CN114309967A - Laser processing method and apparatus - Google Patents
Laser processing method and apparatus Download PDFInfo
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- CN114309967A CN114309967A CN202210025396.XA CN202210025396A CN114309967A CN 114309967 A CN114309967 A CN 114309967A CN 202210025396 A CN202210025396 A CN 202210025396A CN 114309967 A CN114309967 A CN 114309967A
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- 238000003672 processing method Methods 0.000 title claims abstract description 26
- 239000010408 film Substances 0.000 claims abstract description 126
- 239000010409 thin film Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 28
- 238000003754 machining Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000003550 marker Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The invention discloses a laser processing method and a device, wherein the laser processing method comprises the following steps: placing the product with the film on a workbench; focusing a laser beam over the thin film; and controlling the laser beam to move according to a preset path, and processing the film by using the heat diffused by the focal point of the laser beam. The laser processing method of the technical scheme of the invention is simple and convenient to operate and high in processing precision.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a laser processing method and laser processing equipment using the same.
Background
In the production process of the product, each production link is closely related, and in order to acquire the relevant information of the product in different production links, the relevant information needs to be recorded and attached to the product, so that the product is convenient to check and manage in real time. In general, a label having information related to a product is processed and then attached to a protective film of the product, which is troublesome to operate.
Disclosure of Invention
The invention provides a laser processing method which is simple and convenient to operate and high in processing precision.
The laser processing method provided by the invention comprises the following steps:
the laser processing method comprises the following steps:
placing the product with the film on a workbench;
focusing a laser beam over the thin film;
and controlling the laser beam to move according to a preset path, and processing the film by using the heat diffused by the focal point of the laser beam.
Optionally, the distance between the focal point of the laser beam and the thin film is d, and the value range of d is as follows: 0.3 mm-1 mm.
Optionally, before controlling the laser beam to move along the preset path, the method further includes the following steps:
and obtaining a preset path according to the preset information.
Optionally, obtaining the preset path according to the preset information includes:
dividing the picture into a plurality of identification grids which are arranged in an array, and setting identifiers in the corresponding identification grids according to preset information;
and taking the identifiers in all the identification grids as preset paths.
Optionally, the identifier comprises one or more marking patterns; the preset path comprises one or more than one sub-paths;
one sub-path comprises a marking graph in all the identification cells;
controlling the laser beam to move according to a preset path comprises:
and controlling the laser beam to carry out laser processing on the film according to each sub-path in sequence.
Optionally, the marker pattern comprises a dot, a line segment or a closed end wire frame.
Optionally, the distance between two adjacent mark patterns of the same identifier is w, and the value range of w is 0.02-0.04 mm.
Optionally, the identifier comprises a first circular ring and a second circular ring, the first circular ring and the second circular ring are concentrically arranged, and the diameter of the first circular ring is different from the diameter of the second circular ring;
controlling the laser beam to move according to a preset path comprises:
and controlling the laser beam to move according to the first circular rings in all the identification grids, and then controlling the laser beam to move according to the second circular rings in all the identification grids.
Optionally, focusing the laser beam over the thin film comprises:
the laser beam passes through the lens and is focused above the film;
the focal length range of the lens is as follows: 32 mm-100 mm;
and/or the wavelength range of the laser beam is as follows: 355 nm-532 nm;
and/or the pulse width range of the laser beam is as follows: 7 ns-20 ns;
and/or the power range of the laser beam is as follows: 0.3W-5W;
and/or the output frequency of the laser beam is: 10Kdz-100 Kdz.
The invention also provides a laser processing device, which is used for executing the laser processing method; the laser processing equipment comprises a laser head and a workbench, wherein the laser head emits laser beams;
the laser processing method comprises the following steps:
placing the product with the film on a workbench;
focusing a laser beam over the thin film;
and controlling the laser beam to move according to a preset path, and processing the film by using the heat diffused by the focal point of the laser beam.
According to the technical scheme, the film is processed in a laser processing mode, the laser beam is used for etching the surface of the workpiece in the laser processing mode, specifically, the surface of the film is carved, and compared with a traditional code spraying mode, the laser beam processing mode does not need ink, is more environment-friendly, has high processing precision, and enables patterns formed on the surface of the film to be clearer and easier to identify.
Furthermore, in the technical scheme of the invention, the film attached to the product is directly processed, the product can support the film, so that the processed surface of the film can be kept in a flat state, the surface of the film is easier to process, and the operation is simpler, more convenient and quicker.
The laser beam is focused above the film because the energy of the laser beam at the focus is maximum and the heat is highest, so that the focus of the laser beam is positioned above the film, the film is processed by utilizing the heat radiated at the focus, the temperature of the laser beam acting on the surface of the film is proper, and the pattern processed on the surface of the film by the laser beam is clear and easy to identify.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of a drawing file according to an embodiment of the present invention;
FIG. 2 is a schematic view of a drawing file of another embodiment of the laser processing method of the present invention;
FIG. 3 is a diagram illustrating a drawing file according to yet another embodiment of the laser processing method of the present invention;
FIG. 4 is a schematic illustration of a drawing file of yet another embodiment of the laser processing method of the present invention;
FIG. 5 is a flowchart illustrating a laser processing method according to an embodiment of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a laser processing method, which is used for carrying out laser processing on a workpiece and processing a recognizable pattern on the surface of the workpiece. According to the technical scheme, the processed workpiece can be a film adhered to a product, and in the processing process of the film, patterns capable of being recognized can be processed on the film without damaging the product below the film.
In the embodiment of the invention, the laser processing method comprises the following steps:
placing the product with the film on a workbench;
focusing a laser beam over the thin film;
and controlling the laser beam to move according to a preset path, and processing the film by using the heat diffused by the focal point of the laser beam.
Specifically, prepare the film, laminate the film prepared to the product to will laminate the product of film and place the workstation in, the film is located the surface that the product deviates from the workstation, utilizes the laser beam of laser head transmission to carry out laser beam machining to the film on the workstation. The film is made of resin material, specifically polyethylene glycol terephthalate (PET) film; the film may be a transparent film.
In the above embodiment, the product that has the film of laminating can be the display screen, and laser beam moves according to predetermineeing the route, and the pattern that processes out at the film surface can be white, and the display screen shows for black under the condition that does not show, and transparent film laminating is in the display screen, because the light transmissivity of film, can show black white pattern in the end of a project for laser beam machining shaping's pattern display is more clear.
The thickness of the film is h, the value range of h can be 0.1 mm-0.3 mm, specifically, h can be 0.1mm, 0.2mm or 0.3mm, and also can be any other value in the value range. The film within the thickness range can well protect the display screen, so that the display screen is not easy to damage in the production and processing processes.
The jig can be arranged on the workbench, before laser processing is carried out on the film, the display screen attached with the film is arranged on the jig of the workbench, the jig can position the display screen, and the surface attached with the film of the display screen is ensured to be kept horizontal. The jig can position the display screen in a vacuum adsorption mode and can also position the display screen in other common positioning modes.
The laser processing equipment for realizing the laser processing method can comprise a workbench, a jig on the workbench and a laser head for processing a workpiece, wherein the laser head is positioned above the workbench, and a laser beam emitted by the laser head acts on the workpiece on the workbench to process a required pattern on the workpiece.
According to the technical scheme, the film is processed in a laser processing mode, the laser processing utilizes laser beams to etch the surface of a workpiece, specifically, the surface of the film is carved, and compared with a traditional code spraying mode, the laser beam processing mode does not need ink, is more environment-friendly, has high processing precision, and enables patterns formed on the surface of the film to be clearer and easier to identify.
Furthermore, in the technical scheme of the invention, the film attached to the display screen is directly processed, and the display screen can support the film, so that the processed surface of the film can be kept in a flat state, the surface of the film is easier to process, and the operation is simpler, more convenient and quicker.
The laser beam is focused above the film because the energy of the laser beam at the focus is maximum and the heat is highest, so that the focus of the laser beam is positioned above the film, the film is processed by utilizing the heat radiated at the focus, the temperature of the laser beam acting on the surface of the film is proper, and the pattern processed on the surface of the film by the laser beam is clear and easy to identify.
Further, the laser beam is focused on the thin film, so that the distance between the focal point of the laser beam and the thin film is d, and the value range of d is as follows: 0.3 mm-1 mm.
The worktable is a movable worktable which can move along three vertical coordinate directions in space, so that a workpiece to be machined on the worktable can move to a proper position relative to the laser head. Three directions of movement of the table may be defined as an x-axis, a y-axis, and a z-axis, respectively, the x-axis direction and the y-axis direction may define a horizontal plane, and the z-axis direction may be perpendicular to the horizontal plane. The laser head can control the laser beam to move along the horizontal plane direction in the process of processing the workpiece. The workbench moves along the direction of the z axis, so that the workpiece on the workbench can be close to the laser head or far away from the laser head.
Before the laser head processes the workpiece, the workbench can be controlled to move along the x-axis direction, the y-axis direction and the z-axis direction, so that the workpiece on the workbench is positioned below the laser processing head. When the workpiece is a display screen attached with a film, the laser beam emitted by the laser head can be focused on the upper surface of the film by adjusting the parameters of the laser head, that is, the focal point of the laser beam is positioned on the surface of the film, and then the worktable is controlled to move along the z-axis direction, so that the film attached to the display screen moves towards the direction away from the laser head, the distance between the focal point of the laser beam and the film is d, the value range of the d is 0.3 mm-1 mm, specifically 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm, and any other value in the value range can be further taken.
When the value range of d satisfies above condition, the heat that laser beam acted on the film surface is suitable, and laser beam is in carrying out the course of working to the film, and the film can not appear the condition of bulging or explosion point because the temperature is too high, also can not make the pattern of machine-shaping unobvious because the temperature is low excessively for easily form out meticulous and clear pattern on the film, be convenient for manual work or machine identification.
In the above embodiment, the depth of the laser beam processed on the film is a, and a may range from 0.02mm to 0.04 mm. The value of a may specifically be: 0.02mm, 0.03mm or 0.04mm, and can also be any other value within the value range.
Because the thickness range of the film is 0.1 mm-0.3 mm, the depth of the laser beam processed on the film meets the value range, so that the laser beam can form clear patterns on the film, and the film cannot penetrate through to influence the display screen.
Before controlling the laser beam to move along the preset path in the above embodiment, the method may further include the following steps:
and obtaining a preset path according to the preset information.
The step can be automatically generated through a machine, the preset information can be related information in the production process of the product, such as product code number, product size parameter, product technical parameter and the like, and the preset information can also be used for tracing and linking the product, decoding the pattern formed by processing the laser beam on the surface of the workpiece, and acquiring the related information. The preset path can be a one-dimensional code, a two-dimensional code or other patterns which can carry information.
When the film is of a transparent structure, the pattern processed on the surface of the film by the laser beam according to the preset path is white, and the display screen seen through by the film is black, the white part on the film is the pattern carrying information. The transparent part on the film can also form a pattern carrying information, the transparent part formed by enclosing the white part on the film forms the pattern carrying information, and the transparent part on the film is black due to the fact that the display screen is not displayed.
In the above embodiment, the setting of the preset path according to the preset information includes:
dividing the picture into a plurality of identification grids which are arranged in an array, and setting identifiers in the corresponding identification grids according to preset information;
and taking the identifiers in all the identification grids as preset paths.
And converting the preset information into a preset path on the inner picture file, moving the laser beam according to the preset path, and processing and forming a pattern which is consistent with the preset path on the picture file on the film.
And setting identifiers in different identification grids, wherein the formed preset paths have different information. And determining the identification grids needing to be provided with the identifiers according to the preset information, and then arranging the determined identifiers in the corresponding identification grids.
Once the identification lattice for which the identifier needs to be set is determined, the preset information that the preset path needs to represent is determined. The specific shape of the identifier can be set as required, and the specific shape of the identifier determines the complexity of the laser beam processing according to the preset path, and the definition and the forming quality of the patterns on the processed and formed film.
In the above embodiments, the identifier comprises one or more patterns of markings.
When the identifier comprises a mark pattern, the shape of the identifier is simpler, the laser beam is used as a preset path to carry out a processing process simply according to the mark pattern in each mark grid, and the processing efficiency is high.
When the identifier comprises more than one or more than one mark patterns, the shape of each identifier is complex, the laser beam is complex to process according to the mark patterns in each mark grid as a preset path, the filling degree of the mark grids provided with the identifier is higher, and the symbols represented by the patterns formed on the film after the processing is finished are clearer and have higher identifiability.
In the above embodiment, the preset path may include one or more sub-paths;
a sub-path may include a marking pattern within all of the identification cells;
controlling the laser beam to move according to the preset path comprises:
and controlling the laser beam to carry out laser processing on the film according to each sub-path in sequence.
When the preset path only comprises one sub-path, the laser beam moves in sequence according to the marking graph in the identification grid provided with the identifier; when the preset path comprises two or more than two sub-paths, the laser beam moves along any one of the sub-paths and then sequentially moves along other sub-paths.
When the identifier comprises two or more than two mark patterns, that is, the preset path comprises two or more than two sub-paths, the pattern processed along the preset path has high definition and high identification, and the laser beam is controlled to move along each sub-path in sequence, so that the laser beam can move along a mark pattern in the next mark cell after moving along a mark pattern in one mark cell, the processing time of the laser beam in the same mark cell cannot be too long, the laser beam can be cooled at the pattern part which is formed on the film and corresponds to the mark pattern in the previous mark cell during processing along the mark pattern in the subsequent mark cell, the laser beam moves along the next sub-path, and during the processing process near the pattern which is processed and formed before, the temperature accumulation effect is weak, so that the film is not easy to bulge and explode due to overheating, and the standard and clear pattern formed on the film is ensured.
In the above embodiments, the marker pattern may comprise dots, line segments or a closed end-to-end wire frame. Each identifier may include one or more indicia patterns. Each marker graph may include one line segment or more than one line segment, each marker graph may include one end-to-end closed wire frame or more than one end-to-end closed wire frames, and each marker graph may further include a shape formed by combining the line segment and the end-to-end closed wire frames. For clarity of presentation in the embodiments of the present invention, each mark figure includes only one line segment or one end-to-end closed line frame, and the mark figures included in each identifier are all described as being consistent in shape and size.
Referring to the embodiment shown in fig. 1, the marking pattern includes dots, and the mark is processed according to the identifier in the drawing file shown in fig. 1 as the preset path, so that the processing efficiency is high, and the requirements on various parameters of the laser beam are low.
Referring to the embodiment shown in fig. 2, the marking pattern includes line segments, the line segments in each identification grid area in fig. 2 are more and denser, and the pattern processed by using the identifier in the drawing file shown in fig. 2 as the preset path is clearly displayed and easily recognized.
Referring to the embodiment shown in fig. 3 and 4, the marking pattern comprises a wire frame closed end to end, in particular a circular loop. Each mark grid area in fig. 3 has only one wire frame, and the mark in the figure file shown in fig. 3 is used as a preset path for processing, so that the processing efficiency is high, the temperature of the laser beam acting on the film is easy to control, and the accuracy of the processed pattern is high; each of the mark grid regions in fig. 4 is provided with a plurality of wire frames, and the pattern processed by using the identifier in the drawing file shown in fig. 4 as a preset path is clearly displayed and easily recognized.
In the above embodiment, the distance between two adjacent mark patterns of the same identifier is w, and the value range of w may be 0.02mm to 0.04 mm. w may be 0.02mm, 0.03mm or 0.04mm, and may be any other value within the above range. When the distance between two adjacent marked graphs of the same identifier meets the above range, the laser beam is in the process of processing along a preset path, the distance between two adjacent processing traces on the film is proper, and in the process of processing, the heat cannot be excessively concentrated, so that the patterns processed on the film are clear.
In the above embodiment, the identifier may include a first circular ring and a second circular ring, the first circular ring and the second circular ring are concentrically arranged, and the diameter of the first circular ring is different from the diameter of the second circular ring;
controlling the laser beam to move according to a preset path comprises:
and controlling the laser beam to move according to the first circular rings in all the identification grids, and then controlling the laser beam to move according to the second circular rings in all the identification grids.
When the identifier comprises the first circular ring and the second circular ring, the movement path of the laser beam can move along the first circular rings in all the identification cells firstly and then move along the second circular rings in all the identification cells; or the laser beam moves along the second circular rings in all the identification cells firstly and then moves along the first circular rings in all the identification cells.
The first circular ring and the second circular ring belong to the wire frames which are closed end to end.
In the above embodiment, the identifier may further include a third circular ring, and specifically, referring to fig. 4, the first circular ring, the second circular ring and the third circular ring are all concentrically arranged, and the diameter of the first circular ring is greater than that of the second circular ring, and the diameter of the second circular ring is greater than that of the third circular ring.
The laser beam can be processed along the first circular circles in all the identification cells as a first sub-path, then processed along the second circular circles in all the identification cells as a second sub-path, and further processed along the third circular circles in all the identification cells as a third sub-path. The laser beam has small heat accumulation in the processing process, and can effectively avoid damaging the film, so that the surface pattern of the film is standard and clear.
Referring to fig. 5, an exemplary embodiment of the present invention may be:
placing the display screen attached with the film on a workbench;
adjusting the position of the workbench relative to the laser head to enable the focus of the laser beam to be positioned above the film;
controlling the laser beam to process the film according to the first sub-path;
controlling the laser beam to process the film according to the second sub-path;
controlling the laser beam to process the film according to the third sub-path;
and detecting the pattern formed on the film by using a detection device.
The pattern formed on the film can be a two-dimensional code, and the detection device can be a scanning device, wherein the scanning device can identify the two-dimensional code on the film and convert the two-dimensional code into readable information.
In the above embodiments, the focusing the laser beam on the film comprises:
the laser beam passes through the lens and is focused above the film;
the focal length range of the lens is: 32 mm-100 mm.
Specifically, a lens with a focal length of 32mm, a lens with a focal length of 50mm, a lens with a focal length of 60mm, a lens with a focal length of 74mm, or a lens with a focal length of 100mm may be selected, and a lens with a focal length of any value within the above range may be selected. The lens with the small focal length can enable laser beams to pass through the lens and then be focused to have small light spots, concentrated energy, high processing precision and easy control.
In the embodiment of the invention, an F-theta focusing scene can be selected specifically, and the focal length can be 74 mm.
In the above embodiment, the wavelength range of the laser beam may be: 355 nm-532 nm;
and/or the pulse width range of the laser beam is: 7 ns-20 ns.
In the above embodiment, the laser head may use an ultraviolet nanosecond laser, specifically, the wavelength of a laser beam emitted by the laser head may be 355nm, the pulse width is less than 20ns, specifically, 7ns, 10ns, or 20ns, or any other value within the above range.
In the above embodiment, the power range of the laser beam is: 0.3W-5W;
and/or the output frequency of the laser beam is: 10Kdz-100 Kdz.
In the technical scheme of the invention, a more typical embodiment is as follows:
preparing a film, attaching the film to a display screen, placing the display screen on a workbench, and positioning the display screen by using a jig so that the display screen is in a horizontal state, namely, the film on the display screen is in a horizontal state;
adjusting the workbench to focus laser beams emitted by the laser head above the film;
guiding a preset drawing file into laser processing equipment, adjusting various parameters of the laser processing equipment, controlling a laser beam to perform laser processing on a film according to an identifier arranged on the drawing file as a preset path, and processing a pattern with the shape consistent with that of the identifier on the drawing file on the film;
and taking out the display screen attached with the film, scanning the pattern on the film by using scanning equipment, and further uploading the scanning result to a system to confirm whether the scanned information is correct.
The relevant parameters of the laser processing equipment can be adjusted according to the following table ranges:
among them, the parameters in a more typical embodiment can be set according to the following table:
compared with the traditional process for jet printing the label two-dimensional code through an ink jet printer, the technical scheme provided by the invention has the advantages that the film is etched by adopting the laser beam, and the two-dimensional code is engraved on the surface of the film, so that consumables such as ink and the like are not required to be replaced, the environmental pollution is small, and the process is more environment-friendly. According to the technical scheme, the laser head adopts the lens with the small focal length, the focal point of the laser beam is positioned above the film to engrave the film, and the laser beam is further controlled to be processed according to each sub-path in sequence, so that the definition of an engraved pattern formed on the film is high, the display screen below the film cannot be influenced, and the processed film has a smooth surface and no touch.
The invention also provides laser processing equipment which is used for executing the laser processing method. The specific structure of the laser processing method refers to the above embodiments, and since the laser processing apparatus adopts all technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here.
The laser processing method can form a two-dimensional code capable of accommodating a character length of 200 bits on the surface of the film, and the size of the two-dimensional code can be 10mm by 10 mm.
The workpiece in the embodiment of the invention can be a display screen or any other product, and the laser processing method can be used for simply engraving the film on the workpiece, so that the film can be conveniently formed with relevant information, the production and processing of the product are facilitated, the product is not damaged in the processing process of the film, and the production quality of the product is ensured. The display screen can be a liquid crystal display screen or other display screens.
This laser processing equipment includes above-mentioned laser head, and each item parameter of laser head can refer to above-mentioned embodiment, and this laser processing equipment can also further include above-mentioned workstation and tool, and the workstation can move relative to the laser head, and laser beam is launched to the laser head, and laser beam carries out laser processing to the work piece on the workstation, specifically is for carrying out the laser sculpture.
This laser processing equipment can also be equipped with and take out the dirt device, takes out the dirt device and can clear away the laser beam waste residue that produces in to the film course of working, guarantees that the film surface is clean in the course of working for film surface machining shaping high quality, and can reduce the energy loss of laser beam in the transmission course.
The laser processing equipment can be interconnected with other equipment, is communicated with one another, can realize the functions of real-time information transmission, automatic two-dimensional code generation according to rules, programming and the like, and realizes automatic production management.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A laser processing method, characterized by comprising:
placing the product with the film on a workbench;
focusing a laser beam over the thin film;
and controlling the laser beam to move according to a preset path, and processing the film by using the heat diffused by the focal point of the laser beam.
2. The laser processing method of claim 1, wherein a distance d between a focal point of the laser beam and the thin film is in a range of: 0.3 mm-1 mm.
3. The laser machining method of claim 1, wherein before controlling the laser beam to move along the predetermined path, further comprising the steps of:
and obtaining a preset path according to the preset information.
4. The laser processing method of claim 3, wherein obtaining the preset path according to the preset information comprises:
dividing the picture into a plurality of identification grids which are arranged in an array, and setting identifiers in the corresponding identification grids according to preset information;
and taking the identifiers in all the identification grids as preset paths.
5. The laser machining method according to claim 4, wherein the identifier includes one or more marking patterns; the preset path comprises one or more than one sub-paths;
one sub-path comprises a marking graph in all the identification cells;
controlling the laser beam to move according to a preset path comprises:
and controlling the laser beam to carry out laser processing on the film according to each sub-path in sequence.
6. The laser machining method according to claim 5, wherein the marking pattern includes a dot, a line segment, or a closed-end wire frame.
7. The laser processing method of claim 5, wherein the distance between two adjacent mark patterns of the same identifier is w, and the value of w ranges from 0.02mm to 0.04 mm.
8. The laser machining method of claim 4, wherein the identifier includes a first circular ring and a second circular ring, the first circular ring and the second circular ring being concentrically arranged, and a diameter of the first circular ring being different from a diameter of the second circular ring;
controlling the laser beam to move according to a preset path comprises:
and controlling the laser beam to move according to the first circular rings in all the identification grids, and then controlling the laser beam to move according to the second circular rings in all the identification grids.
9. The laser machining method of any one of claims 1 to 8, wherein focusing the laser beam over the thin film comprises:
the laser beam passes through the lens and is focused above the film;
the focal length range of the lens is as follows: 32 mm-100 mm;
and/or the wavelength range of the laser beam is as follows: 355 nm-532 nm;
and/or the pulse width range of the laser beam is as follows: 7 ns-20 ns;
and/or the power range of the laser beam is as follows: 0.3W-5W;
and/or the output frequency of the laser beam is: 10Kdz-100 Kdz.
10. A laser machining apparatus for performing the laser machining method according to claims 1 to 9, the laser machining apparatus comprising a laser head that emits a laser beam and a table.
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