CN104959732A - Method for automatically cutting optical lens substrate - Google Patents
Method for automatically cutting optical lens substrate Download PDFInfo
- Publication number
- CN104959732A CN104959732A CN201510244543.2A CN201510244543A CN104959732A CN 104959732 A CN104959732 A CN 104959732A CN 201510244543 A CN201510244543 A CN 201510244543A CN 104959732 A CN104959732 A CN 104959732A
- Authority
- CN
- China
- Prior art keywords
- lens substrate
- laser
- cutting
- optical lens
- energy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 25
- 230000003287 optical effect Effects 0.000 title claims abstract description 24
- 238000005520 cutting process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000000835 fiber Substances 0.000 claims abstract description 26
- 238000005253 cladding Methods 0.000 claims abstract description 8
- 239000013307 optical fiber Substances 0.000 claims abstract description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 12
- 238000009966 trimming Methods 0.000 claims description 10
- 238000003698 laser cutting Methods 0.000 claims description 9
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 7
- 238000005086 pumping Methods 0.000 claims description 7
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 claims description 7
- 230000001476 alcoholic effect Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 7
- 230000001105 regulatory effect Effects 0.000 description 4
- 230000003252 repetitive effect Effects 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- QFXZANXYUCUTQH-UHFFFAOYSA-N ethynol Chemical group OC#C QFXZANXYUCUTQH-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Lasers (AREA)
Abstract
The invention discloses a method for automatically cutting an optical lens substrate. The method comprises a plurality of production processes, including design and dotting of a lens substrate vector graphic, arrangement of an optical fiber transmission system, arrangement of energy velocity parameters, lens cleaning, and other steps. A solid-state diode is used to pump molecules in a double-cladding Yb-doped fiber, and the molecules are stimulated and emit to form laser. The method is precise and fast in forming and cutting, and repeated positioning accuracy is improved to +-0.02/240 mm from original +-0.03/300 mm, and required energy reduces by 25%-33%. The processing has no distortion, and is high in precision, fast in speed, and high in automation degree, and subsequent processing is not needed. The method is good in cutting quality and low in energy consumption, and saves production cost and improves product economic benefits.
Description
Technical field
The present invention relates to the processing technology of optical lens, especially the processing method technical field of optical lens substrate.
Background technology
Optical lens is the optical element of piece with the surface that transparency material is made, (as glass by transparency material, crystal etc.) optics made, be applied to space flight, military, electrical equipment manufactures, the every field such as scientific research, be widely used in product manufacturing, five, in the main method that the sixties cut as substrates of lenses: adopt oxyacetylene torch cutting method, single, complicated, after the seventies, in order to improve the kerf quality of gas flame cuttiug, the accurate gas flame cuttiug of oxidative ethane and method for plasma cutting are promoted again, in order to reduce the manufacturing cycle of diel, the punching of numerical control step and EDM Technology are developed again, these cutting method precision are low, trivial operations, processing cost is high and efficiency is low, production cycle is long, energy consumption is high, affect the development of our most of manufacturing enterprise, for the defect of current technology, invent the processing technology of laser cutting, solve the process issues of optical lens substrate, improve the cut quality of optical lens substrate, achieve efficient large-scale production, facilitate the formation and development of China's related industry, also our economic development and the adjustment of the industrial structure is greatly facilitated, its automaticity is high, easy operation, the manufacturing cycle of effective shortening substrates of lenses, also save manufacturing a finished product of product, improve productivity effect.The great raising that the research and development of laser cutting machine and application are produced modern industry beyond doubt and strategic structural.
Summary of the invention
, trivial operations low for precision, the production cycle is long, energy consumption is high, processing cost is high and inefficient processing method, has invented the processing technology of laser cutting.
For solving the problems of the technologies described above, the present invention adopts technical scheme as described below:
(1) method for surface trimming optical lens substrate, the optical lens substrate that first will cut, is drawn as vector bargraphs, and pneumatic marking machine, save as corresponding PLT file;
(2) start optical fiber laser, regulate its power to be 2KW, carry out the molecule in pumping Double Cladding Ytterbium Doped Fiber with solid-state diode, then form laser, spread out of by fiber optics;
(3) use fiber laser operating system, open above-mentioned PLT file, energy and speed parameter are set, carry out surface trimming figure according to instruction;
(4) be that 10%-15% analyzes pure acetone alcoholic solution and cleans lens surface by mass concentration.
Described is fibre laser cutting optical system substrate energy parameter is maximum laser power output is 500W, and idle running speed is 0-1000mm/min, and cutting speed is 0-1500mm/min, and power pulse width is 0.4ms-1ms; Desired speed parameter is 0-2000mm/min.
Advantageous Effects of the present invention is: the molecule stimulated emission adopting solid-state diode to come in pumping Double Cladding Ytterbium Doped Fiber forms laser, disposable cutting is carried out by regulating its power, speed, make substrates of lenses not yielding, quality is good, repetitive positioning accuracy brings up to ± 0.02/240mm by original ± 0.03/300mm, due to so the collision of molecule all occurs in optical fiber, just do not need laser gas, therefore the required energy be reduced to before 25%-33%, substantially increase the production efficiency of product, save product cost.
The present invention is compared with additive method, and having significant advantage is:
(1) automaticity is high, and cutting speed is fast, and it is high to produce efficiency, and the cycle is short;
(2) easy operation, energy consumption is low, on environment without impact;
(3) stable performance, cut quality is good, without the need to postorder process;
(4) processing is without distortion, and cost is low.
Embodiment
The present invention instead of traditional mechanical blades with sightless light beam, has precision high, and cutting fast, is not limited to cutting pattern restriction.
The present invention is the form optical lens substrate that will produce being drawn as vector bargraphs, and pneumatic marking machine, save as corresponding PLT file.
Start optical fiber laser, regulate its power to be 2KW, carry out the molecule in pumping Double Cladding Ytterbium Doped Fiber with solid-state diode, then form laser, spread out of by fiber optics.
Use fiber laser operating system, open above-mentioned PLT file, energy and speed parameter are set, carry out surface trimming figure according to instruction.
Be that 10%-15% analyzes pure acetone alcoholic solution and cleans lens surface by mass concentration.
Described is fibre laser cutting optical system substrate energy parameter is maximum laser power output is 500W, and idle running speed is 0-1000mm/min, and cutting speed is 0-1500mm/min, and power pulse width is 0.4ms-1ms; Desired speed parameter is 0-2000mm/min.
Example 1
First the optical lens substrate that will produce is drawn as the form of vector bargraphs, and pneumatic marking machine, save as corresponding PLT file, then optical fiber laser is started, its power is regulated to be 2KW, carry out the molecule in pumping Double Cladding Ytterbium Doped Fiber with solid-state diode, then form laser, spread out of by fiber optics.Use fiber laser operating system again, open above-mentioned PLT file, energy and speed parameter are set, carry out surface trimming figure according to instruction, finally with the analysis pure acetone alcoholic solution that mass concentration is 12%, lens surface is cleaned again.Above-described be fibre laser cutting optical system substrate energy parameter be laser output power is 480W, idle running speed is used to be 680mm/min, cutting speed is 1200mm/min, power pulse width is 0.6, speed parameter is 1600mm/min, reaches the standard that repetitive positioning accuracy index brings up to-0.01/140mm, required target energy reduction by 27%.
Example 2
First the optical lens substrate that will produce is drawn as the form of vector bargraphs, and pneumatic marking machine, save as corresponding PLT file, then optical fiber laser is started, its power is regulated to be 2KW, the molecule in pumping Double Cladding Ytterbium Doped Fiber is carried out with solid-state diode, then laser is formed, spread out of by fiber optics, use fiber laser operating system again, open above-mentioned PLT file, energy and speed parameter are set, carry out surface trimming figure according to instruction, finally with the analysis pure acetone alcoholic solution that mass concentration is 11%, lens surface is cleaned again.Above-described be fibre laser cutting optical system substrate energy parameter be laser output power is 450W, idle running speed is used to be 560mm/min, cutting speed is 1080mm/min, power pulse width is 0.4, speed parameter is 1480mm/min, reaches the standard that repetitive positioning accuracy index brings up to 0.01/150mm, required target energy reduction by 25%.
Example 3
First the optical lens substrate that will produce is drawn as the form of vector bargraphs, and pneumatic marking machine, save as corresponding PLT file, then optical fiber laser is started, its power is regulated to be 2KW, the molecule in pumping Double Cladding Ytterbium Doped Fiber is carried out with solid-state diode, then laser is formed, spread out of by fiber optics, use fiber laser operating system again, open above-mentioned PLT file, energy and speed parameter are set, carry out surface trimming figure according to instruction, finally with the analysis pure acetone alcoholic solution that mass concentration is 14%, lens surface is cleaned again.Above-described be fibre laser cutting optical system substrate energy parameter be laser output power is 500W, idle running speed is used to be 760mm/min, cutting speed is 1380mm/min, power pulse width is 0.7, speed parameter is 1760mm/min, reaches the standard that repetitive positioning accuracy index brings up to-0.01/200mm, required target energy reduction by 30%.
Claims (2)
1. a method for surface trimming optical lens substrate, is characterized in that:
(1) the optical lens substrate that will cut, is drawn as vector bargraphs, and pneumatic marking machine, save as corresponding PLT file;
(2) start optical fiber laser, regulate its power to be 2KW, carry out the molecule in pumping Double Cladding Ytterbium Doped Fiber with solid-state diode, then form laser, spread out of by fiber optics;
(3) use fiber laser operating system, open above-mentioned PLT file, energy and speed parameter are set, carry out surface trimming figure according to instruction;
(4) be that 10%-15% analyzes pure acetone alcoholic solution and cleans lens surface by mass concentration.
2. the method for a kind of surface trimming optical lens substrate according to claim 1, it is characterized in that: described is fibre laser cutting optical system substrate energy parameter is maximum laser power output is 500W, idle running speed is 0-1000mm/min, cutting speed is 0-1500mm/min, and power pulse width is 0.4ms-1ms; Desired speed parameter is 0-2000mm/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510244543.2A CN104959732A (en) | 2015-05-11 | 2015-05-11 | Method for automatically cutting optical lens substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510244543.2A CN104959732A (en) | 2015-05-11 | 2015-05-11 | Method for automatically cutting optical lens substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104959732A true CN104959732A (en) | 2015-10-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510244543.2A Pending CN104959732A (en) | 2015-05-11 | 2015-05-11 | Method for automatically cutting optical lens substrate |
Country Status (1)
| Country | Link |
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| CN (1) | CN104959732A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110405354A (en) * | 2019-07-24 | 2019-11-05 | 西安交通大学 | A kind of femtosecond laser processing method of optical fiber lens |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19859243A1 (en) * | 1998-12-22 | 2000-07-20 | Horst Exner | Twin beam laser processing equipment for welding, cutting, drilling or coating metallic or non-metallic materials comprises a light source, a fiber laser located in an optical fiber and a common light and laser radiation focusing device |
| US20100147810A1 (en) * | 2005-12-20 | 2010-06-17 | Livio Campana | Tool machine for laser cutting of sheet and pipe materials |
| JP2010239157A (en) * | 2010-07-15 | 2010-10-21 | Laser System:Kk | Laser cutting method |
| CN102241201A (en) * | 2011-04-18 | 2011-11-16 | 北京工业大学 | Laser melting and etching marking device and method based on transparent material |
| CN102528278A (en) * | 2010-12-30 | 2012-07-04 | 杭州中科新松光电有限公司 | Method for cutting materials on line by using laser |
-
2015
- 2015-05-11 CN CN201510244543.2A patent/CN104959732A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19859243A1 (en) * | 1998-12-22 | 2000-07-20 | Horst Exner | Twin beam laser processing equipment for welding, cutting, drilling or coating metallic or non-metallic materials comprises a light source, a fiber laser located in an optical fiber and a common light and laser radiation focusing device |
| US20100147810A1 (en) * | 2005-12-20 | 2010-06-17 | Livio Campana | Tool machine for laser cutting of sheet and pipe materials |
| JP2010239157A (en) * | 2010-07-15 | 2010-10-21 | Laser System:Kk | Laser cutting method |
| CN102528278A (en) * | 2010-12-30 | 2012-07-04 | 杭州中科新松光电有限公司 | Method for cutting materials on line by using laser |
| CN102241201A (en) * | 2011-04-18 | 2011-11-16 | 北京工业大学 | Laser melting and etching marking device and method based on transparent material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110405354A (en) * | 2019-07-24 | 2019-11-05 | 西安交通大学 | A kind of femtosecond laser processing method of optical fiber lens |
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Application publication date: 20151007 |
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