laser irradiation control signal to the laser irradiation time control means 32.

The pulsed laser beam PL2 whose passage and cutoff are switched in synchronization with the clock signal S1 is shaped into a required shape by the beam shaper 33, and is subjected to a laser beam scanning system such as a polygon mirror on the surface of the workpiece in the X direction. A pulsed laser beam PL4 that scans in the one-dimensional direction is used. The surface of the work piece is processed by irradiating the surface of the work piece with this pulsed laser beam PL4.

The laser processing control means 20 scans the pulsed laser beam for processing the surface of the workpiece once in the one-dimensional direction by the laser beam scanning system, and then scans the XY table 40 on which the workpiece is placed in the scanning direction in the X direction. It is driven in the orthogonal Y direction, and the surface of the workpiece is processed by scanning in the next one-dimensional direction.

The metal plate of the work W is ablated at each irradiation spot on the surface of the work W of the pulsed laser beam PL4. That is, the pulsed laser beam PL4 irradiation light by each scan is projected with a pulse of a ps (picosecond) laser beam or a fs (femtosecond) laser beam a predetermined number of times during the time specified by the laser irradiation control signal. As a result, a fine recess W1 and a through hole W2 having a depth and an opening width of about several tens of μm are formed on the metal plate of the work W for the metal mask for vapor deposition.

By scanning and processing the pulsed laser beam PL4 in this way, the wall surface of the through hole W2 of the metal mask for vapor deposition can be formed by tilting from the vertical. Alternatively, the surface of the recess W1 that substantially constitutes the wall surface of the through hole W2 can be processed by tilting it from the vertical.

As described above, the metal mask processing apparatus for vapor deposition of the present embodiment includes a non-contact three-dimensional surface precision measuring means 11, a laser beam processing head 30, an XY table 40, and a laser processing control means 20. In particular, the surface height of the through hole W2 of the metal mask for vapor deposition and the fine recess W1 around the through hole W2 is precisely measured by using the non-contact three-dimensional surface precision measuring means 11 of the metal mask processing apparatus for vapor deposition.

Further, the laser processing control means 20 includes the processing pattern data creating means 25, and the processing pattern data creating means 25 creates the three-dimensional shape target grid data and the three-dimensional shape measurement grid data, and the three-dimensional shape target grid data and 3 3D shape processing depth grid data of the difference of the dimension shape measurement grid data is created, and processing format data for pulse laser processing is created using it.

Then, the laser beam scanning system uses the laser beam processing head 30 and the XY table 40 according to the three-dimensional shape processing depth grid data for processing the through hole of the wall surface inclined from the vertical, and the metal for vapor deposition of the workpiece W is used. The spot of the pulsed laser beam PL4 is irradiated on the surface of the mask.

As a result, there is an effect that the work piece W can be manufactured by precisely processing the fine recesses W1 and the through holes W2 on the surface of the metal mask for vapor deposition to produce a precise metal mask for vapor deposition.

<Second embodiment>
In the second embodiment of the present invention, similarly to the first embodiment, the metal mask manufacturing apparatus for vapor deposition includes a laser processing unit 10, an XY table 40, and a laser processing control means 20, and vapor deposition is performed on the XY table 40. A metal plate of a work piece (work W) for a metal mask is placed.

Then, the integral over the laser processing unit 10, installing a non-contact three-dimensional surface precision measuring means 11 and the alignment camera 12 and the laser beam machining head 30, such as lasers microscope.

The difference between the second embodiment and the first embodiment is that the surface height of the through hole W2 in the unit processing region AR and the fine recess W1 around it is determined by using the non-contact three-dimensional surface precision measuring means 11. It is a point to measure and create three-dimensional shape data of the unit processing area AR by using the surface shape data.

(Processing procedure for metal mask for vapor deposition)
That is, in the second embodiment, from the outside, the laser processing control means 20 has the pitch of the through holes W2 of the metal mask for vapor deposition (workpiece W), the number of through holes W2 in the X direction, and the penetration in the Y direction. Only the repeated arrangement data of the through holes W2 such as the number of holes W2 and the total number of through holes is received. Then, the metal mask for vapor deposition is processed by the following steps S1 to S10.

(Step S1)
First, the laser processing control means 20 calculates the position of the through hole W2 of the metal mask for vapor deposition (workpiece W) based on the repeated arrangement data of the through hole W2 such as the total number of through holes received from the outside.

(Step S2)
Next, the laser processing control means 20 drives the XY table 40 using the mechanism drive control means 24 to determine the position of the through hole W2 of the metal mask for vapor deposition (workpiece W) with non-contact three-dimensional surface precision. The process of the following step S3 is repeated at the positions of the three or more through holes W2 according to the position of the measuring means 11.

(Step S3)
<Measurement of surface shape of unit processing area AR at multiple locations>
Next, the non-contact three-dimensional surface precision measuring means 11 measures the surface height of the through hole W2 in the unit machining area AR and the fine recess W1 around it, and inputs the surface shape data into the machining pattern data creating means 25. To do.

(Step S4)
<Creation of multiple 3D shape measurement grid data>
Three-dimensional shape measurement grid data generation unit 25b of the processing pattern data creating means 25, the surface shape data non-contact 3D surface precision measuring means 11 is measured at the position of the through-hole W2 three or more points, 3 of each箇plants Converted to 3D shape measurement grid data and stored.

(Step S5)
<Creation of 3D shape target grid data as a reference>
The processing pattern data creating means 25 creates the three-dimensional shape target grid data as a reference based on the majority of the three-dimensional shape measurement grid data that are similar to each other.

(Step S6)
<Measurement processing of the surface shape of each through hole W2>
Next, the laser processing control means 20 uses the non-contact three-dimensional surface precision measuring means 11 for each position of the through hole W2 to obtain the surface height of the through hole W2 in the unit processing region AR and the fine recess W1 around the through hole W2. the measures of, and inputs the surface shape data to the machining pattern data creating means 25.

(Step S7)
<Creation of 3D shape measurement grid data>
The three-dimensional shape measurement grid data creation means 25b of the processing pattern data creation means 25 converts the surface shape data of the unit processing area AR into three-dimensional shape measurement grid data and stores it.

(Modification 2)
As a modification 2, the laser processing control means 20 operates at a higher speed than measuring the opening shape of the through hole W2 other than the non-contact three-dimensional surface precision measuring means 11 at each position of the through hole W2. It can be inspected using a shape measuring means.

(Step S6')
<Measurement process of surface shape of through hole W2>
As a result of the measurement, if the opening shape of the through hole W2 is different from the shape of the normal through hole W2 by a specified value or more, the through hole of the unit processing area AR is again used by using the non-contact three-dimensional surface precision measuring means 11. The surface height of W2 and the fine recess W1 around it is precisely measured, and the surface shape data is input to the processing pattern data creating means 25.

(Step S7')
<Creation of 3D shape measurement grid data>
The three-dimensional shape measurement grid data creation means 25b of the processing pattern data creation means 25 converts the surface shape data measured by the non-contact three-dimensional surface precision measurement means 11 into three-dimensional shape measurement grid data and stores it.

(Step S8)
<Creation of 3D shape processing depth grid data>
Next, the 3D shape machining depth grid data creation means 25c of the machining pattern data creation means 25 determines the height of the 3D shape of the 3D shape target grid data and the 3D shape measurement grid data as shown in FIG. and calculates the machining depth H is the difference, to create a three-dimensional shape processing depth grid data recorded for each grid.

(Step S9)
<Creation of processing format data>
Next, the machining format data creating means 25c of the machining pattern data creating means 25 converts the three-dimensional shape machining depth grid data to create the machining format data for pulse laser machining.

(Step S10)
<Laser ablation processing of metal mask for vapor deposition>
Next, as in the first embodiment, based on this processing format data, a pulse is applied to the surface of the workpiece (work W) for the metal mask for vapor deposition for each scanning line in the one-dimensional direction of the laser beam. By performing laser processing, the workpiece W is processed into the shape of the metal mask for vapor deposition as shown in FIG. 3A.

In the second embodiment, according to the above configuration, the non-contact three-dimensional surface precision measuring means 11 is used without preparing the surface height data of the through hole W2 of the unit processing region AR and the fine recess W1 around the through hole W2. There is an effect that the surface shape data can be created by precisely measuring the surface height of the through hole W2 of the unit processing area AR and the minute recess W1 around the hole W2.

Although the preferred embodiment of the present invention has been described above, the above-described embodiment does not limit the present invention, and the pulsed laser oscillator 31 is appropriately selected depending on the material to be processed in addition to the YAG laser. A single wavelength band laser or a laser that emits a multi-wavelength band laser can be used.

Further, the uniaxial scan mirror 34 is not limited to the polygon mirror, and a galvano scanner can be used for the uniaxial scan mirror 34.

10 ... Laser processing unit 11 ... Non-contact three-dimensional surface precision measuring means 12 ... Alignment camera 20 ... Laser processing control means 21 ... Laser beam scanning system control unit 22 ... Reference Clock oscillation circuit 23 ... Laser irradiation drive signal creation circuit 24 ... Mechanism drive control means 25 ... Machining pattern data creation means 25a ... Three-dimensional shape target grid data creation means 25b ... Three-dimensional shape measurement Grid data creation means 25c ... Three-dimensional shape processing depth Grid data creation means 25d ... Processing format data creation means 30 ... Laser beam processing head 31 ... Pulse laser oscillator 32 ... Laser irradiation time control Means 33 ... Beam shaper 34 ... 1-axis scan mirror 35 ... fθ lens 40 ... XY table 41 ... Stretching mechanism AR ... Unit processing area H ... Processing depth PL1 , PL2, PL3, PL4 ... Pulse laser beam W ... Work piece (workpiece) for metal mask for deposition
W1 ... Recess W2 ... Through hole

Claims (2)

A metal mask processing device for vapor deposition having a plurality of openings consisting of through holes and mortar-shaped recesses around the holes.
at least,
An XY table that moves the pulsed laser beam in the scanning direction while holding the metal mask for vapor deposition while stretching it.
A non-contact 3D surface precision measuring means that measures the surface shape of the through hole of the metal mask for vapor deposition held on the XY table and the recesses around it and generates 3D shape measurement data .
From the three-dimensional CAD data of the vapor-deposited metal mask, the unit processing area including the through holes of the vapor-deposited metal mask and the recesses around it is divided into grids, and each of the through-holes is the height information of the vapor-deposited metal mask. Means for creating 3D shape target grid data,
A means for converting the surface height of the metal mask from the three-dimensional shape measurement data to the three-dimensional shape measurement grid data for each grid that is the same as the three-dimensional shape target grid data .
A means for calculating the height difference between the three-dimensional shape measurement grid data and the three-dimensional shape target grid data to create the three-dimensional shape processing depth grid data.
Means for creating a pulsed laser processing data from the three-dimensional shape machining depth grid data,
Characterized Rukoto includes a laser beam machining head including a laser beam scanning system for scanning the one-dimensional direction a short pulse of the pulsed laser beam of 1 nanosecond or less the deposition metal mask using the pulsed laser processing data Metal mask processing equipment for vapor deposition. Using the thin-film deposition metal mask processing apparatus according to claim 1, the vapor deposition metal mask is irradiated with a pulse laser beam for ablation processing according to the pulse laser processing data created by the vapor deposition metal mask processing apparatus. A characteristic metal mask processing method for vapor deposition.