CN102241201B - Laser melting and etching marking device and method based on transparent material - Google Patents
Laser melting and etching marking device and method based on transparent material Download PDFInfo
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- CN102241201B CN102241201B CN201110096887.5A CN201110096887A CN102241201B CN 102241201 B CN102241201 B CN 102241201B CN 201110096887 A CN201110096887 A CN 201110096887A CN 102241201 B CN102241201 B CN 102241201B
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Abstract
The invention discloses a laser melting and etching marking device and method based on a transparent material, solving the problem the transparent material is subjected to laser marking at high transmittivity and belonging to the field of micro processing. The device comprises a laser, a computer, laser marking system software, a motion control system, a worktable, a clamp, a groove base, a heat-conducting medium and a transparent material plate, wherein the laser is connected with the computer; the worktable is arranged below the motion control system; the heat-conducting medium is paved on the groove base; and the transparent material is used as a cover plate and is fixed above the worktable by using a clamp. During marking, laser is focused on the contacted surface between the transparent material and the heat-conducting medium through the motion control system; the medium absorbs laser energy and the laser energy is converted into heat which is transmitted to the closely-contacted transparent material, so that the transparent material reaches a melting point in an extremely-short time, further the transparent material is separated from a substrate and the indention is realized. According to the laser melting and etching marking device and method disclosed by the invention, the laser melting and etching marking on the transparent material is realized, the resolution and the edge sharpness of marking patterns are improved and the roughness on the bottom surface of a microgroove reaches micro size.
Description
Technical field
The present invention relates to a kind of laser fusion marking device based on transparent material and method, the method can etch the figure or very low power with controllable depth in transparent material surface fusing, belongs to micro Process field.
Background technology
Laser marking technology is one of maximum application of Laser Processing.Laser marking utilizes the laser of high-energy-density to carry out local irradiation to workpiece, makes skin-material depart from base material or the chemical reaction of color change occurs, thus leaving a kind of marking method of permanent marker.Laser marking can get various word, symbol and pattern etc., and character boundary can from millimeter to micron dimension, and this has special meaning to the false proof of product.
It has the advantage that conventional method (burn into spark machined, mechanical scratching, printing etc.) hardly matches.
1. have contactless, without cutting force, the advantage that heat affecting is little, ensure that original precision of workpiece.Meanwhile, comparatively wide to the adaptability of material, very meticulous mark can be produced on the surface of multiple material and durability is very good;
2. the space controlling of laser and time controling fine, to the material of processing object, shape, the free degree of size and processing environment is all very large, is specially adapted to automation processing and special processing.And processing mode is flexible, both can adapts to the needs of the individual event design of testing cell-type, also can meet the requirement of industrialized mass;
3. laser grooving and scribing is meticulous, and lines can reach millimeter to micron dimension;
4. laser-processing system combines with computer numerical control software, forms high-efficient automatic process equipment, can the various word of marking according to demand, and symbol and pattern, have excellent controllability.
Laser marking technology is widely used in all trades and professions, is high-quality, and efficiently, pollution-free and modern processing that is low cost opens wide prospect.
Laser marking has following several conventional method according to rapidoprint difference,
1, laser direct etching mark.The laser beam focus sent by laser instrument, on the surface of mark material, because material itself is high to adopted laser absorption rate, can realize the mark technique of vaporescence without the need to other external conditions.
2, the mark of laser indirect etching.The metal of some material as high reflecting rate and the nonmetallic materials of any surface finish, adopt laser direct etching, cannot obtain the marking effect needed, and needing to increase the power of several times is just enough to vaporize the material of the necessarily less degree of depth.Indirect etching mark applies one deck assist absorption layer at these material surfaces exactly, realizes the mark effect under relative low-power lasing condition with its vaporescence, reduces the loss of energy.
Directly beat calibration method and be applicable to the major part material high to particular laser output wavelength absorptivity, processing technology is simple, and effect is better, without the need to subsequent treatment, but has larger restriction for processed material, is not suitable for most of transparent material.The mark technique of indirect vaporizing etching is applicable to those materials little to specific wavelength absorptivity, can improve the utilization rate of laser energy.But this technique relative complex, needs to find suitable assist absorption layer also and not readily, also add follow-up treatment process, have certain limitation.
Summary of the invention
The present invention is intended to solve use laser at present and directly or indirectly etches dozen calibration method, and transparent material is difficult to laser absorption rate is low the difficult problem realizing the mark of vaporescence etching, proposes a kind of laser fusing etching marking apparatus based on transparent material and method.This apparatus and method etching technics is simple, can etch the various patterns with the controlled etched degree of depth, and process velocity is fast, without the need to the subsequent treatment process of complexity in transparent material surface fusing.
To achieve these goals, this invention takes following technical scheme.Laser fusing etching marking apparatus in the present invention comprises computer, laser instrument, the laser motion control system being installed on laser instrument, workbench, fixture, groove base, heat-conducting medium, transparent material cover plate; Wherein: laser instrument is connected with computer, workbench is placed in the below of laser motion control system, heat-conducting medium is evenly laid in the groove of groove base, and make cover plate with transparent material cover plate, clamped by fixture, be fixed on above workbench, laser instrument is optical fiber laser or Nd:YAG solid state laser.
When using said apparatus to carry out the mark of fusing etching, its concrete marking method is as follows:
(1) will the image of mark import in computer;
(2) heat-conducting medium is laid in the bottom land of groove base, and make cover plate with transparent material cover plate, clamped by fixture, be fixed on above workbench, the focus place plane after the laser beam focus that the lower surface of transparent material cover plate and laser instrument send is in same plane;
Described heat-conducting medium be fusing point more than 1500 DEG C, under normal temperature, thermal conductivity factor is the material of 8W/mK, has slightly solubility with transparent material, high to irradiation laser absorptivity.Can be the solid plate that surface smoothness is high, also can be the powder particle that granularity is less than 5 microns.
If medium is solid plate, be then placed in by sheet material below transparent material cover plate, smooth surface and cover plate are close to, and the two are fixedly clamped with fixture;
If medium is powder particle, then powder is evenly laid in the groove of groove-bottom seat board, with the compacting of transparent material cover plate, and with fixture, three is fixedly clamped.
(3) the laser marking system software by being installed on computer reads treats marking image, laser fusing etching mark technological parameter is set, parameter comprises laser output power, light-spot speed and laser instrument repetition rate, heat-conducting medium can absorb luminous energy under this laser action, and change into rapidly heat energy raised temperature, under arriving melting point;
(4) laser instrument is opened, laser motion control system carries out spot scan according to the picture signal of computer export, high-octane laser beam transparent transparent material cover plate irradiation, at heat-conducting medium and cover plate interface, transparent cover plate lower surface carries out laser fusion marking;
(5) work as finishing image scanning, unclamp fixture, take off transparent material cover plate, remove the heat-conducting medium adhered to around indentation.
Groove base, heat-conducting medium and transparent material cover plate are fixed in surrounding shape by described fixture from top to bottom, and the elasticity of adjustable holding keeps transparent material coverplate stress uniformity coefficient and pressure size.
The Digit Control Machine Tool that described laser motion control system is scanning galvanometer, digital control laser processing head maybe can realize two dimension or Three-dimension process.
Described transparent material plate is glass plate or organic polymer transparent material.
Operation principle of the present invention is: to be placed in by heat-conducting medium below transparent material and contact both ensureing is good, use fixture control both contact, make mark face to be etched and heat-conducting medium entirety even power be seamless to contact.Laser penetration transparent material cover plate is radiated on the heat-conducting medium of cover plate and medium interface, heat-conducting medium has high absorptivity to the laser output wavelength used, after the laser energy absorbing irradiation, luminous energy is converted into heat energy in very short time, temperature raises, because heat-conducting medium has good heat conductivility, most heat energy is conducted fast to the transparent material be close to, transparent material absorbs heat, temperature reaches its melting point, depart from base material after fusing, thus fusing forms indentation, reaches the effect of marking.Along with the movement of laser beam, mark goes out the pattern consistent with laser beam scan path.
This method and device can also realize the etching of groove on transparent material, and the degree of depth of etching groove and width can by controlling the laser power exported, the defocusing amount of laser beam and heat-conducting medium, and the live width and the scanning times that import image control.In addition, the atmosphere of the flowing at fixture place has the function of protection and cooling, has good effect, can improve the marginal definition of fusing indentation, reduce the roughness of trench bottom for control heat affected area.
Experimental provision of the present invention is simple, with low cost, is easy to operation.By selecting corresponding difform plane or curved indentations base, can be implemented on difformity transparent material substrate fusing etching mark, and the resolution ratio of mark pattern and marginal definition high.The present invention can also etch microchannel on transparent material, and the depth of passage and width are by laser parameter and designed Graph Control, and forming quality etches higher than Direct Laser mark.
Accompanying drawing explanation
The structural representation of the laser fusion marking device based on transparent material in Fig. 1 the present invention
In figure: 1, computer, 2, laser instrument, 3, laser motion control system, 4, fixture, 5, mark transparent material, 6, heat-conducting medium, 7, groove base, 8, workbench.
The laying method schematic diagram of the fixture used in Fig. 2 the present invention and workpiece
Fig. 3 applies " rabbit year is lucky " pattern that method of the present invention makes in the thick ultra-clear glasses of 3.2mm
Fig. 4 applies the three-dimensional appearance figure of the precision line that method of the present invention makes on the thick transparent acrylic of 2mm
Detailed description of the invention
The invention will be further described by reference to the accompanying drawings:
The laser instrument that the laser fusing etching marking apparatus that the present invention adopts comprises is connected by the computer of data wire with the laser marking system software of installation, the laser power that computer will control, sweep speed, repetition rate signal is input to laser instrument, and laser instrument is optical fiber laser or Nd:YAG solid state laser.Laser instrument is equipped with laser motion control system, by the workbench below beam direction.Heat-conducting medium is contained in groove base, and transparent material covers on heat-conducting medium, by clamp, is placed on processing work platform.
Use the above-mentioned laser fusion marking device based on transparent material to carry out mark, its method is as follows:
(1) will the image of mark import in computer;
(2) heat-conducting medium is laid in the bottom land of groove base, and make cover plate with transparent material cover plate, clamped by fixture, be fixed on above workbench, the focus place plane after the laser beam focus that the lower surface of transparent material cover plate and laser instrument send is in same plane;
Described heat-conducting medium be fusing point more than 1500 DEG C, under normal temperature, thermal conductivity factor is the material of 10W/mK, has slightly solubility with transparent material, high to irradiation laser absorptivity.Can be the solid plate that surface smoothness is high, also can be the powder particle that granularity is less than 5 microns.
If medium is solid plate, be then placed in by sheet material below transparent material cover plate, smooth surface and cover plate are close to, and the two are fixedly clamped with fixture;
If medium is powder particle, then powder is evenly laid in the groove of groove-bottom seat board, with the compacting of transparent material cover plate, and with fixture, three is fixedly clamped.
(3) the laser marking system software by being installed on computer reads treats marking image, laser fusing etching mark technological parameter is set, parameter comprises laser output power, light-spot speed and laser instrument repetition rate, heat-conducting medium can absorb luminous energy under this laser action, and change into rapidly heat energy raised temperature, under arriving melting point;
(4) laser instrument is opened, laser motion control system carries out spot scan according to the picture signal of computer export, high-octane laser beam transparent transparent material cover plate irradiation, at heat-conducting medium and cover plate interface, transparent cover plate lower surface carries out laser fusion marking;
(5) work as finishing image scanning, unclamp fixture, take off transparent material cover plate, remove the heat-conducting medium adhered to around indentation.
Groove base, heat-conducting medium and transparent material cover plate are fixed in surrounding shape by described fixture from top to bottom, and the elasticity of adjustable holding keeps transparent material coverplate stress uniformity coefficient and pressure size.
The Digit Control Machine Tool that described laser motion control system is scanning galvanometer, digital control laser processing head maybe can realize two dimension or Three-dimension process.
Described transparent material plate is glass plate or organic polymer transparent material.
Following instance selects that volume is little, good beam quality, optical fiber laser easy to process, and wavelength is 1064nm, and laser control system adopts scanning galvanometer, and process velocity is fast; With fusing point 2050 DEG C, under normal temperature, thermal conductivity factor is the aluminium oxide Al of 10W/mK, particle diameters 1um
2o
3powder, and surface roughness be the alumina ceramic plate of 500nm is heat-conducting medium; With the thick transparent plexiglass plate material of 1mm for groove base; The thick ultra-clear glasses of 3.2mm and the thick transparent acrylic of 2mm is selected to be that material carries out fusing mark and accurately to rule.
Embodiment 1: make " rabbit year is lucky " pattern in the thick ultra-clear glasses of 3.2mm
By Al
2o
3powder is evenly elaborated in lucite groove base, until fill up whole groove, scrape off more than powder, powder upper surface and groove base upper surface are maintained an equal level, and depth of groove is 1mm, and planar dimension is 32mm × 22mm.3.2mm is thick, and planar dimension is that the ultra-clear glasses of 30mm × 18mm is covered on powder, and uniform compaction, is placed on fixture and clamps.Then be put on workbench, Laser Focusing is in the plane of ultra-clear glasses and heat conduction powder contact.The pattern contour of required marking is of a size of 30mm × 20mm, and picture pixels is 300dpi.After importing to computer, the transparent acrylic profile of the instruction laser alignment mark sent by laser instrument.Arranging machined parameters is laser power 20W, sweep speed 300mm/s frequency 20KHZ.Open laser instrument, laser is scanned according to the machined parameters of setting, and scanning times is 2 times.Scannedly unclamp fixture, take out ultra-clear glasses, rush except in fusing etching process with the running water flowed, be attached on the powder around indentation due to fusing and use Ultrasonic Cleaning, indentation can be obtained in ultra-clear glasses clear, image spatial resolution be 12 lines right/the fusing mark pattern of millimeter.
Embodiment 2: make accurate line in the thick ultra-clear glasses of 3.2mm
By Al
2o
3powder is evenly elaborated in lucite groove base, until fill up whole groove, scrape off more than powder, powder upper surface and groove base upper surface are maintained an equal level, and depth of groove is 1mm, and planar dimension is 32mm × 22mm.3.2mm is thick, and planar dimension is that the ultra-clear glasses of 30mm × 15mm is covered on powder, and uniform compaction, is placed on fixture and clamps.Then be put on workbench, Laser Focusing is in the plane of transparent acrylic and heat conduction powder contact.In the control software design of computer, draw length is 20mm, and live width is the horizontal linear of 0.15mm, and arranging machined parameters is laser power 20W, sweep speed 300mm/s frequency 20KHZ.Open laser instrument, laser is scanned according to the machined parameters of setting, and scanning times sets according to etching depth.Scannedly unclamp fixture, take out ultra-clear glasses cover plate, with the running water flowed punching except in fusing etching process, owing to melting the powder be attached on around indentation.And with Ultrasonic Cleaning, can obtain carving width in ultra-clear glasses is 0.18mm, and the degree of depth is 320 μm, the very low power of roughness Ra=2.62, bottom surface μm.
Embodiment 3: make " rabbit year is lucky " pattern on the thick transparent acrylic of 2mm
By Al
2o
3powder is evenly elaborated in lucite groove base, until fill up whole groove, scrape off more than powder, powder upper surface and groove base upper surface are maintained an equal level, and depth of groove is 1mm, and planar dimension is 32mm × 22mm.2mm is thick, and planar dimension is that the transparent acrylic of 30mm × 20mm covers on powder, and uniform compaction, is placed on fixture and clamps.Then be put on workbench, Laser Focusing is in the plane of transparent acrylic and heat conduction powder contact.The rabbit pattern contour of required marking is of a size of 30mm × 20mm, and picture pixels is 300dpi, after importing to computer, and the transparent acrylic profile of the instruction laser alignment mark sent by laser instrument.Arranging machined parameters is laser power 20W, sweep speed 300mm/s frequency 20KHZ.Open laser instrument, laser is scanned according to the machined parameters of setting, and scanning times is 2 times.Scannedly unclamp fixture, take out transparent acrylic cover plate, rush except in fusing etching process with the running water flowed, be attached on the powder around indentation due to fusing and use Ultrasonic Cleaning, image outline clear-cut margin can be obtained, the fusing mark pattern that resolution ratio is high on transparent acrylic material.
Embodiment 4: accurate line on the thick transparent acrylic of 2mm
By Al
2o
3powder is evenly elaborated in lucite groove base, until fill up whole groove, scrape off more than powder, powder upper surface and groove base upper surface are maintained an equal level, and depth of groove is 1mm, and planar dimension is 32mm × 22mm.2mm is thick, and planar dimension is that the transparent acrylic of 30mm × 20mm covers on powder, and uniform compaction, is placed on fixture and clamps.Then be put on workbench, Laser Focusing is in the plane of transparent acrylic and heat conduction powder contact.In the control software design of computer, draw length is 20mm, and live width is the horizontal linear of 0.15mm, and arranging machined parameters is laser power 20W, sweep speed 300mm/s frequency 20KHZ.Open laser instrument, laser is scanned according to the machined parameters of setting, and scanning times sets according to etching depth.Scannedly unclamp fixture, take out transparent acrylic cover plate, with the punching of the running water of flowing except in fusing etching process, be attached on the powder around indentation due to fusing and use Ultrasonic Cleaning, can obtain carving width on transparent acrylic material is 0.21mm, the degree of depth is 200 μm, the very low power of roughness Ra=1.43, bottom surface μm.
Embodiment 5: use alumina ceramic plate carving characters in the thick ultra-clear glasses of 3.2mm for heat-conducting medium
Alumina ceramic plate and ultra-clear glasses supersonic wave cleaning machine are cleaned up, after drying, the two smooth surface is close to, be placed on fixture and clamp, be put on workbench, in the plane that Laser Focusing contacts with alumina ceramic plate in ultra-clear glasses.The character contour of required marking is of a size of 15mm × 2mm, after importing to computer, and the instruction laser alignment aluminium oxide ceramics sent by laser instrument and ultra-clear glasses contact position.Arranging machined parameters is laser power 20W, sweep speed 300mm/s frequency 20KHZ.Open laser instrument, laser is scanned according to the machined parameters of setting, and scanning times is 2 times.Scannedly unclamp fixture, take out ultra-clear glasses, with the running water flowed punching except in fusing etching process, be attached on the slag around indentation.And with Ultrasonic Cleaning, in ultra-clear glasses, namely obtain indentation clear, the laser fusion marking word that edge is outstanding, its spatial resolution be 20 lines right/millimeter.
Claims (5)
1. the laser fusing etching marking method based on transparent material, it is characterized in that: application is as lower device, and this device comprises computer, laser instrument, the laser motion control system being installed on laser instrument, workbench, fixture, groove base, heat-conducting medium, transparent material cover plate; Wherein: laser instrument is connected with computer, workbench is placed in the below of laser motion control system, heat-conducting medium is evenly laid in the groove of groove base, and make cover plate with transparent material cover plate, clamped by fixture, be fixed on above workbench, laser instrument is optical fiber laser or Nd:YAG solid state laser, and the method comprises the following steps:
(1) will the image of mark import in computer;
(2) heat-conducting medium is laid in the bottom land of groove base, and make cover plate with transparent material cover plate, clamped by fixture, be fixed on above workbench, the focus place plane after the laser beam focus that the lower surface of transparent material cover plate and laser instrument send is in same plane;
(3) the laser marking system software by being installed on computer reads treats marking image, laser fusing etching mark technological parameter is set, parameter comprises laser output power, light-spot speed and laser instrument repetition rate, heat-conducting medium can absorb luminous energy under this laser action, and change into rapidly heat energy raised temperature, under arriving melting point;
(4) laser instrument is opened, laser motion control system carries out spot scan according to the picture signal of computer export, high-octane laser beam transparent transparent material cover plate irradiation, at heat-conducting medium and cover plate interface, transparent cover plate lower surface carries out laser fusion marking;
(5) work as finishing image scanning, unclamp fixture, take off transparent material cover plate, remove the heat-conducting medium adhered to around indentation.
2. method according to claim 1, it is characterized in that: groove base, heat-conducting medium and transparent material cover plate are fixed in surrounding shape by described fixture from top to bottom, and regulate the elasticity of clamping to keep transparent material coverplate stress uniformity coefficient and pressure size.
3. method according to claim 1, is characterized in that: described heat-conducting medium be fusing point more than 1500 DEG C, under normal temperature, thermal conductivity factor is the material of more than 8W/mK; Heat-conducting medium is the solid plate that surface roughness Ra is less than 500nm, or the powder particle that granularity is less than 5 microns;
If medium is solid plate, be then placed in by sheet material below transparent material cover plate, solid plate and cover plate are close to, and the two are fixedly clamped with fixture;
If medium is powder particle, then powder is evenly laid in the groove of groove-bottom seat board, with the compacting of transparent material cover plate, and with fixture, three is fixedly clamped.
4. method according to claim 1, is characterized in that: described laser motion control system is one of Digit Control Machine Tool of scanning galvanometer, digital control laser processing head, two dimension or Three-dimension process.
5. method according to claim 1, is characterized in that: described transparent material cover plate is glass plate or organic polymer transparent material.
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| CN201110096887.5A CN102241201B (en) | 2011-04-18 | 2011-04-18 | Laser melting and etching marking device and method based on transparent material |
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| CN201110096887.5A CN102241201B (en) | 2011-04-18 | 2011-04-18 | Laser melting and etching marking device and method based on transparent material |
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| CN102241201B true CN102241201B (en) | 2014-12-31 |
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| CN103311785B (en) * | 2013-06-17 | 2015-10-28 | 深圳市杰普特电子技术有限公司 | A kind of fiber laser and fiber laser marking system |
| CN105856855A (en) * | 2014-06-10 | 2016-08-17 | 赵牧青 | Laser marking system |
| CN104475976B (en) * | 2014-11-19 | 2016-04-06 | 江苏大学 | The method and apparatus of magnetic induction type laser plasma etching insulation transparent material |
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| CN105313481B (en) * | 2015-11-23 | 2018-01-09 | 英诺激光科技股份有限公司 | A kind of transparent material induced with laser wet method making color marker device and method |
| CN107310142B (en) * | 2017-07-14 | 2023-02-03 | 广东工业大学 | Device and method for preparing PDMS surface patterning wrinkles based on laser |
| CN109048057A (en) * | 2018-09-04 | 2018-12-21 | 沈阳飞机工业（集团）有限公司 | One kind beating calibration method on glass components |
| CN111069783A (en) * | 2018-10-22 | 2020-04-28 | 大族激光科技产业集团股份有限公司 | Device and method for reducing back marks of laser marks |
| CN112939487B (en) * | 2021-01-28 | 2023-03-10 | 佛山科学技术学院 | Sandwich type glass microfluidic chip double-sided laser processing device and method |
| CN114309967A (en) * | 2022-01-11 | 2022-04-12 | 大族激光科技产业集团股份有限公司 | Laser processing method and apparatus |
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