KR20050084853A - 적층코일부품 및 그 제조방법 - Google Patents
적층코일부품 및 그 제조방법 Download PDFInfo
- Publication number
- KR20050084853A KR20050084853A KR1020057006498A KR20057006498A KR20050084853A KR 20050084853 A KR20050084853 A KR 20050084853A KR 1020057006498 A KR1020057006498 A KR 1020057006498A KR 20057006498 A KR20057006498 A KR 20057006498A KR 20050084853 A KR20050084853 A KR 20050084853A
- Authority
- KR
- South Korea
- Prior art keywords
- ceramic
- external electrode
- chip inductor
- coil component
- coil
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000919 ceramic Substances 0.000 claims abstract description 146
- 239000004020 conductor Substances 0.000 claims abstract description 65
- 238000003475 lamination Methods 0.000 claims description 18
- 238000010304 firing Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 abstract description 5
- 230000006866 deterioration Effects 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 11
- 230000032798 delamination Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000002788 crimping Methods 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000007423 decrease Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
Claims (4)
- 복수의 띠형상 전극과, 이들 띠형상 전극의 소정의 단부끼리를 접속하는 비어홀로 이루어지는 코일 도체가, 대략 직육면체형상을 갖는 세라믹 적층체의 내부에 설치되어 이루어지는 적층코일부품으로서,상기 코일 도체의 축심방향은, 상기 세라믹 적층체의 적층방향(두께방향) 및 길이방향 중 어느 방향과도 직교하는 상기 세라믹 적층체의 폭방향과 일치하고 있는 것을 특징으로 하는 적층코일부품.
- 제1항에 있어서, 상기 코일 도체의 단부와 접속되는 외부전극은, 상기 세라믹 적층체의 적층방향에 있어서의 주표면의 길이방향의 단부위치에 형성되어 있는 것을 특징으로 하는 적층코일부품.
- 제2항에 있어서, 상기 외부전극은, 상기 비어홀이 형성된 영역을 피복한 상태로 형성되어 있는 것을 특징으로 하는 적층코일부품.
- 제3항에 기재된 적층코일부품을 제조하는 방법으로서,상기 띠형상 전극 또는/및 비어홀이 형성된 세라믹 그린시트와, 상기 외부전극의 하지가 되는 도체 패턴이 인쇄된 세라믹 그린시트를 적층한 후, 압착하여 소성하는 공정을 포함하는 것을 특징으로 하는 적층코일부품의 제조방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003352770 | 2003-10-10 | ||
JPJP-P-2003-00352770 | 2003-10-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050084853A true KR20050084853A (ko) | 2005-08-29 |
KR100664999B1 KR100664999B1 (ko) | 2007-01-09 |
Family
ID=34431128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020057006498A KR100664999B1 (ko) | 2003-10-10 | 2004-09-07 | 적층코일부품 및 그 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7176772B2 (ko) |
JP (1) | JP4492540B2 (ko) |
KR (1) | KR100664999B1 (ko) |
CN (1) | CN100356489C (ko) |
WO (1) | WO2005036566A1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8988180B2 (en) | 2012-03-30 | 2015-03-24 | Tdk Corporation | Multilayer coil component |
KR20150058869A (ko) * | 2013-11-21 | 2015-05-29 | 삼성전기주식회사 | 적층형 인덕터 |
KR20180036613A (ko) * | 2016-09-30 | 2018-04-09 | 다이요 유덴 가부시키가이샤 | 코일 부품 |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007266105A (ja) * | 2006-03-27 | 2007-10-11 | Tdk Corp | 薄膜デバイス |
US8378777B2 (en) * | 2008-07-29 | 2013-02-19 | Cooper Technologies Company | Magnetic electrical device |
JP4900186B2 (ja) * | 2007-10-17 | 2012-03-21 | 株式会社村田製作所 | コイル部品の実装構造 |
JP5115585B2 (ja) * | 2010-05-21 | 2013-01-09 | パナソニック株式会社 | アンテナ装置 |
KR101116897B1 (ko) * | 2010-01-06 | 2012-03-06 | 주식회사 실리콘하모니 | 디지털 cmos 공정에서 주파수 합성기에 사용되는 솔레노이드 인덕터 |
JP5482554B2 (ja) * | 2010-08-04 | 2014-05-07 | 株式会社村田製作所 | 積層型コイル |
KR20120072424A (ko) * | 2010-12-24 | 2012-07-04 | 삼성전기주식회사 | 트랜스포머 |
JP2012160507A (ja) * | 2011-01-31 | 2012-08-23 | Toko Inc | 面実装インダクタと面実装インダクタの製造方法 |
JP2013089640A (ja) * | 2011-10-13 | 2013-05-13 | Tdk Corp | 積層コイル部品 |
KR20130051614A (ko) * | 2011-11-10 | 2013-05-21 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 제조 방법 |
JP5700233B2 (ja) | 2012-05-09 | 2015-04-15 | 株式会社村田製作所 | コイルアンテナ素子およびアンテナモジュール |
CN104185883B (zh) * | 2012-05-15 | 2019-04-19 | 株式会社村田制作所 | 电感元件 |
JP5674077B2 (ja) * | 2012-09-25 | 2015-02-25 | 株式会社村田製作所 | インダクタ素子 |
JP2014107513A (ja) * | 2012-11-29 | 2014-06-09 | Taiyo Yuden Co Ltd | 積層インダクタ |
CN103035390A (zh) * | 2012-12-24 | 2013-04-10 | 深圳顺络电子股份有限公司 | 电感磁珠 |
KR101983139B1 (ko) * | 2013-03-14 | 2019-05-28 | 삼성전기주식회사 | 적층형 인덕터 및 적층형 인덕터 어레이 |
JP2014232814A (ja) * | 2013-05-29 | 2014-12-11 | 太陽誘電株式会社 | コイル部品の製造方法 |
JP6387215B2 (ja) * | 2013-05-29 | 2018-09-05 | 太陽誘電株式会社 | コイル部品 |
US10109404B2 (en) * | 2013-08-30 | 2018-10-23 | Virginia Tech Intellectual Properties, Inc. | Low profile coupled inductor substrate with transient speed improvement |
KR101983150B1 (ko) * | 2013-10-11 | 2019-05-28 | 삼성전기주식회사 | 적층형 인덕터 및 그 제조 방법 |
US10062493B2 (en) * | 2013-11-26 | 2018-08-28 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and circuit board having the same mounted thereon |
US9368564B2 (en) * | 2014-03-28 | 2016-06-14 | Qualcomm Incorporated | 3D pillar inductor |
KR102004787B1 (ko) * | 2014-04-02 | 2019-07-29 | 삼성전기주식회사 | 적층형 전자부품 및 그 제조방법 |
KR20160019265A (ko) * | 2014-08-11 | 2016-02-19 | 삼성전기주식회사 | 칩형 코일 부품 및 그 제조방법 |
JP6265275B2 (ja) * | 2014-09-19 | 2018-01-24 | 株式会社村田製作所 | インダクタ部品およびインダクタ部品の製造方法 |
CN107077956B (zh) * | 2014-10-22 | 2019-01-15 | 株式会社村田制作所 | 线圈部件 |
DE202016007184U1 (de) * | 2016-11-22 | 2016-12-02 | Stadlbauer Marketing + Vertrieb Gmbh | Spulenanordnung und Modellauto mit einer derartigen Spulenandordnung |
JP6579118B2 (ja) * | 2017-01-10 | 2019-09-25 | 株式会社村田製作所 | インダクタ部品 |
CN111309197B (zh) * | 2020-01-19 | 2024-08-16 | 深圳市鸿合创新信息技术有限责任公司 | 感应膜及其制作方法、感应板及其制作方法和显示设备 |
JP2022038242A (ja) * | 2020-08-26 | 2022-03-10 | 株式会社村田製作所 | インダクタ部品 |
WO2024095565A1 (ja) * | 2022-11-02 | 2024-05-10 | 株式会社村田製作所 | インダクタ部品 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS587609Y2 (ja) * | 1979-01-25 | 1983-02-10 | ティーディーケイ株式会社 | 積層トランス |
JPH01129808U (ko) * | 1988-02-25 | 1989-09-04 | ||
JP3150141B2 (ja) * | 1990-08-24 | 2001-03-26 | ティーディーケイ株式会社 | 高周波用チップインダクタ |
JPH06112655A (ja) * | 1992-09-29 | 1994-04-22 | Matsushita Electric Ind Co Ltd | コイル内蔵多層印刷配線板およびその製造方法 |
JPH0855726A (ja) * | 1994-08-10 | 1996-02-27 | Taiyo Yuden Co Ltd | 積層型電子部品及びその製造方法 |
JPH08250333A (ja) * | 1995-03-14 | 1996-09-27 | Taiyo Yuden Co Ltd | インダクタアレイ |
JP3097569B2 (ja) * | 1996-09-17 | 2000-10-10 | 株式会社村田製作所 | 積層チップインダクタの製造方法 |
JPH11186040A (ja) * | 1997-12-22 | 1999-07-09 | Tdk Corp | 積層型ノイズフィルタ |
JP3500319B2 (ja) * | 1998-01-08 | 2004-02-23 | 太陽誘電株式会社 | 電子部品 |
JPH11273979A (ja) * | 1998-03-19 | 1999-10-08 | Tdk Corp | インダクタンス素子の製造方法およびインダクタンス素子 |
JP3058164B1 (ja) | 1999-06-02 | 2000-07-04 | 株式会社村田製作所 | 積層型インダクタ |
JP2001102218A (ja) * | 1999-10-01 | 2001-04-13 | Koa Corp | 積層チップインダクタ及びその製造方法 |
JP3788325B2 (ja) | 2000-12-19 | 2006-06-21 | 株式会社村田製作所 | 積層型コイル部品及びその製造方法 |
JP2003017325A (ja) * | 2001-06-27 | 2003-01-17 | Murata Mfg Co Ltd | 積層型金属磁性電子部品及びその製造方法 |
JP4206745B2 (ja) * | 2002-12-13 | 2009-01-14 | 株式会社村田製作所 | 積層チップインダクタ |
JP2004303776A (ja) * | 2003-03-28 | 2004-10-28 | Mitsubishi Materials Corp | 積層型コモンモードチョークコイル及びその製造方法 |
JP2005039187A (ja) * | 2003-06-26 | 2005-02-10 | Murata Mfg Co Ltd | 積層コイル部品 |
JP3594031B1 (ja) * | 2003-07-04 | 2004-11-24 | 株式会社村田製作所 | 積層セラミック電子部品、積層コイル部品および積層セラミック電子部品の製造方法 |
EP1564761A4 (en) * | 2003-09-01 | 2010-03-31 | Murata Manufacturing Co | LAMINATED COIL COMPONENT AND PROCESS FOR PRODUCING THE SAME |
-
2004
- 2004-09-07 US US10/531,956 patent/US7176772B2/en not_active Expired - Lifetime
- 2004-09-07 KR KR1020057006498A patent/KR100664999B1/ko active IP Right Grant
- 2004-09-07 JP JP2005514539A patent/JP4492540B2/ja not_active Expired - Lifetime
- 2004-09-07 CN CNB2004800010807A patent/CN100356489C/zh not_active Expired - Lifetime
- 2004-09-07 WO PCT/JP2004/012987 patent/WO2005036566A1/ja active IP Right Grant
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8988180B2 (en) | 2012-03-30 | 2015-03-24 | Tdk Corporation | Multilayer coil component |
KR20150058869A (ko) * | 2013-11-21 | 2015-05-29 | 삼성전기주식회사 | 적층형 인덕터 |
KR20180036613A (ko) * | 2016-09-30 | 2018-04-09 | 다이요 유덴 가부시키가이샤 | 코일 부품 |
US10867743B2 (en) | 2016-09-30 | 2020-12-15 | Taiyo Yuden Co., Ltd. | Coil component |
Also Published As
Publication number | Publication date |
---|---|
CN100356489C (zh) | 2007-12-19 |
CN1701398A (zh) | 2005-11-23 |
JP4492540B2 (ja) | 2010-06-30 |
KR100664999B1 (ko) | 2007-01-09 |
WO2005036566A1 (ja) | 2005-04-21 |
US20060049905A1 (en) | 2006-03-09 |
US7176772B2 (en) | 2007-02-13 |
JPWO2005036566A1 (ja) | 2006-12-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100664999B1 (ko) | 적층코일부품 및 그 제조방법 | |
US7579937B2 (en) | Laminated inductor and method of manufacture of same | |
JP4821908B2 (ja) | 積層型電子部品及びこれを備えた電子部品モジュール | |
US8508912B2 (en) | Capacitor and method for manufacturing the same | |
KR101043890B1 (ko) | 적층 코일 부품 및 그 제조방법 | |
US6730183B2 (en) | Laminated ceramic electronic components and manufacturing method therefor | |
WO2014069050A1 (ja) | 積層型インダクタ素子 | |
JP4213679B2 (ja) | 積層型インダクタ | |
US8207810B2 (en) | Multilayer electronic component | |
US8143989B2 (en) | Multilayer inductor | |
JP2017118003A (ja) | 積層セラミック電子部品 | |
JP2001176725A (ja) | 積層電子部品 | |
US6551426B2 (en) | Manufacturing method for a laminated ceramic electronic component | |
JP2006310475A (ja) | 積層コイル | |
JP6784183B2 (ja) | 積層コイル部品 | |
JP2590019Y2 (ja) | 積層チップインダクタ | |
JP2005142302A (ja) | 積層コイル部品およびその製造方法 | |
JP2005167098A (ja) | 積層セラミック電子部品 | |
JP2001307937A (ja) | 積層セラミック電子部品の製造方法 | |
JPH0757935A (ja) | 積層チップインダクタ | |
JPH06215948A (ja) | 積層インダクタ | |
JPH04206910A (ja) | 積層コイルの製造方法 | |
JP2010050390A (ja) | 積層型コイル部品の製造方法 | |
JPH06215947A (ja) | 積層インダクタ | |
JPH06196334A (ja) | 積層インダクタ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20121203 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20131202 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20141203 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20151218 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20161216 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20181220 Year of fee payment: 13 |