KR20110081909A - 반도체 집적회로 기판용 분리 구조체와 형성 방법 - Google Patents

반도체 집적회로 기판용 분리 구조체와 형성 방법 Download PDF

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Publication number
KR20110081909A
KR20110081909A KR1020117014787A KR20117014787A KR20110081909A KR 20110081909 A KR20110081909 A KR 20110081909A KR 1020117014787 A KR1020117014787 A KR 1020117014787A KR 20117014787 A KR20117014787 A KR 20117014787A KR 20110081909 A KR20110081909 A KR 20110081909A
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South Korea
Prior art keywords
trench
layer
dielectric material
substrate
dielectric
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Ceased
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KR1020117014787A
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English (en)
Korean (ko)
Inventor
리차드 케이 윌리암스
Original Assignee
어드밴스드 아날로직 테크놀로지스 인코퍼레이티드
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Publication of KR20110081909A publication Critical patent/KR20110081909A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/014—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations
    • H10W10/0145—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations of trenches having shapes other than rectangular or V-shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/17—Isolation regions comprising dielectric materials formed using trench refilling with dielectric materials, e.g. shallow trench isolations

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  • Element Separation (AREA)
KR1020117014787A 2005-12-09 2006-12-07 반도체 집적회로 기판용 분리 구조체와 형성 방법 Ceased KR20110081909A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/298,075 US20070132056A1 (en) 2005-12-09 2005-12-09 Isolation structures for semiconductor integrated circuit substrates and methods of forming the same
US11/298,075 2005-12-09

Related Parent Applications (1)

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KR1020087014965A Division KR20080098481A (ko) 2005-12-09 2006-12-07 반도체 집적회로 기판용 분리 구조체와 형성 방법

Related Child Applications (1)

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KR1020117022767A Division KR101323497B1 (ko) 2005-12-09 2006-12-07 반도체 집적회로 기판용 분리 구조체와 형성 방법

Publications (1)

Publication Number Publication Date
KR20110081909A true KR20110081909A (ko) 2011-07-14

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Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020117014787A Ceased KR20110081909A (ko) 2005-12-09 2006-12-07 반도체 집적회로 기판용 분리 구조체와 형성 방법
KR1020087014965A Ceased KR20080098481A (ko) 2005-12-09 2006-12-07 반도체 집적회로 기판용 분리 구조체와 형성 방법
KR1020117014788A Ceased KR20110079861A (ko) 2005-12-09 2006-12-07 반도체 집적회로 기판용 분리 구조체와 형성 방법
KR1020117022767A Expired - Fee Related KR101323497B1 (ko) 2005-12-09 2006-12-07 반도체 집적회로 기판용 분리 구조체와 형성 방법

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020087014965A Ceased KR20080098481A (ko) 2005-12-09 2006-12-07 반도체 집적회로 기판용 분리 구조체와 형성 방법
KR1020117014788A Ceased KR20110079861A (ko) 2005-12-09 2006-12-07 반도체 집적회로 기판용 분리 구조체와 형성 방법
KR1020117022767A Expired - Fee Related KR101323497B1 (ko) 2005-12-09 2006-12-07 반도체 집적회로 기판용 분리 구조체와 형성 방법

Country Status (7)

Country Link
US (5) US20070132056A1 (https=)
EP (1) EP1958249A1 (https=)
JP (4) JP5438973B2 (https=)
KR (4) KR20110081909A (https=)
CN (1) CN101366112B (https=)
TW (2) TWI460818B (https=)
WO (1) WO2007070311A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220094440A (ko) 2020-12-29 2022-07-06 주식회사 제이디케이바이오 부착성 규조류 광배양 장치

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Publication number Priority date Publication date Assignee Title
KR20220094440A (ko) 2020-12-29 2022-07-06 주식회사 제이디케이바이오 부착성 규조류 광배양 장치

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Publication number Publication date
CN101366112B (zh) 2011-05-04
JP2013168662A (ja) 2013-08-29
KR20110079861A (ko) 2011-07-08
KR20110111549A (ko) 2011-10-11
US7955947B2 (en) 2011-06-07
JP5438973B2 (ja) 2014-03-12
JP6263569B2 (ja) 2018-01-17
US7915137B2 (en) 2011-03-29
EP1958249A1 (en) 2008-08-20
JP2016164998A (ja) 2016-09-08
WO2007070311A1 (en) 2007-06-21
TWI544573B (zh) 2016-08-01
KR20080098481A (ko) 2008-11-10
US20100055864A1 (en) 2010-03-04
US20080254592A1 (en) 2008-10-16
US7923821B2 (en) 2011-04-12
JP2015062239A (ja) 2015-04-02
TWI460818B (zh) 2014-11-11
JP6026486B2 (ja) 2016-11-16
US20080203543A1 (en) 2008-08-28
US20080203520A1 (en) 2008-08-28
TW200733297A (en) 2007-09-01
CN101366112A (zh) 2009-02-11
TW201419444A (zh) 2014-05-16
US20070132056A1 (en) 2007-06-14
KR101323497B1 (ko) 2013-10-31
JP2009518867A (ja) 2009-05-07
US7994605B2 (en) 2011-08-09

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