CN102241201A - Laser melting and etching marking device and method based on transparent material - Google Patents
Laser melting and etching marking device and method based on transparent material Download PDFInfo
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- CN102241201A CN102241201A CN2011100968875A CN201110096887A CN102241201A CN 102241201 A CN102241201 A CN 102241201A CN 2011100968875 A CN2011100968875 A CN 2011100968875A CN 201110096887 A CN201110096887 A CN 201110096887A CN 102241201 A CN102241201 A CN 102241201A
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Abstract
The invention discloses a laser melting and etching marking device and method based on a transparent material, solving the problem the transparent material is subjected to laser marking at high transmittivity and belonging to the field of micro processing. The device comprises a laser, a computer, laser marking system software, a motion control system, a worktable, a clamp, a groove base, a heat-conducting medium and a transparent material plate, wherein the laser is connected with the computer; the worktable is arranged below the motion control system; the heat-conducting medium is paved on the groove base; and the transparent material is used as a cover plate and is fixed above the worktable by using a clamp. During marking, laser is focused on the contacted surface between the transparent material and the heat-conducting medium through the motion control system; the medium absorbs laser energy and the laser energy is converted into heat which is transmitted to the closely-contacted transparent material, so that the transparent material reaches a melting point in an extremely-short time, further the transparent material is separated from a substrate and the indention is realized. According to the laser melting and etching marking device and method disclosed by the invention, the laser melting and etching marking on the transparent material is realized, the resolution and the edge sharpness of marking patterns are improved and the roughness on the bottom surface of a microgroove reaches micro size.
Description
Technical field
The present invention relates to a kind of laser fusion marking device and method based on transparent material, this method can etch figure or the little groove with controllable depth in the transparent material surface fusing, belongs to little manufacture field.
Background technology
The laser marking technology is one of application of Laser Processing maximum.Laser marking is to utilize the laser of high-energy-density that workpiece is carried out local irradiation, makes skin-material break away from the chemical reaction of base material or generation change color, thereby stays a kind of marking method of permanent marker.Laser marking can be got various literal, symbol and pattern etc., and character boundary can be from the millimeter to the micron dimension, and this has special meaning to product false proof.
It has the advantage that conventional method (burn into spark machined, mechanical scratching, printing etc.) hardly matches.
1. have contactless, no cutting force, the advantage that heat affecting is little has guaranteed original precision of workpiece.Simultaneously, wider to the adaptability of material, can produce very fine mark on the surface of multiple material and durability very good;
2. the space of laser is controlled controlled fine with the time, and to the material of processing object, shape, the free degree of size and processing environment are all very big, is specially adapted to automation processing and special processing.And processing mode is flexible, both can adapt to the needs of the individual event design of testing cell-type, also can satisfy requirement of industrialized batch production;
3. laser grooving and scribing is meticulous, and lines can reach millimeter to micron dimension;
4. laser-processing system combines with computer numerical control software, constitutes the high-efficient automatic process equipment, various literal of marking according to demand, and symbol and pattern have good controllability.
The laser marking technology has been widely used in all trades and professions, is high-quality, and efficient, wide prospect has been opened up in pollution-free and modern cheaply processing.
Laser marking has following several method commonly used according to the rapidoprint difference,
1, the direct etching mark of laser.The laser absorption rate height of material to being adopted itself be about to the surface that laser beam that laser instrument sends focuses on the mark material, owing to need not the mark technology that other external conditions can realize vaporescence.
2, the mark of laser indirect etching.The metal of some material such as high reflecting rate and the nonmetallic materials of any surface finish adopt the direct etching of laser, can't obtain the marking effect that needs, need to increase several times power just be enough to the to vaporize material of certain less degree of depth.Indirectly the etching mark is exactly to apply the auxiliary absorbed layer of one decks at these material surfaces, realizes mark effect under the relative low power laser condition, the loss of minimizing energy with its vaporescence.
Directly the method for mark is applicable to major part to the high material of particular laser output wavelength absorptivity, and processing technology is simple, and effect is better, need not subsequent treatment, but for institute's material processed bigger restriction is arranged, and is not suitable for most of transparent material.The mark technology of indirect vaporizing etching is applicable to the material that those are little to the specific wavelength absorptivity, can improve the utilization rate of laser energy.Yet, this technology relative complex, need find suitable auxiliary absorbed layer is not easily yet, has also increased follow-up treatment process, and certain limitation is arranged.
Summary of the invention
The present invention is intended to solve the method for the direct or indirect etching mark of present use laser, and transparent material has proposed a kind of laser fusion etching marking device and method based on transparent material to the low difficult problem that is difficult to realize the mark of vaporescence etching of laser absorption rate.This apparatus and method etching technics is simple, can etch the various patterns with controlled etched degree of depth in the transparent material surface fusing, and process velocity is fast, need not complicated subsequent treatment process.
To achieve these goals, the present invention has taked following technical scheme.Laser fusion etching marking device among the present invention comprises computer, laser instrument, is installed on laser motion control system, workbench, anchor clamps, groove base, heat-conducting medium, the transparent material cover plate of laser instrument; Wherein: laser instrument links to each other with computer, workbench places the below of laser motion control system, heat-conducting medium evenly is tiled in the groove of groove base, and make cover plate with the transparent material cover plate, by anchor clamps it is clamped, be fixed on the workbench top, laser instrument is optical fiber laser or Nd:YAG solid state laser.
When using said apparatus to melt the etching mark, its concrete marking method is as follows:
(1) image that will mark imports in the computer;
(2) heat-conducting medium is tiled in the bottom land of groove base, and make cover plate with the transparent material cover plate, by anchor clamps it is clamped, be fixed on the workbench top, the plane, focus place after the laser beam that the lower surface of transparent material cover plate and laser instrument send focuses on is in same plane;
Described heat-conducting medium be fusing point more than 1500 ℃, thermal conductivity factor is the material of 8W/mK under the normal temperature, has slightly solubility with transparent material, to irradiation laser absorptivity height.Can be the high solid plate of surface smoothness, also can be granularity less than 5 microns powder particle.
If medium is a solid plate, then sheet material is placed transparent material cover plate below, smooth surface and cover plate are close to, and with anchor clamps the two are fixedly clamped;
If medium is a powder particle, then powder evenly is tiled in the groove of groove bedplate, use the compacting of transparent material cover plate, and the three is fixedly clamped with anchor clamps.
(3) read by the laser marking system software that is installed on computer and treat marking image, laser fusion etching mark technological parameter is set, parameter comprises laser output power, light-spot speed and laser instrument repetition rate, heat-conducting medium can absorb luminous energy under this laser action, and change into heat energy rising temperature rapidly, arrive under the melting point;
(4) open laser instrument, the laser motion control system is carried out spot scan according to the picture signal of computer output, and high-octane laser beam sees through transparent material cover plate irradiation at heat-conducting medium and cover plate interface, carries out the laser fusion marking on the transparent cover plate lower surface;
(5) work as finishing image scanning, unclamp anchor clamps, take off the transparent material cover plate, remove and adhere to indentation heat-conducting medium on every side.
Described anchor clamps are the encirclement shape from top to bottom with groove base, heat-conducting medium and transparent material cover plate to be fixed, and the elasticity that adjustable clamp is held keeps stressed uniformity coefficient of transparent material cover plate and pressure size.
Described laser motion control system is the Digit Control Machine Tool that scanning galvanometer, digital control laser processing head maybe can be realized two dimension or three-dimensional processing.
Described transparent material plate is glass plate or organic polymer transparent material.
Operation principle of the present invention is: heat-conducting medium is placed transparent material below and guarantee that the two contact is good, use anchor clamps to control the contact pressure of the two, make that mark face to be etched and heat-conducting medium are whole spares that power is seamless to be contacted.Laser penetration transparent material cover plate is radiated on the heat-conducting medium of cover plate and medium interface, heat-conducting medium has high absorptivity to the laser output wavelength that uses, behind the laser energy that absorbs irradiation, luminous energy is converted into heat energy at the utmost point in the short time, temperature raises, because heat-conducting medium has good heat-conducting, most heat energy are conducted fast to the transparent material of being close to, transparent material absorbs heat, temperature reaches its melting point, the fusing back breaks away from base material, thereby fusing forms indentation, reaches the effect of marking.Along with moving of laser beam, mark goes out the pattern consistent with laser beam scan path.
This method and device can also be realized the etching of groove on transparent material, and the degree of depth of etching groove and width can be by the laser powers of control output, the defocusing amount of laser beam and heat-conducting medium, and the live width and the scanning times of importing image are controlled.In addition, the atmosphere that flows at anchor clamps place has the function of protection and cooling, has better action for the control heat affected area, can improve the marginal definition of fusing indentation, reduces the roughness of trench bottom.
Experimental provision of the present invention is simple, and is with low cost, easy operating.By selecting corresponding difform plane or curved surface groove base, can be implemented in the fusing etching mark on the difformity transparent material substrate, and the resolution ratio of mark pattern and marginal definition height.The present invention can also be on transparent material the etching microchannel, the depth of passage and width are by laser parameter and the control of designed figure, forming quality is higher than direct laser marking etching.
Description of drawings
Structural representation among Fig. 1 the present invention based on the laser fusion marking device of transparent material
Among the figure: 1, computer, 2, laser instrument, 3, laser motion control system, 4, anchor clamps, 5, mark transparent material, 6, heat-conducting medium, 7, groove base, 8, workbench.
The laying method schematic diagram of anchor clamps that use among Fig. 2 the present invention and workpiece
Fig. 3 uses " the luckiness rabbit year " pattern that method of the present invention is made on the thick ultra-clear glasses of 3.2mm
Fig. 4 uses the three-dimensional appearance figure of the precision line that method of the present invention makes on the thick transparent acrylic of 2mm
The specific embodiment
The invention will be further described in conjunction with the accompanying drawings:
The laser instrument that the laser fusion etching marking device that the present invention adopts comprises links to each other by the computer of data wire with the laser marking system software of installation, computer is with the laser power of control, sweep speed, the repetition rate signal is input to laser instrument, and laser instrument is optical fiber laser or Nd:YAG solid state laser.Be equipped with the laser motion control system on the laser instrument, on the workbench with the beam direction below.Heat-conducting medium is contained in the groove base, and transparent material covers on heat-conducting medium, by clamp, places on the processing workbench.
Use above-mentioned laser fusion marking device based on transparent material to carry out mark, its method is as follows:
(1) image that will mark imports in the computer;
(2) heat-conducting medium is tiled in the bottom land of groove base, and make cover plate with the transparent material cover plate, by anchor clamps it is clamped, be fixed on the workbench top, the plane, focus place after the laser beam that the lower surface of transparent material cover plate and laser instrument send focuses on is in same plane;
Described heat-conducting medium be fusing point more than 1500 ℃, thermal conductivity factor is the material of 10W/mK under the normal temperature, has slightly solubility with transparent material, to irradiation laser absorptivity height.Can be the high solid plate of surface smoothness, also can be granularity less than 5 microns powder particle.
If medium is a solid plate, then sheet material is placed transparent material cover plate below, smooth surface and cover plate are close to, and with anchor clamps the two are fixedly clamped;
If medium is a powder particle, then powder evenly is tiled in the groove of groove bedplate, use the compacting of transparent material cover plate, and the three is fixedly clamped with anchor clamps.
(3) read by the laser marking system software that is installed on computer and treat marking image, laser fusion etching mark technological parameter is set, parameter comprises laser output power, light-spot speed and laser instrument repetition rate, heat-conducting medium can absorb luminous energy under this laser action, and change into heat energy rising temperature rapidly, arrive under the melting point;
(4) open laser instrument, the laser motion control system is carried out spot scan according to the picture signal of computer output, and high-octane laser beam sees through transparent material cover plate irradiation at heat-conducting medium and cover plate interface, carries out the laser fusion marking on the transparent cover plate lower surface;
(5) work as finishing image scanning, unclamp anchor clamps, take off the transparent material cover plate, remove and adhere to indentation heat-conducting medium on every side.
Described anchor clamps are the encirclement shape from top to bottom with groove base, heat-conducting medium and transparent material cover plate to be fixed, and the elasticity that adjustable clamp is held keeps stressed uniformity coefficient of transparent material cover plate and pressure size.
Described laser motion control system is the Digit Control Machine Tool that scanning galvanometer, digital control laser processing head maybe can be realized two dimension or three-dimensional processing.
Described transparent material plate is glass plate or organic polymer transparent material.
Following example selects that volume is little for use, good beam quality, optical fiber laser easy to process, and wavelength is 1064nm, and laser control system adopts scanning galvanometer, and process velocity is fast; With 2050 ℃ of fusing points, thermal conductivity factor is 10W/mK under the normal temperature, the aluminium oxide Al of powder particle diameter 1um
2O
3Powder, and surface roughness is that the alumina ceramic plate of 500nm is a heat-conducting medium; With the thick transparent plexiglass plate material of 1mm is the groove base; Selecting thick ultra-clear glasses of 3.2mm and the thick transparent acrylic of 2mm is that material melts mark and accurate line.
Embodiment 1: make " the luckiness rabbit year " pattern on the thick ultra-clear glasses of 3.2mm
With Al
2O
3Powder is evenly elaborated in lucite groove base, until filling up whole groove, scrape off more than powder, powder upper surface and groove base upper surface are maintained an equal level, depth of groove is 1mm, planar dimension is 32mm * 22mm.3.2mm is thick, and planar dimension is that the ultra-clear glasses of 30mm * 18mm is covered on powder, and evenly compacting is placed on the anchor clamps and clamps.Then it is put on the workbench, laser focuses on ultra-clear glasses and the plane that the heat conduction powder contacts.The pattern contour of required marking is of a size of 30mm * 20mm, and the picture pixel is 300dpi.After importing to computer, the transparent acrylic board profile of the indication laser alignment mark of sending by laser instrument.It is laser power 20W that machined parameters is set, sweep speed 300mm/s frequency 20KHZ.Open laser instrument, laser is scanned according to the machined parameters of setting, scanning times is 2 times.Been scanned is unclamped anchor clamps, take out ultra-clear glasses, dash with the running water that flows and remove in the fusing etching process, because fusing is attached on the powder around the indentation and cleans with ultrasonic wave, it is clear to obtain indentation on ultra-clear glasses, image spatial resolution be 12 lines right/millimeter fusing mark pattern.
Embodiment 2: make accurate line on the thick ultra-clear glasses of 3.2mm
With Al
2O
3Powder is evenly elaborated in lucite groove base, until filling up whole groove, scrape off more than powder, powder upper surface and groove base upper surface are maintained an equal level, depth of groove is 1mm, planar dimension is 32mm * 22mm.3.2mm is thick, and planar dimension is that the ultra-clear glasses of 30mm * 15mm is covered on powder, and evenly compacting is placed on the anchor clamps and clamps.Then it is put on the workbench, laser focuses on transparent acrylic and the plane that the heat conduction powder contacts.Drawing length in the control software of computer is 20mm, and live width is the horizontal linear of 0.15mm, and it is laser power 20W that machined parameters is set, sweep speed 300mm/s frequency 20KHZ.Open laser instrument, laser is scanned according to the machined parameters of setting, scanning times is set according to etching depth.Been scanned is unclamped anchor clamps, takes out the ultra-clear glasses cover plate, melts in the etching process towards removing with the running water that flows, because fusing is attached on indentation powder on every side.And clean with ultrasonic wave, can obtain carving width on ultra-clear glasses is 0.18mm, the degree of depth is 320 μ m, little groove of bottom surface roughness Ra=2.62 μ m.
Embodiment 3: make " the luckiness rabbit year " pattern on the thick transparent acrylic of 2mm
With Al
2O
3Powder is evenly elaborated in lucite groove base, until filling up whole groove, scrape off more than powder, powder upper surface and groove base upper surface are maintained an equal level, depth of groove is 1mm, planar dimension is 32mm * 22mm.2mm is thick, and planar dimension is that the transparent acrylic of 30mm * 20mm covers on powder, and evenly compacting is placed on the anchor clamps and clamps.Then it is put on the workbench, laser focuses on transparent acrylic and the plane that the heat conduction powder contacts.The rabbit pattern contour of required marking is of a size of 30mm * 20mm, and the picture pixel is 300dpi, import to computer after, the transparent acrylic board profile of the indication laser alignment mark of sending by laser instrument.It is laser power 20W that machined parameters is set, sweep speed 300mm/s frequency 20KHZ.Open laser instrument, laser is scanned according to the machined parameters of setting, scanning times is 2 times.Been scanned is unclamped anchor clamps, take out transparent acrylic cover plate, dash with the running water that flows and remove in the fusing etching process, because fusing is attached on the powder around the indentation and cleans with ultrasonic wave, can on transparent acrylic sheet material, obtain the image outline clear-cut margin, the fusing mark pattern that resolution ratio is high.
Embodiment 4: accurate line on the thick transparent acrylic of 2mm
With Al
2O
3Powder is evenly elaborated in lucite groove base, until filling up whole groove, scrape off more than powder, powder upper surface and groove base upper surface are maintained an equal level, depth of groove is 1mm, planar dimension is 32mm * 22mm.2mm is thick, and planar dimension is that the transparent acrylic of 30mm * 20mm covers on powder, and evenly compacting is placed on the anchor clamps and clamps.Then it is put on the workbench, laser focuses on transparent acrylic and the plane that the heat conduction powder contacts.Drawing length in the control software of computer is 20mm, and live width is the horizontal linear of 0.15mm, and it is laser power 20W that machined parameters is set, sweep speed 300mm/s frequency 20KHZ.Open laser instrument, laser is scanned according to the machined parameters of setting, scanning times is set according to etching depth.Been scanned is unclamped anchor clamps, take out transparent acrylic cover plate, dash except that in the fusing etching process with the running water that flows, because fusing is attached on the powder around the indentation and cleans with ultrasonic wave, can obtain carving width on transparent acrylic sheet material is 0.21mm, the degree of depth is 200 μ m, little groove of bottom surface roughness Ra=1.43 μ m.
Embodiment 5: use alumina ceramic plate carving characters on the thick ultra-clear glasses of 3.2mm as heat-conducting medium
Alumina ceramic plate and ultra-clear glasses are cleaned up with supersonic wave cleaning machine, after drying the two smooth surface is close to, be placed on the anchor clamps and clamp, be put on the workbench, laser focuses on ultra-clear glasses and the plane that alumina ceramic plate contacts.The character contour of required marking is of a size of 15mm * 2mm, import to computer after, the indication laser alignment aluminium oxide ceramics and the ultra-clear glasses contact position that send by laser instrument.It is laser power 20W that machined parameters is set, sweep speed 300mm/s frequency 20KHZ.Open laser instrument, laser is scanned according to the machined parameters of setting, scanning times is 2 times.Been scanned is unclamped anchor clamps, and the taking-up ultra-clear glasses is dashed except that in the fusing etching process with the running water that flows, and is attached on indentation slag on every side.And clean with ultrasonic wave, it is clear promptly to obtain indentation on ultra-clear glasses, the laser fusion marking literal that the edge is outstanding, its spatial resolution be 20 lines right/millimeter.
Claims (6)
1. laser fusion etching marking device based on transparent material is characterized in that: comprise computer, laser instrument, be installed on laser motion control system, workbench, anchor clamps, groove base, heat-conducting medium, the transparent material cover plate of laser instrument; Wherein: laser instrument links to each other with computer, workbench places the below of laser motion control system, heat-conducting medium evenly is tiled in the groove of groove base, and make cover plate with the transparent material cover plate, by anchor clamps it is clamped, be fixed on the workbench top, laser instrument is optical fiber laser or Nd:YAG solid state laser.
2. one kind is utilized that claim 1 is described carries out the method for laser marking based on the laser fusion marking device of transparent material, it is characterized in that this method may further comprise the steps:
(1) image that will mark imports in the computer;
(2) heat-conducting medium is tiled in the bottom land of groove base, and make cover plate with the transparent material cover plate, by anchor clamps it is clamped, be fixed on the workbench top, the plane, focus place after the laser beam that the lower surface of transparent material cover plate and laser instrument send focuses on is in same plane;
(3) read by the laser marking system software that is installed on computer and treat marking image, laser fusion etching mark technological parameter is set, parameter comprises laser output power, light-spot speed and laser instrument repetition rate, heat-conducting medium can absorb luminous energy under this laser action, and change into heat energy rising temperature rapidly, arrive under the melting point;
(4) open laser instrument, the laser motion control system is carried out spot scan according to the picture signal of computer output, and high-octane laser beam sees through transparent material cover plate irradiation at heat-conducting medium and cover plate interface, carries out the laser fusion marking on the transparent cover plate lower surface;
(5) work as finishing image scanning, unclamp anchor clamps, take off the transparent material cover plate, remove and adhere to indentation heat-conducting medium on every side.
3. a kind of laser fusion etching marking method according to claim 2 based on transparent material, it is characterized in that: described anchor clamps are the encirclement shape from top to bottom with groove base, heat-conducting medium and transparent material cover plate to be fixed, and regulates the elasticity maintenance stressed uniformity coefficient of transparent material cover plate and the pressure size of clamping.
4. a kind of laser fusion etching marking method based on transparent material according to claim 2 is characterized in that: described heat-conducting medium be fusing point more than 1500 ℃, thermal conductivity factor is the above material of 8W/mK under the normal temperature; Heat-conducting medium is the solid plate of surface roughness Ra less than 500nm, or granularity is less than 5 microns powder particle;
If medium is a solid plate, then sheet material is placed transparent material cover plate below, solid plate and cover plate are close to, and with anchor clamps the two are fixedly clamped;
If medium is a powder particle, then powder evenly is tiled in the groove of groove bedplate, use the compacting of transparent material cover plate, and the three is fixedly clamped with anchor clamps.
5. a kind of laser fusion etching marking method based on transparent material according to claim 2 is characterized in that: described laser motion control system is one of Digit Control Machine Tool of scanning galvanometer, digital control laser processing head, two dimension or three-dimensional processing.
6. a kind of laser fusion etching marking method based on transparent material according to claim 2, it is characterized in that: described transparent material cover plate is glass plate or organic polymer transparent material.
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| CN107310142B (en) * | 2017-07-14 | 2023-02-03 | 广东工业大学 | Device and method for preparing PDMS surface patterning wrinkles based on laser |
| CN109048057A (en) * | 2018-09-04 | 2018-12-21 | 沈阳飞机工业（集团）有限公司 | One kind beating calibration method on glass components |
| CN111069783A (en) * | 2018-10-22 | 2020-04-28 | 大族激光科技产业集团股份有限公司 | Device and method for reducing back marks of laser marks |
| CN112939487A (en) * | 2021-01-28 | 2021-06-11 | 佛山科学技术学院 | Sandwich type glass microfluidic chip double-sided laser processing device and method |
| CN112939487B (en) * | 2021-01-28 | 2023-03-10 | 佛山科学技术学院 | Sandwich type glass microfluidic chip double-sided laser processing device and method |
| CN114309967A (en) * | 2022-01-11 | 2022-04-12 | 大族激光科技产业集团股份有限公司 | Laser processing method and apparatus |
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