KR100664999B1 - 적층코일부품 및 그 제조방법 - Google Patents
적층코일부품 및 그 제조방법 Download PDFInfo
- Publication number
- KR100664999B1 KR100664999B1 KR1020057006498A KR20057006498A KR100664999B1 KR 100664999 B1 KR100664999 B1 KR 100664999B1 KR 1020057006498 A KR1020057006498 A KR 1020057006498A KR 20057006498 A KR20057006498 A KR 20057006498A KR 100664999 B1 KR100664999 B1 KR 100664999B1
- Authority
- KR
- South Korea
- Prior art keywords
- ceramic
- external electrode
- laminated
- chip inductor
- ceramic laminate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000919 ceramic Substances 0.000 claims abstract description 146
- 239000004020 conductor Substances 0.000 claims abstract description 65
- 238000003475 lamination Methods 0.000 claims abstract description 19
- 238000010304 firing Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 12
- 238000002788 crimping Methods 0.000 abstract description 8
- 238000009413 insulation Methods 0.000 abstract description 5
- 230000007423 decrease Effects 0.000 abstract description 4
- 238000007747 plating Methods 0.000 description 15
- 230000032798 delamination Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000003825 pressing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
Claims (4)
- 복수의 띠형상 전극과, 이들 띠형상 전극의 소정의 단부끼리를 접속하는 비어홀로 이루어지는 코일 도체가, 대략 직육면체형상을 갖는 세라믹 적층체의 내부에 설치되어 이루어지는 적층코일부품으로서,상기 코일 도체의 축심방향은 상기 세라믹 적층체의 적층방향(두께방향) 및 길이방향 중 어느 방향과도 직교하는 상기 세라믹 적층체의 폭방향과 일치하고 있고,상기 코일 도체의 단부와 접속되는 외부전극은 상기 세라믹 적층체의 적층방향에 있어서의 주표면의 길이방향의 단부위치에 형성되어 있고,상기 외부전극은 상기 비어홀이 형성된 영역을 피복한 상태로 형성되어 있는 것을 특징으로 하는 적층코일부품.
- 삭제
- 삭제
- 제1항에 기재된 적층코일부품을 제조하는 방법으로서,상기 띠형상 전극 또는/및 비어홀이 형성된 세라믹 그린시트와, 상기 외부전극의 하지가 되는 도체 패턴이 인쇄된 세라믹 그린시트를 적층한 후, 압착하여 소성하는 공정을 포함하는 것을 특징으로 하는 적층코일부품의 제조방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003352770 | 2003-10-10 | ||
JPJP-P-2003-00352770 | 2003-10-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050084853A KR20050084853A (ko) | 2005-08-29 |
KR100664999B1 true KR100664999B1 (ko) | 2007-01-09 |
Family
ID=34431128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020057006498A KR100664999B1 (ko) | 2003-10-10 | 2004-09-07 | 적층코일부품 및 그 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7176772B2 (ko) |
JP (1) | JP4492540B2 (ko) |
KR (1) | KR100664999B1 (ko) |
CN (1) | CN100356489C (ko) |
WO (1) | WO2005036566A1 (ko) |
Families Citing this family (34)
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JP2007266105A (ja) * | 2006-03-27 | 2007-10-11 | Tdk Corp | 薄膜デバイス |
US8378777B2 (en) * | 2008-07-29 | 2013-02-19 | Cooper Technologies Company | Magnetic electrical device |
JP4900186B2 (ja) * | 2007-10-17 | 2012-03-21 | 株式会社村田製作所 | コイル部品の実装構造 |
JP5115585B2 (ja) * | 2010-05-21 | 2013-01-09 | パナソニック株式会社 | アンテナ装置 |
KR101116897B1 (ko) * | 2010-01-06 | 2012-03-06 | 주식회사 실리콘하모니 | 디지털 cmos 공정에서 주파수 합성기에 사용되는 솔레노이드 인덕터 |
JP5482554B2 (ja) * | 2010-08-04 | 2014-05-07 | 株式会社村田製作所 | 積層型コイル |
KR20120072424A (ko) * | 2010-12-24 | 2012-07-04 | 삼성전기주식회사 | 트랜스포머 |
JP2012160507A (ja) * | 2011-01-31 | 2012-08-23 | Toko Inc | 面実装インダクタと面実装インダクタの製造方法 |
JP2013089640A (ja) * | 2011-10-13 | 2013-05-13 | Tdk Corp | 積層コイル部品 |
KR20130051614A (ko) * | 2011-11-10 | 2013-05-21 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 제조 방법 |
JP5598492B2 (ja) * | 2012-03-30 | 2014-10-01 | Tdk株式会社 | 積層コイル部品 |
JP5700233B2 (ja) | 2012-05-09 | 2015-04-15 | 株式会社村田製作所 | コイルアンテナ素子およびアンテナモジュール |
CN104185883B (zh) * | 2012-05-15 | 2019-04-19 | 株式会社村田制作所 | 电感元件 |
JP5674077B2 (ja) * | 2012-09-25 | 2015-02-25 | 株式会社村田製作所 | インダクタ素子 |
JP2014107513A (ja) * | 2012-11-29 | 2014-06-09 | Taiyo Yuden Co Ltd | 積層インダクタ |
CN103035390A (zh) * | 2012-12-24 | 2013-04-10 | 深圳顺络电子股份有限公司 | 电感磁珠 |
KR101983139B1 (ko) * | 2013-03-14 | 2019-05-28 | 삼성전기주식회사 | 적층형 인덕터 및 적층형 인덕터 어레이 |
JP2014232814A (ja) * | 2013-05-29 | 2014-12-11 | 太陽誘電株式会社 | コイル部品の製造方法 |
JP6387215B2 (ja) * | 2013-05-29 | 2018-09-05 | 太陽誘電株式会社 | コイル部品 |
US10109404B2 (en) * | 2013-08-30 | 2018-10-23 | Virginia Tech Intellectual Properties, Inc. | Low profile coupled inductor substrate with transient speed improvement |
KR101983150B1 (ko) * | 2013-10-11 | 2019-05-28 | 삼성전기주식회사 | 적층형 인덕터 및 그 제조 방법 |
KR20150058869A (ko) * | 2013-11-21 | 2015-05-29 | 삼성전기주식회사 | 적층형 인덕터 |
US10062493B2 (en) * | 2013-11-26 | 2018-08-28 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and circuit board having the same mounted thereon |
US9368564B2 (en) * | 2014-03-28 | 2016-06-14 | Qualcomm Incorporated | 3D pillar inductor |
KR102004787B1 (ko) * | 2014-04-02 | 2019-07-29 | 삼성전기주식회사 | 적층형 전자부품 및 그 제조방법 |
KR20160019265A (ko) * | 2014-08-11 | 2016-02-19 | 삼성전기주식회사 | 칩형 코일 부품 및 그 제조방법 |
JP6265275B2 (ja) * | 2014-09-19 | 2018-01-24 | 株式会社村田製作所 | インダクタ部品およびインダクタ部品の製造方法 |
CN107077956B (zh) * | 2014-10-22 | 2019-01-15 | 株式会社村田制作所 | 线圈部件 |
JP6594837B2 (ja) | 2016-09-30 | 2019-10-23 | 太陽誘電株式会社 | コイル部品 |
DE202016007184U1 (de) * | 2016-11-22 | 2016-12-02 | Stadlbauer Marketing + Vertrieb Gmbh | Spulenanordnung und Modellauto mit einer derartigen Spulenandordnung |
JP6579118B2 (ja) * | 2017-01-10 | 2019-09-25 | 株式会社村田製作所 | インダクタ部品 |
CN111309197B (zh) * | 2020-01-19 | 2024-08-16 | 深圳市鸿合创新信息技术有限责任公司 | 感应膜及其制作方法、感应板及其制作方法和显示设备 |
JP2022038242A (ja) * | 2020-08-26 | 2022-03-10 | 株式会社村田製作所 | インダクタ部品 |
WO2024095565A1 (ja) * | 2022-11-02 | 2024-05-10 | 株式会社村田製作所 | インダクタ部品 |
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JPH01129808U (ko) * | 1988-02-25 | 1989-09-04 | ||
JP3150141B2 (ja) * | 1990-08-24 | 2001-03-26 | ティーディーケイ株式会社 | 高周波用チップインダクタ |
JPH06112655A (ja) * | 1992-09-29 | 1994-04-22 | Matsushita Electric Ind Co Ltd | コイル内蔵多層印刷配線板およびその製造方法 |
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EP1564761A4 (en) * | 2003-09-01 | 2010-03-31 | Murata Manufacturing Co | LAMINATED COIL COMPONENT AND PROCESS FOR PRODUCING THE SAME |
-
2004
- 2004-09-07 US US10/531,956 patent/US7176772B2/en not_active Expired - Lifetime
- 2004-09-07 KR KR1020057006498A patent/KR100664999B1/ko active IP Right Grant
- 2004-09-07 JP JP2005514539A patent/JP4492540B2/ja not_active Expired - Lifetime
- 2004-09-07 CN CNB2004800010807A patent/CN100356489C/zh not_active Expired - Lifetime
- 2004-09-07 WO PCT/JP2004/012987 patent/WO2005036566A1/ja active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN100356489C (zh) | 2007-12-19 |
CN1701398A (zh) | 2005-11-23 |
JP4492540B2 (ja) | 2010-06-30 |
WO2005036566A1 (ja) | 2005-04-21 |
US20060049905A1 (en) | 2006-03-09 |
US7176772B2 (en) | 2007-02-13 |
KR20050084853A (ko) | 2005-08-29 |
JPWO2005036566A1 (ja) | 2006-12-28 |
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